Personal Information
Organización/Lugar de trabajo
Bengaluru Area, India India
Ocupación
Electrical Engineer|PCB Design|New product development|Lean Manufacturing methodologies|Value Stream Mapping|
Sector
Electronics / Computer Hardware
Etiquetas
layout editor
printed circuit board
schematic editor
solder
eagle
etch
mask
route
surface mount devices
through hole components
components type & their footprint
design
types of pcb- single/double layer/multi-layer
manual routing & autorouter
evolution of pcb
pcb layout
melf (metal electrode leadless face)
soic (small outline integrated circuits)
tsop (thin small outline package)
sot (small outline transistors)
diodes
crystals
plcc (plastic leaded chip carriers)
pqfp (plastic quad flat pack)
smt v/s through hole
electrostatic discharge
basic smt proces
smt overview
rohs
equipments used smt assembly
through hole assembly & soldering
Ver más
Presentaciones
(4)Personal Information
Organización/Lugar de trabajo
Bengaluru Area, India India
Ocupación
Electrical Engineer|PCB Design|New product development|Lean Manufacturing methodologies|Value Stream Mapping|
Sector
Electronics / Computer Hardware
Etiquetas
layout editor
printed circuit board
schematic editor
solder
eagle
etch
mask
route
surface mount devices
through hole components
components type & their footprint
design
types of pcb- single/double layer/multi-layer
manual routing & autorouter
evolution of pcb
pcb layout
melf (metal electrode leadless face)
soic (small outline integrated circuits)
tsop (thin small outline package)
sot (small outline transistors)
diodes
crystals
plcc (plastic leaded chip carriers)
pqfp (plastic quad flat pack)
smt v/s through hole
electrostatic discharge
basic smt proces
smt overview
rohs
equipments used smt assembly
through hole assembly & soldering
Ver más