SlideShare a Scribd company logo
2
Most read
3
Most read
4
Most read
Data sheet 1.2V Full local Analog I/O
TSMC 65nm
Sofics has verified its TakeCharge ESD protection clamps on technology
nodes between 0.25um CMOS down to 5nm across various fabs and
foundries. The ESD clamps are silicon and product proven in more than 4500
mass produced IC-products. The cells provide competitive advantage
through improved yield, reduced silicon footprint and enable advanced
multimedia and wireless interfaces like HDMI, USB 3.0, SATA, WIFI, GPS and
Bluetooth.
The Analog I/O clamp described in this document can be used for 1.2V pads
in the TSMC 65nm CMOS technology.
Data sheet: TSMC 65nm 1.2V Full local protection Analog I/O DS-TS65-AIO1V2-FL
Sofics Proprietary – ©2021 Page 2
TSMC 65nm 1.2V Full local Analog I/O
Clamp type and usage
The Sofics ESD cells cover all types of protection concepts and approaches as detailed in the figure below. The ESD
clamp cell described in this document is a type C solution.
TSMC 65nm 1.2V Comments
Core Protection
Input Protection YES
Output Protection YES
I/O Protection YES
Over Voltage Tolerant I/O (OVT)
Under Voltage Tolerant I/O (UVT)
Inter Domain Protection
Stress cases covered
PAD to VSS Local clamp VSS to PAD Integrated Diode
VDD to PAD Local clamp PAD to VDD Integrated Diode
VDD to VSS Integrated Power clamp VSS to VDD Integrated Reverse diode
Connections in the cell
• IO, VDD, VSS
Features
▪ Customized efficient 1.2V ESD IO and core protection
o ± 2 kV Human Body Model (HBM)
o ± 200 V Machine Model (MM)
o Latch-Up safe
▪ Low Clamping Voltage
▪ Includes an additional Powerclamp
▪ Small Area Dimensions
o Pitch = 50 µm
o Metals used: M1-M4 (M3-M4 bus)
Data sheet: TSMC 65nm 1.2V Full local protection Analog I/O DS-TS65-AIO1V2-FL
Sofics Proprietary – ©2021 Page 3
Maximum ratings
Rating Symbol Value Unit
Min Max
Supply Voltage Range (DC) VDD -0.3 1.32 V
Input/Output Voltage Range (DC) VIO -0.3 1.32 V
Operating Temperature Top -25 125 °C
Burn-in Voltage (DC @ 125°C) 1.8 V
Stresses exceeding these maximum ratings may damage the device. Functional operation above the recommended operating
conditions is not implied. Extended exposure to stresses above the recommended operating conditions may affect device
reliability.
The provided golden cell is designed for these maximum ratings/specifications. If the desired specification level differs, the
golden cell has to be scaled up or down by using the Sofics implementation/scaling guidelines to remain a robust and effective
ESD protection for the different specifications.
Electrical Characteristics
Tamb = 25°C unless stated otherwise
Parameter Symbol Min. Typ. Max. Unit
Trigger Voltage Vt1 - 3.16 - V
Holding Voltage Vh - 1.93 - V
Breakdown Current It2 - 2.7 - A
Breakdown Voltage Vt2 - 4.5 - V
Maximum Current Imax - 2.1 - A
Maximum Voltage Vmax - 4.0 - V
On-Resistance Ron - 0.96 - Ohm
Leakage current IO @ Tamb = 25 °C
IO @ 1.2V
VDD @ 1.2V
Ileak - 20 - pA
Leakage current IO @ Tamb = 125 °C
IO @ 1.2V
VDD @ 1.2V
Ileak - 50 - nA
Leakage current VDD @ Tamb = 25 °C
IO @ 1.2V
VDD @ 1.2V
Ileak - 30 - pA
Data sheet: TSMC 65nm 1.2V Full local protection Analog I/O DS-TS65-AIO1V2-FL
Sofics Proprietary – ©2021 Page 4
Leakage current VDD @ Tamb = 125 °C
IO @ 1.2V
VDD @ 1.2V
Ileak - 45 - nA
Capacitance @ Tamb = 25 °C
(Only junction capacitance)
Cjunction 180 - 190 fF
HBM – Human Body Model
(applicable for standalone golden cell)
-2 - +2 kV
MM – Machine Model
(applicable for standalone golden cell)
-200 - +200 V
Process, Area and integration
▪ Process: TSMC 65 nm – LP
▪ Used Metals: 4 metals
▪ Special needed Layer: N/A
▪ Cell Area: 5997µm² (50.29 µm x 119.235 µm)
▪ Clamp Area: 1906µm² (50.04 µm x 38.1 µm)
Customization possible
▪ Different metallization scheme
▪ Different ESD robustness level
▪ Different aspect ratio
▪ Different behaviour (Vt1, Vh, …)
▪ Tolerated voltage
Data sheet: TSMC 65nm 1.2V Full local protection Analog I/O DS-TS65-AIO1V2-FL
Sofics Proprietary – ©2021 Page 5
About Sofics
Sofics is a foundry independent semiconductor IP provider that has supported 100+ companies worldwide
with customized/specialty Analog IOs and on-chip ESD protection. Fabless companies using Sofics IP can
enable higher performance, higher robustness and reduce design time and cost. Our technology has been
characterized on 10 foundries including advanced nodes at TSMC, UMC, GF.
Sofics IP is used for design projects at 4 of the top-5 semiconductor companies, 6 out of the top-10. The
technology has been silicon proven on more than 50 different processes and integrated into more than 4500
IC designs since 2000.
Sofics is a TSMC 9000™ quality approved ESD solutions provider for TSMC processes
Contact us
Sofics BV
BTW BE 0472.687.037 RPR Gent afdeling Oostende
Engineering office
Sint-Godelievestraat 32
9880 Aalter, Belgium
Website: www.sofics.com
Connect through email: info@mail.sofics.com
Notes
As is the case with many published ESD design solutions, the techniques and protection solutions described
in this data sheet are protected by patents and patents pending and cannot be copied freely. PowerQubic,
TakeCharge, and Sofics are trademarks of Sofics BV.

More Related Content

PDF
1.2V Analog I/O library for TSMC 65nm technology
PDF
Nanometer layout handbook at high speed design
PDF
ESD protection
PPTX
MOSFET, SOI-FET and FIN-FET-ABU SYED KUET
PPTX
SILICON ON INSULATOR
PPT
Low Power Design Techniques for ASIC / SOC Design
PPT
Analog Layout and Process Concern
PPTX
Packaging of vlsi devices
1.2V Analog I/O library for TSMC 65nm technology
Nanometer layout handbook at high speed design
ESD protection
MOSFET, SOI-FET and FIN-FET-ABU SYED KUET
SILICON ON INSULATOR
Low Power Design Techniques for ASIC / SOC Design
Analog Layout and Process Concern
Packaging of vlsi devices

What's hot (20)

PDF
2019 Local I/O ESD protection for 28Gbps to 112Gbps SerDes interfaces in adva...
PDF
Local I/O ESD protection for 28Gbps to 112Gbps SerDes interfaces in advanced ...
PPTX
Silicon on Insulator (SOI) Technology
PPTX
MOSFET and Short channel effects
PPTX
High k dielectric
PPTX
Package fabrication technolog ynew
PPTX
Analog Layout basic Analog Layout basic Analog Layout basic
PDF
OVERVIEW OF IC PACKAGING
PDF
Layout02 (1)
PPTX
Finfet; My 3rd PPT in clg
PDF
Analog Layout design
PPTX
Wide bandgap semiconductor
PDF
Lecture 2 ic fabrication processing & wafer preparation
PPTX
SUPERJUNCTION IN Silicon Carbide Diodes
PPTX
PPTX
VLSI Design-Lecture2 introduction to ic technology
PPTX
Study of inter and intra chip variations
PPTX
CMOS N P Twin Tub Well Formation
PPT
Low Power Techniques
2019 Local I/O ESD protection for 28Gbps to 112Gbps SerDes interfaces in adva...
Local I/O ESD protection for 28Gbps to 112Gbps SerDes interfaces in advanced ...
Silicon on Insulator (SOI) Technology
MOSFET and Short channel effects
High k dielectric
Package fabrication technolog ynew
Analog Layout basic Analog Layout basic Analog Layout basic
OVERVIEW OF IC PACKAGING
Layout02 (1)
Finfet; My 3rd PPT in clg
Analog Layout design
Wide bandgap semiconductor
Lecture 2 ic fabrication processing & wafer preparation
SUPERJUNCTION IN Silicon Carbide Diodes
VLSI Design-Lecture2 introduction to ic technology
Study of inter and intra chip variations
CMOS N P Twin Tub Well Formation
Low Power Techniques
Ad

Similar to 1.2V Analog I/O with full local ESD protection for TSMC 65nm technology (20)

PDF
1.2V Over-voltage tolerant Analog I/O for TSMC 65nm technology
DOCX
1.2V core power clamp for TSMC 65nm technology
PPTX
Introduction to TakeCharge on-chip ESD solutions from Sofics
PPTX
Sofics Linkedin
PDF
On-Chip Solutions for ESD/EOS/Latch up/EMC
PDF
2011 Latch-up immune ESD Protection Clamp for High Voltage optimized on TSMC ...
PDF
How to protect electronic systems against esd
PDF
White paper on Sofics hebistor clamps
PDF
Digital Isolators
PPT
RICH
PDF
info diodos tvs.pdf
PDF
Ditek TSS1 Data Sheet
PDF
Surge Protection - Main Incoming Supply Sub Distribution Boards Socket Outlet...
PDF
On-Chip ESD Protection Achieving 8kV HBM Without Compromising the 3.4Gbps HDM...
PDF
Netzer DS 58 Specsheet
PDF
2010 The Hebistor Device: Novel latch-up immune ESD Protection Clamp for High...
PDF
ST on 96Boards OpenHours - System level ESD protection
PPTX
Applying Digital Isolators in Motor Control
PDF
Netzer DS 90 Specsheet
PDF
36 td sst150
1.2V Over-voltage tolerant Analog I/O for TSMC 65nm technology
1.2V core power clamp for TSMC 65nm technology
Introduction to TakeCharge on-chip ESD solutions from Sofics
Sofics Linkedin
On-Chip Solutions for ESD/EOS/Latch up/EMC
2011 Latch-up immune ESD Protection Clamp for High Voltage optimized on TSMC ...
How to protect electronic systems against esd
White paper on Sofics hebistor clamps
Digital Isolators
RICH
info diodos tvs.pdf
Ditek TSS1 Data Sheet
Surge Protection - Main Incoming Supply Sub Distribution Boards Socket Outlet...
On-Chip ESD Protection Achieving 8kV HBM Without Compromising the 3.4Gbps HDM...
Netzer DS 58 Specsheet
2010 The Hebistor Device: Novel latch-up immune ESD Protection Clamp for High...
ST on 96Boards OpenHours - System level ESD protection
Applying Digital Isolators in Motor Control
Netzer DS 90 Specsheet
36 td sst150
Ad

More from Sofics (20)

PDF
Optimized Local I/O ESD Protection for SerDes In Advanced SOI, BiCMOS and Fin...
PDF
Tsmc65 1v2 full local protection analog io + cdm
PDF
2011 ESD relevant issues and solutions for overvoltage tolerant, hot swap, op...
PDF
2011 Protection of a 3.3V Domain and Switchable 1.8V/3.3V I/O in 40nm and 28n...
PDF
2012 The impact of a decade of Technology downscaling
PDF
2012 Protection strategy for EOS (IEC 61000-4-5)
PDF
2012 Unexpected failures due to dynamic avalanching caused by bipolar ESD stress
PDF
2017 Low Capacitive Dual Bipolar ESD Protection
PDF
ESD protection with ultra-low parasitic capacitance for high bandwidth commun...
PDF
Sofics ESD solutions for FinFET processes
PDF
Design of ESD protection for high-speed interfaces
PPTX
Optimization of On-chip ESD protection with ultra-low parasitic capacitance t...
PPTX
Developing robust, 5V tolerant analog I/O libraries for CMOS processes & FinF...
PPTX
Optimizing I/O’s and ESD protection to reduce power consumption in SOI applic...
PPTX
IoT workshop - Is 1kV Also Enough for IoT ESD Protection – Do Current Test Me...
PDF
On-chip ESD protection for Silicon Photonics
PDF
On chip esd protection for Internet of Things
PDF
On-Chip ESD Protection with Improved High Holding Current SCR (HHISCR) Achiev...
PDF
Patented solution to improve ESD robustness of SOI MOS transistors
PDF
Patented way to create Silicon Controlled Rectifiers in SOI technology
Optimized Local I/O ESD Protection for SerDes In Advanced SOI, BiCMOS and Fin...
Tsmc65 1v2 full local protection analog io + cdm
2011 ESD relevant issues and solutions for overvoltage tolerant, hot swap, op...
2011 Protection of a 3.3V Domain and Switchable 1.8V/3.3V I/O in 40nm and 28n...
2012 The impact of a decade of Technology downscaling
2012 Protection strategy for EOS (IEC 61000-4-5)
2012 Unexpected failures due to dynamic avalanching caused by bipolar ESD stress
2017 Low Capacitive Dual Bipolar ESD Protection
ESD protection with ultra-low parasitic capacitance for high bandwidth commun...
Sofics ESD solutions for FinFET processes
Design of ESD protection for high-speed interfaces
Optimization of On-chip ESD protection with ultra-low parasitic capacitance t...
Developing robust, 5V tolerant analog I/O libraries for CMOS processes & FinF...
Optimizing I/O’s and ESD protection to reduce power consumption in SOI applic...
IoT workshop - Is 1kV Also Enough for IoT ESD Protection – Do Current Test Me...
On-chip ESD protection for Silicon Photonics
On chip esd protection for Internet of Things
On-Chip ESD Protection with Improved High Holding Current SCR (HHISCR) Achiev...
Patented solution to improve ESD robustness of SOI MOS transistors
Patented way to create Silicon Controlled Rectifiers in SOI technology

Recently uploaded (20)

PDF
BIO-INSPIRED HORMONAL MODULATION AND ADAPTIVE ORCHESTRATION IN S-AI-GPT
PDF
Soil Improvement Techniques Note - Rabbi
PDF
Level 2 – IBM Data and AI Fundamentals (1)_v1.1.PDF
PDF
Integrating Fractal Dimension and Time Series Analysis for Optimized Hyperspe...
PPTX
Nature of X-rays, X- Ray Equipment, Fluoroscopy
PPT
INTRODUCTION -Data Warehousing and Mining-M.Tech- VTU.ppt
PDF
737-MAX_SRG.pdf student reference guides
PDF
SMART SIGNAL TIMING FOR URBAN INTERSECTIONS USING REAL-TIME VEHICLE DETECTI...
PPTX
MET 305 2019 SCHEME MODULE 2 COMPLETE.pptx
PDF
Exploratory_Data_Analysis_Fundamentals.pdf
PDF
EXPLORING LEARNING ENGAGEMENT FACTORS INFLUENCING BEHAVIORAL, COGNITIVE, AND ...
PPTX
Artificial Intelligence
PPTX
Fundamentals of Mechanical Engineering.pptx
PDF
86236642-Electric-Loco-Shed.pdf jfkduklg
PPT
Occupational Health and Safety Management System
PPTX
CURRICULAM DESIGN engineering FOR CSE 2025.pptx
PDF
Enhancing Cyber Defense Against Zero-Day Attacks using Ensemble Neural Networks
PDF
Human-AI Collaboration: Balancing Agentic AI and Autonomy in Hybrid Systems
PDF
Mitigating Risks through Effective Management for Enhancing Organizational Pe...
PPT
A5_DistSysCh1.ppt_INTRODUCTION TO DISTRIBUTED SYSTEMS
BIO-INSPIRED HORMONAL MODULATION AND ADAPTIVE ORCHESTRATION IN S-AI-GPT
Soil Improvement Techniques Note - Rabbi
Level 2 – IBM Data and AI Fundamentals (1)_v1.1.PDF
Integrating Fractal Dimension and Time Series Analysis for Optimized Hyperspe...
Nature of X-rays, X- Ray Equipment, Fluoroscopy
INTRODUCTION -Data Warehousing and Mining-M.Tech- VTU.ppt
737-MAX_SRG.pdf student reference guides
SMART SIGNAL TIMING FOR URBAN INTERSECTIONS USING REAL-TIME VEHICLE DETECTI...
MET 305 2019 SCHEME MODULE 2 COMPLETE.pptx
Exploratory_Data_Analysis_Fundamentals.pdf
EXPLORING LEARNING ENGAGEMENT FACTORS INFLUENCING BEHAVIORAL, COGNITIVE, AND ...
Artificial Intelligence
Fundamentals of Mechanical Engineering.pptx
86236642-Electric-Loco-Shed.pdf jfkduklg
Occupational Health and Safety Management System
CURRICULAM DESIGN engineering FOR CSE 2025.pptx
Enhancing Cyber Defense Against Zero-Day Attacks using Ensemble Neural Networks
Human-AI Collaboration: Balancing Agentic AI and Autonomy in Hybrid Systems
Mitigating Risks through Effective Management for Enhancing Organizational Pe...
A5_DistSysCh1.ppt_INTRODUCTION TO DISTRIBUTED SYSTEMS

1.2V Analog I/O with full local ESD protection for TSMC 65nm technology

  • 1. Data sheet 1.2V Full local Analog I/O TSMC 65nm Sofics has verified its TakeCharge ESD protection clamps on technology nodes between 0.25um CMOS down to 5nm across various fabs and foundries. The ESD clamps are silicon and product proven in more than 4500 mass produced IC-products. The cells provide competitive advantage through improved yield, reduced silicon footprint and enable advanced multimedia and wireless interfaces like HDMI, USB 3.0, SATA, WIFI, GPS and Bluetooth. The Analog I/O clamp described in this document can be used for 1.2V pads in the TSMC 65nm CMOS technology.
  • 2. Data sheet: TSMC 65nm 1.2V Full local protection Analog I/O DS-TS65-AIO1V2-FL Sofics Proprietary – ©2021 Page 2 TSMC 65nm 1.2V Full local Analog I/O Clamp type and usage The Sofics ESD cells cover all types of protection concepts and approaches as detailed in the figure below. The ESD clamp cell described in this document is a type C solution. TSMC 65nm 1.2V Comments Core Protection Input Protection YES Output Protection YES I/O Protection YES Over Voltage Tolerant I/O (OVT) Under Voltage Tolerant I/O (UVT) Inter Domain Protection Stress cases covered PAD to VSS Local clamp VSS to PAD Integrated Diode VDD to PAD Local clamp PAD to VDD Integrated Diode VDD to VSS Integrated Power clamp VSS to VDD Integrated Reverse diode Connections in the cell • IO, VDD, VSS Features ▪ Customized efficient 1.2V ESD IO and core protection o ± 2 kV Human Body Model (HBM) o ± 200 V Machine Model (MM) o Latch-Up safe ▪ Low Clamping Voltage ▪ Includes an additional Powerclamp ▪ Small Area Dimensions o Pitch = 50 µm o Metals used: M1-M4 (M3-M4 bus)
  • 3. Data sheet: TSMC 65nm 1.2V Full local protection Analog I/O DS-TS65-AIO1V2-FL Sofics Proprietary – ©2021 Page 3 Maximum ratings Rating Symbol Value Unit Min Max Supply Voltage Range (DC) VDD -0.3 1.32 V Input/Output Voltage Range (DC) VIO -0.3 1.32 V Operating Temperature Top -25 125 °C Burn-in Voltage (DC @ 125°C) 1.8 V Stresses exceeding these maximum ratings may damage the device. Functional operation above the recommended operating conditions is not implied. Extended exposure to stresses above the recommended operating conditions may affect device reliability. The provided golden cell is designed for these maximum ratings/specifications. If the desired specification level differs, the golden cell has to be scaled up or down by using the Sofics implementation/scaling guidelines to remain a robust and effective ESD protection for the different specifications. Electrical Characteristics Tamb = 25°C unless stated otherwise Parameter Symbol Min. Typ. Max. Unit Trigger Voltage Vt1 - 3.16 - V Holding Voltage Vh - 1.93 - V Breakdown Current It2 - 2.7 - A Breakdown Voltage Vt2 - 4.5 - V Maximum Current Imax - 2.1 - A Maximum Voltage Vmax - 4.0 - V On-Resistance Ron - 0.96 - Ohm Leakage current IO @ Tamb = 25 °C IO @ 1.2V VDD @ 1.2V Ileak - 20 - pA Leakage current IO @ Tamb = 125 °C IO @ 1.2V VDD @ 1.2V Ileak - 50 - nA Leakage current VDD @ Tamb = 25 °C IO @ 1.2V VDD @ 1.2V Ileak - 30 - pA
  • 4. Data sheet: TSMC 65nm 1.2V Full local protection Analog I/O DS-TS65-AIO1V2-FL Sofics Proprietary – ©2021 Page 4 Leakage current VDD @ Tamb = 125 °C IO @ 1.2V VDD @ 1.2V Ileak - 45 - nA Capacitance @ Tamb = 25 °C (Only junction capacitance) Cjunction 180 - 190 fF HBM – Human Body Model (applicable for standalone golden cell) -2 - +2 kV MM – Machine Model (applicable for standalone golden cell) -200 - +200 V Process, Area and integration ▪ Process: TSMC 65 nm – LP ▪ Used Metals: 4 metals ▪ Special needed Layer: N/A ▪ Cell Area: 5997µm² (50.29 µm x 119.235 µm) ▪ Clamp Area: 1906µm² (50.04 µm x 38.1 µm) Customization possible ▪ Different metallization scheme ▪ Different ESD robustness level ▪ Different aspect ratio ▪ Different behaviour (Vt1, Vh, …) ▪ Tolerated voltage
  • 5. Data sheet: TSMC 65nm 1.2V Full local protection Analog I/O DS-TS65-AIO1V2-FL Sofics Proprietary – ©2021 Page 5 About Sofics Sofics is a foundry independent semiconductor IP provider that has supported 100+ companies worldwide with customized/specialty Analog IOs and on-chip ESD protection. Fabless companies using Sofics IP can enable higher performance, higher robustness and reduce design time and cost. Our technology has been characterized on 10 foundries including advanced nodes at TSMC, UMC, GF. Sofics IP is used for design projects at 4 of the top-5 semiconductor companies, 6 out of the top-10. The technology has been silicon proven on more than 50 different processes and integrated into more than 4500 IC designs since 2000. Sofics is a TSMC 9000™ quality approved ESD solutions provider for TSMC processes Contact us Sofics BV BTW BE 0472.687.037 RPR Gent afdeling Oostende Engineering office Sint-Godelievestraat 32 9880 Aalter, Belgium Website: www.sofics.com Connect through email: info@mail.sofics.com Notes As is the case with many published ESD design solutions, the techniques and protection solutions described in this data sheet are protected by patents and patents pending and cannot be copied freely. PowerQubic, TakeCharge, and Sofics are trademarks of Sofics BV.