How electronic packaging is transforming technology with advanced materials

View profile for Rajesh Uppal

Senior Technical Program Manager | Product Manager | Aerospace, Defense, Satellite & Emerging Tech | CEO @ Interplanix & IDST | AI & LMS Innovation

Electronic packaging is the invisible backbone of modern technology. Whether it’s shielding smartphones, managing heat in fighter jets, or protecting circuits on satellites, the way we package electronics determines performance, reliability, and even sustainability. This video explores how innovations in advanced materials, thermal management, hermetic sealing, and even microfluidic cooling are transforming the field. 🌍 Why it matters: packaging is no longer just protection — it’s an active part of the technology. 📺 Watch the video: https://lnkd.in/g2ndfYbz 📖 Read the full article: https://lnkd.in/geZnbcSQ #ElectronicPackaging #ElectronicsDesign #AdvancedMaterials #MilitaryElectronics #FutureOfTech #DefenseInnovation

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