Power Discrete Packaging Comparison 2018 report published by System Plus Consulting

©2018 by System Plus Consulting | Power Discrete Package Comparison 1
22, bd Benoni Goullin - Nantes Biotech
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Discrete Packages Comparison
A Cost Oriented Trend Analysis
Power Semiconductor report by Farid Hamrani
May 2018

SUMMARY
Overview 3
o Executive Summary
o Reverse Costing Methodology
o Analyzed devices
Introduction 7
o Discrete Market
Physical and Manufacturing Cost Analysis 24
o 3x1.3mm²
 SOT23
o 3x1.6mm²
 TSOP6
o 3x3mm²
 SON3x3
 TSMT8
o 4.5x2.5mm²
 SOT89
 SOIC-8
o 5x6mm²
 PowerFLAT 5x6
 PowerFLAT 5x6 Double Island
 PowerFLAT 5x6 Dual Side Cooling
 SOP Advance
 DSOP Advance
o 6x6mm²
 DPAK
 DPAK-5
o 10x10mm²
 D2PAK7
 H2PAK
 PSOFA-008
 TO-220
o 15x20mm²
 TO-247
Comparison
Company services 115

O V E R V I E W
METHODOLOGY

Overview
o Executive Summary
o Reverse Costing
Methodology
o Analyzed devices
Introduction
Physical Analysis
About System Plus
Executive Summary
In recent years the packaging market industry has been stabilizing around some standards formats and footprint. But the ever-
going race for optimization is far from being over.
The fast-moving evolutions of the EV/HEV markets, the electrification of transportation, and more generally the of the power
electronic market growth have induced a contested competition between power electronic components manufacturers.
And the race to innovation and efficiency, the semiconductor die itself isn’t the only key of success. In fact, when chasing after
the optimum configuration for electrical, thermal and mechanical performances, the manufacturers also must battle with the
mechanical reliability and cost of the packaging. More than a simple “shell” the packaging surrounding the dies can make or
break a design.
To satisfy an industry where standardization and return of experience and key points of success, seemingly small but smart
tweaks around common packages can turn out to be highly differentiating.
Through physical analysis (chemical opening, cross-section, measurements and so on) this report try to overview the state of
the art of packaging power semiconductor at a discrete level. With a cost oriented point of view, we are revealing the hidden
details that makes the differences between over 20 types of packages ranging from mW to kW sustaining designs.

Overview
o Executive Summary
o Reverse Costing
Methodology
o Analyzed devices
Introduction
Physical Analysis
About System Plus
The report contains the following analysis:
Teardown
analysis
•
•Packages are externally analyzed and measured. Then the molding is removed
through chemical opening. Finally a cross-section on the components is realized for
internal measurements purposes
Reverse methodology
Costing
analysis
•Setup of the manufacturing environment
•Cost simulation of the process steps

Introduction
& M a r ke t

Overview
Introduction
o Packaging technology
o Power Discrete Market
Physical Analysis
About System Plus
Market Evolution
• This Market forecast by Yole Developpment is showing the rise of the global power market devices.
• It also shows that the market for the Discrete devices will follow that trend with an estimated XXX increase in the next five years.
Source: Yole Développment

P H Y S I C A L
A N A L Y S I S
5x6mm²

Overview
Introduction
Physical Analysis
o 5x6mm²
 PowerFLAT 5x6
 PowerFLAT Double Island
 PowerFLAT Double Dual Side
 SOP Advance
 DSOP Advance
 Power 56
 DualCool TM 56
 So-8FL
 TDSON-8
 Direct FET1
About System Plus
SOP Advance – Overview
• The SOP packaging enables current output up to 40 A, an improvement on Toshiba's standard
SOP-8 MOSFETs. Toshiba's SOP Advance packaging is only 1 mm in height, approximately a 37
percent reduction in thickness compared to Toshiba's standard SOP-8 packaging

Overview
Introduction
Physical Analysis
o 5x6mm²
 PowerFLAT 5x6
 SOP Advance
 DSOP Advance
 Power 56
 DualCool TM 56
 So-8FL
 TDSON-8
 Direct FET1
About System Plus
SOP Advance – Views and Dimensions
0.95mm
Top View Side View Bottom View
6mm
5mm
• Total Pad area: 17.5mm²

Overview
Introduction
Physical Analysis
o 5x6mm²
 PowerFLAT 5x6
 SOP Advance
 DSOP Advance
 Power 56
 DualCool TM 56
 So-8FL
 TDSON-8
 Direct FET1
About System Plus
SOP Advance – Opening and Cross-Section
Cross-section View
Top View After Chemical Opening
Description
Base 1 (mm)
Base 2 (mm)
Overall Height (mm)
Overall Width (mm)
Leadframe Thickness (mm)
Leadframe Surface (mm²)
Solder Thickness (µm)
Solder Surface (mm²)
Tinning Thickness (µm)
Tinning Surface (mm²)
Die Height (mm)
Die Area mm²
Die Volume mm3
Overall Volume (mm3)
Leadframe Volume (mm3)
Solder Volume (mm3)
Tinning volum (mm3)
Resine Volume (mm3)

Overview
Introduction
Physical Analysis
o 5x6mm²
 PowerFLAT 5x6
 SOP Advance
 DSOP Advance
 Power 56
 DualCool TM 56
 So-8FL
 TDSON-8
 Direct FET1
About System Plus
SOP Advance – Cost Simulation

COMPARISON

Overview
Introduction
Company Profile & Supply Chain
Physical Analysis
o Comparison
About System Plus
Package Cost Breakdown Comparison
This graph above compares the cost breakdown of each of the studied packages

Overview
Introduction
Company Profile & Supply
Chain
Physical Analysis
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
Power Electronics
• Status of the Power Electronics Industry 2017
• Power Module Packaging: Material Market and Technology
Trends 2017
• Power MOSFET 2017: Market and Technology Trends
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Power Semiconductors & Compound
• Industrial 100V MOSFET Technology and Cost Review
• 1200V SiC MOSFET vs Silicon IGBT: Technology and cost
comparison
• 40V Silicon MOSFETs Technology and Cost Review
Related Reports

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COMPANY
SERVICES

Overview
Introduction
Chain
Physical Analysis
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
Business Models a Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>40 reports per years)
Costing Tools
Training

Overview
Introduction
Chain
Physical Analysis
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
Contact
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