1. The document describes a project to improve the first time yield of TIPM products from 86% to 96% by reducing pin misalignment defects.
2. Key process characteristics identified that contribute to bent pins include the UMG mounting machine, temperature testing chamber, ICT machine, and operator touch up processes.
3. Analysis of pin position data from samples that went through these four processes found they were independently distributed and followed a normal distribution, identifying them as critical processes for further improvement actions.