Apple A9 Series Application Processor
- 2. 2010 2011 2012 2013 2014 ARM® CortexTM‐A8 SC, 45nm ARM® CortexTM‐A9 DC, 45nm ARM® CortexTM‐A9 DC, 32nm HKMG ARM® ARMv7 DC, 32nm HKMG ARM® ARMv7a DC, 32nm HKMG ARM® CortexTM‐A9 SC, 32nm HKMG APL2498APL0498 APL0398 APL5498 APL0598 APL5598 APL0698 APL5698 ARM® ARMv8 DC, 28nm HKMG M7 Motion Coprocessor ARM® CortexTM‐A9 DC, 45nm APL7498
- 3. 2014 2015 2016 APL1011 ARM® ARMv8a DC/TC, 20nm HKMG M8 Motion Coprocessor APL1012 APL1012 APL0898 ARM® ARMv8a DC, 14/16nm FinFET M9 Motion Coprocessor APL1012 M9M9 ARM® v7a SC, 28nm HKMG APL0778 ARM® ARMv8a DC, 16 FinFET M9 Motion Coprocessor
- 6. M9 APL1022/APL0898 ‐ TSMC 16nm FinFET/SAMSUNG 14nm FinFET process ‐ Apple 3rd generation ARM v8a architecture ‐ Integrated M9 motion coprocessor ‐ Imagination PowerVR Series 7 GPU ‐ 4‐channel 16‐bits LPDDR4 ‐ MIPI‐DSI/MIPI‐CSI/eDP(?) ‐ PCIe, HSIC, I2C, UART, USB ‐ Fingerprint sensor controller ‐ Apple customized PoP package
- 7. 70% FASTER 339S0030 339S0036 ARM®ARM11 Single Core 339S0073 ARM® CortexTM‐A8 Single Core ARM® v7 architecture Dual Core ARM® v8a architecture Dual Core ARM® CortexTM‐A8 Single Core ARM® CortexTM‐A9 Single Core ARM® v8 architecture Dual Core ARM® v8a architecture Dual Core ARM®ARM11 Single Core CPU Performance 2007 2015 M9
- 8. 90% FASTER 339S0030 339S0036 339S0073 Imagination MBX Lite Imagination MBX Lite Imagination PowerVR SGX535 Imagination PowerVR SGX535 Imagination PowerVR SGX543MP2 Imagination PowerVR SGX543MP3 Imagination PowerVR GX6430 Imagination PowerVR Series6XT 4‐Clusters Imagination PowerVR Series 7 GPU Graphics Performance 2007 2015 M9
- 10. The only thing that’s changed is everything.
- 12. iPhone 6S A1688 Apple A9 processor, Apple customized PoP package 4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix InvenSense MP‐67B Bosch BMA280 Qualcomm MDM9635M SKYWORKS SKY77812‐19 TriQuint TQF6405 AVAGO AFEM‐8030 Qualcomm QFE1100 Texas Instruments 57A6CVI 3539 SKYWORKS RF1347
- 13. iPhone 6S A1688 Main storage, 16GB/64GB/128GB, NVMe SSD SK Hynix : H230DG8UD1ACS, 16GB Toshiba : THGBX5G7D2KLFXG, 16GB USI 339S00043 WiFi/BT Module Ne G98/Murata(?), RF Front‐End Module NXP 66V10 Apple 338S00105 Apple 338S00120‐A1 Texas Instruments 65730AOP Qualcomm PMD9635 Apple 338S1285 NXP1610A3 Qualcomm WTR3925 SKYWORKS SKY77357‐8 Murata 240 Front‐End Module Apple 338S1285 RFMD RF5150 Rd G54/Murata(?), RF Front‐End Module ALPS HSCDTD007 Bosch BMP280 Texas Instruments 57A5KXI
- 16. iPhone 6S Plus A1687 Apple A9 processor, Apple customized PoP package 4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix InvenSense EMS‐A In the iPhone 6s, there is Bosch BMA280 here. But, in the iPhone 6s Plus, there is no chip here but “PCB pad only” Qualcomm MDM9635M SKYWORKS SKY77812‐19 TriQuint TQF6405 Qualcomm QFE1100 SKYWORKS RF1347 Avago AFEM‐8030
- 17. iPhone 6S Plus A1687 Skyworks SKY13701 ALPS HSCDTD007 USI 339S00043 WiFi/BT Module Apple 338S00122‐A1 Apple 338S00105 Texas Instruments 57A6CVI 3539 NXP 66V10 Main storage, 16GB/64GB/128GB, NVMe SSD SK Hynix : H230DG8UD1ACS, 16GB Apple 338S1285 NXP1610A3 Qualcomm PMD9635 Qualcomm WTR3925 Murata 240 Front‐End Module Texas Instruments 57A5KXI Bosch BMP280 Af G54/Murata(?), RF Front‐End Module Apple 338S1285 RFMD RF5150 SKYWORKS SKY77357‐8 Texas Instruments TPS65730AOP
- 19. Manufacturer Device Function ▼Processor Apple Apple A9 Microprocessor (APL0898 & APL1022) ‧SAMSUNG 14nm FinFet/TSMC 16nm FinFET process ‧Dual‐core, Apple 3rd generation ARMv8a architecture, 1.8GHz ‧Imagination PowerVR 7 series GPU ‧Apple customized PoP package ▼Memory Micron SAMSUNG SK Hynix D9SND (MT53B256M64D2NL) K3RG1G10BM‐BGCH H9HKNNNBTUMUMR‐NLH ‧16‐bit, Quad‐channel, 16Gb LPDDR4 ‧Apple customized PoP package SK Hynix Toshiba ‧NAND Flash‐based storage ‧Apple customized package ‧16GB/64GB/128GB 16GB: SK Hynix H230DG8UD1ACS Toshiba THGBX5G7D2KLFXG ▼PMIC Apple Apple 338S00120‐A1 PMIC for Apple A9 Processor (iPhone 6s) Apple 338S00122‐A1 PMIC for Apple A9 Processor (iPhone 6s Plus) Qualcomm PMD9635 PMIC for Qualcomm MDM9635M baseband processor ▼Audio Apple Apple 338S00105 Audio Codec Apple 338S1285 Audio AMP ▼Touch Screen Controller Apple 343S00014 Touch screen controller for 3D Touch ▼Others Texas Instruments 65730AOP Power management IC 57A6CVI 3539 LED backlight Retina display driver 57A5KXI Charger IC NXP 1610A3 USB charging
- 20. Manufacturer Device Function ▼Sensors InvenSense MPU‐6700(MP67B) (iPhone 6s) 6‐Axis Gyro and Accelerometer Bosch Sensortech EMS‐A (iPhone 6s Plus) 6‐Axis Gyro and Accelerometer BMA280(3P 7LA) (iPhone 6s) 3‐Axis Accelerometer BMP280 Barometer ALPS HSCDTD007 Electronic Compass AMS TSL2586 ALS ▼Radio Frequency USI 339S00043 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.2 NXP 66V10 (PN66V?) NFC controller Qualcomm MDM9635M baseband processor Baseband Processor: ‧20nm process ‧1.2GHz ARM Cortex‐A7 + 800MHz QDSP ‧Rel 9 LTE Cat 6 ‧DC‐HSPA ‧TD‐SCDMA ‧EVDO Rev. B, CDMA 1X ‧GSM ‧QICE, Envelope Tracking ‧Integrated Memory WTR3925 ‧28nm process ‧ GSM/CDMA/W‐CDMA/LTE Transceiver QFE1100 Envelope Power Tracker
- 21. Manufacturer Device Function iPhone 6s Model A1688 Skyworks SKY77812‐19 Power Amplifier Module SKY77357‐8 Power Amplifier Module Avago AFEM‐8030 Power Amplifier Module RFMD RF5150 Antenna Switch RF1347 Antenna Switch Module TriQuint TQF6405 Power Amplifier Module Murata 240 Front End module Murata(?) Ne G98 RF Front End module Rd G54 RF Front End module iPhone 6s Plus Model A1687 Skyworks SKY77812‐19 Power Amplifier Module SKY77357‐8 Power Amplifier Module SKY13701‐17 WLAN front end module Avago AFEM‐8030 Power Amplifier Module RFMD RF5150 Antenna Switch TriQuint TQF6405 Power Amplifier Module Murata 240 Front End module Murata(?) Af G54 RF Front End module
- 22. ▼Processor Application Processor ‧Dual‐core ‧Apple 3rd generation ARM v8a architecture ‧Imagination PowerVR Series 7 GPU ‧SAMSUNG 14nm FinFET process TSMC 16nm FinFET process ‧Apple M9 motion coprocessor Apple M9 Coprocessor ‧ Integrated in the Apple A9 processor ▼Memory System Memory ‧ Quad‐Channel 16‐bits LPDDR4 controller ‧ 16Gb density LPDDR4 ‧ Apple customized PoP package System Storage ‧Apple NVMe controller inside Apple A9 ‧16GB/64GB/128GB capacity NAND Flash M9
- 23. ▼Radio Frequency WiFi/BT ‧ USI WiFi/BT module Baseband Processor ‧Qualcomm MDM9635M ‧Qualcomm WTR3925 PA Chips ‧Avago ‧Qualcomm ‧RF Micro ‧Skyworks ‧TriQuint NFC 66V10 ▼PMIC PMIC for AP ‧Apple 338S00120‐A1 (iPhone 6s) Apple 338S00122‐A1 (iPhone 6s Plus) PMIC for BP ‧ Qualcomm PMD9635 ▼Audio Audio Codec ‧Apple 338S001285 ‧Apple 338S000105
- 45. Apple A9 processor, Apple customized PoP package 4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix Qualcomm MDM9635M Qualcomm WTR1625L Qualcomm QFE1100 Skyworks SKY77611
- 46. ALPS HSCDTD007 Murata 339S00134 WiFi/BT Module Main storage, 16GB/64GBGB, NVMe SSD SK Hynix : H230DG8UD1ACS, 16GB Qualcomm PM8019 Qualcomm WFR1620 NXP CBTL1610A3 TI 5AA56PI SN2400AB0 Apple 338S1285 Apple 338S00170‐A1 NXP 66V10 NFC Broadcom BCM5976 TI 343S0645 Apple 338S00105 InvenSense EMS‐A TI 5CARCPI 3539 TI 65730AOP Skyworks SKY77357 Avago ACPM‐8020 TDK EPCOS D5255 Skyworks SKY77826 Qorvo(TriQuint) TQF6410 Qorvo(RF Micro) RF5159
- 48. Manufacturer Device Function ▼Processor Apple Apple A9 Microprocessor (APL0898 & APL1022) ‧SAMSUNG 14nm FinFet/TSMC 16nm FinFET process ‧Dual‐core, Apple 3rd generation ARMv8a architecture, 1.8GHz ‧Imagination PowerVR 7 series GPU ‧Apple customized PoP package ▼Memory SK Hynix H9HKNNNBTUMUMR‐NLH ‧16‐bit, Quad‐channel, 16Gb LPDDR4 ‧Apple customized PoP package Toshiba ‧NAND Flash‐based storage ‧Apple customized package ‧16GB/64GBGB 16GB: Toshiba THGBX5G7D2KLFXG ▼PMIC Apple Apple 338S00170‐A1 PMIC for Apple A9 Processor (iPhone SE) Qualcomm PM8019 PMIC for Qualcomm MDM9625M baseband processor ▼Audio Apple Apple 338S00105 Audio Codec Apple 338S1285 Audio AMP ▼Touch Screen Controller Texas Instruments 62ARFKI 343S0645 Line Driver Broadcom BCM5976 Touch screen controller ▼Others Texas Instruments 65730AOP Power management IC 5CARCPI 3539 LED backlight Retina display driver 5AA56PI SN2400AB0 Charger IC NXP CBTL1610A3 USB charging
- 49. Manufacturer Device Function ▼Sensors InvenSense EMS‐A 6‐Axis Gyro and Accelerometer Bosch Sensortech BMP280 Barometer ALPS HSCDTD007 Electronic Compass ▼Radio Frequency USI 339S00043 ‧Broadcom BCM4350 ‧ 802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.2 NXP 66V10(PN549/PN66V)) NFC controller Qualcomm MDM9625M baseband processor Baseband Processor: ‧Rel 9 LTE Cat 4(150Mbps) ‧ Rel 10 LTE‐FDD CA ‧ Rel10 3C HSDPA+ 63Mbps ‧ DC HSUPA ‧ TD‐SCDMA ‧ DOrB ‧ QICE, Envelope Tracking ‧Integrated Memory WTR1625L GSM/CDMA/W‐CDMA/LTE RxD Transceiver WFR1620 GSM/CDMA/W‐CDMA/LTE Receiver
- 50. Manufacturer Device Function iPhone SE Model A1662 Skyworks SKY77826 Ultra low‐band Power Amplifier Module SKY77357 2G/Edge Power Amplifier Module SKY77611 Quad‐band Power Amplifier Module Avago AFEM‐8020 Mid‐band Power Amplifier Duplexer Qorvo(RFMD) RF5159 Antenna Switch Qorvo(TriQuint) TQF6410 Low‐band Power Amplifier Duplexer TDK EPCOS D5255 Diversity Receive Module
- 51. APL1021/343S00074 ‐ TSMC 16nm FinFET process ‐ Apple 3rd generation ARM v8a architecture, 2.26GHz ‐ Integrated M9 motion coprocessor ‐ Imagination PowerVR Series 7 GPU ‐ 8‐channel 16‐bits LPDDR4 memory controller ‐ DisplayPort/MIPI‐CSI ‐ PCIe, HSIC, I2C, UART, USB(?) ‐ Fingerprint sensor controller ‐ 147mm2 M9
- 52. 22X FASTER CPU Performance ARM® CortexTM‐A8 SC, 45nm ARM® CortexTM‐A9 DC, 45nm ARM® CortexTM‐A9 DC, 45nm ARM® ARMv7 DC, 32nm HKMG ARM® ARMv8 DC, 28nm HKMG ARM® ARMv8a Tri Core 20nm HKMG M9 ARM® ARMv8a Dual Core 16nm FinFET 2010 2015
- 55. iPad Pro iPad Pro Super. Computer. Now in two sizes.
- 56. iPad Pro USI 339S00045 WiFi/BT Module InvenSense MP67B Apple 343S00025‐A1 Apple 343S00052‐A1 Fresco Logic FL1100SX NXP Semiconductor 1610A3 Maxim Integrated MAX98721CEWV Maxim Integrated MAX98721CEWV Apple 343S1213 AKM AK8963 SK Hynix H9HCNNNBTUMLNR‐NLH, 16Gb LPDDR4 SK Hynix H9HCNNNBTUMLNR‐NLH, 16Gb LPDDR4 Apple A9X processor Bosch Sensortec BMA280 NXP Semiconductor 65V10 Toshiba THGBX5G8D4KLDXG 32GB storage NXP Semiconductors LPC11U37 Fairchild Semiconductor FDMC 6683 This area is reserved for 4G modem which is used in the WiFi + Cellular model Bosch Sensortec BMP280
- 57. iPad Pro Front facing camera Rear facing camera I2C/SPI I2C/SPI PCIeUART LPDDR4 LPDDR4 This is for WiFi + Cellular model HSIC I2C 4‐channel 16‐bit 16Gb LPDDR4 USI 339S00045 Qualcomm QFE1100 Qualcomm MDM9625M Qualcomm WTR1625L Qualcomm PM8019 PA Chips 32/128GB NVMe SSD 338S1213 Audio Codec AKM AK8963 Bosch BMA280 Bosch BMP280 Invensense MP67B ALS NXP 1610A3 NXP 65V10 LPDDR4 LPDDR4 338S00052‐A1 PMIC Broadcom BCM15900 I2C M9MAXIM MAX98721CEWV NXP 8416A1 LPDDR4 LPDDR4 4‐channel 16‐bit 16Gb LPDDR4 LPDDR4 LPDDR4 338S00025‐A1 PMIC Broadcom BCM15900 Parade DP695 TI TPS65144 eDP 12.9” 2732x2048 12.9” 2732x2048 Freesco FL1100SX PCIe NXP LP11U37 M9 Qualcomm WTR1620 STMSTM STM32L052x6
- 58. iPad Pro Manufacturer Device Function ▼Processor Apple Apple A9X Microprocessor (APL1021) ‧16nm FinFET process ‧Dual‐core, Apple 3rd generation ARMv8a architecture, 2.25GHz ‧Imagination PowerVR 7 series GPU ▼Memory SAMSUNG SK Hynix K3RG1G1 OBMKGCH H9HCNNNBTUMLNR‐NLH ‧16‐bit, Octa‐channel, 16Gb LPDDR4 ‧Total system memory capacity is 4GB(16Gbx2) ‧Apple customized package SanDisk Toshiba ‧NAND Flash‐based storage ‧Apple customized package ‧Apple Proprietary NVMe SSD, 32GB and 128GB capacity 32GB: Toshiba THGBX5G8D4KLDXG 128GB: SanDisk SDMMSEDF8 ▼PMIC Apple Apple 338S00052‐A1 PMIC for Apple A9X Processor Apple 338S00025‐A1 PMIC for Apple A9X Processor Qualcomm PM8019 PMIC for Qualcomm MDM9625M baseband processor (For Wi‐Fi + Cellular model) ▼Audio Apple Apple 338S1213 Audio Codec Maxim Integrated MAX98721CEWV Boosted class amplifier ▼Touch Screen Controller Broadcom BCM15900B0 Touch screen controller ▼MEMs InvenSense MPU‐6700(MP67B) 6‐Axis Gyro and Accelerometer Bosch Sensortech BMA280 3‐Axis Accelerometer BMP280 Barometer AKM AK8963 Electronic Compass
- 59. iPad Pro Manufacturer Device Function ▼Others Texas Instruments TPS65144 LCD Bias with Integrated Gamma NXP CBTL1610A3 USB charging LPC11U37 Cortex‐M0 microcontroller NVT8416A1 Unknown Parade DP695 LCD timing controller Fresco Logic FL1100SX PCIe‐to‐USB 3.0 controller Fairchild Semiconductor FDMC 6683 DC/DC Converter FXMA2012 Translator STMicroelectronics STM32L052x6 Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB
- 60. iPad Pro Manufacturer Device Function ▼Radio Frequency USI 339S000045 (Boradcom BCM4350) ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.2 NXP 65V10 NFC controller For Wi‐Fi + Cellular model Qualcomm MDM9625M baseband processor Baseband Processor: ‧Rel 9 LTE Cat 4(150Mbps) ‧Rel 10 LTE‐FDD CA ‧Rel 10 3C HSDPA+ 63Mbps ‧DC HSUPA ‧TD‐SCDMA ‧DOrB ‧QICE, Envelope Tracking ‧Integrated Memory WTR1625L GSM/CDMA/W‐CDMA/LTE RxD Transceiver WFR1620 GSM/CDMA/W‐CDMA/LTE Receiver QFE1100 Envelope Power Tracker Avago A8020 Power Amplifier Module TriQuint TQF6410 Power Amplifier Module TQF6430 Power Amplifier Module RFMD RF5159 Antenna Switch Module RF5145 Antenna Switch RF5147A Antenna Switch
- 62. iPad Pro Apple A9X processor Murata 339S00109 WiFi/BT Module Broadcom BCM15900B0 NXP Semiconductor 66V10 Apple 343S00051‐A1 SAMSUNG K3RG1G1 OBMKGCH, 16Gb LPDDR4 Apple 343S00089‐A1 STMicroelectronics STM32L052x6 NXP Semiconductor CBTL1610A3 InvenSense EMS‐A Maxim Integrated MAX98721BEWV Maxim Integrated MAX98721BEWV Bosch Sensortec BMA280 This area is reserved for 4G modem which is used in the WiFi + Cellular model SK Hynix H23QEG8VG1ACA 32GB storage This area is reserved for 4G modem which is used in the WiFi + Cellular model Apple A9X processor Cirrus Logic CS42L83A
- 63. iPad Pro Front facing camera Rear facing camera I2C/SPI I2C/SPI PCIeUART LPDDR4 LPDDR4 This is for WiFi + Cellular model PCIe 4‐channel 16‐bit 16Gb LPDDR4 Qualcomm MDM9635M Qualcomm WTR3925 Qualcomm PMD9635 PA Chips 32/128/256GB NVMe SSD 343S00089‐A1 eCompass Bosch BMP280 InvenSense EMS‐A ALS NXP 66V10 LPDDR4 LPDDR4 338S00051‐A1 Broadcom BCM15900 I2C M9MAXIM MAX98721BEWV NXP 8416A3 Broadcom BCM15900 Parade DP815 98667A B5528T eDP 9.7” 2048x1536 9.7” 2048x1536 M9 Qualcomm QFE1100 STMSTM STM32L052x6 PCIe NXP 1610A3 339S00109 M CS42L83A
- 64. iPad Pro Manufacturer Device Function ▼Processor Apple Apple A9X Microprocessor (APL1021) ‧16nm FinFET process ‧Dual‐core, Apple 3rd generation ARMv8a architecture, 2.25GHz ‧Imagination PowerVR 7 series GPU ▼Memory SAMSUNG K3RG1G1 OBMKGCH ‧16‐bit, Quad‐channel, 16Gb LPDDR4 ‧Total system memory capacity is 2GB(16Gb) ‧Apple customized package SK Hynix ‧NAND Flash‐based storage ‧Apple customized package ‧Apple Proprietary NVMe SSD, 32GB, 128GB and 256GB capacity 32GB: SK Hynix H23QEG8VG1ACA ▼PMIC Apple Apple 338S00052‐A1 Apple 343S00089‐A1 PMIC for Apple A9X Processor Qualcomm PMD9635 PMIC for Qualcomm MDM9635M baseband processor (For Wi‐Fi + Cellular model) ▼Audio Cirrus Logic CS42L83A Audio Codec Maxim Integrated MAX98721BEWV Boosted class amplifier ▼Touch Screen Controller Broadcom BCM15900B0 Touch screen controller ▼MEMs InvenSense EMS‐A 6‐Axis Gyro and Accelerometer Bosch Sensortech BMA280 Barometer Unknown Unknown Electronic Compass
- 65. iPad Pro Manufacturer Device Function ▼Others Texas Instruments TPS65144 LCD Bias with Integrated Gamma NXP CBTL1610A3 USB charging NVT8416A1 Unknown Parade DP815 LCD timing controller Fairchild Semiconductor FDMC 6683 DC/DC Converter FXMA2012 Translator STMicroelectronics STM32L052x6 Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB
- 66. iPad Pro Manufacturer Device Function ▼Radio Frequency Murata 339S00109 (Boradcom BCM4350) ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.2 NXP 66V10 NFC controller For Wi‐Fi + Cellular model Qualcomm MDM9635M baseband processor Baseband Processor: ‧20nm process ‧1.2GHz ARM Cortex‐A7 + 800MHz QDSP ‧Rel 9 LTE Cat 6 ‧DC‐HSPA ‧TD‐SCDMA ‧EVDO Rev. B, CDMA 1X ‧GSM ‧QICE, Envelope Tracking ‧Integrated Memory WTR3925 ‧28nm process ‧ GSM/CDMA/W‐CDMA/LTE Transceiver QFE1100 Envelope Power Tracker
- 67. iPad Pro Cambridge Silicon Radio (Qualcomm)CSR1012A05 L05286 QS4 VG Z SGP 528 (STMicroelectronics STM32L052x6) EWX 01129 ST Microelectronics AS5C Y533 ST Microelectronics STML151UCY6, ARM Cortex‐M3 MCU Bosch Sensortec BMA280 8529043 343S00008‐A1(Customized part for Apple?)
- 68. iPad Pro Manufacturer Device Function ▼Apple Pencil ST Microelectronics STML151UCy6 ARM Cortex‐M3 MCU AS5C Y533 unknown Bosch Sensortech BMA280 3‐Axis Accelerometer Qualcomm/CSR CSR1012A05 Bluetooth Smart chip STMicroelectronics L05286 QS4 VG Z SGP 528 (STM32L052x6) Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB Unknown(MAXIM?) EWX 01129 unknown Unknown (Customized for Apple?) 8529043 343S00008‐A1 unknown ▼Smart Keyboard ST Microelectronics STM32F103VB 72MHz ARM Cortex‐M3 MCU
- 69. iPad Pro ▼Processor Application Processor ‧Dual‐core ‧Apple 3rd generation ARM v8a architecture ‧Imagination PowerVR Series 7 GPU ‧TSMC 16nm FinFET process ‧Apple M9 motion coprocessor Apple M9 Coprocessor ‧ Integrated in the Apple A9X processor ▼Memory System Memory ‧Eight‐Channel 16‐bits LPDDR4 controller ‧16Gb density LPDDR4 ‧Apple customized package System Storage ‧Apple NVMe controller inside Apple A9 ‧16GB/64GB/128GB capacity NAND Flash M9
- 70. iPad Pro ▼Radio Frequency WiFi/BT ‧Broadcom BCM4350 ‧USI WiFi/BT module Baseband Processor ‧Qualcomm MDM9625M ‧Qualcomm MDM9635M ‧Qualcomm WTR3925 ‧Qualcomm WTR1625L ‧Qualcomm WTR1620 ‧Qualcomm QFE1100 NFC 65V10 66V10 ▼PMIC PMIC for AP ‧Apple 338S00052‐A1 Apple 338S00025‐A1 Apple 338S00051‐A1 PMIC for BP ‧ Qualcomm PM8019 Qualcomm PMD9635 ▼Audio Audio ‧Apple 338S001213 Apple 338S00089‐A1 ‧Maxim MAX98721CEWV