MEMS SEMICONDUCTOR PROCESS Semiconductor process
- 2. • The front-end equipment comprise advanced technologies for lithography, bonding, and testing process, which require substantial investments. Though expensive, front-end equipment are profitable and add more value to the final products. Thus, the front-end equipment segment holds a larger share in the market as compared with the back-end equipment segment. Note: “Others” includes thermal, masking, and other wafer manufacturing equipment.
- 4. • Manufacturers are now adopting different technologies such as 2D ICs, 2.5D ICs, and 3D ICs in their production processes, especially to control size, cost, and performance of their circuits. • The transition from 2D ICs to 2.5D and now to 3D is considered to be the major development in this industry. It has enabled miniaturization to address different challenges such as dense and complex designs, need for low power consumption, and the requirement of increased functionalities.
- 5. COMPARISON BETWEEN 2D, 2.5D, AND 3D IC TECHNOLOGIES COMPARISON BETWEEN 2D, 2.5D, AND 3D IC TECHNOLOGIES
- 7. • The SOI market in North America was severely impacted by the COVID-19. It was followed by the market in Europe and APAC. Most of the manufacturing facilities of the global SOI wafer suppliers such as France, Taiwan, US, Japan, and TSMC (Taiwan) are located in the US, France, China, Japan, and Taiwan. As local governments in these countries imposed complete lockdowns to reduce the spread of infection, it severely impacted the supply chain of various industries. • A number of key players such as Soitec and Sony re-opened their manufacturing facilities by the end of February and March 2020, following all safety measures to normalize their inventory levels and tackle the supply chain disruptions. According to the SEMI industry association, the small- diameter silicon wafer facilities of China were the first to suffer repercussions from the domestic spread of the virus as utilization of SOI wafers in the country dropped between 30% and 50% in February 2020. However, the utilization rate of silicon wafer manufacturers in China recovered to 80% by the end of March 2020.
- 8. • The FD-SOI segment is projected to grow at the highest CAGR during the forecast period. FD-SOI wafer types are highly reliable in high-temperature environments, have reduced operating voltage, and are costeffective. • The growth of the 300 mm segment can be attributed to the increasing global demand for smartphones, consumer electronics, automobiles, and IoT devices as 300 mm wafers are mainly used in these applications. These wafers enable 2.5 times more fabrication of chips than 200 mm wafers, thereby reducing the overall manufacturing costs of SOI wafers. • In addition, foundries such as GlobalFoundries (US), TowerJazz (Israel), TSMC (Taiwan), and UMC (US) are expanding their RF-SOI processes for 300 mm wafers.
- 9. • Among wafer sizes, the 200 mm and less than 200 mm wafer size segment of the SOI market has been impacted the most by COVID-19. This segment is expected to witness lower growth than the 300 mm wafer segment from 2020 to 2025. The wafer manufacturers are expected to increase their production postCOVID-19 to meet the future wafer demand from different end-use industries, including consumer electronics, semiconductors and electronics manufacturing, and automotive. 200 mm and less than 200 mm wafers provide improved stability and have low sensitivity to interferences. Hence, they are majorly used in smartphones. Thus, the increase in demand for smartphones and the advent of 5G technology are expected to increase the demand for these wafers from 2021 onwards.
- 10. • The bonding technology is a traditional technology used for the formation of SOI wafers. This technology gives designers the freedom to design and fabricate SOI wafers with different material combinations. Moreover, it also offers low defect density, thereby making it ideal for high- temperature and high-voltage applications. Smart cut technology involves the implantation of light ions and bonding on wafers for transferring ultrathin single-crystal layers from one substrate to another. The combination of ion implantation and wafer bonding offers the following advantages: • Development of seed wafers to manufacture silicon wafers, which can again be used to produce SOI wafers, thereby reducing manufacturing costs • Suitability for high-volume manufacturing of wafers • Highly flexible thickness of top silicon and Buried Oxide (BOX) layers • Scalability to offer any wafer size
- 11. The MEMS segment is projected to grow at the highest CAGR during the forecast period. The use of SOI wafers in MEMS devices for consumer electronics, automotive, and industrial applications is fueling the growth of the MEMS segment. Additionally, thick SOI- based MEMS are used in accelerometers, gyroscopes, and RF and optical MEMS. SOI-based MEMS devices are highly reliable and compact and can carry out high- speed operations.
- 13. On the basis of verticals, the MEMS market has been segmented into automotive, consumer electronics, industrial, healthcare, defense, telecom, and aerospace. The consumer electronics vertical accounted for the largest share of ~49% of the overall MEMS market in 2016 and is expected to be the major shareholder during the forecast period. The MEMS market for the consumer electronics vertical is expected to grow from USD 5.38 billion in 2016 to USD 10.10 billion by 2022, at a CAGR of 11.4% between 2017 and 2022.The MEMS market for the healthcare vertical is expected to grow at the highest CAGR of 14.1% between
- 14. The overall MEMS market, by device type, was valued at USD 10,923.8 million in 2016 and is expected to reach USD 18,886.5 million by 2022, growing at a CAGR of 9.8% during the forecast period. The sensor type accounted for the largest share of ~70% of the overall MEMS market in 2016. This market is expected to grow from USD 7,657.5 million in 2016 to USD 11,455.3 million by 2022, at a CAGR of 7.2% between 2017 and 2022. The actuator type is expected to grow at the highest CAGR of 14.8% between 2017 and 2022.
- 15. The consumer electronics vertical accounted for the largest share of ~50% of the overall MEMS market for sensor type in 2016. This vertical is expected to grow from USD 3,807.5 million in 2016 to USD 5,794.2 million by 2022, at a CAGR of 7.5% between 2017 and 2022. The healthcare vertical is expected to grow to USD 413.5 million by 2022, at the highest CAGR of 11.7% during the forecast period.
- 17. The automotive MEMS sensor market size in term of value is expected to grow from $2,742.14 million in 2014 to $3,605.57 million by 2020, at an estimated CAGR of 4.7% between 2014 and 2020. The rising demand for safety in automobiles would drive the growth of this market, as safety is given as predominant The production of automotive MEMS sensors is being driven by their increasing usage in the automobiles.
- 18. Inertial sensors accounted for the largest percentage share of nearly 56% in 2013 Microphone is the fastest-growing market at an estimated CAGR of 11.9% between 2014 and 2020 Out of all the types of the inertial automotive MEMS sensors, accelerometers accounted for the maximum percentage share of nearly 53% in 2013 The combo sensor is a newly introduced technology and is accounted as the fastest-growing type of inertial sensor with an estimated CAGR of 20.7% between 2014 and 2020
- 19. MEMS is a primary technology that supports the need of sensing technology in automotive and also finds its way in a wide variety of different control applications in automotive. With the use of the MEMS technology, it has become possible to miniaturize, integrate, and embed automobile sensors in a cost-effective system, while affiliating the automation of automobiles, declines in gas emissions, less power consumption, and improvements in safety INDUSTRY TRENDS
- 20. The Porter‘s analysis of automotive MEMS sensor market indicates that the intensity of rivalry within the industry and bargaining power of buyers will remain high; whereas, threat from new entrants and bargaining power of suppliers will remain medium in the next six years; however, threat from substitutes will remain low throughout the forecast period.
- 21. AUTOMTOIVE MEMS SENSOR MARKET, BY TYPE Inertial sensors accounted for the largest percentage share of nearly 56% in 2013 The inertial sensors market is expected to grow from $1,445.08 million in 2013 to $1,720.06 million in 2020 at an estimated CAGR of 2.0% between 2014 and 2020 Microphone is the fastest-growing market at an estimated CAGR of 11.9% between 2014 and 2020 Out of all the types of the inertial automotive MEMS sensors, accelerometers accounted for the maximum percentage share of nearly 53% in 2013 The combo sensor is a newly introduced technology and is accounted as the fastest-growing type of inertial sensor with an estimated CAGR of 20.7% between 2014 and 2020
- 22. Microphone is the fastest-growing market at an estimated CAGR of 11.9% between 2014 and 2020 and is estimated to grow from $5.89 million in 2013 to $13.64 million in 2020. The major reason behind the fastest growth rate of the microphone market is the advantages offered by the MEMS microphones. MEMS microphones provides improved signal to noise ratio (SNR) and low power consumption.
- 23. In APAC, inertial sensors accounted for the largest share of 55% in 2013 and the market size for inertial sensors is expected to grow from $332.58 million in 2013 to $474.42 million by 2020, at a CAGR of 4.6% between 2014 and 2020. Microphone is expected to be the fastest-growing market at a CAGR of 16.7% between 2014 and 2020.
- 24. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET (2013-2019)
- 25. Semiconductor & IC Packaging Materials Market Size In Packaging Technology, By Packaging Technology The figure above shows the market size growth of semiconductor and IC packaging materials by application between 2013 and 2019 SOP and GA are anticipated to be the dominant market in 2013, and is expected to maintain its position till 2019
- 26. Semiconductor & IC Packaging Materials Market Size, By Packaging Technologies The figure shows the market size for semiconductor and IC packaging technologies between 2013 and 2019 The market size for packaging technologies is expected to witness a rise from $18,290 million in 2013 to $22,451.0 million by 2019
- 27. Asia-Pacific: Semiconductor & IC Packaging Materials Market Size, By Type, 2012–2019 ($Million) The market for organic substrates is expected to grow with the highest CAGR of 7.1% followed by encapsulation resins growing at a CAGR of 6.3% from 2014 to 2019 The total semiconductor & IC packaging materials market is expected to grow at a CAGR of 5.0% from 2014 to 2019