This document provides instructions for performing a rub-out on a printed circuit board using an LPKF milling machine and Circuit Pro software. It describes the basic layers needed, how to define a rub-out boundary layer, and settings for partial or full rub-out toolpaths. Troubleshooting tips are provided for issues like an unexpected circle in mill width tests or Circuit Pro requesting a bit size not available. Detailed steps and screenshots are omitted for brevity.