Apple iPhone X Teardown and Identification of Key Components report 2018 published by System Plus Consulting

©2017 by System Plus Consulting | iPhone X Teardown Smartphone 1
22, bd Benoni Goullin - Nantes Biotech
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
iPhone X
Teardown and Key Components Identification
Teardown report by Audrey LAHRACH

Overview / Introduction
Teardown
o Views & Dimensions
o Interfaces
o Teardown
Components Identification
Repartition
PCB Analysis
Feedback
About System Plus
Teardown

Teardown
o Electronic Board #1
Repartition
PCB Analysis
Feedback
About System Plus
Rear Side – ICs Identification - Board #1
iPhone X Main Board (Rear Side)
©2017 by System Plus Consulting

Teardown
Repartition
PCB Analysis
Feedback
About System Plus
Rear Side – ICs Identification - Board #1
iPhone X Main Board (Rear Side)
©2017 by System Plus Consulting

Teardown
Repartition
PCB Analysis
Feedback
About System Plus
IC MANUFACTURERS DESIGN WINS

Teardown
Repartition
PCB Analysis
Feedback
About System Plus
IC Package Repartition by Family

Teardown
Repartition
PCB Analysis
o Cross section
o Line/Space width
Feedback
About System Plus
PCB Board – Cross-Section

Apple iPhone X Teardown
and Identification of Key Components
Title: Apple iPhone X Teardown
Pages: 40+
Date: May 2018
Format: PDF & Excel file
Price: EUR 1,490
COMPLETE TEARDOWN WITH:
• Smartphone teardown
• IC identification including
markings, manufacturer,
reference, function, package
type, size and pin count
• PCB characteristics including
cross-section and minimum
line width
• Component supplier, package
and footprint breakdown
graphs
TABLE OF CONTENT
• Overview/Introduction
• Executive Summary
• Physical Analysis
 Views and dimensions of the
iphone X
 Iphone X teardown
 Electronic board high
definition photos
 Main component markings
and package type,
dimensions, pitch, pin count
and identification
 PCB surface, cross section
and minimum line width
 IC package breakdown
 IC manufacturer design wins
 IC package footprint
Discover Apple’s key devices, advanced packaging technical choices and main suppliers
Through a teardown of the Apple iPhone X, this report details more than 50
integrated circuit (IC) devices from the main boards.
It will help you to identify the manufacturer, packaging, including the size, type,
and pitch, and function of the iPhone X’s main ICs. A physical analysis of the
main substrates highlights internal structures and technologies used for the
printed circuit boards (PCBs).
The report includes teardown photos, detailed package identification and
descriptions and is supplied with an Excel file summarizing the iPhone X’s
chipset and breakdowns by supplier, package or footprint.
Structure Analysis
AUTHOR:
Audrey Lahrach
Audrey is in charge of costing analyses for ICs, LCD and OLED
displays and sensor devices. She holds a master’s degree in micro-
electronics from the University of Nantes.
RELATED REPORT:
Huawei P20 Pro Teardown
and Identification of Key Components
Discover Huawei’s key devices, advanced
packaging technical choices and main suppliers
Pages: 50+
Date: May 2018
Full report: EUR 1,490*
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Feedback
About System Plus
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