Machine Vision In Electronic & Semiconductor Industry
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The document discusses machine vision systems in the electronic and semiconductor industry, outlining their definition, operation, components, and applications. It highlights various engineering domains and industries that utilize these systems for tasks like quality assurance, flaw detection, and metrology. Additionally, it details specific applications in semiconductor manufacturing, including front-end and back-end inspection processes.
Machine Vision In Electronic & Semiconductor Industry
- 1. Machine Vision In Electronic & Semiconductor Industry Francy Abraham Machine Vision Technologist
- 2. Contents What is machine vision system (vision system) Definition Operation scope Engineering domain Applications in general Industries that use vision systems Vision system components - Introduction Image processing - Introduction Vision system functions - Introduction Vision system performance Introduction to applications in electronic & semiconductor manufacturing Semiconductor front-end inspection & metrology Semiconductor back-end inspection & metrology IC assembly applications IC handling, inspection & metrology Leadframe inspection & metrology PCBA/Substrate assembly inspection
- 3. Machine Vision - Introduction What is machine vision? A utomatic non-contact acquisition and analysis of images to obtain desired data for use in controlling a process or activity
- 4. Operation Scope Operate beyond Human Vision IR UV/DUV X-ray
- 5. Machine Vision: Engineering Domain Optics/Electro-optics Illumination CCD/CMOS Cameras Frame Grabber Computer Precision Mechanical Scan Precision stages Absolute Encoders Motion Control Image Processing (Software) Pixel Count Correlation/NC Blob Analysis Pattern Matching/GP Decision Matrix Neural Networks Fuzzy Logic Many more …
- 6. Industries That Use Machine Vision Semiconductor PCB/A Automotive Pharmaceutical Packaging Military (Partial List) Electronic Components Food Processing Medical Device Glass Primary Metals
- 7. Vision System Applications Quality Assurance Metrology Flaw Detection Defect Detection Foreign Particles Contamination Test & Calibration Sensor calibration Real-Time Process Control Optical fiber drawing Hot steel strip rolling Data Collection & Sorting Mail Sort Machine Monitoring Operation monitoring Material Handling - Storage, Retrieval, Routing Gauging/Metrology Not contact measurement Robotic/Machine Guidance Recognize, Locate, Guide ID Tracking OCR, 1D & 2D barcode Counting Counting bottles Or cans in a conveyor Safety Detect Obstacles and alarm or stop Law Enforcement Vehicle tracking Electronic Road Pricing
- 8. Vision System Components Single or array of sensors to detect electromagnetic energy, usually 2D array Mechanism to collect reflected/transmitted energy Image formation hardware/electro-opto-mechanical assemblies Image acquisition hardware Image processing hardware & software I/O interfaces & User Interfaces Data communication
- 9. Images in Vision Systems Two dimensional array Each element is called a pixel Each pixel is a representation of surface information – 2D Height information – 3D (Voxel) The information can be Visual Non Visual Each pixel normally has a integer value (0 - 255) for 8 bit There are images with 10bit, 12bit, 16bit or 24 bit pixel resolutions The co-ordinate system has origin at top left corner
- 10. Image Processing Methods Pixel Counting Thresholding Connectivity & segmentation Blob analysis Edge Detection Template Matching Pattern Recognition Optical Character Recognition (OCR) Barcode Reading – 1D, 2D codes
- 11. Vision System Functions Location & Orientation Gauging/Metrology Inspection/ Flaw Detection Verification Identification Recognition Tracking & Guidance
- 12. Vision System Performance Perform Beyond Human Vision High Speed High Magnification/Resolution Highly Repeatable in controlled environment No fatigue - 24/7 Reliable Cheaper Good for unsafe and hazardous environment Operate well in space constrained environments
- 13. Semiconductor: Front-end Applications SEM Ellipsometer Reflectometer X-ray Fluroscence Interferometer Wave-front Sensing Dark Field Imaging
- 14. Macro-inspection On-the-fly 2D inspection Image arithmetic, Template matching, Blob Analysis, Pixel counting High Speed 3D Inspection Laser triangulation High speed con-focal Imaging Interferometer White light, Moire
- 15. Machine Vision Enabled Equipments Die Sorter Pick & Place Guidance Crack & Chip out detection Die contamination check Die active area check Wafer Bump inspection Flip-chip Bonder (Film frame to substrate) Pick & Place Guidance Vision guided die attach
- 16. Machine Vision Enabled Equipments Die Bonder Pad Location & alignment Glue Metrology Die placement Die position check Wire Bonder Locate and align die pad and leadframe pad position
- 17. IC, Lead, Pad & Ball Inspection Contamination Package size Pin1 marking Orientation OCV Cracks Chip out Warpage Lead pitch/bend Sweep Lead co-planarity Lead length Lead width Stand off Missing Ball Over sized ball Under sized ball Extra ball Ball residue Ball Height Co planarity
- 18. IC Inspection & Sorting Equipments Laser Mark & Inspection Transfer & Sort with 2D & 3D Inspection (Tray to Tray Strip to Strip) Package Visual Inspection (Tray to Tray Tray to Tape) Package 2D & 3D Inspection ( Tape to Tube )