imec

From September 9–11, imec organized the 17th Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), a leading international forum on wafer cleaning, contamination control, and defect metrology. At this year’s edition, Dr. Paul Mertens presented a course on the basic principles of cleaning, covering ☑️ How contaminants interact with surfaces and fluids ☑️ Mechanisms for their removal ☑️ Guidelines to design cleaning mixtures for specific applications This foundational session was tailored for both newcomers to the field and experienced staff refreshing their knowledge, strengthening the community’s shared expertise in ultra-clean processing. A big thank you to the UCPSS organizers and participants for another successful and inspiring event in Leuven! #imec #UCPSS2025 

⚡️ 𝐄𝐥𝐞𝐜𝐭𝐫𝐢𝐟𝐲𝐢𝐧𝐠 𝐭𝐡𝐞 𝐟𝐮𝐭𝐮𝐫𝐞 𝐨𝐟 𝐛𝐢𝐨𝐞𝐥𝐞𝐜𝐭𝐫𝐨𝐧𝐢𝐜 𝐦𝐞𝐝𝐢𝐜𝐢𝐧𝐞, 𝐭𝐨𝐠𝐞𝐭𝐡𝐞𝐫. Our collaboration with CorTec marks a pivotal step in advancing closed-loop and selective peripheral nerve stimulation (sPNS). By combining 𝐢𝐦𝐞𝐜’𝐬 𝐞𝐱𝐩𝐞𝐫𝐭𝐢𝐬𝐞 𝐢𝐧 𝐜𝐡𝐢𝐩 𝐚𝐧𝐝 𝐬𝐲𝐬𝐭𝐞𝐦 𝐢𝐧𝐭𝐞𝐠𝐫𝐚𝐭𝐢𝐨𝐧 𝐰𝐢𝐭𝐡 𝐂𝐨𝐫𝐓𝐞𝐜’𝐬 𝐞𝐧𝐚𝐛𝐥𝐢𝐧𝐠 𝐭𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐲, we’re enabling intelligent, miniaturized therapies that can selectively stimulate specific nerve fibers with unprecedented accuracy.   We’re proud to be driving these innovations forward and to shape technologies that could transform the treatment of chronic diseases.   #PNS #sPNS #Bioelectronics #Neuromodulation #HealthTech

🎙️ Podcast: AI meets hardware innovation This week, our Scientific Director Axel Nackaerts joined Amelia Dalton on EE Journal’s Fish Fry podcast. Together, they explored why hardware innovation is essential for the future of AI application development, and how imec is helping to push those boundaries. The conversation dives into: 💬 The biggest challenges for the next generation of AI applications 💬 Why flexibility in hardware is key to unlocking AI’s full potential 💬 How imec is driving innovation in AI hardware design Tune in to the full episode here: https://lnkd.in/ekm2RuGY

At European Microwave Week, imec presents breakthroughs in RF packaging, InP-on-Si for ultra-fast communication, and interconnects beyond 100 GHz, while also contributing to discussions on sustainable microwave engineering and microelectronics strategy.

At Optica's Global Photonic Economic Forum 2025, Jo De Boeck, imec’s EVP and CSO, will share imec’s collaborative vision on how photonics can help meet the world’s surging AI-driven energy demand while ensuring sustainability and resilience.   Visit us at booth 34 and explore how imec, together with leading global partners, is advancing innovative photonics solutions enabling next-generation AI and data centers. Attend ITF Spain, on October 9, and discover imec’s 300mm pilot line in Málaga, our advanced technology platforms and much more. Links in comments👇

At imec the Netherlands, research doesn’t stop after a PhD. The story of Jorge Herranz Olazábal and Chris Van Hoof shows how strong industry links and mentorship lead to lasting impact, with students growing into experts who, in turn, teach their mentors. 👇

📌 Save the Date – ITF Chip into the Future 2025 On November 19, imec will host ITF Chip into the Future: Connecting innovation to impact, in Munich, Germany, during SEMICON® Europa. Semiconductors are more than just technology, they are the backbone of economic resilience and competitiveness. That’s why the EU Chips Act, with initiatives such as the NanoIC pilot line, is designed not only to push the limits of R&D, but also to ensure breakthrough innovations reach industry and society. At ITF Chip into the Future, we’ll explore: ➡️ How advanced logic nodes, 3D integration, and integrated photonics will shape industries from health to automotive and security ➡️ How EU pilot lines are bridging the gap between innovation and industrialization ➡️ Key initiatives empowering Europe’s supply chain and talent base Expect an event filled with insightful presentations, dynamic panel discussions, and valuable networking opportunities with imec experts, industry leaders, and researchers from across the semiconductor ecosystem. 👉 Mark your calendar: November 19, 2025 — Munich, during SEMICON® Europa, 10:00–14:00 🔗 Register today: https://lnkd.in/ene6nWMe SEMI Europe, SEMI, Chips Joint Undertaking

Imec takes the stage at the upcoming SPIE Photomask Technology + EUV Lithography conference in Monterey (CA) with more than 20 (co-)authored contributions.   Together with our partners, we’re pushing the boundaries of High NA EUV patterning technology, launching the industry into the angstrom era. Our talks will showcase: ☑️ Next generation patterning resolution ☑️ Dry resist process optimization ☑️ High NA EUV stitching innovations ☑️ Advanced EUV photomask development ☑️ Cutting edge metrology And much more. These contributions are the result of close collaboration with 40+ ecosystem partners and the joint ASML-imec High NA EUV Lab in Veldhoven. Since the Lab’s opening one year ago, we’ve exposed a considerable amount of wafers on the EXE:5000 scanner, and we are thrilled to share our learnings with the community.   Take a sneak peek at our contributions and stay tuned for more news! https://lnkd.in/eM4t7CFV SPIE, the international society for optics and photonics

🌍 In his interview with Bloomberg, imec CEO Luc Van den hove highlights a simple truth: no one can meet the demands of AI alone. Building a sustainable AI ecosystem will require innovation at every layer and global collaboration, combining the strengths of every region. Watch the full interview on the link below 👇 https://lnkd.in/em82hVtw

Within a few years, metal pitches within the most critical back-end-of-line layers of advanced logic and memory chips will drop below 20nm. For these layers, Cu dual-damascene integration – the industry’s workhorse for fabricating interconnects – will run out of steam.   In a recent article published in Semiconductor Engineering, interconnect experts highlight the potential of ruthenium (Ru) as an alternative conductor and discuss new metal integration schemes. View comments by imec’s Marleen van der Veen and Christoph Adelmann on the promises and challenges of using Ru in the most critical interconnect layers – backed by imec’s pioneering work on alternative conductors and innovative integration process of dual-direct metal etch (DDMe). Learn more: https://lnkd.in/gHEzec_d