President and founder of a Failure Analysis and Materials Consulting laboratory in Phoenix which focusses on electronic packaging applications. 50 US patents.
Previously, President of advanced materials manufacturing company focussed on electronic packaging.
Specialties: Materials expertise for electronic packaging and interconnect applications. Expertise includes: advanced materials related consulting, failure analysis, materials characterization, technical market studies and market analysis, deconstruction and reverse engineering.
President and founder of a Failure Analysis and Materials Consulting laboratory in Phoenix which focusses on electronic packaging applications. 50 US patents.
Previously, President of advanced materials manufacturing company focussed on electronic packaging.
Specialties: Materials expertise for electronic packaging and interconnect applications. Expertise includes: advanced materials related consulting, failure analysis, materials characterization, technical market studies and market analysis, deconstruction and reverse engineering.
