🚀 At #AppliedMaterials, we don’t just build tools—we engineer the future of electronics. Our cutting-edge systems fine-tune wafer surfaces with extreme precision, adjusting temperature, pressure, plasma, and more to create the perfect material layers. It’s innovation at the atomic level—powering everything from smartphones to supercomputers. 🔬 Curious how we do it? Dive in: https://bit.ly/3KBVeW5 #Semiconductors #MaterialsEngineering #TechInnovation #WaferMagic #FutureElectronics
How Applied Materials engineers the future of electronics
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IEEE Spectrum “Cooling of smaller portables like phones must focus on spreading heat as widely as possible to the surface of the device, with particular attention to heat-generating components like the chip,” says #KennethGoodson, a professor of mechanical engineering at Stanford University who specializes in heat transfer and energy conversion. https://lnkd.in/dzujc5_m
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🔌 #OnThisDay in 1958, Jack Kilby of Texas Instruments successfully demonstrated the first integrated circuit. His prototype used a small piece of germanium with five interconnected components, showing that resistors and capacitors could be built together on a single semiconductor material. This breakthrough laid the foundation for the microchip and transformed the future of electronics, enabling everything from personal computers to smartphones. A reminder of how one innovation can reshape entire industries. #OnThisDay #TechHistory #Innovation #Electronics #ComputerHistory
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Electronic packaging is the invisible backbone of modern technology. Whether it’s shielding smartphones, managing heat in fighter jets, or protecting circuits on satellites, the way we package electronics determines performance, reliability, and even sustainability. This video explores how innovations in advanced materials, thermal management, hermetic sealing, and even microfluidic cooling are transforming the field. 🌍 Why it matters: packaging is no longer just protection — it’s an active part of the technology. 📺 Watch the video: https://lnkd.in/g2ndfYbz 📖 Read the full article: https://lnkd.in/geZnbcSQ #ElectronicPackaging #ElectronicsDesign #AdvancedMaterials #MilitaryElectronics #FutureOfTech #DefenseInnovation
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📱🔊 The Hidden Challenges uSpeakers: Non-Linearities We often take for granted how much sound our smartphones / laptop / notebooks deliver from speakers that are thin and tiny. But behind that convenience lies one of audio engineering’s toughest challenges: non-linearities in micro speakers. Unlike large home or car speakers, micro speakers face extreme design constraints—tiny enclosures, limited excursion, and high SPL demands. The result? Distortion caused by: • Non-linear suspension and diaphragm movement • Magnetic field variations at high excursions • Voice coil heating in small form factors These non-linearities introduce harmonic distortion, intermodulation artifacts, and dynamic compression, which can make music sound harsh and limit bass performance. 👉 How to address speaker non-linearities? • Advanced materials & suspensions to extend speaker linearity zone (can be expensive) • DSP-based pre-distortion to “cancel out” known non-linearities (harmonics / DC excursion) • Feedback sensors that monitor coil motion and adapt in real time (needs additional sensors like mic or dual Vsns) • Smart tuning that balances loudness, clarity, and reliability (need to give up on excursion / thermal headroom) TI has been investing heavily in pre-distortion and excursion domain DC removal mechanisms to address adverse effects of speaker non-linearities. TI’s patented techniques help to reduce your overall system cost while getting the best acoustic performance from small speakers. If you want to know more about these topics, reach out to your TI’s sales / field representative for a demo. Visit www.ti.com/audio to know more about TI’s offering in audio space. #AudioEngineering #MobileAudio #MicroSpeakers #DSP #SoundInnovation
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🚀 Ever wondered what it looks like when 30,000 PSI of water and garnet meets solid aluminum? At finalREV, we decided to find out—so we mounted a camera inside our waterjet cutter and hit record. The result? 🔥 A front-row seat to raw physics at work: water, grit, and 30,000 pounds of pressure slicing through metal like it’s butter. 💡 In manufacturing, innovation isn’t always about fancy robots or AI. Sometimes, it’s about taking a fresh look at the fundamentals—and having the guts to put an iPhone camera where no iPhone camera should ever go. What’s the coolest iPhone shot you've seen? #manufacturing #engineering #innovation #waterjet #finalREV
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🚀 Engineers designing next-gen mobile and wearable tech — how do you fit high performance connectors into ever-smaller devices like smartphones, tablets, smartwatches, smart glasses, earbuds, and VR headsets? Molex’s Quad-Row Connector answers that challenge with: Fine pitch and ultra-low profile perfectly suited for tight spaces 🤏 Compatibility with both SMT and flexible printed circuits (FPC) for versatile assembly Engineered for scalable, reliable production across global supply chains 🌍 Developed through close collaboration of engineering, manufacturing, and supply teams, Quad-Row delivers big performance in a tiny footprint. Check out how we’re powering the future of wearable tech 👉 https://molex.io/461zvkK #Molex #WearableTech #ConnectorSolutions #MobileEngineering #PrecisionDesign
Quad-Row Connectors: A Breakthrough in Miniaturized Device Design | Molex
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Canon’s Flat Panel Display (FPD) lithography equipment is redefining how high-resolution displays are made — from smartphones to large TVs. With ultra-precise mirror projection systems, hybrid alignment tech, and high-speed stages, Canon enables seamless, submicron circuit patterning on massive glass substrates. 🔬 The result? Higher yields, sharper displays, and faster production. Explore the innovation: https://lnkd.in/gDbpJTBV #Canon #BusinessCanBeSimple #SmartTech #DisplayTechnology #FPD #Innovation #Semiconductor #Lithography
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📱 SK Hynix isn’t just leading in HBM – it’s now launching mobile DRAM with industry-first High-K EMC, boosting thermal conductivity 3.5×! Could this finally fix overheating in flagship smartphones? 🔎 EMC (Epoxy Molding Compound) is a key semiconductor packaging material that shields chips from water, heat, impact, and electrostatic charge, while also serving as a heat dissipation channel. 💡More: https://buff.ly/QmIO89D 🔗 #SKhynix #DRAM
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We use them every single day… but do we really know what’s inside our chargers, cables, pendrives, or earbuds? Most people think accessories are “just add-ons.” The truth? They’re powered by the same tech that runs your laptops, SSDs, and even future semiconductors In this carousel, we’ve broken down: ⚡ Why copper makes cables last longer 💾 How pendrives use NAND flash memory 🔋 The science behind certified chargers 🎧 What makes premium earbuds sound better 🚀 And the future of GaN semiconductors 👉 Swipe through to see the hidden world inside your everyday gadgets #TechMadeSimple #InnovationInHand #EDENIC #MobileAccessories #TechKnowledge #EverydayTech #SmartLiving #FutureOfTech #TechTalk
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Samsung Display's QD technology utilizes a front light-emitting method that efficiently utilizes light, enabling a simpler and more efficient structure, unlike LCDs that require a backlight, providing a thin and light display. https://lnkd.in/gMb_TjWm
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