Tablet in 2012
- 2. Apple New iPad (Apple 4th Generation iPad) Apple iPad mini Google Nexus 7 Amazon Kindle Fire HD 7” SAMSUNG Galaxy Note 10.1 ASUS Transformer Prime 2013 Tablet guide
- 4. Apple 338S116, audio codec Texas Instruments TPS61045 16/32/64GB NAND Flash Apple A6X, SAMSUNG 32nm HKMG process 1.4GHz, Dual core ARMv7, Imagination PowerVR 554MP4+ GPU Apple 343S0622‐A1, PMIC NXP CBTL1608 Apple 338S1077, Class‐D Audio Amplifiers
- 5. Broadcom BCM5974 Broadcom BCM5973A Texas Instruments CD3240B0 LPDDR2‐1066, x32/dual‐channel Supplier: Elpida/SK Hynix Fairchild 6676BZ Fairchild 6683 Murata 339S0171, BRCM BCM4334 SDIO WiFi/High Speed UART BT SoC
- 7. Manufacturer Device Function ▼Processor Apple Apple A6X Microprocessor ‧1.4GHz, ARMv7, Dual‐core ‧Imagination PowerVR SGX 554MP4+ ‧32nm process ▼Memory Elpida/SK Hynix ‧32‐bit, Dual‐channel, 4Gb LPDDR2‐1066 B4064B3MA‐1D‐F ‧Two memory chip on the system main board H9TCNNN4KDBMUR ‧Supplier: Elpida/SK Hynix SK Hynix 16/32/64GB NAND Flash Main storage ▼Radio Frequency Murata 339S0171 Broadcom BCM4334 (BRCM BCM4334 SDIO WiFi/ High ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity Speed UART BT SoC) ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧ Bluetooth Class 1 transmitter operation Qualcomm MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory RTR8600 Multi‐band/mode RF transceiver for 3G and 4G LTE bands ▼PMIC Apple Apple 343S0622‐A1 PMIC for Apple A6 Processor (Dialog Semiconductor ) Qualcomm PM8018 PMIC for Qualcomm MDM9615M baseband processor
- 8. Manufacturer Device Function ▼Audio Apple Apple 338S116 Audio Codec (Cirrus Logic) Apple 338S1077 Low Power Class‐D Audio Amplifiers (Cirrus Logic) ▼Touch Screen Controller Texas Instruments CD3240B0 Line Driver Broadcom BCM5974 Touch Screen Controller BCM5973A1 ▼MEMs STMicroelectronics AGD8/2234 chip marking MEMS motion sensor: three‐axis digital output gyroscope (STMicroelectronics L3G4200D) A233 /33DH chip marking MEMS digital output motion sensor ultra low‐power high performance 3‐axes nano (STMicroelectronics LIS331DLH) accelerometer AKM AK8975 3‐axis Electronic Compass ▼Camera Omnivision OV290BA Front Camera, 5 Mp CMOS Image Sensor OV2C3B8E Rear Camera, 1.2MP CMOS Image Sensor ▼Others NXP Semiconductor CBTL1608 Parade DP635 LCD timing controller Integrated Memory Logic iML7990 Programmable gamma buffer RichTek RT9910 Power management IC for the touchscreen display Failchild FDMC6683 MOSFET FDMC6676BZ PowerTrench MOSFET Texas Instruments TPS61045
- 10. 16/32/64GB NAND Flash STMicroelectronics L3G4200D STMicroelectronics LIS331DLH Apple 338S1116, audio codec AKM AK8963 Apple A5; 32nm process, Dual core Cortex‐A9, Imagination PowerVR 543MP2+ Apple 343S0593‐A5, PMIC Apple 338S1077, Class‐D Audio Amplifiers Fairchild 6676BZ Fairchild 6683 NXP CBTL1608 Murata 339S0171, BRCM BCM4334 SDIO WiFi/High Speed UART BT SoC
- 11. Touch Screen Solution Rear Camera BROADCOM BROADCOM Omnivision BCM5976 BCM5976 Front Camera Omnivision LVDS STM I2C/SPI ALS L3G4200D x32;LPDDR2 STM I2C/SPI 4Gb(2Gbx2) LIS331DLH LPDDR2‐800 x32;LPDDR2 Elpida PoP Package AKM I2C/SPI AK8963 NAND Flash NAND Flash 16GB/32GB/64GB Hynix Apple Apple I2S 338S1077 338S1116 I2C Apple 343S0593‐A5 PMIC UART SDIO Qualcomm NXP RTR8600 Qualcomm CBTL1608 0 MDM9615M Murata 339S0171 Broadcom Qualcomm Lightning BCM4334 PM8018 8‐pin connector
- 12. Manufacturer Device Function ▼Processor Apple Apple A5 ‧1GHz, ARM Cortex‐A9, Dual‐core ‧Imagination PowerVR 543MP2+ GPU ‧SAMSUNG 32nm HKMG process ▼Memory Elpida ‧32‐bit, Dual‐channel, 4Gb LPDDR2‐800 E4064P3PM‐8D‐5 ‧PoP package SK Hynix 16/32/64GB NAND Flash Main storage ▼Radio Frequency Murata 339S0171 Broadcom BCM4334 (BRCM BCM4334 SDIO WiFi/ High ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity Speed UART BT SoC) ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧ Bluetooth Class 1 transmitter operation Qualcomm MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory RTR8600 Multi‐band/mode RF transceiver for 3G and 4G LTE bands ▼PMIC Apple Apple 343S0593‐A5 PMIC for Apple A6 Processor Qualcomm PM8018 PMIC for Qualcomm MDM9615M baseband processor
- 13. Manufacturer Device Function ▼Audio Apple Apple 338S1116 Audio Codec (Cirrus Logic) Apple 338S1077 Low Power Class‐D Audio Amplifiers (Cirrus Logic) ▼Touch Screen Controller Broadcom BCM5976C0KUB6G Touch Screen Controller ▼MEMs STMicroelectronics AGD3 2236 J5CAO chip marking MEMS motion sensor: three‐axis digital output gyroscope (STMicroelectronics L3G4200D) (2230 DSH EWFFR chip marking) MEMS digital output motion sensor ultra low‐power high performance 3‐axes nano STMicroelectronics LIS331DLH accelerometer AKM AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output ▼Camera Omnivision OV2C3BEE Front Camera, 5 Mp CMOS Image Sensor OV2C3B8E Rear Camera, 1.2MP CMOS Image Sensor ▼Others Fairchild PCHPS FDMC 6676BZ PowerTrench MOSFET BC7BE F0MC 6683 MOSFET NXP Semiconductor CBTL1608
- 15. SK Hynix H5TC2G83CFR‐H9A, 2Gb DDR3L nVIDIA® Tegra® 3 processor MAXIM MAX77612A Texas Instruments TPS63020 Fairchild FDMC6675BZ AzureWave AW‐NH665 NXP PN544 Broadcom BCM4751 Invensense MPU‐6050
- 16. Kingston KE44B‐26BN/8GB; 8GB eMMC Realtek ALC5642 audio codec ELAN eKTF36248WS ELAN eKTH10368WS Texas Instruments 22C96ST LVDS83B Texas Instruments TI20 MI60 SK Hynix H5TC2G83CFR‐H9A, 2Gb DDR3L
- 18. Manufacturer Device Function ▼Processor nVidia NVIDIA® Tegra® 3 1.5GHz, ARM CortexTM‐A9, Quad‐core ▼Memory SK Hynix H5TC2G83CFR‐H9A 2Gb DDR3L Kingston KE44B‐26BN/8GB 8/16GB eMMC ▼Radio Frequency AzureWave AW‐NH665 802.11b/g/n Wi‐Fi + Bluetooth EDR Broadcom BCM4751 GPS receiver ▼PMIC MAXIM MAX77612A PMIC for NVIDIA® Tegra® 3 ▼Audio Realtek ALC5642 Audio codec ▼Touch Screen Controller ELAN Microelectronics ELAN eKTH10368WS Touch screen ELAN eKTF36248WS ▼MEMs 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Invensense MPU‐6050 Processor. (DMP.) hardware accelerator engine
- 19. Manufacturer Device Function ▼Video Texas Instruments 22C96ST LVDS83B FlatLink 10‐135MHz Transmitter HYDIS HV070WX1‐1E0 7", 1280*800, IPS panel ▼Others Texas Instruments TPS63020 High efficiency single inductor buck‐boost converter with 4‐A switchs Fairchild FDMC6675BZ 30V P‐Channel Power Trench MOSFET NXP PN544(65N04) NFC controller
- 21. Wolfson WM8962E audio codec Texas Instruments OMAP4460, 1.2GHz Elpida B8164B3PF‐1D‐F 8Gb LPDDR2, PoP package micro‐USB Texas Instruments TWL6032 PMIC micro‐HDMI SAMSUNG KLMAG2GE4A, 16GB eMMC Broadcom BCM2076, GPS and GLONASS AGPS, Bluetooth 4.0, and FM Receiver/Transmitter Broadcom BCM43239, 2T2R WiFi
- 24. Manufacturer Device Function ▼Processor Texas Instruments TI OMAP4, OMAP4460 1.2GHz ARM CortexTM‐A9, Dual‐core, Application Processor with Imagination PowerVR SGX540 GFX ▼Memory Elpida B8164B3PF‐1D‐F 8Gb LPDDR2, PoP package SAMSUNG KLMAG2GE4A 16GB eMMC or or KLMBG4GE4A 32GB eMMC ▼Radio Frequency Broadcom BCM43239 802.11 a/b/g/n 2T2R WiFi BCM2076 Multifunction Monolithic IC with GPS and GLONASS AGPS, Bluetooth 4.0, and FM Receiver/Transmitter ▼PMIC Texas Instruments TWL6032 PMIC for TI OMAP4460 ▼Audio Wolfson WM8962E Audio Codec ▼Touch Screen Controller Atmel maXTouch™ mXT768E Touch screen controller ▼MEMs 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) Invensense MPU‐6050M hardware accelerator engine
- 27. Wacom Pen controller ABOV MC96FR332A Unknown STMicronelectronics SAMSUNG eMMC; 16/32/64GB SAMSUNG Exynos 4 Quad LSM330DLC SAMSUNG K3PE0E000M‐XGC1 LPDDR2 Atmel mXT1664S touch screen Controller Suspect to be the BOM option for MAXIM Suspect to be the BOM MAX77693 PMIC option for WWAN MAXIM MAX77686 PMIC Wolfson WM1811 Doestek DTC34LM85AM Silicon Image Sil9244 MHL transmitter AKM 8975 Murata/SEMCO WiFi/BT SoC module, BRCM BCM4334
- 28. 10.1" MHL Rear‐facing camera: 1280*800 5MP pixel Silicon Image Atmel LVDS SiI9244 Front‐facing camera: mXT1664S MHL™ Transmitter 1.9M pixel Doestek 34LM85AM 2 IC HDMI Wacom x32; LPDDR2 SAMSUNG W8008 K3PE0E000M‐ XGC1 x32; LPDDR2 16Gb LPDDR2 STM I2C/SPI LSM330DLC SAMSUNG eMMC KLMAG2GE4A 2 eMMC AKM I C/SPI 16/32/64GB AK8975 MAXIM I2C Wolfson I2S MAX77686 WM1811AE PMIC SDIO Murata MAXIM I2C MAX77693 /SEMCO UART PMIC BRCM4334 USB/I2C I2C USB SDIO Skyworks SKY77604 Skyworks F0514A ABOV SKY13397 MC96FR332 USB Port 430 A Infineon Winbond SMARTi™ UE2 W949D5CBHX5I
- 29. Manufacturer Part Number Function ▼Processor SAMSUNG Exynos 4 Quad, Exynos 4412 1.4GHz, ARM CortexTM‐A9, Quad‐core, with ARM Mail‐400 GFX integrated, 32nm/High‐K ▼Memory SAMSUNG K3PE0E000M‐XGC1 16Gb LPDDR2‐800, 32‐bit/Dual Channel, LPDDR2‐1066 KLMAG2GE4A SAMSUNG eMMC; 16/32/64GB Winbond W949D5CBHX5I 512Mb LPDDR1 ▼Radio Frequency Intel/Infineon XG626(Marked PMB9811) Baseband processor: ‧ ARM11™ architecture ‧ 3GPP Rel7 HSPA+ platform supports HSPA category 14 (21 Mbit per second) in the downlink and category 7 (11.5 Mbit per second) in the uplink. ‧ EDGE multislot class 33 PMB5712 SMARTi UE2 RF Transceiver Skyworks SKY77604 Power Amplifier SKY13397 RF Switch Murata/SEMCO N/A Broadcom BCM4334 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧ Bluetooth Class 1 transmitter operation ▼PMIC MAXIM MAX77686 PMIC for SAMSUNG Exynos AP
- 30. Manufacturer Part Number Function ▼Audio Wolfson Microelectronics WM1811AE Audio Codec ▼Touch Screen Controller Atmel mXT1664S Touch screen controller Wacom W8008 for SAMSUNG S Pen ▼MEMs AKM AKM8975 Electronic compass STMicroelectronics LSM330DLC 3D accelerometer and 3D gyroscope ▼Video Doestek DTC34LM85AM LVDS transmitter Silicon Image SiI9244BO MHL™ Transmitter SAMSUNG N/A Front camera, 5.0MP Murata N/A Rear camera, 1.9MP ▼Others ABOV MC96FR332A 8‐bit Microcontroller Unknown F0514A Unknown
- 31. The metallic spun finish with ultra-slim and light features of the Transformer Prime sets a new benchmark in the art of tablet
- 32. Broadcom BCM47511 Nuvoton NPCE795LA0BX 32GB/64GB eMMC; Konix KXTF9 Winbond 25X40BVIG AzureWave AW‐NH615 Hynix/Kinston Invensense MPU‐3050 Fortemedia FM34 Fujitsu Image Processor Voice Processor Texas Instruments NVIDIA® Tegra® 3 TPS659110 PMIC Realtek ALC5631 LVDS Transmitter; audio codec Elpida 8Gb LPDDR2 TI/THine memory
- 33. 10.1", Super IPS LCD LVDS LVDS Korea Transmitter MBG043 1280*800 Atmel mXT768E I2C CMOS HDMI 8Gb*1pcs Kionix I2C LPDDR2 Elpida KXTF9 B8132B2MA 32/64GB Invensense I2C eMMC eMMC MPU‐3050 Hynix/Kingston TI I2S/PCM I2C Fortemedia TPS659II02 FM34NE 395 PMIC I2S/PCM SDIO Realtek ALC5631 I2C SPI USB UART UART SDIO 0 nuvonTon I2C nuvonTon winbond BROADCOM AzureWave Docking NPCE795 NPCE795 25X40BVIG BCM4751 AW‐NH615 Station
- 34. Manufacturer Device Function ▼Processor nVidia NVIDIA® Tegra® 3 1.5GHz, ARM CortexTM‐A9, Quad‐core ▼Memory Elpida B8132B2MA‐6D‐F 8Gb LPDDR2 Hynix H26M64002BNR e‐NAND 32/64GB eMMC Kingston KE4BT5D6A 32/64GB eMMC ▼Radio Frequency AzureWave AW‐NH615 802.11b/g/n Wi‐Fi + Bluetooth EDR Broadcom BCM47511 GPS receiver ▼PMIC Texas Instruments TPS659110 PMIC for NVIDIA® Tegra® 3 ▼Audio Realtek ALC5631 Audio codec Fortemedia FM34NE Voice Processor ▼Touch Screen Controller Atmel MXT768E Touch screen controller
- 35. Manufacturer Device Function ▼MEMs Invensense MPU‐3050 Three‐axis gyroscope Kionix KXTF9 3‐axis accelerometer and inclinometers ▼Video Texas Instruments SN75LVDS83B FlatLink 10‐135MHz LVDS Transmitter THine TH133B LVDS Transmitter Fujitsu MBG048 Image processor ▼Others TPS51125A Dual‐Synchronous, Step‐Down Controller Texas Instruments bq24725 2‐4 Cell Li+ Battery SMBus Charge Controller FPF2700 AccuPower FPF2700 Integrated Load Switch Fairchild FDMC4435BZ 30V P‐Channel Power Trench MOSFET Nuvoton NPCE795LA0BX Embedded controller Winbond 25X40BVIG 4Mb serial flash
- 36. Tablet System Display MHL MIPI‐CSI Rear‐facing camera: Wacom Touch Touch Screen Silicon Image Screen Controller MHL Transmitter Controller MIPI‐CSI Front‐facing camera: I2C/UART/ LVDS/eDP SPI HDMI /MIPI 2 I C/SPI Gyro LPDDR2/DDR3L System LPDDR2/DDR3L Memory I2C/SPI accle NAND Flash NF/eMMC I2C/SPI or Compass eMMC I2C/SPI ALS USB/C2C/HSIC Baseband Mobile Processor DDR Pressure I2C/SPI Sensor SDIO WiFi/BT I2C Soc PMIC UART I2S I2C/UART/ UART USB SDIO SPI voice I2S Audio GNSS NFC processor Receiver Codec USB Port
- 37. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
- 38. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
- 39. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
- 40. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
- 41. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
- 42. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura