The document discusses the growth of polycrystalline aluminum nitride (AlN) films on silicon wafers using a reactive sputter magnetron technique, focusing on achieving a preferential orientation along the (1 0 ̄1 1) planes. The study employs various analytical methods, including x-ray diffraction and transmission electron microscopy, to characterize the films and highlight challenges due to symmetry issues in the growth chamber. The findings suggest that optimizing the crystal structure of AlN is essential for its applications in semiconductor technologies, especially in deep ultraviolet light-emitting diodes.
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