New research on GaN-based AC-DC converters with ZVS performance

Say hello to the future of semiconductor testing with the Autonomous High-Power Measurement Assistant. Engineered for high-power devices like SiC and GaN, it takes the complexity out of testing by automating processes under extreme thermal and electrical conditions. With intelligent probe control and real-time adjustments, it ensures precision, reliability, and maximum throughput—all while reducing operator input. Perfect for next-gen power device characterization, it’s a game-changer in the lab. https://lnkd.in/gFXK24Np #Semiconductors #PowerDevices #GaN #SiC #HighPowerTesting #AutomatedTesting #TechInnovation #PowerSemiconductors

"Non-volatile reconfigurable planar lightwave circuit splitter enabled by laser-directed Sb2S3 phase transitions", published in Opto-Electronic Technology https://lnkd.in/g8JbNFt4 Full-length paper available at https://lnkd.in/gjJ6PJxQ

🔬 Okika Devices, a Colorado Springs-based developer of field programmable analog array (#FPAA) integrated circuits, has received an investment from Colorado ONE Fund. 💡 While the deal amount was not disclosed, the funding will enable Okika Devices Inc. Devices to: ✅ Expand operations ✅ Advance FPAA development efforts ✅ Strengthen its presence within Colorado’s innovation ecosystem Led by CEO William Staunton III, Okika Devices specializes in analog signal processing and the development of FPAAs — integrated circuits that allow engineers to dynamically configure analog functions through software, much like FPGAs do for digital circuits. This flexibility accelerates prototyping, reduces costs, and enables the rapid deployment of complex analog systems. The investment also follows the company’s recent move to the Catalyst Campus in downtown Colorado Springs, a hub for aerospace, defense, and advanced technology collaboration. #Semiconductors #AnalogTech #FPAA #DeepTech #FundingNews

🎥 PEW Magazine Interviews 'Integrated Voltage Regulators for advanced electronics' Noah Sturcken, CEO of Ferric, Inc., discusses the power delivery problem as AI workloads surge and chip architectures grow denser – traditional power solutions can’t cope. Step forward Ferric’s proprietary thin-film, magnetic materials technology, representing a breakthrough in integrated power management which has enabled the company to build the world’s smallest, most efficient power converters, including the highest density DC-DC power converter, to power the future of computing and all digital electronics. Click the link to watch 🔗 https://lnkd.in/e6XCje4E #PEWMagazine #powerelectronicsworld #powerelectronics

Today, ECCE Europe 2025 came to an end, and I’d like to share my takeaways: 1. DC is making a comeback, not only HVDC but also LVDC. This trend brings new demands for fast and reliable fault protection algorithms. 2. V2G (Vehicle-to-Grid) is happening faster than I expected. Since your car battery is no longer entirely under your control, aggregators need to apply smart charging and discharging strategies to optimize both State of Charge (SoC) and State of Health (SoH). 3. Batteries, especially for xEVs, are experiencing skyrocketing demand. This is the time for material scientists to explore new chemistries. Key factors remain power density, cost-effectiveness, and life cycle. The LFMP chemistry is becoming the focus. 4. MATLAB is catching up with PLECS in modeling power losses and thermal responses in semiconductor switches. By extracting parameters directly from device xml files, Simulink can now offer capabilities similar to PLECS, thus reducing the need for the PLECS blockset in Simulink. I'll probably make a separate post on this. …and many more interesting discussions and presentations throughout the conference. Thanks to Silvia Mastellone and Martin Geidl for their support. NCCR Automation Hochschule für Technik und Umwelt FHNW ECCE Europe #ECCEEurope2025 #powerelectronics #NCCRAutomation #powerconverter

I’m excited to share our latest work presented at PCIM Europe 2025: “Next Generation SiC Technology Targeting Long Distance Driving.” In this paper, we explore how next-generation 1200 V CoolSiC™ trench MOSFETs push the boundaries of electric vehicle inverters. Their low conduction and switching losses, combined with the ability to operate up to 200 °C, improve efficiency, extend driving range, and reduce overall system cost - all of which are key enablers for long-distance EV driving. Read more here: https://lnkd.in/e_Dk-UrT #SiC #PowerElectronics #WideBandgap #ElectricVehicles #EVInverter #EnergyEfficiency #PCIM

Wireless charging is no longer a future promise. It’s here, and it’s changing how we power EVs and AGVs. At IECON 2025, the tutorial Advanced Static and Dynamic Wireless Charging will take a practical look at: - The fundamentals of wireless power transfer - Designing misalignment-tolerant magnetic couplers - Control strategies for better efficiency - Real case studies from static and dynamic charging It’s a chance to discuss real challenges, explore solutions, and see where wireless charging is headed next. Lecturers: Chi-Seng Lam, Zhicong Huang, Io-Wa Iam https://lnkd.in/ddXd44VM #IECON2025 #WirelessCharging #EVs #PowerElectronics

Learn more about our quantum diamond cryomicroscope! It’s already uncovering insights that inform superconductor electronics design, and we foresee a broader impact across quantum and materials science, as well as electronics diagnostics. https://lnkd.in/eBxwQ9HE

Thermal Limits of GaN HEMTs I’ve been working with Silvaco TCAD to study how thermal stress impacts Gallium Nitride (GaN) High Electron Mobility Transistors (HEMTs), devices that are reshaping power electronics, radar, EVs, and next-gen communication systems. Here’s what the simulations revealed: > Threshold voltage shifted from -6 V to -7.5 V under heating. > Drain current collapsed at higher voltages due to self-heating. > Mobility degradation in the 2DEG channel limited the performance. The takeaway? GaN’s wide bandgap advantage is undeniable, but thermal reliability is the make-or-break factor for its future in high-power, high-frequency systems. From defense radar to electric vehicles, success depends on mastering thermal management at the device level. I take pride in bridging semiconductor device physics with practical engineering challenges, as the next wave of innovation will be driven not only by speed and power, but by the ability to ensure stability under thermal stress. #GaN #HEMT #TCAD #Semiconductors #PowerElectronics #Innovation #ThermalManagement

A recently-published technical conference paper describes an NVE magnetic #sensor, an Arduino and a Digital-to-Analog Converter to measure magnetic fields with excellent linearity. https://lnkd.in/ggAXkb2P