Chip Module Encapsulation Machine PTCME302
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The PT-CME302 is an advanced chip module encapsulation machine designed for high-speed smart card production, featuring automated processes that minimize manual labor and improve efficiency. It includes a UV curing system that is more compact than traditional lamps, as well as options for visual inspection and real-time monitoring of dosing and thickness. The machine offers a comprehensive solution for encapsulation, testing, and quality control, making it a cost-effective alternative to imported brands.
Chip Module Encapsulation Machine PTCME302
- 1. Beyond Smart Manufacturing Chip Module Encapsulation Machine PTCME302
- 2. Chip Module Encapsulation Machine PTCME302 PTCME302 represents the new generation of high-speed smart card chip module dosing, UV curing, encapsulated module thickness measurement and visual inspection system. 100% online control of the whole process can minimize manual intervention and save labor costs. Latest dosing program for dosing head with 16 dosing nozzles which makes the dosing quality higher and maintain- ing easier, realizes a simpler operation. The LED UV lamp of PTCME302 curing module is signifi- cantly smaller than traditional UV gas discharge lamps , while it has a higher power to makes the production more efficiency. PTCME302 configured encapsulated module thickness measurement module as well as upper and lower chip module surface defect inspection module to saving factory labor cost and control product quality effectively. Advantages Overview 1 2 3 4 5 7 6 Real-time monitoring of dosing effect and encapsulation thick- ness. Encapsulated module thickness accuracy ±30um. Automatic X/Y direction move- ment punching hole function. Optional visual defect inspection function. Visual dosing trajectory design can easily create a dosing path. DAM resin and Filling resin or Double Filling resin production mode. Detailed production process report. The Chinese own Smart Card Chip Module Encapsulation Machine. Cost-effective far exceeds imported brands. High-speed Smart Card Chip Module Encapsulation, Testing and Surface Defect Inspection turnkey solution.
- 3. Unwinding/ Rewinding module: 1. A tray with an inner diameter of φ40mm (without keyway) and an outer diam- eter of φ500mm can be loaded. 2. A protective tape tray with an inner diameter of φ40mm (without keyway) and an outer diameter of φ500mm can be loaded. 1. Bad holes and side holes from unwiding tapes can be detected. 2. X/Y sliding table is installed at the bottom of the mechanism to facilitate precise adjustment of the sensor position. Unwinding Detection Module: 1. A set of visual positioning system is installed behind each dosing module. 2. Module tape positioning function and dosing absence detection function are configured. 3. Linkage control between visual positioning system and the three-axis motion mechanism of the dosing module to ensure that the position accuracy after dosing is no more than ±0.1mm. 4. Camera with 5 million pixel is configured. Optical Positioning Module: Dosing module： 1. 2 sets of dosing heads (suitable for 9.5mm tapes) with 16 dosing nozzles for each are configured. 2. 14.25mm dosing head with 16 dosing nozzles for each is optional. 3. Applicable resin types include: DAM resin and Filling resin. 4. The dosing head is driven by the X/Y/Z three-axis motion mechanism with accuracy is no more than ±0.1mm, and the encapsulated module thickness accuracy is no more than ±0.03mm. 5.Zero correction for Z-axis dosing nozzle can re-calibrate the height of Z-axis after replacing the dosing head. 1. Tape tensioning, forward transmission and backward rewinding functions. 2. Servo driver + pin wheel mechanism for tape transmission. 3. Tape running accuracy is no more than ±0.1mm. Tape Driving Module： Unwinding Detection Module Dosing module UV Curing Module Optical Positioning Module Thickness Measurement Module Punching Module 1. 1.2m LED UV lampis equipped. 2. The LED UV lamp can be automatically raised and lowered by software con- trol. When the UV lamp is attenuated, the height of the lamp can be adjusted to compensate for the curing effect. 3. The LED UV lamp can be moved back into the maintenance position as a whole, and can be turned back 90 ° to facilitate the maintenance or replacement of the LED UV lamp. UV Curing Module: Punching Module: 1. A hole will be punched on the chip that is failed in thickness measurement and dosing appearance defect inspection. 2. Following punching mode, the diameter of the punching hole is 2±0.1mm, and the position error is no more than 0.2mm. Thickness Measurement Module: 1. 8 length gauges in total are configured. 2. Adjustment function in X, Y and Z three directions. Configurations Tape Driving Module Unwinding/ Rewinding module
- 4. Software Filling Resin Supply system Dam Resin Supply system Optical Surface Defect Inspection Module (optional) 1. Appearance size and defect inspection on the encapsulated block after UV curing can be realized. 2. Defects such as unencapsulated, missing solder joints, repeated dosing, dosing deviation, sinking, dragging, large or small dosing size, wrinkles and other defects can be inspected. 3. 3 sets of 5 million pixel cameras are configured. Optical Surface Defect Inspection Module (optional)： Filling Resin Supply system: 1 set of Filling Resin Supply System is configured. Dam Resin Supply system: 1 set of Dam Resin Supply System is configured. Software： 1. Control system software. 2. Dosing trajectory graphic design software. 3. Visual recognition and positioning software. 4. Visual monitoring software. 5. Dosing appearance defect inspection software. (optional). 9.5 23000 9.5 33000 14.25 27000 14.25 20000 Chip pitch(mm) Produdion mode Glob top Damm&Fill Glob top Damm&Fill Throughput Table Produdion capacity (UPH) Technical Specification Parameters 7300mm×1200mm×2000mm（L×W×H） 2100Kg 220V(-5%～+10%), 50Hz, 8KW ≤65dB 23℃±3℃ 50±10%rh Pressure：0.6Mpa Flow：1500LPM Glob Top：33000UPH Damm＆Fill：23000UPH Name Dimension Weight Power Supply Noise Operation Temperature Operation Humidity Compressed Air MaximumThroughput Tel：86-24-2378 3285 E-mail：sales@piotec.cn Add：No.37,Shiji Rd,Hunnan District,shenyang,China Website：www.piotec.cn Shenyang Piotec Technology Co.,LTD