How to prepare TEM samples for sub-2nm semiconductor analysis

As semiconductor features shrink below 2nm, TEM sample quality becomes the difference between accurate analysis and misleading data. Our latest blog explores: • Critical challenges in modern TEM sample prep • How to achieve sub-10nm lamella thickness • Reducing artifacts with advanced preparation techniques • Best practices for FIB damage control Essential reading for semiconductor failure analysis, metrology, and characterization professionals! Read now: https://bit.ly/46o7MMN #Semiconductors #TEM #FailureAnalysis #Pathfinding

As semiconductor features shrink below 2nm, TEM sample quality becomes the difference between accurate analysis and misleading data. Our latest blog explores: • Critical challenges in modern TEM sample prep • How to achieve sub-10nm lamella thickness • Reducing artifacts with advanced preparation techniques • Best practices for FIB damage control Essential reading for semiconductor failure analysis, metrology, and characterization professionals! Check it out: https://bit.ly/3K8tpI3 #Semiconductors #TEM #FailureAnalysis #Pathfinding

A single semiconductor chip can contain over 50 miles of intricate wiring—a testament to the complexity of modern electronics. Every wafer undergoes rigorous inspection to ensure precise wire placement. At Applied Materials, our advanced inspection technologies empower customers to accelerate time-to-market and maximize yield performance. 🔗 Learn more: https://bit.ly/3KBVeW5 #Semiconductor #Nanotechnology #YieldOptimization #TimeToMarket #WaferInspection #AppliedMaterials #ChipDesign #AdvancedManufacturing #TechInnovation #ElectronicsEngineering

Silicon polishing is a crucial step in the semiconductor manufacturing process. This meticulous procedure not only refines the surface smoothness and flatness of the wafer but also enables precise control over surface roughness. By doing so, it significantly enhances the stability and repeatability of the entire production workflow, streamlines operational efficiency, and ultimately contributes to substantial cost reductions. #silicon #PolishedSilicon #PolycrystallineSilicon #semiconductor #solar #chips

🎥 Silicon Semiconductor Magazine Interviews 'Nitrogen bubbling technology solved poor wet etching uniformity and by-product regrowth' Jim Straus, Vice President of Sales and Leo Archer, Program Director, Technical, both at ACM RESEARCH, INC., discuss the recently announced major upgrades to the company’s Ultra C wb cleaning tool, including a patent-pending nitrogen bubbling technology to provide significant wet etching uniformity improvement and enhanced cleaning performance. The technology holds significant application potential in the wet etching process for manufacturing 3D DRAM, 3D logic and 500 layer 3D NAND devices. Click the link to watch 🔗 https://lnkd.in/edTWCjpd #SSMagazine #siliconsemiconductor

Crest Ultrasonics is headed to SEMICON West 2025 to showcase our precision cleaning technology! After refurbishing or cleaning, semiconductor manufacturers must quickly eliminate all particle contamination from large process chambers and components. Crest's advanced ultrasonic systems deliver sub-micron precision cleaning for: • Automated etch tools • Dry tools designed for sub-micron particle removal • A wide range of tools and chamber components used in semiconductor processing Visit our team on October 7–9 in Phoenix, AZ at Booth #7337 to see how we help semiconductor and electronics manufacturers tackle their toughest cleaning challenges. SemiCon West: https://semiconwest.org Crest Ultrasonics Semiconductor Cleanning: https://lnkd.in/eHbJ-fmx #SemiconWest #Semiconductor #UltrasonicCleaning #CrestUltrasonics #ElectronicsManufacturing #PrecisionCleaning

⚙️ Not all silicon wafers are created equal — and it all comes down to crystal orientation. In semiconductor manufacturing, even a tiny angle can change everything. 🧪💡 🔹 ⟨100⟩: Most used for CMOS, offers easier oxidation and uniformity 🔹 ⟨110⟩: Preferred for p-type devices due to higher hole mobility 🔹 ⟨111⟩: Best packing density, but challenging to process 🔹 Orientation affects etching, doping, growth rates, and even mechanical strength 🔹 Choosing the right one = better performance + lower cost Which wafer orientation has given you the most challenges or surprises in your projects? 👇 🔗Read the full article: https://lnkd.in/euSC8SgN #SiliconWafers #SemiconductorEngineering #CrystalOrientation #WaferFabrication #CMOSDesign #NanoTech #MaterialsScience #EtchingProcess #ChipManufacturing #DiskMFR #SZYUNZE

Stronger Adhesion for Reliable Semiconductor Manufacturing MicroPrime HP builds a uniform hydrophobic layer on silicon dioxide, helping resists stick better and reducing patterning defects. It creates sharper etch profiles and delivers stable, repeatable performance across advanced processes. Proven in key steps, it supports higher yield and dependable results when precision matters most! See how MicroPrime HP improves performance: https://lnkd.in/g-Rxtiku #MicroPrimeHP #ShinEtsuMicroSi #SemiconductorManufacturing #ResistAdhesion #ProcessControl

How Foundry Provides Data to Customers: A Case Study with Samsung Foundry When a foundry like Samsung provides process data to customers (e.g., ARM as a design house), it typically delivers this information in the form of an HSPICE documentation package. This package includes corner models and parameter specifications, such as the PMOS data you provided, to help customers simulate and verify their designs across process variations (e.g., SS, FS, TT, SF, FF). Below is an organized explanation of the process and its importance: 1. Foundry Data Delivery Samsung Foundry supplies an HSPICE document containing: Corner model specifications (e.g., your table with Vth and Idsat for different W, L, and process corners). .MODEL or .SUBCKT definitions for transistors (e.g., PMOS) with parameters like threshold voltage (Vth), saturation current (Idsat), and parasitic effects. Supporting documentation detailing the process technology (e.g., 28nm, 7nm), operating conditions (e.g., Vdd, temperature), and corner definitions. Example: Your PMOS data (e.g., Vth from -0.49 V to -0.27 V, Idsat from -6.34E-07 A to -3.42E-03 A) would be included in this package, likely under a "Corner Model SPEC" section. 2. Customer Responsibility (e.g., ARM) Initial Use: ARM uses this data to build their CPU or SoC designs, simulating performance , if they found any issue, they contact with the foundry to correct it or ask for confirmation of the trend.

Our recent paper on Wafer yield prediction has been published in IEEE. Artificial intelligence is everywhere, and the semiconductor industry is no exception to that. Yield is the most critical aspect in the semiconductor industry, defining every company's revenue generation and profit margin. Please feel free to explore our paper. Thanks to Infineon Technologies for the support, and thanks to my co-author Maruf D. Md.Tarekul Islam