Failure Analysis Engineer

JOB SUMMARY

Responsible for performing physical failure analysis of glass substrates. This includes using a variety of techniques, such as microscopy, spectroscopy, and metallurgy to identify the root cause of failures. The ideal candidate will have a strong background in electrical engineering and be able to work independently and as part of a team.

DUTIES/RESPONSIBILITIES:

·       Investigate physical failures and defects including delamination, cracks, and voids using advanced microscopy and analytical techniques

·       Prepare samples for analysis, including cutting, polishing, and coating, while ensuring preservation of relevant features

·       Use optical microscopes, electron microscopes, and other imaging tools to examine samples at various scales

·       Analyze images to identify defects, fractures, corrosion, and other anomalies

·       Analyze data collected from various analyses to develop comprehensive understanding of failure mechanism

·       Generate detailed reports outlining findings, analysis methodologies, and recommendations

·       Utilize spectroscopic methods to identify material compositions and elemental distributions

·       Perform mechanical and thermal testing

·       Prepare reports and documentation of failure analysis results

·       Work with other engineers and scientists to develop and improve the failure analysis process

·       Participate in quality control procedures, including instrument calibration and performance check

·       Troubleshoot technical issues

·       Provide support to the OQA function with analysis results

 REQUIREMENTS:

·       Experiences on SEM / FIB equipments (Analysis tools)

·       Excellent analytical and problem-solving skills to identify root cause of failures

·       Strong attention to detail and ability to accurately document findings and observations

·       Excellent and proven personnel management skills

·       Excellent communication skills and a proven ability to juggle multiple high priority tasks

QUALITIFICATIONS:

·       Strong knowledge of electronic devices and their failure mechanisms

·       Experience with a variety of failure analysis techniques

·       Proficiency in microscopy techniques, material analysis, and spectropy

·       Strong understanding of material properties, fracture mechanics, and root cause analysis

·       Proficiency in operating microscopy equipment (optical, SEM, TEM) and analytical tools (FTIR, EDX)

EDUCATION:

·       Bachelor’s degree in material science, electrical engineering, or related field

EXPERIENCE:

·       3+ years of experience in physical failure analysis in electronic or semiconductor applications

Experiences in Manufacturing