congatec

We’re excited to be part of the TSN/A Conference in Stuttgart this week! Our colleague Arthur Hutter is on site showcasing congatec’s balancing ball live demo, powered by a congatec Intel-based Computer-on-Module combined with our aReady.VT platform. Together, they highlight how virtualization technology can simplify complex embedded applications and enable real-time control. If you’re attending, make sure to stop by and see the demo in action – a great example of how modular building blocks help accelerate development in industrial and real-time environments. Not in Stuttgart? You can still watch the balancing ball demo here 🎥: https://lnkd.in/dCyp3ZdE Intel Corporation #TSN #virtualization #hypervisor

🤝 Partnership Announcement We are happy to announce, that we partner with Aaronn Electronic GmbH. Developers and OEMs in the DACH region benefit from an even greater product diversity, faster development cycles, and personalized support by the combined services of the leading COM vendor and one of the most successful system integrator for embedded computing in Germany.  With this strategic collaboration, Aaronn customers gain access to congatec’s complete Computer-on-Module portfolio, plus our application-ready building blocks - helping reduce integration complexity and accelerate time-to-market. 🔹 “The combination of our market-leading module portfolio and aReady. building blocks empowers customers to bring innovative systems to market faster,” says Oliver Utesch, Director of Business Development EMEA at congatec. 🔹 “Partnering with congatec feels like things are coming full circle – uniting our system integration know-how with the COM market leader founded by former JUMPtec employees,” adds Florian Haidn, CEO of Aaronn Electronic. 👉 Read the Press Release: https://lnkd.in/etmKpWmn #EmbeddedComputing #ComputerOnModules #Partnership #EdgeComputing

congatec will be at EOT - Electronics of Tomorrow 2025 📍 MCH Messecenter Herning, Denmark  📅 September 30 – October 2  📌 Booth C 2764 We will be #EOT2025, the knowledge hub and meeting place in the electronics and technology industry, at MCH Messecenter Herning in Denmark. Visit us at Booth C 2764 on September 30th to October 2nd to see how we continue to evolve our comprehensive COM-HPC, COM Express, and SMARC ecosystems to make high-performance embedded computing accessible and easy to integrate, while providing a foundation for scalable, energy-efficient, and secure designs. You'll also see firsthand how joining forces with JUMPtec gives you an even wider range of cutting-edge embedded computing options - built on decades of combined expertise. 🎡 And if you’re feeling lucky, spin our wheel of fortune and stand a chance to win one of 10 Bluetooth speakers! 

We’re excited to be part of the AMD Adaptive & Embedded Computing Tech Day in Tokyo today 🇯🇵✨ At this free technical conference, participants can explore the latest AMD products, tools, and solutions. Through presentations and interactive demos, we’re showcasing how AMD platforms and our solutions enable efficiency, scalability, and innovation in embedded computing. If you’re here in Tokyo, don’t miss the chance to stop by 👋

Small enough to slip in your pocket, big enough to run AI The SMARC (Smart Mobility ARChitecture) Module is a low-power, credit-card-sized Computer-on-Module designed for edge applications where every mm, gram, and watt counts.  📏 Quick Facts:  Size: 82 × 50 mm  Ultra-thin: just 1.5 mm from carrier to module bottom  Overall height with heat spreader: 11.7 mm → the slimmest open COM standard Designed for AI at the rugged edge, SMARC delivers high performance without compromise: https://lnkd.in/dQbrP67e 

Intel Corporation + congatec unlock the Power of Time Sensitive Networking: Visit Us in Stuttgart 💥 We’re excited to participate in the 10th TSN/A Conference hosted by Computer&Automation on September 23–24. Our Partner Intel Corporation will use our TSN demo setup to showcase the benefits of TSN in complex industrial, automotive, and audio/video applications.   Meet our colleagues Marcus Strobl and Arthur Hutter and get detailed information on our application-ready building blocks for Time Sensitive Networking and system consolidation in real-time applications. For a glimpse of what you can expect, watch our TSN demo video 👇👇👇

Find us today at SIDO Lyon - IoT, IA, Robotique & XR 2025 From September 17–18 at the Cité Internationale in Lyon, we’ll be part of Europe’s leading B2B showroom for #IoT, AI, XR & robotics. 👉 Meet us at booth 0212 🔹 Discover how our COM-HPC, COM Express & #SMARC modules enable powerful, efficient, and reliable solutions for tomorrow’s #AI, #IIoT, XR & intelligent automation. 🔹 Learn more about our aReady.COM ecosystem, providing flexible, pre-configured COMs to simplify installation, reduce costs, and speed up your embedded applications. 🎡 Give it a spin! Our wheel of fortune is giving away 10 Bluetooth speakers every single day.

Let’s meet at CIIF China 2025 – Booth 6.1H-B037 📅 September 23–27, 2025 | Shanghai  We’re excited to attend CIIF China, the leading trade show for emerging and high-end industries. At our booth, we’ll showcase how our latest innovations make embedded technology easier, faster, and more sustainable for your cutting-edge applications. 🚀 What awaits you: 🔹 aReady.COM – Discover how pre-configured hardware & software building blocks (with ctrlX OS or Ubuntu Pro) simplify application design and boost efficiency.  🔹 COM-HPC ecosystem – Experience high performance & scalability with our conga-HPC/mRLP.  🔹 COM Express ecosystem – Explore our conga-TC750, which delivers sophisticated AI performance for demanding use cases. 💡 Plus: test your knowledge in our interactive game and see how our ecosystems help you accelerate time-to-market while increasing agility, security, and cost-efficiency.    Register here: https://bit.ly/4mdAq7F  👉 See you in Shanghai    

Robot controller design is evolving fast. 🤖 The challenge? Balancing performance, cost, and complexity without compromising reliability. The solution? Real-time hypervisors. Read the Blog post by Claire Liu to learn more. 👇👇👇

We’re heading to Embedded Conference Finland (ECF25) on September 16 at Maria 01, Helsinki! Visit us to explore how our Computer-on-Modules and aReady.COM building blocks can accelerate your embedded designs. Don’t miss Timo Poikonen at 14:15 with his session “How to Simplify the Use of Embedded Technology” He’ll show how modular hardware and software building blocks – combined with comprehensive embedded services – can reduce development costs, support agile design, and help you build scalable, future-proof solutions. #ECF25 #EmbeddedConferenceFinland #congatec #ComputerOnModules #aReadyCOM #EmbeddedSystems #EdgeAI