Mitchell De Young

Mitchell De Young

Greater Vancouver Metropolitan Area
2K followers 500+ connections

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About

I am the Chief Product Officer at SPENN Technology, a leading provider of digital banking…

Activity

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Experience

  • SPENN Technology Graphic

    SPENN Technology

    Kristiansand, Agder, Norway

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    Zambia

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    Geneva, Switzerland

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    United States

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    Copenhagen, Capital Region, Denmark

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    Singapore

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    Phra Nakhon Si Ayutthaya, Thailand

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    Phra Nakhon Si Ayutthaya, Thailand

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    Phra Nakhon Si Ayutthaya, Thailand

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Education

Licenses & Certifications

Volunteer Experience

Publications

  • Is Identity the New Money?

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Patents

  • Document authentication using distributed ledger

    Filed EU EP3678872A1

    A method for authenticating a certificate includes placing a sticker having a chip integrated therein onto the certificate. The chip includes a memory having information identifying the sticker and particular information that is on the certificate. An association is created between the information identifying the sticker and the certificate. This information is stored on a block chain.

    See patent

  • Laminate Structure for a Chip Card and Method for the Production Thereof

    US US20130277432A1

    The invention relates to a laminate structure (30) for a chip card (31), comprising a base layer (35), a chip module (32) accommodated at least partially in the base layer, and at least one cover layer (39) that covers the base layer, wherein an intermediate space (61) formed between the chip module and the cover layer as well as between the chip module and the base layer is filled with an adhesive material, wherein the adhesive material generates adhesive forces with respect to the wetted…

    The invention relates to a laminate structure (30) for a chip card (31), comprising a base layer (35), a chip module (32) accommodated at least partially in the base layer, and at least one cover layer (39) that covers the base layer, wherein an intermediate space (61) formed between the chip module and the cover layer as well as between the chip module and the base layer is filled with an adhesive material, wherein the adhesive material generates adhesive forces with respect to the wetted surfaces of the base layer and of the cover layer and generates adhesive forces with respect to the wetted surfaces of the chip module as well.

    See patent

Organizations

  • PMI

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    - Present

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