Cheryl Tulkoff

cheryl tulkoff electronics reliability reliability pcb wearable electronics printed circuit board immersion oil dfr solutions flexure pb-free sherlock ada wearable reliability smta coefficient of thermal expansion thermal cycling physics of failure smtai ecm electrochemical migration data center immersion oil cooling copper dissolution nanocoating wearable technology cheryl tulkoff. asq reliability division glass style failure analysis reliability modeling design for manufacturing ict vibration sac305 ipc 9704 innovation uv exposure wearable medical wearable tech use environment flexure warpage. cte sac rohs qfn btc immersion technology liquid immersion cooling reliability prediction server counterfeit electronics medical electronics hydrophobicity corrosion printed board tg lead free shock ipc-tr-579 pof cte fda cbe medical devices hbm mttf. mtbf human body model ted dangelmayer cbm electrical overstress cdm charged board event charged device model medical device regulation mil-hdbk-217 pad cratering jim lance telcordia sr-332 bga ipc-hdbk-830 j-std-001 ipc2221 strain silicone urethane epoxy acrylic glass transition temperature trace fracture conformal coating laminate cracking step stress root cause analysis highly accelerated reliability test reliability test halt pb-free hasl electroless palladium enig enepig immersion silver osp cleaning processes cleanliness dendritic growth dendrites contamination super hydrophobic coating medical device component storage long term storage obsolescence die banking non-functional pads non functional pads nfp dangelmayer associates esd electrostatic discharge eol in circuit test acoustic emissions ipc 9702 ipc 9708 strain gage test hot bump pull cold bump pull transient bending pad crater design failure mode and effects analysis dfmea oil cooling dielectric oil atomic layer deposition multi layer barrier films ald lotus leaf hydrophobic hermiticity accelerated testing auto reliability sir hand soldering surface insulation resistance standoff height mcc mlp son mlf lga ipc-7093 bottom termination component modulus of elasticity thermo-mechanical reliability fatigue temperature cycling market validation brett cornwell innovation commercialization rob adams asq innovation conference mstc electronic medical devices degradation capacitance delamination moisture sensitivity pb-free reflow moisture absorption process audit risk electronics quality risk management privacy medical apps healthcare ehealth healthcare apps security ehealth apps fitness tracker mobile health health tracker health app digital health advocate innovate selling ideas john daly advocacy ctea central texas electronics association sweat liquid flux cored solder wire surface finish manual soldering ptv plated through via pth. plated through hole potting coating mixed assembly lead-free sac405 creep ada randy schueller automated design analysis nate blattau underfill low-k dielectric pop tmv package on package semi sae as5553 ndaa idea iacc gidep erai counterfeit anti-counterfeit counterfeit detection counterfeit prevention hand cleaning fabrication supply chain frequency observability severity detectability rpn risk priority number failure modes and effects analysis fmea asq failure inducing loads test plan development wicking drilling silane conductive anodic filament caf mixed soldering ipc soldering dfm compressive stress whisker whisker mitigation tin whisker fr-4 ipc-dr-579