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Automated Metrology System
- 1. NGS 3500 Advanced Metrology System Hologenix, Inc. Huntington Beach, CA USA 714-903-5999 [email_address]
- 2. Optical Defect Detection, Classification, and Dimensional Metrology
- 3. Summary Capability Automatic Defect Detection & Classification Surface & Edge Defect Detection Texture Defect Detection (e.g. stains, etc.) Missing or Deformed Object Detection Extensive Defect Review Capability Graphic Maps & Image Archival Advanced System Hardware & Microscope CAD file import
- 4. Defect Detection – SiC Wafer – 10X Objective
- 5. Defect Detection – SiC Wafer – 10X Objective
- 6. Pattern Masking/ Defect Detection - Slider
- 7. Missing / Faint Object Detection - Slider The system can detect, and classify any missing pattern/ object and indicate to what degree it is fainted or partially missing.
- 8. Wafer Level Inspection - Micro Probes Automatic wafer alignment Step & Repeat from CAD file If a probe is defective or out of tolerance, the position is marked in red. Green indicates a good probe If an object is missing, a red graphic marks its expected position
- 9. Graphical Data/ Defect Maps/ Image Archival
- 10. Surface Defect Detection Surface defects can vary widely, and can be simple to detect, or very challenging depending on visual ambiguity. Defects may be: Lumped Defects (blobs) which can be separated from the background and can be individually detected, counted, classified and measured Textured Surface Areas can be detected, and classified as a single event in the sampled area Overlapped & Broken Objects may be detected as one or more blobs, but may not be correctly counted or classified due to overlap and random deformation Defects on Busy Patterns , are possible to detect if the pattern can be separated by masking, subtraction, or grayscale thresholds
- 11. Understanding Surface Defects The system can detect, classify and measure lumped and surface defects. Background interference is removed by Masking & Image Correction.
- 12. Advanced Dimensional Metrology – CD & Overlay Nanometer Repeatability for CD & Overlay measurements Masks and difficult to image substrates Advanced algorithms for best Performance Sample imaged with 100x objective Line Width (CD) of 2 microns can be measured accurately Line Breaks can be detected automatically
- 13. CD & Overlay Metrology Enhancement of difficult images through photo resist Optimal filtering & model fitting for best performance
- 14. Overlay Metrology – Typical Performance Test on overlay target compared with Industry leader Statistics performed over 50 samples (taken 5 at a time) Numbers are in Microns
- 15. 3D Dimensional Metrology Diameter, width, position, z-height, pitch and distance measurements. A comprehensive set of other functions is available. Pitch = 45 um
- 16. User Interface
- 17. Summary Performance Accuracy and Repeatability (verified on NIST traceable calibration glass master): Large XYZ Measurements: within 1 um Sub-micron accuracy for smaller objects (within FOV) Higher accuracy for CD/ Overlay applications Throughput: Combined staging and processing speed (on the average) is 2 to 3 sites per second Measurement, defect detection & classification speed is typically 20 to 100 measurements per second
- 18. New Technology and Capabilities Very High Resolution Imaging: 20K X 20K images and 2K X 2K Camera Support 2K X 2K camera provides a 10X increase in throughput compared to a 640 X 480 camera. Full Color Processing and Color Recognition/Classification Texture Pattern Recognition