2D3D AOI在packaging substrate的運用及演變與對設備商之建議
- 1. 2D/3D AOI在Packaging Substrate 的運用及演變與對設備商之建議 Reporter : 陳永財(Morse Chen) SBU/Div. : Unimicron Carrier SBU/S1 Plant RD Date : 2014/10/15
- 2. Contents 1 1. Unimicrom公司簡介 2. 2D&3D AOI Metrology應用 3. 2D AOI 演變與挑戰 4. 3D AOI 演變與挑戰 5. 給設備商之建議
- 4. Unimicron Introduction 3 Unmicron Customer Base Established CEO President of Carrier SBU President of PCB SBU Total Employees Registered Capital Filed Patents 1990 T.J. Tseng ChiaPin Lee Maurice Lee 10,150 (Taiwan) / 11,298 (China) US$ 523.3M (NT$ 15.39Bn) 2,349 (Since 1998) Notebook PC & Peripheral Communication Consumer Packaging Others
- 5. Unimicron CSP Product Roadmap 4 2003 2005 2008 2010 2011 2012 2013 2014 2015 2016 FC PoP I/O FCCSP Hybrid CSP WB PoP EPS FC PoP Ultra Thin CSP TCA Coreless BOL UTS – EP
- 6. Unimicron FCBGA Product Roadmap 5 I/O Coreless FCBGA FCBGA (BT) FCBGA (ABF) EPS FCBGA TCA LBS / HLC by low loss ABF BOL 2003 2005 2008 2010 2011 2012 2013 2014 2015 2016
- 7. 6 2. 2D&3D AOI Metrology應用
- 8. 2D/3D Metrology Application in packaging substrate 2D Application Trace defect --- open/short/nick/… Via defect ---missing plating/recess/… 7
- 9. 2D/3D Metrology Application in packaging substrate 3D Application Bump Height/Dimension Warpage SR surface Bump height Convex (cry) ++ - Concave (smile) - 8
- 10. 9 3. 2D AOI 演變與挑戰
- 11. 10 Fine line design for Resolution trend(R&D)
- 12. Challenge --- mouse bite defects Defect size / type Detection by AOI Detection by 4W OST Risk if escapes to Customer Very small nick (L,W :<3~4um) Not always NO Potential reliability risk defect Medium nick (W : 4um~L :~10um) YES NO Trace crack open at stressful location. Potentially escape to customer. Big nick W : almost full width L : 10~ 30um level YES Questionable Missing Plated Cu (L : 30um~ level) YES YES Trace crack open in various locations L W L W L L W AOI machines are used on fine line design layers to detect “mouse- bite” type defects not caught by E-test. – these are potential product reliability risk defects. 11
- 13. Case Study Copper or Dust ? Challenge --- real defect & false alarm cause 12
- 14. Case Study Nick or Oxidation ? Challenge --- real defect & false alarm cause Microscope image Red light imageBlue light image 13
- 15. Case Study VRS times coverage vs image quality Challenge --- real defect & false alarm cause 14
- 16. 15 4. 3D AOI 演變與挑戰
- 17. Reduced Bump Pitch requires better inspection metrology resolution. Challenge --- Fine Bump pitch 16
- 18. o Large variations of bump flattened areas from center to corners o CAW(C4 area warpage) impact to assembly integration yield cause open issue Corner bumps are flattened Center bumps are not flattened Flatten Bump Metrology challenges 17
- 19. Tighter Pitches with smaller present metrology challenge Need to assess --Higher resolution/speed or smart sensor/camera technology --Higher proformance logic to reduce false alarm Bump AOI 10 um pixel 70 um SRO 50 um SRO 40 um SRO Need higher resolution 18 Bump Metrology challenges
- 20. 19 5. 給設備商之建議
- 21. Expectation on Metrology Tool Technical (Quality) Higher Resolution for fine line design product Direct SCRAP proposal (Skip VRS) Defect mapping system for strip type product Automation operation (ex：Loader & Un-Loader) Throughput (Cost) Faster / Lower false alarm Improvement (YIP) Datamation capability for in-line Analysis/Process feedback 20
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