Fully automatic Advanced plasma ashing and etching equipment.

One of the latest additions to the industry leading NEO range of advanced plasma ashing and etching products.The platform can be configured with any of the available process modules and is compatible with the substrates up to 200mm in diameter.This platform can be used as a full bridge tool with the compatibility to run substrates of different type and diameter up to 200mm.

Our equipment to address a wide range of applications during the semiconductor manufacturing process. Companies involved in CMOS, Power, RF, MEMS, LED, as well as Wafer Level Packaging can benefit from our solutions. Various types of materials, wafer sizes and thicknesses could be processed.

Ashing, Descum, Etching, Surface Preparation & Cleaning

Trymax offers plasma solutions for ashing, descum, light etching, surface preparation, and cleaning. All these applications are using dry and environmental-friendly processes.

• Ashing: Consists in stripping the photo resist. Ashing is usually performed after ion implantation or etching.

• Descum: Removing remaining photoresist or polyimide on wafers for front end or wafer level packaging fabs.

• Etching: Materials such as Si3N4, SiO2 and Poly-Si can efficiently be isotropically etched in a cost-effective manner.

• Surface modification: Wide range of possibilities such as surface activation before wet etch to improve etch process step, surface adhesion enhancement before deposition, and many more.

• Cleaning: wide range of cleaning possibilities. For instance, plasma cleaning could be performed after wet etch to complete the cleaning step or after DRIE to remove some polymer from the cavity or the via.

Features

• 100 / 150 / 200mm substrate size configurable

• 4 integrated SMIF indexer or 4 open cassette stations

• 4 axis dual arm robot handling with x-track (optional)

• 2 or 4 process chambers

• 3 different process chamber technologies available:      

• Microwave downstream (2.45 GHz)      

• RF bias (13.56 MHz)      

• Dual Source (Microwave, RF bias)

• Mechanical throughput >300wph

• Compact footprint

• Very low Cost of Ownership

• Fully digital controlled, devicenet-ethernet

• Windows based industrial computers

• Cooling station and notch aligner

Applications

• Bulk resist, post LDI resist strip

• Descum processing

• Polymer removal

• Post high dose implant strip

• Silicon nitride/silicon carbide etch applications

• TaSi etch

• MEMS applications

• Advanced packaging processing (PR, PI, BCB, PBO)

• RF filter BAW/SAW resist processing

For personalized support, reach out to our expert:

Mr. Rajendra kumar Singh (DGM)

📞 Call: +91 9717004203

✉️ Email: rajendra@higgsbosonsystems.com

http://www.higgsbosonsystems.com

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