FPC material with RA and ED feature

Flexible circuit board copper foil is a conductive material used to connect electronic components on circuit boards. According to the manufacturing process and performance, PCB copper foil can be divided into two categories:

rolled copper foil (RA) and electrolytic copper foil (ED)

1.Rolled copper foil is made of pure copper blanks through continuous rolling and compression. It has a smooth surface, low roughness and good electrical conductivity, and is suitable for high-frequency signal transmission. However, the cost of rolled copper foil is higher and the thickness range is limited, usually between 9-105 µm.

2.Electrolytic copper foil is obtained by electrolytic deposition processing on a copper plate. One side is smooth and one side is rough. The rough side is bonded to the substrate, while the smooth side is used for electroplating or etching. The advantages of electrolytic copper foil are its lower cost and wide range of thicknesses, usually between 5-400 µm. However, its surface roughness is high and its electrical conductivity is poor, making it unsuitable for high-frequency signal transmission.

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