SURFACE MOUNT DEVICES-TYPES
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The seminar presented by Mr. Abdul Munaff focused on various types of surface mount technology (SMT) components, including small outline transistors (SOT), diodes, crystals, and different integrated circuit packages. It detailed specific characteristics and case sizes for components such as capacitors and resistors, along with their dimensions and designations. Additionally, it highlighted packaging methods for components like MELF and QFP.
SURFACE MOUNT DEVICES-TYPES
- 1. A Seminar on PRESENTED BY: Mr. ABDUL MUNAFF Asst. Professor DEPARTMENT OF ELECTICAL & ELECTRONICS ENGINEERING, SIET, VIJAYAPURA.
- 2. Types of SMT components SOT (Small Outline Transistors) Diodes Crystals SOIC (Small Outline Integrated Circuits) PLCC (Plastic Leaded Chip Carriers) PQFP (Plastic Quad Flat Pack) TSOP (Thin Small Outline Package) MELF (Metal Electrode Leadless Face)
- 3. SOT (Small Outline Transistor)
- 4. PLCC (Plastic leaded chip carrier)
- 6. Diode (MELF)
- 7. Capacitor Case Sizes 0402-2225 0402-2225 0402-1210 0603-2225 Capacitance 0.5 pf- 100 pf 1000 pf 0.001 uf- Range 0.065 uf 2.2 uf 0.47uf 4.7 uf
- 9. Resistor Case Sizes LENGTH WIDTH HEIGHT TERMINATION DESIGNATION NOM (L) NOM (W) MAX (H) MIN (T) R0402 0.04 0.02 0.016 0.004 R0603 0.06 0.03 0.024 0.006 R0805 0.08 0.05 0.028 0.006 R1206 0.12 0.06 0.028 0.01 R1210 0.12 0.1 0.028 0.01 R2010 0.2 0.1 0.028 0.014 R2512 0.25 0.12 0.028 0.014
- 10. MELF (Metal Electrode Leadless Face) Cylindrical in shape (like discrete through hole without leads) Used for diodes (lamp), resistors, and capacitors May require notch land pattern
- 11. QFP (Quad Flat Package)
- 12. SOIC (tape feed)
- 13. Chip (tape feed)