Technical Consultant for EU Market Entry | VPD, CAE Simulation & Compliant AI (Certified EU AI Act) | Helping innovative manufacturers succeed in Europe | A Mechanical Engineer (M.Sc. Candidate)
EV fast chargers demand relentless power, but heat is the silent killer. How are we tackling extreme thermal challenges in IGBT modules to shrink footprints and boost reliability? Liquid cold plates are essential for managing the significant heat generated by IGBTs, enabling higher power densities and compact designs (Advanced Thermal Solutions). Minimising thermal resistance is key, especially at the module-to-cold plate interface (Semikron Danfoss). Surface flatness and roughness directly impact thermal contact resistance and TIM thickness uniformity (NDIA GVSETS). Poor interfaces create bottlenecks. Revolutionary direct liquid cooling designs, integrating channels directly into the DBC substrate, eliminate multiple thermal interfaces, significantly shortening the heat path (NDIA GVSETS). This allows up to a 10x reduction in volume per watt dissipated for SiC IGBT modules, vital for EV fast charger reliability and footprint (NDIA GVSETS). Concrete takeaway: Optimal liquid cooling demands meticulous interface management, or better yet, eliminating interfaces for superior heat transfer. What's your biggest thermal challenge in scaling power electronics today? #ThermalManagement #IGBT #LiquidCooling #EVCharging #PowerElectronics
