How 5G RedCap simplifies connectivity for embedded systems

Ambiq #Apollo510B enhances #EdgeAI with energy-efficient wireless connectivity The #Apollo510B’s rich set of peripherals makes it ideal for always-on, intelligent, and connected devices, particularly in body-worn and ambient AI applications. Its advanced memory architecture enables fast execution and real-time data processing, while# secureSPOT® 3.0 and Arm TrustZone® provide secure boot, firmware updates, and protection of interoperability and data exchange across diverse edge devices, specifically for wearables, smart glasses, remote patient monitoring, asset tracking, and #industrialautomation. 

Live from #GTS2025, we’re excited to bring you the latest announcements on our differentiated technologies and partnerships that are delivering power-efficiency, high performance and reliable connectivity to the world’s essential industries: https://lnkd.in/gNQjDStj First, we are excited to announce the availability of our 22FDX+ platform with Resistive RAM (RRAM) technology, a significant advancement in our portfolio of eNVM solutions. This platform upgrade helps GF deliver secure, low-latency, high-density embedded memory tailor-made for powering intelligence at the edge in devices such as sensors, wearables and complex industrial systems. We are also excited to announce that our 130CBIC SiGe platform is now available for production. As our highest-performance SiGe platform to date, 130CBIC delivers significant performance and power efficiency advantages across essential markets, including smartphones, wireless infrastructure and industrial IoT. This breakthrough reduces costs while enabling innovations like low-noise amplifiers (LNAs) in smartphones that extend battery life and deliver high gain-bandwidth at lower power for next-gen optical and analog networking. Finally, in partnership with Silicon Labs, we’re announcing a new milestone for 40nm process technology with a shipment of more than 10 million Silicon Labs Wi-Fi units, including the SiWX917 Wi-Fi chip, built on GF’s 40LP platform. Together with our customers and partners, we are setting a new standard for essential chips with solutions that deliver power, performance and reliability, creating consistent experiences that shape how consumers live and connect.

Today, GlobalFoundries is pleased to announce the availability of our 22FDX platform with embedded RRAM, a major step forward in building out our embedded non-volatile memory portfolio: https://loom.ly/BRNQTLU Our team at GF is leading the way in enabling secure, high-density, low-latency memory that is ideal for wireless microcontrollers and other AI-driven IoT applications. This platform will further help us support our customers in building smarter, more efficient and connected devices purpose-built for the evolving needs of next-generation intelligent and connected devices. Looking forward to what’s next.

Recently in 2025 GlobalFoundries Technology Summit, we are excited to announce the availability of our 22FDX+ platform with Resistive Random Access Memory (RRAM) technology, a significant advancement in our portfolio of eNVM solutions. Glad to join the team right after my early RRAM journey as a doctoral researcher and further contribute on RRAM technology development to offer more advanced chips enabling power-efficient life in the near future.

What if your remote worked like a mouse — point, click, and drag right on your screen? Avnet engineers made it possible with a new reference design powered by: ✅ Ultra-Wideband (UWB) — like a super-accurate radar that knows exactly where you’re pointing ✅ Inertial Measurement Unit (IMU) — the same kind of motion sensor in your smartphone, tracking every tilt and turn Together, they turn the remote into a precise pointer, letting you move a cursor, drag, and tap — just by waving it in the air. This reference design gives companies a practical way to develop the next generation of smart, connected devices. 👉 Read the full article here: http://bit.ly/46rcYPF #SmartTech #Innovation #ElectronicsDesign #UWB #IMU #IoT #Engineering #Avnet #FutureOfTech #ConnectedDevices

🚀 Exciting News! We are thrilled to introduce the KT1328A Bluetooth Host-Slave Integrated Chip – a game-changer for BLE-enabled devices! 🎯 Built on the robust KT6368A platform, the KT1328A supports Bluetooth 5.1 BLE and enables seamless master-slave role switching via AT commands. Whether you're building smart home devices, wearable tech, or industrial IoT solutions, this chip delivers unmatched flexibility and performance. 🔹 Key Features: ▶️ Host & slave mode switching via AT commands ▶️ Preloaded with KT6368A commands + enhanced master-slave controls ▶️ Ultra-low cost & SOP8 package for easy production ▶️ Steady 6mA power consumption ▶️ Crystal oscillator: 24MHz, 12pF load, ±10PPM 📡 With a simple antenna setup (just a single capacitor!), achieve ranges over 10m effortlessly. Perfect for custom apps, mini-programs, and more! 👉 Ideal for: ✅ Remote-controlled toys ✅ Medical devices ✅ Thermal printers ✅ Battery management systems ✅ And much more! Download the schematic and learn more about how the KT1328A can power your next Bluetooth project! ⚡ #Bluetooth #BLE #IoT #EmbeddedSystems #HardwareDesign #KT1328A #Innovation #Tech

External antennas don’t belong in 5G. They’re relics of the past. AiP — Antenna in Package — removes the excuse for bulky designs. It buries antennas directly into chips where they belong. The payoff? ✅ Smaller devices, no performance loss. ✅ Stable connections without interference. ✅ Access to the high frequencies that make 5G matter. Phones, wearables, IoT — they all benefit. Industrial automation works because of it. Manufacturers get the bonus too: ⚡ Fewer parts to manage. 🎯 Less assembly chaos. 🌐 Faster production at scale. Yet some still defend external antennas. Why? Habit. Comfort. Fear of change. But clinging to old designs isn’t “safe.” 5G doesn’t need nostalgia. It needs AiP — the only antenna tech built for the future. Thanks for reading. If you find this informative, then repost. Share it with your connections. 🙏

The objective of this application is to design and implement a reliable charging solution for single-cell batteries (such as Li-ion or Li-Polymer) that can be powered from dual input sources (e.g., USB and Adapter, or Solar and USB). The system ensures seamless source selection, safe charging, and efficient power management to maximize battery life and device usability. Dual Source Input Support : Allows charging from two sources (e.g., USB port + wall adapter, or solar panel + adapter). Automatic source priority and selection without user intervention. Power Path Management : Ensures uninterrupted system operation even when the battery is fully discharged. Manages load sharing between source, charger, and battery. Seamless Source Switching : Smooth transition between power inputs without resetting or disturbing the system load. Battery Charging Control : Supports constant current (CC) and constant voltage (CV) charging profile. Programmable charge current and voltage for optimized single-cell battery performance. Protection Features : Input over-voltage, under-voltage, and over-current protection. Battery overcharge, over-discharge, and thermal protection. Efficiency Optimization : Integrated switching regulator or linear charging modes to reduce power loss. Dynamic power management to utilize the most efficient source. Compact and Cost-Effective Solution Integration reduces external components. Suitable for portable electronics like wearables, IoT devices, handheld instruments. System-Level Benefits Extends battery life with proper charge termination. Provides flexibility to end-users for charging from available power sources Follow for more SURAJ SHARMA #BMS #EVcharger #SingleCellCharger #DualPowersource #NMC #LiPolymer #LFP #BusMaster #CAN #I2C #Eastman

The MEMS (Micro-Electro-Mechanical Systems) market is projected to reach USD 38.6 billion by 2030, but not all growth is created equal. A significant portion of this value is now being driven by resonator MEMS—a category that's fundamentally reshaping timing and sensing in electronics. Several years ago, crystal oscillators were the undisputed king of precision timing. They were reliable, established, and deeply integrated into the semiconductor supply chain. However, their size, power consumption, and vulnerability to environmental factors are now proving to be their biggest liabilities in an increasingly compact and mobile world. Here’s why resonator MEMS are now gaining traction: * Miniaturization: Resonator MEMS are fabricated using standard semiconductor processes, allowing them to be integrated directly onto a chip. This is critical for wearables, IoT devices, and smartphones where every millimeter of board space counts. * Performance & Resilience: They offer superior stability and shock resistance compared to bulkier quartz crystals. This makes them ideal for applications in automotive electronics and industrial IoT, where vibration and temperature fluctuations are common. * Supply Chain Consolidation: The shift to MEMS-based solutions simplifies the supply chain by moving from a legacy component to a modern silicon-based one, which aligns with the industry's push for integration and efficiency. The transition from quartz to silicon-based timing isn't just a technical upgrade; it's a strategic move that enables the next wave of connected devices. The ability to integrate high-performance timing and sensing directly onto a single chip will fuel innovations in areas from autonomous systems to personalized health monitoring. It will be interesting to see how this trend accelerates in the coming years, particularly as regulatory standards for device connectivity and reliability become more stringent.

Bluetooth is moving beyond connectivity into spatial awareness 🛜 Panasonic Industry Europe’s new PAN B611-1 Bluetooth module is now in mass production, adding Bluetooth 6.0 support and Channel Sounding for accurate distance measurement and stronger wireless performance. Built on Nordic Semiconductor’s nRF54L15 SoC, the module combines a compact hybrid castellated/LGA package with options for ultra-low-power or more demanding Matter applications. It also supports multiple protocols, including Zigbee, Thread, and Bluetooth Mesh, giving engineers flexibility to design for today’s ecosystems while preparing for the future. From smart lighting and appliances to medical wearables and industrial sensors, the PAN B611-1 provides a certified, versatile platform that makes prototyping easier and scaling faster. 🔗 Learn more: https://lnkd.in/dc63Qiun 👉 Join the club and stay informed: https://lnkd.in/epYBc3kj 🎙️ Continue the discussion on Reddit: https://lnkd.in/edBrha36 #TCC #TheComponentClub #Bluetooth #Bluetooth6 #IoT #Matter #Wireless #Zigbee #Thread #SmartHome #Wearables #IndustrialIoT #EmbeddedSystems #Electronics #Engineering #Innovation