The document discusses a novel image-processing method for automatically detecting broken pins of integrated circuits (ICs) during manufacturing using 2-dimensional wavelet pre-processing before applying edge detection. It compares the efficiency of various conventional edge-detection methods—Sobel, Prewitt, and Canny—against the proposed wavelet-enhanced approach, concluding that the latter significantly improves accuracy in detecting IC pins. This automated method is expected to enhance productivity and accuracy in the IC manufacturing process.