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Smart Textiles – Adding Value to Sri Lankan Textiles
           The Electronic Textiles Option



Dr Tilak Dias
School of Materials
The University of Manchester, UK
Tilak Dias



                 Introduction

• All current commodity textiles are passive;
  i.e. not capable of adapting to environmental
  changes

• Current technical textiles are engineered to
  perform within a defined set of parameters; may
  have the ability to adapt to changes within very
  narrow bandwidth of environmental changes
Tilak Dias

                                          Introduction



Next generation of textiles will be active and
intelligent;
i.e. they would be able to adapt to changes in
the environment


               Question
                What are they ?
Tilak Dias


SMART & Intelligent Knitted Structures

          Core Elements


Knitted transducers


Intelligent signal processing



       Knitted actuators
Tilak Dias




Background
Tilak Dias




          Background

Research team:
• Anura Fernando
• Edward Lay
• Kim Mitcham
• Ravindra Monaragala
• Ravindra Wijesiriwardana
• William Hurley
Tilak Dias




      Research in Electro-textiles

• Heat generating knitted structures
• Knitted transducers and sensors
• Light emitting fabrics
• Electronically active yarns
Tilak Dias


            Electrically Active Knitted Structures

Concept of creating textiles with significant electrical properties:
Incorporate conductive elements into the structure

                                                       knitted structure




       Electro Conductive Area (ECA)
Tilak Dias



       Science and Technology Base

    Advantage of using knitted structures

•
•


•


•
Tilak Dias




 Creation of ECA

Use of electro-conductive
fibres/yarns
 Metal yarns (mono-filament
   and multi-filament)
 Metal deposition yarns
 Carbon fibres and yarns
 Conducting polymeric yarns

                               Stainless steel yarn
Tilak Dias




 Creation of ECA

Use of electro-conductive
fibres/yarns
 Metal yarns (mono-filament
   and multi-filament)
 Metal deposition yarns
 Carbon fibres and yarns
 Conducting polymeric yarns

                               PA yarn vacuum coated with Ag
                                         nano layer
Tilak Dias




 Creation of ECA

Use of electro-conductive
fibres/yarns
 Metal yarns (mono-filament
   and multi-filament)
 Metal deposition yarns
 Carbon fibres and yarns
 Conducting polymeric yarns

                               Silicone monofilament yarn loaded with
                               Carbon (0.5mm diameter); FabRoc®
Tilak Dias

                                           Scan2Knit Technology


 Computerised flat-bed knitting technology to create
three dimensionally shaped seamless stockings




                 Stoll CMS 330.6, E18
Tilak Dias




Advantages of using modern computerised flat-
bed knitting technology to create medical textiles


   • Precision positioning of fibers in 3D space
   • Ability to create seamless 3D structures
   • Multilayer structures
   • True seamless garment knitting techniques
   •   “Scan2Knit” technology
Tilak Dias


  Example of a knitted sensor
                                Conductive pathway 1

       Base structure


                        ECA




Conductive pathway 2
Tilak Dias

                     Modelling

                                        RH




                             RL                     RL

                                        RH




Unit Cell - Stitch           Electrical Equivalent Circuit
Tilak Dias


                                  Modelling

                        Calculation of RH and RL



             Lleg                                             Lhead
RL                                              RH 
                 A                                                   A
RL   Resistance of the stitch leg       RH    Resistance of the stitch head
Lleg Yarn length in the stitch leg      Lhead Yarn length in the stitch head
A     Yarn cross sectional area         A     Yarn cross sectional area
ρ      Resistivity of yarn              ρ      Resistivity of yarn
Tilak Dias


             Equivalent resistive mesh circuit of the ECA


Modelling                                                   22




                              Equivalent Resistance (Req)
                                                            20

                                                            18

                                                            16

                                                            14

                                                            12


                                                            10
                                                            20
                                                                   10                                  20
                                                                                                15
                                                                                         10
                                                                          0        5
                                                                              0


                                                            Relationship between equivalent
                                                            resistance and stitch density of the ECA
 Dimensions of the ECA:
 m courses x n wales                                               Assumption: Lleg = 2 Lhead
Tilak Dias


            Theoretical Prediction of Current Distribution




Current Distribution in Stitch Heads   Temperature Distribution in Stitch Heads




Current Distribution in Stitch Legs     Temperature Distribution in Stitch Legs
Tilak Dias



                                                                            Heating Glove

Conductive pathways
                                                                           ThermoKnit® heater
                                                                           elements (ECA)




   Power Vs Temperature (Room temp: 25°C )   Voltage Vs Average Steady State Temperature (Room temp: 25°C)
Tilak Dias



           Knitted Switch Technology “K-Switch”


Motivation:
Development of Next Generation of Textiles for the Automotive
Industry

Industry Requirement:
• Textile based switches and sensors with electro conductive
   pathways

• Heating textiles

• Light emitting textiles (headliners)
Tilak Dias

             Knitted structure with 4 dual ECAs (K-Switches)



                                         ECA2

                                                ECA1



        Knitted structure          20m
                                   m



                                         Constructional information:
Principle of operation:
                                         The minimum gap between the ECAs:
Measurement of DC resistance between     • Yarn filament diameter;
the two ECAs                             • Stitch length
Tilak Dias

                                                          K-Switch Technology

                                            DC Resistance variation




   Operation of the K-Switch

Principle of operation:
Measurement of the DC resistance
between the two ECAs
                                   Determined with a precision digital multimeter
                                   under two wire resistance measurement
                                   configuration at 0.1s sample rate
Tilak Dias

                     K-Switch Technology


DC Resistance variation with time




Observation: less than 300µs settling time
Tilak Dias

Applications   K-Switch Technology
Tilak Dias

                                                K-Switch Technology
Analysis
Advantages:
• Easy and reliable manufacture
• Higher degree of design capability (3 yarn jacquard knitting)
• Cost effective manufacture
• Higher durability and life time
• Straightforward integration of K-Switches for different
  applications

Limitations:
• Simple electronics
• Switch characteristics depends on skin resistance
• Ineffective to other materials
Tilak Dias

                                          K-Switch Technology

Modelling of Impedance between the ECAs




   Cole-Cole model equivalent circuit of the
         ECA - Skin - ECA Impedance
Tilak Dias


                                   Influence of the measurement frequency on the
                                         impedance - open circuit of the ECAs


                                                          Open circuit impedance is 0.1954 MΩ
                                                          at frequencies greater than 2 MHz
                      Impedance in MΩ
K-Switch Technology




                                                  Frequency in MHz
Tilak Dias

                      Impedance characteristics of K-Switch
                           Closed circuit of the ECAs
K-Switch Technology
Tilak Dias


                      Impedance characteristics of K-Switch
                           Closed circuit of the ECAs
K-Switch Technology
Tilak Dias


                 Electro-Luminescent Fibre Structures

Theoretical background:
Exposure of an electroluminescent substance to a high frequency
electrical field           radiate light

The state-of-the-art
EL polymer sheets
Screen printing micro-encapsulated phosphors (Osram) on to
plastic sheets

         EL layer (µm)            Conductive transparent layer (µm)

   2 dielectric layers (µm)
     Silver layer (µm)
           Plastic sheet (base)
Tilak Dias

                             EL Yarn Technology

     Motivation:
     Develop EL Yarns which could be integrated into textile structures

                                                               Concept




1. Electro-conductive yarn
2. Dielectric layer
3. EL layer
4. Transparent protective
   layer
5. Conductive wire
Tilak Dias

Experimental Rig
Tilak Dias




  Not activated       Activated – low frequency



Knitted EL Samples



                     Activated – high frequency
Tilak Dias

                     Application of EL Fibres
• Light Emitting Textiles
  • Transport sector, passenger cabin design of vehicles; e.g.
    headliners, carpets, upholstery
  • Advertising industry; e.g. flexible and drapable billboards
    and notice boards
  • Buildings; e.g. ceilings, walls, carpets
  • Household products; e.g. curtains, furniture fabrics, wall
    hangings, lamp shades, decorative products
  • Safety and security products

• Light Emitting Braids and Ropes
  • Safety and security products
  • Decorative and fashion products
Tilak Dias


Garment System for vital sign monitoring

Background

Suggestion from School of Medicine, University of Manchester

Initiation of partnership between Imaging Science and
Biomedical Engineering (ISBE), Medical School; Digital Signal
Processing Group (DSPG), School of Electrical & Electronics,
and Department of Textiles (UMIST) in 2002

Initial funding from The Department of Trade and Industry, UK

Setting-up research team for Science & Technology
development
Tilak Dias




Research Achievements


• Creation of Science base for knitted transducers
  •   Knitted dry electrodes
  •   Knitted strain gauges
  •   Knitted inductive sensors
  •   Knitted conductive pathways


• Development of technology for producing a garment with
  integrally knitted sensors and conductive pathways

• Development of vest with 2 lead ECG (proof of concept)
Tilak Dias




Commercialisation of Technology

• IPR protected by UMIP
  1 core patent
• IPR assigned to a group of entrepreneurs
• Formation of a joint venture company by UMIP
  SmartLife® Technology Ltd

• Raised funds by SmartLife® for development of core
  technology in the University (SoM, ISBE, DSPG)
• Development of “Health Vest” with 3 leads ECG,
  Respiratory and Skin Temperature monitoring
• Development of hardware and signal processing software
Tilak Dias

SmartLife® Health Vest




                         2004




 2004                           2007
Tilak Dias



     Signal comparison




Signal from standard Ag/AgCl Gel electrodes           Signal from SmartLife® electrodes


                                   Amplitude (mV)                     Duration (ms)
     Signal
     Section             Ag/AgCl                    Vest           Ag/AgCl      Vest

  P wave                   0.2                      0.3              120        120

  QRS complex              2.0                      2.5              80          80

  T wave                   0.5                      0.5              240        240
Tilak Dias



   Target Markets


  1. Health, Wellbeing & Homecare
     Market size e.g. cardiovascular: ECG US$8bn1
      Predictive monitoring
      Clinical monitoring of patients in their own homes

  2. Sports
     Estimated market size US$2bn – Professional Personal monitoring
      Training, lifestyle, personal

  3. Hazardous Environment – first responders, military
     Estimated market size US$2bn

[1] Global Market For Patient Monitoring devices US$11.4bn (Frost & Sullivan 2005)
Tilak Dias



Current Research




                          Sensor sock for drop
                          foot detection




 High frequency textile
 antenna
Tilak Dias


Future ……       Electronically functional yarns




            Fibres and yarns with
            sensors, transducers
            and activators
Tilak Dias


               Apparel Manufacturing Process Interface
Key process steps                 Integration of electronic devices with apparels
    Active and sensory micro-devices




                                                                                 GARMENT
 Fibres/Yarn                         Fabric              Garment
 Manufacture                       Manufacture
                                     2nd Generation     Manufacture
                 3rd Generation




                                                           1st Generation




                                                                                 1st Generation
Tilak Dias


      Electronically active and sensor fibres




Technology is based on the encapsulated area not
    exceeding 110% of the thread thickness
Tilak Dias




Vision
The development of novel technology for
fabricating electronically active and sensor
fibres which will be the basic building blocks of
the next generation ‘SMART’ fibrous materials
Tilak Dias


     Micro-device Encapsulation Technology




Involves encapsulating devices with a flexible hermetic
seal for mechanical, thermal and electrical protection
Tilak Dias


MET Platform

                                        μ-devices:
                                           • electronic chips
                                           • magnetic devices
                                           • optical devices
                                           • thermal devices
   Schematic diagram of a yarn device


• Development of the concept of encapsulating
• Mathematical modelling
• Design and development of an experimental rig
• Demonstrator E-Yarn with a working diode (LED) and RFID tag
Tilak Dias

MET Platform
Tilak Dias


   INVENTION

Micro-device
Encapsulation
Technology Platform




                      Prototype
                      Demonstrator ?
Tilak Dias


Demonstrator 1               Light Emitting Fibres




 Yarn with a working Diode                 Energised
  (0.4 x 1.0 x 0.3 mm LED)
Tilak Dias

Light Emitting Garments
   Events Garments
Tilak Dias


                                                            Demonstrator 2   RFID Fibres

                                    Aim: Development of MET for embedding Hitachi MU Tag
© Copyright EntellFibres Ltd 2008
Tilak Dias


              Current Research

Development of light emitting fabrics
• Active fashion garments
• Displays



Development of sensory yarn capable of:
• Monitoring strain/stress
• Sensing temperature
• Pressure measurement
• Sensing fluids/liquids
Thank You

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Smart Textiles – Adding Value to Sri Lankan Textiles The Electronic Textiles Option (Handout)

  • 1. Smart Textiles – Adding Value to Sri Lankan Textiles The Electronic Textiles Option Dr Tilak Dias School of Materials The University of Manchester, UK
  • 2. Tilak Dias Introduction • All current commodity textiles are passive; i.e. not capable of adapting to environmental changes • Current technical textiles are engineered to perform within a defined set of parameters; may have the ability to adapt to changes within very narrow bandwidth of environmental changes
  • 3. Tilak Dias Introduction Next generation of textiles will be active and intelligent; i.e. they would be able to adapt to changes in the environment Question What are they ?
  • 4. Tilak Dias SMART & Intelligent Knitted Structures Core Elements Knitted transducers Intelligent signal processing Knitted actuators
  • 6. Tilak Dias Background Research team: • Anura Fernando • Edward Lay • Kim Mitcham • Ravindra Monaragala • Ravindra Wijesiriwardana • William Hurley
  • 7. Tilak Dias Research in Electro-textiles • Heat generating knitted structures • Knitted transducers and sensors • Light emitting fabrics • Electronically active yarns
  • 8. Tilak Dias Electrically Active Knitted Structures Concept of creating textiles with significant electrical properties: Incorporate conductive elements into the structure knitted structure Electro Conductive Area (ECA)
  • 9. Tilak Dias Science and Technology Base Advantage of using knitted structures • • • •
  • 10. Tilak Dias Creation of ECA Use of electro-conductive fibres/yarns  Metal yarns (mono-filament and multi-filament)  Metal deposition yarns  Carbon fibres and yarns  Conducting polymeric yarns Stainless steel yarn
  • 11. Tilak Dias Creation of ECA Use of electro-conductive fibres/yarns  Metal yarns (mono-filament and multi-filament)  Metal deposition yarns  Carbon fibres and yarns  Conducting polymeric yarns PA yarn vacuum coated with Ag nano layer
  • 12. Tilak Dias Creation of ECA Use of electro-conductive fibres/yarns  Metal yarns (mono-filament and multi-filament)  Metal deposition yarns  Carbon fibres and yarns  Conducting polymeric yarns Silicone monofilament yarn loaded with Carbon (0.5mm diameter); FabRoc®
  • 13. Tilak Dias Scan2Knit Technology Computerised flat-bed knitting technology to create three dimensionally shaped seamless stockings Stoll CMS 330.6, E18
  • 14. Tilak Dias Advantages of using modern computerised flat- bed knitting technology to create medical textiles • Precision positioning of fibers in 3D space • Ability to create seamless 3D structures • Multilayer structures • True seamless garment knitting techniques • “Scan2Knit” technology
  • 15. Tilak Dias Example of a knitted sensor Conductive pathway 1 Base structure ECA Conductive pathway 2
  • 16. Tilak Dias Modelling RH RL RL RH Unit Cell - Stitch Electrical Equivalent Circuit
  • 17. Tilak Dias Modelling Calculation of RH and RL Lleg Lhead RL  RH  A A RL Resistance of the stitch leg RH Resistance of the stitch head Lleg Yarn length in the stitch leg Lhead Yarn length in the stitch head A Yarn cross sectional area A Yarn cross sectional area ρ Resistivity of yarn ρ Resistivity of yarn
  • 18. Tilak Dias Equivalent resistive mesh circuit of the ECA Modelling 22 Equivalent Resistance (Req) 20 18 16 14 12 10 20 10 20 15 10 0 5 0 Relationship between equivalent resistance and stitch density of the ECA Dimensions of the ECA: m courses x n wales Assumption: Lleg = 2 Lhead
  • 19. Tilak Dias Theoretical Prediction of Current Distribution Current Distribution in Stitch Heads Temperature Distribution in Stitch Heads Current Distribution in Stitch Legs Temperature Distribution in Stitch Legs
  • 20. Tilak Dias Heating Glove Conductive pathways ThermoKnit® heater elements (ECA) Power Vs Temperature (Room temp: 25°C ) Voltage Vs Average Steady State Temperature (Room temp: 25°C)
  • 21. Tilak Dias Knitted Switch Technology “K-Switch” Motivation: Development of Next Generation of Textiles for the Automotive Industry Industry Requirement: • Textile based switches and sensors with electro conductive pathways • Heating textiles • Light emitting textiles (headliners)
  • 22. Tilak Dias Knitted structure with 4 dual ECAs (K-Switches) ECA2 ECA1 Knitted structure 20m m Constructional information: Principle of operation: The minimum gap between the ECAs: Measurement of DC resistance between • Yarn filament diameter; the two ECAs • Stitch length
  • 23. Tilak Dias K-Switch Technology DC Resistance variation Operation of the K-Switch Principle of operation: Measurement of the DC resistance between the two ECAs Determined with a precision digital multimeter under two wire resistance measurement configuration at 0.1s sample rate
  • 24. Tilak Dias K-Switch Technology DC Resistance variation with time Observation: less than 300µs settling time
  • 25. Tilak Dias Applications K-Switch Technology
  • 26. Tilak Dias K-Switch Technology Analysis Advantages: • Easy and reliable manufacture • Higher degree of design capability (3 yarn jacquard knitting) • Cost effective manufacture • Higher durability and life time • Straightforward integration of K-Switches for different applications Limitations: • Simple electronics • Switch characteristics depends on skin resistance • Ineffective to other materials
  • 27. Tilak Dias K-Switch Technology Modelling of Impedance between the ECAs Cole-Cole model equivalent circuit of the ECA - Skin - ECA Impedance
  • 28. Tilak Dias Influence of the measurement frequency on the impedance - open circuit of the ECAs Open circuit impedance is 0.1954 MΩ at frequencies greater than 2 MHz Impedance in MΩ K-Switch Technology Frequency in MHz
  • 29. Tilak Dias Impedance characteristics of K-Switch Closed circuit of the ECAs K-Switch Technology
  • 30. Tilak Dias Impedance characteristics of K-Switch Closed circuit of the ECAs K-Switch Technology
  • 31. Tilak Dias Electro-Luminescent Fibre Structures Theoretical background: Exposure of an electroluminescent substance to a high frequency electrical field radiate light The state-of-the-art EL polymer sheets Screen printing micro-encapsulated phosphors (Osram) on to plastic sheets EL layer (µm) Conductive transparent layer (µm) 2 dielectric layers (µm) Silver layer (µm) Plastic sheet (base)
  • 32. Tilak Dias EL Yarn Technology Motivation: Develop EL Yarns which could be integrated into textile structures Concept 1. Electro-conductive yarn 2. Dielectric layer 3. EL layer 4. Transparent protective layer 5. Conductive wire
  • 34. Tilak Dias Not activated Activated – low frequency Knitted EL Samples Activated – high frequency
  • 35. Tilak Dias Application of EL Fibres • Light Emitting Textiles • Transport sector, passenger cabin design of vehicles; e.g. headliners, carpets, upholstery • Advertising industry; e.g. flexible and drapable billboards and notice boards • Buildings; e.g. ceilings, walls, carpets • Household products; e.g. curtains, furniture fabrics, wall hangings, lamp shades, decorative products • Safety and security products • Light Emitting Braids and Ropes • Safety and security products • Decorative and fashion products
  • 36. Tilak Dias Garment System for vital sign monitoring Background Suggestion from School of Medicine, University of Manchester Initiation of partnership between Imaging Science and Biomedical Engineering (ISBE), Medical School; Digital Signal Processing Group (DSPG), School of Electrical & Electronics, and Department of Textiles (UMIST) in 2002 Initial funding from The Department of Trade and Industry, UK Setting-up research team for Science & Technology development
  • 37. Tilak Dias Research Achievements • Creation of Science base for knitted transducers • Knitted dry electrodes • Knitted strain gauges • Knitted inductive sensors • Knitted conductive pathways • Development of technology for producing a garment with integrally knitted sensors and conductive pathways • Development of vest with 2 lead ECG (proof of concept)
  • 38. Tilak Dias Commercialisation of Technology • IPR protected by UMIP 1 core patent • IPR assigned to a group of entrepreneurs • Formation of a joint venture company by UMIP SmartLife® Technology Ltd • Raised funds by SmartLife® for development of core technology in the University (SoM, ISBE, DSPG) • Development of “Health Vest” with 3 leads ECG, Respiratory and Skin Temperature monitoring • Development of hardware and signal processing software
  • 39. Tilak Dias SmartLife® Health Vest 2004 2004 2007
  • 40. Tilak Dias Signal comparison Signal from standard Ag/AgCl Gel electrodes Signal from SmartLife® electrodes Amplitude (mV) Duration (ms) Signal Section Ag/AgCl Vest Ag/AgCl Vest P wave 0.2 0.3 120 120 QRS complex 2.0 2.5 80 80 T wave 0.5 0.5 240 240
  • 41. Tilak Dias Target Markets 1. Health, Wellbeing & Homecare Market size e.g. cardiovascular: ECG US$8bn1  Predictive monitoring  Clinical monitoring of patients in their own homes 2. Sports Estimated market size US$2bn – Professional Personal monitoring  Training, lifestyle, personal 3. Hazardous Environment – first responders, military Estimated market size US$2bn [1] Global Market For Patient Monitoring devices US$11.4bn (Frost & Sullivan 2005)
  • 42. Tilak Dias Current Research Sensor sock for drop foot detection High frequency textile antenna
  • 43. Tilak Dias Future …… Electronically functional yarns Fibres and yarns with sensors, transducers and activators
  • 44. Tilak Dias Apparel Manufacturing Process Interface Key process steps Integration of electronic devices with apparels Active and sensory micro-devices GARMENT Fibres/Yarn Fabric Garment Manufacture Manufacture 2nd Generation Manufacture 3rd Generation 1st Generation 1st Generation
  • 45. Tilak Dias Electronically active and sensor fibres Technology is based on the encapsulated area not exceeding 110% of the thread thickness
  • 46. Tilak Dias Vision The development of novel technology for fabricating electronically active and sensor fibres which will be the basic building blocks of the next generation ‘SMART’ fibrous materials
  • 47. Tilak Dias Micro-device Encapsulation Technology Involves encapsulating devices with a flexible hermetic seal for mechanical, thermal and electrical protection
  • 48. Tilak Dias MET Platform μ-devices: • electronic chips • magnetic devices • optical devices • thermal devices Schematic diagram of a yarn device • Development of the concept of encapsulating • Mathematical modelling • Design and development of an experimental rig • Demonstrator E-Yarn with a working diode (LED) and RFID tag
  • 50. Tilak Dias INVENTION Micro-device Encapsulation Technology Platform Prototype Demonstrator ?
  • 51. Tilak Dias Demonstrator 1 Light Emitting Fibres Yarn with a working Diode Energised (0.4 x 1.0 x 0.3 mm LED)
  • 52. Tilak Dias Light Emitting Garments Events Garments
  • 53. Tilak Dias Demonstrator 2 RFID Fibres Aim: Development of MET for embedding Hitachi MU Tag © Copyright EntellFibres Ltd 2008
  • 54. Tilak Dias Current Research Development of light emitting fabrics • Active fashion garments • Displays Development of sensory yarn capable of: • Monitoring strain/stress • Sensing temperature • Pressure measurement • Sensing fluids/liquids