Lightmatter

We're excited to announce that Lightmatter Principal Solutions Architect Taylor Groves will be presenting at Hot Interconnects this year. Join him for his session, "Accelerating Frontier MoE Training with 3D Integrated Optics," on August 20th at 12:30 PM PDT. Taylor will share insights on how our technology is pushing the boundaries of AI performance. Secure your spot today and register here: https://hoti.org/

Ready to dive into the future of interconnects? Registration is officially open for Hot Interconnects! Make sure to catch our Founder & CEO, Nicholas Harris, presenting on Day 1, August 20th. He'll share valuable insights on transforming AI infrastructure with 3D photonics, unpacking enabling technologies for faster, more efficient AI model training. Don't miss out – register now! https://hoti.org/ Thank you to all of the organizers who make this event possible! Artem Polyakov Rohit Zambre Subhadeep Bhattacharya Taylor Groves

Couldn't make it to the EE Times | Electronic Engineering Times Chiplet Pavilion at DAC last month? You're in luck! The entire program will be available as a virtual event, kicking off July 30th. Access Lightmatter's contributions, including Eric Yeh's technical presentation on unleashing AI performance and Ritesh Jain's insightful panel discussion with Sally Ward-Foxton. Register for free access to these valuable insights: https://bit.ly/4kSvSTO

Our Director of Product Marketing, Peter Carson, shares expert insights in his new article, "Charting the Photonic Future of AI Interconnect" for insideHPC. He explains how photonics is essential to overcome current interconnect bottlenecks, enabling the next great leap in AI performance as traditional scaling limits are met. Read more: https://bit.ly/4nVdL2k

Lightmatter's Senior Director, Head of Packaging Technologies Sandeep Sane presenting "Advancing AI Infrastructure with 3D Photonics and Chiplet Integration" at last week's CHIPcon in San Jose, CA.

Lightmatter is excited to be part of LightCounting Market Research's Exclusive Virtual Conference "Tracking Progress in Co-Packaged Optics," featuring our own Steve Klinger, VP of Product. This virtual event on July 15th, from 5:00 PM to 8:00 PM PST, explores CPO's development, success stories, and remaining challenges. Secure your spot and register today: https://bit.ly/44E4WkC

Lightmatter is at CHIPcon 2025 in San Jose this week! Don't miss Sandeep Sane, our Senior Director & Head of Packaging, presenting on "Silicon Photonics and Chiplet Integration for Future Compute Platforms." He'll discuss how silicon photonics and advanced packaging are reshaping high-performance computing to meet AI's demands. Catch his session: 🗓️ Thursday, July 10 | 1:30 PM – 2:30 PM 📍 San Jose Marriott We hope to see you there! Register here: https://bit.ly/4eIkk3R

Lightmatter is proud to be featured on CRN’s 2025 list of The 10 Hottest Semiconductor Startups. The article spotlights our mission, funding, and recent L200 and M1000 launches. This marks our second consecutive year on the list, affirming our progress in AI infrastructure. Thanks to The Channel Company and Dylan Martin! Read more: https://bit.ly/3Tk4UJl #Lightmatter #CRN #HottestStartups #SemiconductorTech #AITech

Thrilled to attend a powerhouse panel discussion featuring Ritesh Jain from Lightmatter! Incredible insights on how optical interconnects are transforming the future of AI infrastructure. EE Times | Electronic Engineering Times The future of #chiplets 2025 Design Automation Conference Lightmatter Ritesh Jain Kaushik Patel Ruosi (Moira) Feng Monica D'Angelo Peter Carson Eric Yeh Esha Radhakrishnani Sakura Ticer

The Design Automation Conference (DAC) kicks off today at the Moscone Center in San Francisco! Lightmatter is thrilled to be at the EE Times | Electronic Engineering Times Chiplet Pavilion, ready to discuss the future of AI infrastructure and chip technology. Stop by booth 2308 throughout the conference to learn how our photonic solutions are revolutionizing AI interconnects. Be sure to connect with our team and catch these key sessions: Panel Discussion: "Enabling New Design Directions" with Ritesh Jain, SVP of Engineering & Operations Date: Wednesday, June 25th, 2025 Time: 11:10 AM – 12:05 PM PDT Technical Presentation: "Unleashing AI Performance: Silicon Photonic Interconnects for the Next Wave of Acceleration" by Eric Yeh, Head of Product Marketing Date: Wednesday, June 25th, 2025 Time: 12:35 PM – 12:55 PM PDT We look forward to connecting with you at DAC. Learn more: https://bit.ly/4n57bFU #62DAC #Chiplets #AIInfrastructure #Photonics