Intigrated circuit
- 2. INTEGRATED CIRCUITS by KHURRAM IMTIAZ 03F-EE-39
- 3. CONTENTS SCALE OF INTEGRATION CLASSIFICATION MONOLITHIC IC THICK & THIN FILM IC MULTICHIP IC LINEAR IC DIGITAL IC ADVANTAGES & AND DISADVANTAGES
- 4. WHAT IS AN INTEGRATED CIRCUIT? An IC is complete electronic circuit in which both the active & passive components are fabricated on a tiny single chip of SLICON . Active components are those components which are able to produce gain. Passive components are those components which do not have this ability.
- 5. HISTORY Tremendous changes in Electronic circuitry starts after the invention of Triode by L.D Forest in 1907. Invention of Transistor in 1948 by W.H Bardeen & I.Bardeen electronic circuit became reduced in size. In early 1960 field of microelectronic born to meet the requirement of Military.
- 6. CONTD… J.S Kilby was first person who develop IC. Soon after Robert Noyce fabricate a complete IC including interconnection on single chip.
- 7. SCALE OF INTEGRATION SSI – small scale integration MSI – medium scale integration LSI – large scale integration VLSI – very large scale integration ULSI – ultra large scale integration GSI – giga scale integration
- 8. CIRCUITS PER CHIP SSI < 12 (No. of comp.less than 50) MSI 12 – 99 (No. of comp. 50 – 5000) LSI 100 – 9999 (No. of comp. 5000 – 100000) VLSI 10000 – 99999 (No. of comp. 100000 – 1000000) ULSI 100000 – 999999 (No. of comp. 1000000 – 10000000) GSI >1000000 (No. of comp. 100000000)
- 9. CLASSIFICATION OF IC’s On structure basis On function basis
- 10. ON STRUCTURE BASIS MONOLITHIC INTEGRATED CIRCUITS THICK & THIN FILM INTEGRATED CIRCUITS HYBRID / MULTICHIP INTEGRATED CIRCUITS
- 11. MONOLLITHIC IC The word monolithic means “SINGLE STONE” or more appropriately “Single solid structure’. In this all circuit all components are fabricated within single continuous piece of silicon crystalline material called “WAFER” or “SUBSTRATE”
- 12. ADVANTAGES & DISADVANTAGES OF MONOLITHIC IC’s These have advantage of lower cost and high reliability. However they have poor isolation between the components, short range of passive components, no flexibility of circuit design. INDUCTORS cannot be fabricated.
- 13. THICK & THIN FILM IC The difference between between thick & thin film are not their relative thickness but method of depositing film. These IC’s are not formed within single silicon wafer but surface of an insulating substrate such as glass or ceramic materials. Only passive components are formed through thick or thin film.
- 14. THIN FILM IC Such circuits are constructed by depositing film of conducting material through a mask on the surface of substrate made of glass or ceramic. Following methods are used to produce thin film. VACUUME EVAPORATION CATHODE SPRUTTERING
- 15. THICK FILM IC These are printed thin film circuits. Silk screen printing techniques are employed to create the desired circuit pattern on the surface of substrate
- 16. ADVANTAGES & DISADVANTAGES OF FILM IC’s These have advantages of forming passive components of broader range. High tolerance Isolation is better Better high frequency performance.
- 17. CONTD… Not able to fabricate active components Comparatively higher cost Larger physical size
- 18. HYBRID IC These IC’s are formed either by interconnecting a number of individual chips or by combination of film & monolithic ICs They have chief advantage high flexibility but too much expensive for mass production and least reliability.
- 19. ON FUNCTION BASIS LINEAR DIGITAL
- 20. LINEAR IC’s (LICs) These also referred as “Analog IC”. They possess much high reliability Their use is much less as compared to digital and mostly used in military and industrial application
- 21. USE OF LIC’s Operational amp. Power amp. Microwave amp. Voltage comparators Small – signal amp. RF & IF amp. Multipliers Voltage regulators
- 22. DIGITAL IC’s About 80% of IC market has been captured by digital IC which is mostly used in computer IC Digital IC contain circuits whose input and output voltages are limited to 2 possible level – high and low
- 23. USES OF DIGITAL IC’s Digital circuits Flip – flops Counters Clock chips Calculator chips Memory chips Microprocessors
- 24. ADVANTAGES OF IC’s Extremely small physical size Very small weight Reduced cost Extremely high reliability Increased response time & speed Low power consumption Easy replacement Higher yield
- 25. DRAWBACK OF IC’s Coils & inductors cannot be fabricated IC’s function are fairly low voltage They handle only limited amount of power They are quite delicate and cannot withstand rough handling or excessive heat
- 26. THANK YOU