Unit1_Lecture1_Basic Planar Processes.ppt
- 1. Overview of Silicon Semiconductor Technology Module 1 – CMOS Technology Module 1 – CMOS Technology
- 2. Learning Outcome Learning Outcome Students will be able to illustrate the processing steps in silicon semiconductor technology Lecture 1 - Overview of Silicon Semiconductor Technology 2 Course Outcome (CO1) Students will be able to Familiarize the process involved in fabrication of CMOS Technology
- 3. Basic Planar Processes Basic Planar Processes
- 4. Processes used to fabricate IC Processes used to fabricate IC Silicon Wafer (Substrate) Preparation Epitaxial Growth Oxidation Photolithography Diffusion Ion Implantation Isolation Technique Metallization Assembly Processing and Packaging
- 5. Silicon Wafer Preparation Silicon Wafer Preparation Czochralski Crystal Growth Czochralski Crystal Growth
- 6. Silicon Ingot & Ingot Slicing Silicon Ingot & Ingot Slicing
- 7. Wafer Polishing and Etching Wafer Polishing and Etching
- 10. Oxidation Oxidation Si + 2H2O SiO2 + 2H2
- 14. Isolation Techniques Isolation Techniques PN Junction Isolation Dielectric Isolation
- 15. PN Junction Isolation PN Junction Isolation
- 17. Metallization Metallization Aluminium is used in metallization due to following reasons: It is a good conductor. Easy to deposit using aluminium films using vacuum deposition It makes good mechanical bonds with silicon It forms low resistance contact with p type Si and heavily doped n-type Si.
- 19. Assembly Processing and Packaging Assembly Processing and Packaging
- 20. Assembly Processing and Packaging Assembly Processing and Packaging