![www.first-sensor.com | 8
LiDAR Receivers Challenge 1: Bandwidth vs Sensitivity vs. Excess noise of APD
World Photonics Technology Summit 2019
SILICON PHOTONIC SENSORS
Maximum permissible exposure
Source: https://en.wikipedia.org/wiki/Laser_safety
− Maximum permissible exposure roughly doubles
going from 905nm -> 980nm
− Resolution requirements need short pulses of
1ns...5ns, i.e. fast detector (drift speed limits!)
200 300 400 500 600 700 800 900 1000 1100
0,01
0,1
1
10
100
1000
Room temperature
Si
thickness
for
90%
absorption
[µm]
Wavelength [nm]
Input pulse Output pulse](https://image.slidesharecdn.com/2019firstsensorsiliconphotonicsensorsapplicationsandchallenges-250210173735-eb12bf96/85/2019-First-Sensor-SILICON-PHOTONIC-SENSORS-APPLICATIONS-AND-CHALLENGES-pdf-8-320.jpg)
![www.first-sensor.com | 16
Aerospace sensors challenge 1: Silicon sensitivity
World Photonics Technology Summit 2019
SILICON PHOTONIC SENSORS
− Many aerospace applications work with 1064nm (strong
lasers, low CMOS sensitivity) and large detector areas
− 100% absorption would require ~1 mm thick absorption
− Typical pulse widths < 10ns demand for detector thickness
< 400µm @200V (drift speed limits bandwidth)
200 300 400 500 600 700 800 900 1000 1100
0,01
0,1
1
10
100
1000
Room temperature
Si
thickness
for
90%
absorption
[µm]
Wavelength [nm]
400µm silicon
400µm silicon
Cat-eye detector
400µm silicon
Diffusor mirror
(requires tight process
control on roughness)
Challenge Solution
Source:
http://www.ioffe.ru/SVA/NSM/
Semicond/Si/electric.html
50µm/ns
@ 5kV/cm](https://image.slidesharecdn.com/2019firstsensorsiliconphotonicsensorsapplicationsandchallenges-250210173735-eb12bf96/85/2019-First-Sensor-SILICON-PHOTONIC-SENSORS-APPLICATIONS-AND-CHALLENGES-pdf-16-320.jpg)
簡報 2019 (First Sensor) SILICON PHOTONIC SENSORS APPLICATIONS AND CHALLENGES.pdf
- 1. SILICON PHOTONIC SENSORS APPLICATIONS AND CHALLENGES DR. MARC SCHILLGALIES WORLD PHOTONICS TECHNOLOGY SUMMIT 2019 AUGUST 30, 2019
- 2. www.first-sensor.com | 2 Company Overview Capabilities − 7 clean room production sites: wafer fab and assembly facilities − Automotive, medical and aerospace certifications − Development and production of customized and standard sensors − Complete sensor value chain from die to system in one company Short facts − Founded 1991 in Berlin, Germany − 970 employees − 155 Mio€ revenue 2018 − Stock-listed in Germany Markets & Products − 3 target markets: industry, automotive, medical − Sensor products for photonics, pressure, flow and inertial measurement − Cameras and integrated manufacturing services for imaging sensors World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS
- 3. www.first-sensor.com | 3 Product Overview Photonics World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS LiDAR Position Sensor Optical Analysis Digital Imaging Aerospace Sensors
- 4. www.first-sensor.com | 4 Product Overview Pressure Photonics World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS LiDAR Position Sensor Optical Analysis Digital Imaging Pressure sensor element Pressure compo- nent Digital pressure sensor Digital flow sensor Actuators Aerospace Sensors
- 5. www.first-sensor.com | 5 Product Overview Pressure Photonics Advanced Electronics World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS LiDAR Position Sensor Optical Analysis Digital Imaging Pressure sensor element Pressure compo- nent Digital pressure sensor Digital flow sensor Actuators Inertial sensor solutions Magnetic sensor solutions Temperat sensor solutions Multi sensor systems Solutions without sensor Aerospace Sensors
- 6. www.first-sensor.com | 6 Technology First Sensor Value Proposition − Avalanche Photodiodes for 905nm in larger arrays with improved resolution, dark current, cross talk and yield − Scalable automotive grade low cost package platform for receiver incl. ASIC − Forward integrated receiver and sender solutions − Automotive-grade, high volume APD and packaging technologies with best SNR − Heritage/experience and customization along value chain New chips, new packages, electronic designs and integrated systems Tiger Team Quality Marketing Initiatives Ecosystem partnerships Yield & Cost RM Applications − Automation in manufacturing, logistics, traffic, security, maps − Autonomous transport and delivery from drones to trucks − Driver assistance/automation/MaaS up to level 5 cars LiDAR Receivers: Technology and Applications World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS
- 7. www.first-sensor.com | 7 LiDAR Receivers Challenge 1: Bandwidth vs Sensitivity vs. Excess noise of APD World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS Maximum permissible exposure Source: https://en.wikipedia.org/wiki/Laser_safety − Maximum permissible exposure roughly doubles going from 905nm -> 980nm − Resolution requirements need short pulses of 1ns...5ns, i.e. fast detector
- 8. www.first-sensor.com | 8 LiDAR Receivers Challenge 1: Bandwidth vs Sensitivity vs. Excess noise of APD World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS Maximum permissible exposure Source: https://en.wikipedia.org/wiki/Laser_safety − Maximum permissible exposure roughly doubles going from 905nm -> 980nm − Resolution requirements need short pulses of 1ns...5ns, i.e. fast detector (drift speed limits!) 200 300 400 500 600 700 800 900 1000 1100 0,01 0,1 1 10 100 1000 Room temperature Si thickness for 90% absorption [µm] Wavelength [nm] Input pulse Output pulse
- 9. www.first-sensor.com | 9 LiDAR Receivers Challenge 1: High resolution vs fill factor vs crosstalk World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS Common solid state LiDAR schematic for 1D MEMS − Demand for high resolution LiDAR and optimal SNR in case of strong ambient light require higher pixel count − This has two challenges: 1) Properties of small pixels and small gaps 2) Routing of signal traces vs fill factor
- 10. www.first-sensor.com | 10 LiDAR Receivers Challenge 1: High resolution vs fill factor vs crosstalk World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS Common solid state LiDAR schematic for 1D MEMS − Demand for high resolution LiDAR and optimal SNR in case of strong ambient light require higher pixel count − This has two challenges: 1) Properties of small pixels and small gaps 2) Routing of signal traces vs fill factor Pixel distances < Epi layer thickness Proximity increases cross talk Inner pixels need traces in gaps More than 8 rows reduces fill factor significantly
- 11. www.first-sensor.com | 11 LiDAR Receivers Challenge 3: ~200V operation + non-hermetic packages + AEC-Q World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS − In many cases IR-optimized detector and readout IC are different technologies − System in a package is well established in electronics, necessity for optical window reduces number of available or economically attractive technologies − Example: film assisted molding of detector with glued glass and ROIC − Proximity of ROIC requires thermal management
- 12. www.first-sensor.com | 12 LiDAR Receivers Challenge 3: ~200V operation + non-hermetic packages + AEC-Q World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS Corrosion causes leakage paths Without corrosion Influence of humidity: AEC-Q-Test H3TRB (Bias 100 V, 85 °C, 85 % r.h.)
- 13. www.first-sensor.com | 13 Technology First Sensor Value Proposition − PCB or ceramic substrate chip-on-board-technology (COB) in combination with surface mount technology (SMT) on panel − Chip&wire; TSV/flip chip BGA high density interconnects − Various direct optical interfaces (e.g. prisms, filters etc) − Fulfilling extreme mechanical requirements even for largest dies (low warp/50µm flatness, 5µm position accuracy) with cost efficient COB techn., high density/small gap connects − Being able to combine COB with optics, SMT, etc − Clean-room (ISO 5-8) from dicing to final test Applications − Cameras for industrial process control, endoscope, automotive/ADAS/MaaS, aerospace − Medical imaging (radiation detector arrays) for X-ray and PET Dicing, die attach, chip&wire / flip chip/ SMT, optics aligment, singulation, test Medical imager arrays, large imagers, endoscopes, TOF cameras Imager assemblies: Technology and Applications World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS
- 14. www.first-sensor.com | 14 Imager assemblies: Challenges World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS Soldered with SAC, max bending 45µm Soldered with SnBi, max bending 45µm − Large imagers -> CTE-mismatch to substrate -> Warp, TC,... − COB+SMT technology with passives and imager on same board -> meeting of different worlds w.r.t. particle contamination specs − Tiled detectors (e.g. medical imaging) require exceptional position tolerance - Design, materials, processes must go hand in hand 160 mm Solution Challenge
- 15. www.first-sensor.com | 15 − APDs and large quadrant photodiodes in n- and p-type high resistivity silicon for 1064nm; small pitch photodiode arrays − Hermetic assemblies with high optical and mechanical precision, partially thermal control − Space-grade large imager array assemblies − Laser guidance and laser warners − Proximity detectors and distance measurement, encoders − Receiver assemblies for satellites/areal surveillance Large area photodiodes for 1064nm Optical assemblies Opto-electronic assemblies Technology First Sensor Value Proposition − Photodiodes with excellent performance for 1064nm − Manufacturing in Germany + all aerospace certifications Applications Aerospace sensors: Technology and Applications World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS
- 16. www.first-sensor.com | 16 Aerospace sensors challenge 1: Silicon sensitivity World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS − Many aerospace applications work with 1064nm (strong lasers, low CMOS sensitivity) and large detector areas − 100% absorption would require ~1 mm thick absorption − Typical pulse widths < 10ns demand for detector thickness < 400µm @200V (drift speed limits bandwidth) 200 300 400 500 600 700 800 900 1000 1100 0,01 0,1 1 10 100 1000 Room temperature Si thickness for 90% absorption [µm] Wavelength [nm] 400µm silicon 400µm silicon Cat-eye detector 400µm silicon Diffusor mirror (requires tight process control on roughness) Challenge Solution Source: http://www.ioffe.ru/SVA/NSM/ Semicond/Si/electric.html 50µm/ns @ 5kV/cm
- 17. www.first-sensor.com | 17 Maximum active area in round package Octagonal chips World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS − Aerospace industry likes hermetic TO packages with large diameters Quadrant photodetector for laser guidance Large welded package Mechanical strain can lead to glass damages Aerospace sensors challenge 1: Large hermetic TO packages with glass window
- 18. www.first-sensor.com | 18 Polyboard Fiber Transeiver Optical elements − Automated and scalable assembly-technologies for components on „Polyboards“ using SMD equipment ➔ Close to existing production equipment / processes − First project Wavelength-tunable 10G WDM-Transceiver for Fiber connection/ backhaul to 5G network, fiber to home for − Technology platform will be used for other cost-efficient fiber applications in datacon & sensors Technology First Sensor Value Proposition − Lower assembly costs than classical approaches due to self alignment and use of electronic assembly equipment Applications Polymer Photonics: Technology and Applications World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS
- 19. www.first-sensor.com | 19 Thin film filters made of complex layer systems in defined "thinness" (15 ... 20μm), which are inserted directly into the slots of the polymer board Integration of highly complex filter functions Low coupling losses Easy to process on wafer and panel level How to realize the pickup from the wafer and the 90 ° rotation of the filter? Use of common pick & place equipment for bare dies with adapted "pick&flip" process Automatic pick-and-place assembly of the filter elements Functional realization Motivation Challenge Solution Polymer Photonics Challenge 1: Integration of optical filters World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS
- 20. www.first-sensor.com | 20 Step 1 Step 2 Punching system ejects and tilt Thin-Film-Filter from tape Dedicated Pickup-Tool with lateral vaccum flow sucks in filter and flip it 90° Step 3 Machine vision alignment of Filter and slot in Polyboard Step 4 Pushing filter in slot, UV-gluing Polymer Photonics Challenge 1: Integration of optical filters World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS
- 21. www.first-sensor.com | 21 High-precision (<1µm) etched "U-grooves" in the poly boards for mating SM fibers or optical elements and adjust them to the waveguide of the poly-boards Integration of optical functions and connections Low coupling losses due to "interference fit“ Passive adjustment of the elements possible Easy to process on wafer and panel level Are machines with high process speed usable? Use of pick & place machines for MEMS Assembling Polyboard with U-grooves U-groove in cross section Functional realization Motivation Challenge Solution Fiber in U-groove World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS Polymer Photonics Challenge 1: Integration of µ-optical elements Panellevel Assembling of fiberends
- 22. www.first-sensor.com | 22 Challenges World Photonics Technology Summit 2019 SILICON PHOTONIC SENSORS LiDAR Polyphotonic Tranceiver Boards Digital Imaging Aerospace Sensors − SiGe APD-Arrays − Flip-chip-APD-Arrays − Materials für automotive packaging of high voltage devices − Low warp assemblies with large Chips − Particle contamination in COB+SMT − High position accuracy − 1064nm sensitivity + bandwidth of large area Si detector − Large hermetic TO packages − Using standard high speed electronic assembly equipment for photonic circuits
- 23. First Sensor AG www.first-sensor.com THANK YOU. Dr. Marc Schillgalies
- 24. This presentation was presented at EPIC World Photonics Technology Summit 2019 HOSTED BY GOLD SPONSOR SILVER SPONSORS BRONZE SPONSORS EU initiatives funded by www.photonics21.org