Cmc Laboratories Client Presentation 2009
- 1. 1 CMC Laboratories, Inc. Client Presenta4on March 2009 Friday, September 11, 2009
- 2. 2 • CMC Laboratories was founded in 2003 by a group of packaging industry veterans. • Today, CMC has over 200 clients ranging from start-‐ups to Fortune 100 companies. • CMC supports clients across North America, Europe, and throughout Asia including China, Taiwan, Singapore, and Malaysia. Friday, September 11, 2009
- 3. 3 CMC Laboratories provides a high level of technical service focussed on advanced materials within the electronic industry. Innova&ve Materials Solu&ons for Electronics Friday, September 11, 2009
- 4. 4 Technical Exper4se Friday, September 11, 2009
- 5. 4 Technical Exper4se • Advanced electronic packaging materials • Micro-‐structural Characteriza:on • Failure Analysis and Destruc:ve Physical Analysis • Electrical, Thermal and Mechanical Test and Proper:es of Packaging Materials • Custom Reliability Tes:ng: Test Development and Implementa:on • Thin and Thick FIlm Metalliza:on • Electro and Electro-‐less pla:ng for electronic applica:ons Friday, September 11, 2009
- 6. 5 CMC Business Focus • Materials Analysis • Electrical and Thermal Tes:ng • Technology Development and Prototype/ Low Volume Fabrica:on Friday, September 11, 2009
- 7. Business Sectors 6 CMC Client Industries Friday, September 11, 2009
- 8. Business Sectors 6 CMC Client Industries Medical Device Photovoltaic Military and Aerospace Advanced Materials Telecommunications Semiconductor Friday, September 11, 2009
- 9. 7 Technical Support to Medical Device Manufacturers Friday, September 11, 2009
- 10. 7 Technical Support to Medical Device Manufacturers • Reliability evalua:on and failure mode analysis. • Device and component construc:on analysis for supplier qualifica:on. • Microstructural analysis in support of process op:miza:on and verifica:on. • Design, development and FA support to assist clients with FDA submissions. Friday, September 11, 2009
- 11. 8 Medical Device Manufacturers: Recent Projects Friday, September 11, 2009
- 12. 8 Medical Device Manufacturers: Recent Projects 1. Electronic reliability and failure mode evalua:on of a PCB assembly used in a hand held medical device. 2. Evalua:on of Pb and Pb-‐free solder processing parameters and rework limita:ons for high reliability implantable devices. 3. Assisted in the development of an improved herme:c feed-‐thru for an implantable device. Friday, September 11, 2009
- 13. 9 Experience Base in Op4cal Applica4ons for Semiconductors Friday, September 11, 2009
- 14. 9 Experience Base in Op4cal Applica4ons for Semiconductors •Solar cells, high brightness LEDs, Laser Diodes •Thin film, thick film and direct bond copper metalliza:on •Material structure, composi:on and defect characteriza:on in Opto-‐electronic assemblies • Ceramic packages including alumina and AlN • Cu pla:ng Friday, September 11, 2009
- 15. 10 Optoelectronics and Photovoltaics: Recent Projects Friday, September 11, 2009
- 16. 10 Optoelectronics and Photovoltaics: Recent Projects 1. Characteriza:on and op:miza:on of high thermal demand packaging for cuUng edge solar concentrator technology. 2. Thick Cu pla:ng process development for an HBLED package 3. New material selec:on and assembly process development for a high frequency MEMs op:cal transmiWer. Friday, September 11, 2009
- 17. 11 Experience in RF and Microwave Device Packaging Friday, September 11, 2009
- 18. 11 Experience in RF and Microwave Device Packaging • Cellular base-‐sta:on power amplifier packages including GaAs and Silicon LDMOS • Microwave communica:on devices • Packaging materials and processing for high frequency applica:ons • Alumina, LTCC and LCP TELECOMUNICATIONS Friday, September 11, 2009
- 19. 12 RF and Microwave Device Packaging: Recent Projects Friday, September 11, 2009
- 20. 12 RF and Microwave Device Packaging: Recent Projects 1. Working with a leading edge advanced packaging material supplier to introduce a new genera:on of RF packages for cellular base-‐sta:on applica:ons. 2. Supported the introduc:on to market of a new high frequency passive component technology with enhanced performance from 20-‐100 GHz. 3. Assisted in the development of a novel, low stress die aWach technology for RF devices which enhances thermal managment. Supported client patent submissions. TELECOMUNICATIONS Friday, September 11, 2009
- 21. 13 CMC Supports The Worlds Most Innova4ve Advanced Materials Suppliers Worldwide Friday, September 11, 2009
- 22. 13 CMC Supports The Worlds Most Innova4ve Advanced Materials Suppliers Worldwide • CMC provides clients cri4cal exper4se for advanced materials development • CMC assists in market introduc4on for advanced materials in electronic applica4ons • High thermal performance materials • Expansion matched systems • Advanced solder systems • Specialized thick film and thin film metalliza4on • Polymer composites • High frequency materials • LTCC, HTCC, and AlN • Pla4ng layers Friday, September 11, 2009
- 23. 14 Advanced Materials: Recent Projects Friday, September 11, 2009
- 24. 14 Advanced Materials: Recent Projects 1. Process development to reclaim/rework high-‐end specialty components preven:ng mul:-‐million dollar yield loss. 2.Valida:on of material proper:es and market opportuni:es for advanced polymer composites used in high thermal demand packaging applica:ons. 3.Licensing of CMC developed AlN mul:layer ceramic technology for military, space, medical, wafer tes:ng, and telecommunica:ons. Friday, September 11, 2009
- 25. 15 Core Exper4se in Specialized Technology for Military and Aerospace Applica4ons Friday, September 11, 2009
- 26. 15 Core Exper4se in Specialized Technology for Military and Aerospace Applica4ons • Ceramic packaging technologies including LTCC, AlN and HTCC • Thin film metalliza4on • High performance organic packaging solu4ons • High thermal demand packaging materials including AlSiC and other composite metal solu4ons • Herme4c package sealing technologies • Custom, aerospace focussed reliability test development Friday, September 11, 2009
- 27. 16 Military and Aerospace Applica4ons: Recent Projects Friday, September 11, 2009
- 28. 16 Military and Aerospace Applica4ons: Recent Projects 1. Developed and implemented custom electrical test program for power components for space under environmental stress condi:ons. 2. LTCC component op:miza:on and failure analysis for next genera:on short wave military communica:ons. 3. Root cause analysis of wirebond failures in guidance system control module. Friday, September 11, 2009
- 29. 17 Technology Services Friday, September 11, 2009
- 30. 17 Technology Services Failure Analysis Reliability and Test Materials Characterization Process Development AlN Licensing Market Analysis Friday, September 11, 2009
- 31. 18 Failure Analysis and Material Characteriza4on Capabili4es Friday, September 11, 2009
- 32. 18 Failure Analysis and Material Characteriza4on Capabili4es • Package deconstruc4on • Electrical resis4vity • Interfacial structure • Dielectric constant and loss • Elemental analysis and • Surface roughness mapping • Adhesion Tes4ng • Microstructure and phase • Mechanical Tes4ng analysis • Thermal conduc4vity • Grain structure and size • Interfacial thermal distribu4on resistance • Failure interface • Micro-‐hardness iden4fica4on Friday, September 11, 2009
- 33. 19 Failure Analysis and Material Characteriza4on Capabili4es-‐ Con4nued Friday, September 11, 2009
- 34. 19 Failure Analysis and Material Characteriza4on Capabili4es-‐ Con4nued • SEM with SE and BSE imaging • IC Level Analysis • Energy Dispersive • Metal Fractography Spectrometry • Acous4c Microscopy • Metallographic Evalua4on (CSAM) • X-‐Ray Radiography • Secondary Ion Mass • XRF Thickness Measurement Spectroscopy (SIMS) Friday, September 11, 2009
- 35. 20 Failure Analysis and Material Characteriza4on: Recent Projects Friday, September 11, 2009
- 36. 20 Failure Analysis and Material Characteriza4on: Recent Projects 1. Failure determina:on of a herme:c feed-‐thru in an implantable medical device. 2. Construc:on evalua:on of a discrete device for patent infringement li:ga:on. 3. Compe::ve analysis of advanced graphics processor including the device, package/substrate and graphics board. 4. Advanced solder process evalua:on and op:miza:on for major medical device manufacturer. Friday, September 11, 2009
- 37. 21 Metal Fractography Friday, September 11, 2009
- 38. 22 IC Level Cross Sec4on Analysis Friday, September 11, 2009
- 39. 23 X-‐ray Radiography and Acous4c Microscopy Friday, September 11, 2009
- 40. 24 Custom Design for Specialized Tes4ng Requirements Friday, September 11, 2009
- 41. 24 Custom Design for Specialized Tes4ng Requirements • Micro-‐Controllers • Air to air thermal • High-‐Speed Data stress Acquisi:on • HAST Chamber • Lab View Programming • Wide range of • Environmental Test electrical test Chambers equipment from DC to • Mechanical Tes:ng GHz Friday, September 11, 2009
- 42. 25 Custom Design for Specialized Tes4ng Requirements: Recent Projects Friday, September 11, 2009
- 43. 25 Custom Design for Specialized Tes4ng Requirements: Recent Projects 1. System design and development to test and capture extremely short :me scale events in an advanced satellite component while undergoing environmental stress. 2. Burn-‐in and precision electrical monitoring of military components under rigid temperature condi:ons. 3. Design and development of a custom op:cal reflectometer to set laser weld condi:ons for high reliability. Friday, September 11, 2009
- 44. 26 Technology Development and Fabrica4on • Pla:ng metalliza:on development • Low volume electro-‐pla:ng, electro-‐less pla:ng and barrel pla:ng • Fabrica:on and assembly process development – Solder profiles – Braze profiles – Die aWach processes • Low volume fabrica:on and assembly capability • Thick film metalliza:on produc:on facility • Module re-‐work for military and medical applica:ons Friday, September 11, 2009
- 45. 27 Pla4ng Process Development Friday, September 11, 2009
- 46. 27 Pla4ng Process Development • Development of custom pla4ng processes – Evaluate pla4ng chemistry op4ons – Create prototypes for func4onal and reliability tes4ng – Detailed documenta4on of pla4ng procedures – Transfer to high volume processors • Small volume, fully func4onal pla4ng facility – Rack and barrel pla4ng – DC and pulsed rec4fica4on Friday, September 11, 2009
- 47. 28 Pla4ng Process Development Friday, September 11, 2009
- 48. 28 Pla4ng Process Development • CMC’s Pla4ng Development Customers: – Semiconductor manufacturers – Electronic Package fabricators – Specialty materials manufacturers • Cu, Ni, Au, Sn and co-‐deposited alloys • Cleaning and etching chemistry Friday, September 11, 2009
- 49. 29 Technology Development and Fabrica4on-‐ Recent Projects • Fabricate specialized direct bond copper substrates • Plate Al-‐SiC flanges over wide composi:on range • Re-‐work and re-‐assemble module used for medical imaging • Produce range of high temperature thick film metalliza:on pastes for AlN ceramics • Assemble MEMs diode laser switching module for telecommunica:ons applica:ons Friday, September 11, 2009
- 50. 30 CMC Wireless Packaging Experience Friday, September 11, 2009
- 51. 31 Mul4layer, Co-‐Fire AlN Technology Licenses Friday, September 11, 2009
- 52. 31 Mul4layer, Co-‐Fire AlN Technology Licenses • Non-‐exclusive Licensing of CMC’s proprietary co-‐fired, mul4layer AlN process – Thermal conduc:vity as high as 190 W/m-‐K – Up to 20 metalliza:on layers – Required materials, processes and equipment details transferred to licensees • Process has been u4lized for high volume produc4on • Applica4ons in telecommunica4ons infrastructure, power electronics, op4cal communica4ons, HBLED and industrial equipment. ALUMINUM NITRIDE TECHNOLOGY LICENSING Friday, September 11, 2009
- 53. 32 Technology Market Analysis Friday, September 11, 2009
- 54. 32 Technology Market Analysis • Technical Market Studies focused on Electronic Interconnect, Packaging, New Materials, Assembly Technology, or Passive Components • Compe44ve Analysis including Compe4tor’s Technical Performance, Target Markets, Key Strengths/Weaknesses and Product Roadmaps • Iden4fica4on of Acquisi4on Candidates to fit Client’s Growth Objec4ves. • Industry Wide Surveys and Survey Data Analysis Friday, September 11, 2009
- 55. 33 Technology Market Analysis-‐ Recent Projects Friday, September 11, 2009
- 56. 33 Technology Market Analysis-‐ Recent Projects 1. Developed a customized market analysis for a large advanced materials company, evalua:ng the market poten:al of a new polymer-‐based product line used in high thermal demand electronic applica:ons. Developed a market strategy and iden:fied poten:al customers throughout the US and Asia (2008). 2. Introduced a small advanced materials company specializing in new polymer formula:ons for packaging applica:ons to poten:al strategic partners to assist in scale-‐up and marke:ng of this technology (2008). 3. Performed a detailed market analysis for an advanced electronic materials company in China, delinea:ng commercial market opportuni:es for ceramic products. Created a technology roadmap for this client based on the study. Provided technical support to implement the roadmap (2007, 2008). Friday, September 11, 2009
- 57. 34 Friday, September 11, 2009
- 58. 34 CMC Laboratories, Inc. 7755 South Research Drive Tempe, AZ 85284 (480) 496-‐5000 Contact Us: info@CMCLaboratories.com Friday, September 11, 2009