Disadvantages of Odd Number Layer Count Circuit Boards

The disadvantages of odd-layer circuit boards mainly include high cost, difficulty in processing, easy bending and quality issues.

High Cost: Odd-number-layer PCBs have slightly lower raw material costs than even-number-layer PCBs, but the overall cost is higher due to the significant increase in processing costs. Odd-layer boards require additional lamination and core bonding processes, increasing outer layer processing costs, including the risk of scratches and etching errors.

Difficult processing: Odd-layer circuit boards require a non-standard stacking and core-layer bonding process during processing, which reduces production efficiency and increases the risk of outer layer scratches and etching errors. In addition, odd-layer circuit boards are prone to bending during the cooling process due to the different lamination tensions of the core structure and the foil structure, which increases the complexity and cost of subsequent assembly.

Easy to bend: When odd-numbered circuit boards cool down after the multi-layer circuit bonding process, the different lamination tensions of the core structure and the foil structure can cause the circuit board to bend. As the thickness of the circuit board increases, the risk of this bending will also increase, affecting the quality and production efficiency of the circuit board.

Quality Issue: The yield of odd-numbered circuit boards is usually lower than that of even-numbered circuit boards because they have weaker anti-interference capabilities and require special equipment and processes during assembly, which reduces the accuracy of component placement and damages the overall quality.