J-STD-001, IPC A-610 F to G Differences Webinar

J-STD-001 Rev F - G Comparison
Presented by
Norman D. Mier Jr. IPC MIT
BEST, Inc
© 2018 BEST Inc. - Presented for SMTA 1-29-18

1.1 Scope This standard prescribes practices and
requirements for the manufacture of soldered
electrical and electronic assemblies. For a more
complete understanding of this document’s
recommendations and requirements, one may use
this document in conjunction with IPC-HDBK-001
and IPC-A-610.
This standard describes materials, methods and
acceptance criteria for producing soldered electrical
and electronic assemblies. The intent of this
document is to rely on process control
methodology to ensure consistent quality levels
during the manufacture of products. It is not the
intent of this standard to exclude any procedure for
component placement or for applying flux and
solder used to make the electrical connection.© 2018 BEST Inc. - Presented for SMTA 1-29-18

1.2 Purpose This standard describes materials, methods and
acceptance criteria for producing soldered electrical and
electronic assemblies. The intent of this document is to rely
on process control methodology to ensure consistent quality
levels during the manufacture of products. It is not the intent
of this standard to exclude any procedure for component
placement or for applying flux and solder used to make the
electrical connection.
This standard prescribes material requirements, process
requirements, and acceptability requirements for the
manufacture of soldered electrical and electronic assemblies.
For a more complete understanding of this document’s
recommendations and requirements, one may use this
document in conjunction with IPC-HDBK-001 and IPC-A-610.
Standards may be updated at any time, including with the use
of amendments. The use of an amendment or newer revision
is not automatically required.

1.4 Measurement Units and Applications
All dimensions and tolerances, as well as other forms of measurement
(temperature, weight, etc.) in this standard are expressed in SI (System
International) units (with Imperial English equivalent dimensions
provided in brackets). Dimensions and tolerances use millimeters as
the main form of dimensional expression; micrometers are used when
the precision required makes millimeters too cumbersome. Celsius is
used to express temperature. Weight is expressed in grams.
This Standard uses International System of Units (SI) units per ASTM
SI10-10, IEEE/ASTM SI 10 Practice (Section 3) [Imperial English
equivalent units are in brackets for convenience]. The SI units used in
this Standard are millimeters (mm) [in] for dimensions and
dimensional tolerances, Celsius (°C) [°F] for temperature and
temperature tolerances, grams (g) [oz] for weight, lux (lx) [footcandles]
for illuminance.
Note: This Standard uses other SI prefixes (ASTM SI10-10, Section 3.2)
to eliminate leading zeroes (for example, 0.0012 mm becomes 1.2 μm)
or as alternative to powers-of-ten (3.6 × 10³ mm becomes 3.6 m).

1.4.1 Verification of Dimensions
Actual measurement of specific part mounting and solder
fillet dimensions and determination of percentages are
not required except for referee purposes. For the
purposes of determining conformance to this
specification, all specified limits in this standard are
absolute limits as defined in ASTM E29.For determining
conformance to the specifications in this Standard, round
all observed or calculated values “to the nearest unit” in
the last right-hand digit used in expressing the
specification limit, in accordance with the rounding
method of ASTM Practice E29. For example, specifications
of 2.5 mm max, 2.50 mm max, or 2.500 mm max, round
the measured value to the nearest 0.1 mm, 0.01 mm, or
0.001 mm, respectively, and then compare to the
specification number cited.

1.5 Definition of Requirements When the
International Space Station symbol appears next
to a paragraph it indicates that J-STD-001GS
Space Applications Electronic Hardware
Addendum to J-STD-001G contains some
different requirements to this document. The
criteria in J-STD-001GS are not applicable unless
the addendum is specifically required by
procurement documentation.

1.7.1 Conflict The user has the responsibility to
specify acceptance criteria. If no criteria is
specified, requirements, or cited, then best
manufacturing practices applies

1.8.1 Diameter
1.8.1.1 Conductor Diameter The conductor
diameter is the outside diameter of wire, either
stranded or solid, without the insulation.
1.8.1.2 Wire Diameter The wire diameter is the
outside diameter of wire, either stranded or
solid, including insulation if present.

1.8.7 Objective Evidence
Such documentation may include, but is not limited to:
a. Work instructions.
b. Procedures and records required by the quality management
system.
c. Chemical and physical test data.
d. Reliability calculations based on recognized industry reliability
standards.
e. Manufacturer data sheets/reports, known acceptable record of
performance by selected suppliers.
f. External and/or internal audit reports.
g. Test/inspection reports including actual measured values.
h. Training records.
i. Soldering temperature versus time profiles.
j. Technical basis for changes in materials and/or processes (as an
example, see Appendix C).
k. Historical data.
l. Competency Matrix (skills checklist).

2.6 International Electrotechnical Commission
IEC 61340-5-1 Protection of Electronic Devices from
Electrostatic Phenomena – General Requirements
2.7 SAE International7
GEIA-STD-0005-1 Performance Standard for Aerospace and
High Performance Electronic Systems Containing Lead-free
Solder
GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin
Whiskers in Aerospace and High Performance Electronic
Systems
2.8 Military Standards
MIL-STD-1686 Electrostatic Discharge Control Program For
Protection Of Electrical And Electronic Parts, Assemblies And
Equipment (Excluding Electrically Initiated Explosive Devices)

3.1 Materials
Manufacturers, when specified, shall [N1N2D3]
have a lead-free control plan (LFCP), which shall
[N1N2D3] be agreed upon by the Manufacturer
and the User.
Note: GEIA-STD-0005-1 and GEIA-STD-0005-2
constitute examples for the implementation of
LFCPs/tin whisker mitigation for Aerospace and
other High Performance Electronic Systems.

3.2.2.1 Solder Pot Purity and Maintenance
Dross shall [N1D2D3] be removed from the
solder surface in a manner that assures the
dross does not contact the items being tinned.

4.1 Electrostatic Discharge (ESD)
If there are any assemblies that contain
components or parts sensitive to ESD, the
Manufacturer shall [D1D2D3] implement a
documented ESD control program in accordance
with ANSI/ESD S20.20, IEC 61340-5-1, MIL-STD-
1686, or as agreed between User and Supplier.
Documentation necessary for an effective
program shall [D1D2D3] be available for review.

4.2 Facilities
Cleanliness and ambient environments in all
work areas shall [D1D2D3] be maintained at
levels that prevent contamination or
deterioration of tools, materials, and surfaces to
be soldered or conformally coated. Eating,
drinking, smoking, including use of e-cigarettes,
and/or use of tobacco products shall [D1D2D3]
be prohibited in the work area.

4.6 Thermal Protection
Multilayer Ceramic Chip Capacitors (MLCCs) and
‘‘stacked’’ capacitors containing these parts
shall [N1D2D3] be handled as thermal shock
sensitive. Heat up and cool down rates should
be controlled within the component
manufacturer's recommendations.

4.9 General Part Mounting Requirements
Uninsulated parts mounted over exposed
circuitry shall [N1N2D3] have their leads formed
to provide a minimum of 0.25 mm [0.01 in]
between the bottom of the component body
and the exposed circuitry.

4.17 Reflow Soldering
IPC-7530 provides guidance on developing an
appropriate profile for wave and reflow
soldering.

4.18 Solder Connection
The primary difference between the solder
connections created with processes using tin-lead
alloys and processes using lead free alloys is related
to the visual appearance of the solder. All other
solder fillet criteria are the same.
Lead-free and tin-lead connections may exhibit
similar appearances but lead free alloys are more
likely to have surface roughness (grainy or dull) or
different wetting contact angles.

Figure 5-1
1. 100% insulation thickness
2. 20% insulation thickness reduction
5.1.1 Insulation Damage

5.1.2 Strand Damage
The number of damaged (nicked or broken) strands in a
wire shall not [D1D2D3] exceed the limits given in Table
5-1. There shall not [N1P2P3] be any number of severed
or damaged strands less than the quantity allowed in
Table 5-1. There shall [A1P2D3] be no strand separation
(birdcaging) greater than one strand diameter. There shall
[A1D2D3] be no strand separation (birdcaging) beyond
the outside diameter of the insulation. Recommendations
and requirements on wires used in high voltage
applications are provided in 1.13.2.3.
• Wire strands shall not [A1D2D3] be altered or cut to fit
terminals.

5.1.3.2 Tinning of Stranded Wire – Coverage
The solder shall [N1D2D3] wet the tinned
portion of the wire and should penetrate to the
inner strands of the wire. Pinholes, voids,
dewetting/nonwetting shall not [A1P2D3]
exceed 5% of the area required to be tinned.

5.4.1.2 Service Loops
When service loops are required at initial
attachment, wires shall [D1D2D3] have
sufficient length as shown in Figure 5-6, 7 to
allow at least one field re-termination.
Note: When Service Loop(s) are required, that
requirement should be included on the
assembly drawing(s)/documentation.

5.4.1.4 Orientation of Lead or Wire Wrap
Attachments to terminals that require a wrap
may be wrapped clockwise or counterclockwise
(consistent with the direction of potential stress
application). The lead or wire shall [A1P2D3]
continue the curvature of the dress of the
lead/wire. Wrapped conductors shall not
[A1D2D3] cross over or overlap themselves or
each other on the terminal. and shall not
[A1D2D3] interfere with the wrapping of other
leads or wires on the terminal or overlap itself.

5.4.1.5 Continuous Runs A continuous solid bus wire may be run from
terminal to terminal to three or more bifurcated, turret, or pierced
terminals are to be connected. A curvature shall [D1D2D3] be
included in the unwrapped wire portion of the jumper to provide relief
of tension from environmental loading. The connections to the first
and last terminals shall [D1D2D3] meet the required wrap for
individual terminals.
The following additional requirements shall [A1P2D3] be met:
a. For each intermediate turret terminal, the wire is wrapped 3600
around or interweaves each terminal.
b. For each intermediate bifurcated terminal, the wire passes
through the slot and is in contact with the base of the terminal or a
previously installed wire.
c. For each intermediate pierced or perforated terminal, the wire is
in contact with at least two nonadjacent contact surfaces of each
intermediate terminal.
d. For each intermediate hook terminal, the wire is wrapped 360°
around each terminal.

5.4.3.1 Side Route Connection
Table 5-6 provides the staking criteria for side route
connections that do not meet minimum wrap criteria, see
Figure 5-10. As an alternative to the wrap criteria
provided in Table 5-5, wire(s) and/or component lead(s)
may be routed straight through the terminal when the
assembly drawing/documentation incorporates
bonding/staking for the wire(s)/lead(s) to the
requirements of Table 5-6. If straight through routing is
utilized, wire(s) or lead(s) shall [A1P2D3] extend beyond
the post of the terminal and be in contact with the base
of the terminal or the previously installed wire (see Figure
5-11). Additionally, wires/leads shall [D1D2D3] meet the
staking requirements of Table 5-6.

7.5.5 Cylindrical End Cap Terminations
Note 5: The maximum fillet may overhang the
land or extend onto the top metallization but of
the component termination; however, the
solder does not touch the top of extend further
onto the component body. Solder may touch the
bottom half of the component body.

9.1.12 Crazing Crazing shall not [N1D2D3]
exceed 50% of the physical spacing between
noncommon conductors.
Crazing at the edge of the board shall not
N1D2D3] reduce the spacing minimum defined
distance between the board edge and any
conductive pattern to below the minimum
lateral conductor spacing specified in the
drawing(s)/documentation. If the minimum
distance is not specified, crazing shall not
[N1D2D3] reduce the distance between the
board edge and conductive pattern by not more
than 50% or 2.5 mm [0.1 in], whichever is less.

10 COATING, ENCAPSULATION AND STAKING (ADHESIVE)
All assemblies shall [N1N2D3] be clean before processing. After
cleaning, prior to processing, assemblies shall [N1N2D3] be handled to
prevent contamination. The material specification/data sheet or other
documented procedure shall [D1D2D3] be followed for mixing and
curing. The material shall [D1D2D3] be used within the time period
specified (both shelf life and pot life) or used within the time period
indicated by a documented system to control age-dated material.
When processing varies from supplier recommended instructions, the
variations shall [D1D2D3] be documented and available for review.
Items exposed to uncured silicone material shall not [D1D2D3] be
used for processing other material. An authorized exception is allowed
only in cases where equipment is used for co-curing processes and the
manufacturer has demonstrated through system tests that non-
silicone material properties have not changed and design
requirements are met. Objective evidence shall [D1D2D3] be
maintained and available for review.

10.5.1.2 Staking – Application - SMT The following criteria apply to surface mount
components only.
a. Components whose longest dimension is their height - The staking material shall
[N1D2D3] be applied to a minimum height of 25% of each individual component’s
body height. Slight flow of staking material under the component body is acceptable
provided it does not violate 10.5.1.
i. For closely spaced arrays consisting of up to four components fillet height
requirements for the two outer end-faces shall [N1D2D3] be the same as for an
individual component. In addition, the top inner surfaces shall [N1D2D3] be bonded
to each other for 50% of the components’ width.
ii. For closely spaced arrays consisting of greater than four components staking
shall [N1D2D3] be applied in the same manner as arrays up to four components, with
the additional requirement that every other internal component shall [N1D2D3] have
their sides staked to the board surface.
b. Components whose longest dimension is their diameter or length (e.g., QFPs)
Rectangular components shall [N1D2D3] be staked with a bead of staking material
placed at each corner of the component. For each bead, the staking material shall
[N1D2D3] contact a minimum 25% of the height of the component body. Slight flow of
staking material under the component body is acceptable provided it does not violate

12.1.2 Visual Inspection The assembly shall [N1D2D3]
be evaluated either by sample based inspection in
accordance with the established a documented process
control plan system, see 12.2, or by 100% visual
inspection, see 1.11. Inspection of soldering and post
solder cleanliness may be performed in the same
operation using Tables 12-1, 12-2, and 12-3 conformal
coating, staking or encapsulation shall [N1D2D3] be
performed after and not combined with, soldering and
cleaning process inspections. Inspection of soldering and
cleanliness shall [N1D2D3] be performed prior to
conformal coating, staking or encapsulation. Inspection
for damage may be combined with solder and/or
cleanliness inspections. Inspection for damage should be
performed prior to conformal coating and as part of the
final inspection process.

IPC-A-610 Rev F - G Comparison
Presented by
Norman D. Mier Jr. IPC MIT
BEST, Inc

1.2 Purpose
Standards may be updated at any time,
including with the use of amendments. The use
of an amendment or newer revision is not
automatically required.

1.4 Measurement Units and Applications This Standard uses International System of
Units (SI) units per ASTM SI10-10, IEEE/ASTM SI 10 American National Standard for
Metric Practice (Section 3) [Imperial English equivalent units are in brackets
forconvenience]. The SI units used in this Standard are millimeters (mm) [in] for
dimensions and dimensional tolerances, Celsius (°C) [°F] for temperature and
temperature tolerances, grams (g) [oz] for weight, lux (lx) [footcandles] for
illuminance.
Note: This Standard uses other SI prefixes (ASTM SI10-10, Section 3.2) to eliminate
leading zeroes (for example, 0.0012 mm becomes 1.2 μm) or as alternative to powers-
of-ten (3.6 × 10³ mm becomes 3.6 m).
1.4.1 Verification of Dimensions Actual MeasurementsFor determining conformance
to the specifications in this Standard, round all observed or calculated values “to the
nearest unit” in the last right-hand digit used in expressing the specification limit, in
accordance with the
• J-STD-001G Draft Document for Industry Consensus Ballot Only January 2017
• 2 | P a g e
• rounding method of ASTM Practice E29, Using Significant Digits in Test Data to
Determine Conformance with Specification. For
• example, specifications of 2.5 mm max, 2.50 mm max, or 2.500 mm max, round
the measured value to the nearest 0.1 mm, 0.01 mm,
• or 0.001 mm, respectively, and then compare to the specification number cited.

1.7.5 (Examples and Illustrations) Definitions of
Requirements
Many of the examples (illustrations) shown are
grossly exaggerated in order to depict the
reasons for this classification.
It is necessary that users of this standard pay
particular attention to the subject of each
section to avoid misinterpretation.

1.5.1.3 Defect Condition
A defect is a condition that may be insufficient to ensure
the form, fit or function of the assembly in its end use
environment. Defect conditions shall be dispositioned by
the manufacturer based on design, service, and customer
requirements.
Disposition may be to rework, repair, scrap, or use as is.
Repair or "use as is" may require customer concurrence.
It is the responsibility of the User to define unique defect
categories applicable to the product.
A defect for Class 1 automatically implies a defect for
Class 2 and 3. A defect for Class 2 implies a defect for
Class 3. (Note this would not be the case where criteria
for a particular class have not been established).

1.8.3 Diameter
Conductor The conductor diameter is the outside diameter of
wire, either stranded or solid, without the insulation.
Wire Wire diameter is the outside diameter of wire, either
stranded or solid, including insulation if present.
1.8.8 Locking Mechanism
A method of securing a mated assembly, e.g., fastener,
connector, either by use of a device integral to the assembly’s
components / parts, e.g., polymer insert, design feature, e.g.,
spring clip, latch, twist detent, push-pull, or by additive
device, material, or process, e.g., thread adhesive, safety wire
that when engaged prevents loosening or disconnection of
the mated assembly.

1.8.13 *Stress Relief
Slack in a component lead or wire that is formed in
such a way as to minimize mechanical stresses.
1.6.11 Wire Diameter
In this document, wire diameter (D) is the outside
overall diameter of conductor wire, either stranded
or solid, including insulation if present. Unless
otherwise specified, criteria in this standard are
applicable for solid wire/component leads or
stranded wire.

1.8.12 Inspection Methodology
Accept and/or reject decisions shall be based on applicable documentation
such as contract, drawings, specifications and referenced documents.
The use of any non-visual inspection methods, other than those already
detailed in Sections 8.3.12 and 8.3.13 are not specifically covered by this
Standard and shall be used as agreed between User and Manufacturer.
The inspector does not select the class for the assembly under inspection, see
1.3. Documentation that specifies the applicable class for the assembly under
inspection shall be provided to the inspector.
Automated Inspection, e.g., AOI, AXI, Technology (AIT) is a viable alternative
to visual inspection and complements automated test equipment. Many of
the characteristics in this document can be inspected with an AIT automated
system. IPCAI-641 "User's Guidelines for Automated Solder Joint Inspection
Systems" and IPC-AI-642 "User's Guidelines for Automated Inspection of
Artwork, Inner-layers, and Unpopulated PCBs" provide more information on
automated inspection technologies.
If the customer desires the use of industry standard requirements for
frequency of inspection and acceptance, J-STD-001 is recommended for
further soldering requirement details.

4.1.5 Hardware Installation - Threaded Fasteners and
Other Threaded Hardware
Acceptable - Class 1
Defect – Class 2,3
Less than one and one-half threads extend beyond the
threaded hardware, (e.g., nut) unless otherwise specified
by engineering drawing. thread extension would interfere
with other component.
Thread extension more than 3 mm [0.1 in] plus one and
one-half threads for bolts or screws up to 25 mm [1 in].
Thread extension more than 6.3 mm [0.25 in] plus one
and one-half threads for bolts or screws over 25 mm [1
in]. Bolts or screws without locking mechanisms extend
less than one and one half threads beyond the threaded
hardware.

4.1.5.1 Hardware Installation - Threaded Fasteners and Other Threaded
Hardware –Torque
Acceptable - Class 1,2,3
Fasteners are tight and split-ring lock washers, when used, are fully
compressed.
Fastener torque value, if specified, is within limits.
No evidence of damage resulting from overtightening of the threaded item.
Torque stripe on fasteners (witness/anti-tampering stripe), when required,
see Figure 4-21:
Is continuous between the fastener and the substrate.
Extends from the top of the fastener onto the adjacent substrate (at
minimum).
Is aligned with the center line of the fastener.
Is undisturbed (indicating no movement of the fastener and stripe after
torqueing).

4.1.5.1 Hardware Installation - Threaded Fasteners and Other Threaded
Hardware –Torque
Defect - Class 1,2,3
Threaded items are not tight and split ring lock washer, Split ring lock washer,
if used, is not compressed, see Figure 4-212.
Fastener torque value, if specified, is not within limits.
Hardware is loose, see Figure 4-22.
Evidence of damage resulting from overtightening of the threaded item to
the parts being fastened / tightened.
Required torque stripe is not continuous between the fastener and the
substrate.
Required torque stripe does not extend from the top of the fastener onto the
adjacent substrate (at minimum).
Required torque stripe is not aligned with the center line of the fastener.
Required torque stripe is disturbed (indicating movement of the fastener and
stripe after torqueing

4.2 Jackpost Mounting
This section covers the height relationship of the face of the jackpost to the associated
connector face. This is critical to obtain maximum connector pin contact.
Hardware stack-up for mounted connectors may be varied in order to locate the face
of the jackpost flush to 0.75 mm [0.030in] below the face of the connector.
Jackpost face is flush to 0.75 mm [0.030 in] below the face of the connector.
The jackposts can be above or below the face of the connector, depending on
the design, providing the connector and jackposts mate
correctly.
Height is obtained by adding or removing washers
(supplied with jackpost) in accordance with manufacturer’s instructions.
Jackpost face extends above the connector face, see Figure 4-28 The jackposts are
above or below the face of the connector, depending on the design, and the
connector and jackposts do not mate correctly. (No figure showing the defect
condition.).
Face of jackpost is greater than 0.75 mm [0.030 in] below the connector face, see
Figure 4-29.

5.2.1 Soldering Anomalies - Exposed Basis
Metal
Component leads, sides of land patterns,
conductors, and use of liquid photo imageable
solder mask can have exposed basis metal per
original designs.

5.2.14 Partially Visible or Hidden Solder
Connections
A partially visible or hidden solder connection shall
have the visible portion inspected, if any, of the
connection on either side of the PTH solder
connection (or the visible portion of an SMT
connection), and shall be compliant with the
criteria stated herein for that type of connection.
The non-visible portion of the connection should be
maintained in accordance with Clause 1.5.1.4.1.
NOTE: Nondestructive evaluation (NDE) may be
used or AABUS to verify the specified dimensions
that are not visible through normal visual means.

6.2.1.2 Insulation – Damage – Post-Solder
Insulation charred.
Solder connection contaminated by burnt or
melted insulation.

6.2.3.1 Insulation - Flexible Sleeve – Placement
Acceptable – Class 2,3
• Sleeving/tubing is tight on terminal and
wire/cable.
• Multiple pieces of sleeving overlap each other by
at least 3 wire/cable diameters, or 13 mm [0.5in],
whichever is larger.
• Sleeving/tubing is not tight on terminal and
wire/cable.
• Multiple pieces of sleeving overlap is less than 3
• wire/cable diameters or 13 mm [0.5
inch],whichever is less.

6.3.2.1 Conductor – Damage – Stranded Wire
Target – Class 1,2,3
Wire conductor ends are cut perpendicular to the
wire longitudinal axis.
All of the strands of the strand group are the same
length.
Wire strands are not scraped, nicked, cut,
flattened, scored, or otherwise damaged.
The number of Damaged (scraped, nicked or
severed) strands exceed the limits specified in a
single wire exceeds the limits in Table 6-2.

6.4 Service Loops
When a service loop is required, wire has at
initial attachment there is sufficient length to
allow one field re-termination to be made.
When a service loop is required, wire does not
have sufficient at initial attachment the length is
to short to allow at least one field re-
termination to be made.

6.5.1 Stress Relief – Bundle
Acceptable – Class 1
Process Indicator – Class 2
Defect - Class 3
Does not meet bend radius requirements. See
Table 4-1, see Figure 6-58.
There is insufficient stress relief, see Figure 6-
58.
The wire is under stress at the wrap, see Figure 6-59.
Defect – Class 1,2,3
Does not meet bend radius requirements. See Table 4-1,
see Figure 6-59.

6.6 Lead/Wire Placement – General Requirements
The terminal wire wrap summarized in Table 6-
3 apply equally to wires and component leads.
The criteria associated with each terminal type
or connection are in clauses 6.8 through 6.15
apply only to that connection.
Unless otherwise specified the wire or lead
should be in contact with base of the terminal
or a previously installed wire. The lead and wire
ends should not extend beyond the terminal
greater than one (1) lead diameter.
Removed Table 6-3

6.6 Lead/Wire Placement – General Requirements
Target - Class 1, 2, 3
Wires placed in ascending order with the largest on the bottom.
Wraps to a terminal are parallel with the terminal base and each
other.
Wires are mounted as close to the terminal base as allowed by
the insulation.
Wraps to a terminal are parallel with the terminal base and each
other.
Wires are mounted as close to the terminal base as allowed by
the insulation.
Wrapped conductors do not cross over or overlap each other on
terminal.
Strand separation (birdcaging) meets the requirements of 6.3.3
and 6.3.4.
Calibration parts may be mounted to the tops of hollow
terminals, see Figure 6-69.

6.6 Lead/Wire Placement – General
Requirements
• Terminal altered to accept oversized wire or wire
group.
• Wrapped conductors cross over or overlap each
• other on terminal, see Figure 6-67B.
• Strand separation (birdcaging) does not meet the
requirements of 6.3.3 and 6.3.4.
• The lead or wire interferes with the wrapping of
other leads or wires on the terminal.

6.8.1 Turrets and Straight Pins - Lead/Wire
Placement
Process Indicator - Class 2
Defect - Class 3
• On straight pins, the top wire on terminal is
less than one wire diameter below the top of
the terminal.

6.9.1 Bifurcated - Lead/Wire Placement - Side Route Attachments
Process Indicator - Class 2
Defect - Class 3
• Any portion of the wrap extends beyond the top of
• terminal post.
• Wire does not have positive contact with at least one corner of the
post.
• Wire/lead less than 0.75 mm [0.03 in] in diameter is wrapped
around a post less than 90º.
• Wire does not pass through slot.
• Wire end violates minimum electrical clearance, see Figure 6-82.
• Wire/lead less than 0.75 mm [0.03 in] in diameter is wrapped around a
post less than 90º and is not staked, see 6.9.2.

6.9.4 Bifurcated – Solder
Process Indicator – Class 2,3
• Wire/lead not discernible in solder connection.
• Depression of solder between the post and the
wire is greater than 50% of wire radius.
Defect – Class 3
• Depression of solder between the post and the
wire is greater than 25% of wire radius.

6.13.2 Solder Cups – Solder
• Thin film of solder on the outside of the cup.
• Solder fills the inside of the cup.
• Solder fill 75% or more of visible portion
above the cup lip.
• Solder buildup on the outside of the cup, as long as it does not affect
form, fit or function.
• Solder visible in or slightly protrudes from the
inspection hole (if one is provided).
• Solder does not fill the inside of the cup.
• Vertical fill of solder in the visible portion of the cup is less than
75%.
• Solder vertical fill less than 75%.
• Solder buildup on outside of the cup negatively
affects form, fit or function.
• Solder not visible in the inspection hole (if one is provided).

7.3.5.1 Supported Holes – Solder - Vertical fill (A)
• Minimum vertical fill of 50% or 1.2 mm [0.05in],
whichever is less, for components with 14 (not
shown).
• Component lead is discernible in the solder source
side of the solder connection.
• Minimum vertical fill of hole is more than 50% or
1.2 mm [0.05 in], whichever is less, for
components with less than 14 leads and having
an internal thermal plane providing the solder fillet
of Side B of Figure 7-87 has wetted 360o of the
PTH barrel wall and 360o of the lead and the
surrounding PTHs meet requirements of Table 7-4.

7.3.5.1 Supported Holes – Solder - Vertical fill
(A)
• Minimum 75% fill. A maximum of 25% total
depression, including both solder source and
solder destination side is permitted.
Note: For Class 2, this criteria is specific to
components with less than 14 leads and not
having an internal thermal plane.

Defect - Class 2
• Vertical fill of hole is less than 75% for
component less than 14 leads and not having an
internal thermal plane.
• Vertical fill of hole is less than 75% and greater
than 50% or 1.2 mm [0.05 in], whichever is less,
for components with less than 14 leads and
having an internal thermal plane and the solder
fillet on Side B of Figure 7-867 has wetted less
than 360° of the PTH barrel wall and less than
360° of the lead.
• Vertical fill of hole is less than 50% or 1.2
mm[0.05 in], whichever is less, for component
with greater than or equal to 14 leads or more.

7.5 Jumper Wires
The requirements relative to wire type, wire
routing, staking and soldering requirements are
the same for both haywires and jumper wires.
For the sake of simplicity only the more
common term, jumper wires, is used in this
section; however these requirements would
apply to both haywires and jumper wires.

8.3.2.9 Rectangular or Square End Chip
Components - 1, 2, 3 or 5 Side Terminations -
Termination Variations

8.3.5 Flat Gull Wing Leads
Note 6. (C) is measured at the narrowest point
of the solder fillet.
Note 7. If Side Overhang (A) is present, then the
Side Joint Length (D) on the overhanging portion
of the lead is not inspectable

8.3.6 Round or Flattened (Coined) Gull Wing
Leads
Note 6. Side fillet (and corresponding
Dimensions (D) & (Q)) would not form and
therefore is not required on a side where
acceptable side overhang (A) is present.
Note 7. (C) is measured at the narrowest point
of the solder fillet.

8.3.12.5 Surface Mount Area Array – Underfill/Staking
Target - Class 1, 2, 3
• Underfill or staking material does not contact adjacent
components.
Acceptable – Class 1,2,3
• When specified required, underfill or staking material is present.
• Excess underfill or staking material does not interfere with form,
fit, or function of the assembly.
• Underfill or staking material completely cured.
Defect – Class 1,2,3
• When specified, underfill or staking material is not present.
• Excess underfill or staking material interferes with form, fit or
function of the assembly.
• Missing or incomplete underfill or staking material when required.
• Underfill or staking material not fully cured.

8.3.16.2 P-Style Connections – Maximum Toe
Overhang (B)
• No portion of the Lead Length (L) extends
beyond the Land Length (S).Does not violate
minimum electrical clearance.
• Defect – Class 1,2,3
• Any portion of the Lead Length (L) extends
beyond the Land Length (S).Violates minimum
electrical clearance.

10.2.2 Laminate Conditions - Blistering and
Delamination
• Blister/delamination exceeds 25% of the distance
between plated-through holes or internal conductors.
• Blister/delamination exceeds 25% of the distance
between plated-through holes or internal conductors.
• Blistering/delamination reduce the space between
conductive patterns below the minimum electrical
clearance

10.2.4 Laminate Conditions – Haloing
• The distance between the haloing penetration and the
nearest conductive feature is not less than the
minimum lateral conductor spacing, or 0.1 mm [0.004 in]
when the minimum lateral conductor spacing is not
specified.
• Defect - Class 1,2,3
• The distance of between the haloing penetration and
the nearest conductive feature is less than the
minimum lateral conductor spacing, or less than 0.1
mm [0.004 in] when the minimum lateral conductor
spacing is not specified.

10.4.2.2 Flexible and Rigid-Flex Printed Circuitry –Delamination/Blister – Flex to Stiffener
Not Established – Class 1
Acceptable – Class 2,3
• The distance from stiffener board edge in the straight section of flex circuit which is
intended to remain straight is 0.5mm [0.02 in] or less.
• The distance from stiffener board edge in the bend section of the flex circuit which is
intended to bend is 0.3mm [0.01 in] or less.
• The area of blister or delamination between flex circuitry and a stiffener board exceeds
20% of the joined area provided the thickness of the blister does not exceed the thickness
limit of the entire board.
• Delamination (separation) or bubbles in the coverlayers of the flexible circuitry does not
span more than 25% of the distance between adjacent conductive patterns.
• Not Established – Class 1
• Defect – Class 2,3
• The distance from stiffener board edge in the straight section of flex circuit which is
intended to remain straight exceeds 0.5mm [0.02 in].
• The distance from stiffener board edge in the bend section exceeds 0.3mm [0.01 in].
• The area of blister or delamination between flex circuitry and a stiffener board
exceeds 20% of the joined area.
• Delamination (separation) or bubbles in the coverlayers of the flexible circuitry span more
than 25% of the distance between adjacent conductive patterns.

10.5.5.3 Marking - Labels - Adhesion and Damage
• Label lifted 10% or less of the label area.
• Physical damage is 10% or less of the label area and does
not affect form, fit or function.
• Damage does not affect legibility or the barcode
readability
• More than 10% of the label area is peeling.
• Missing labels
• Label wrinkle affects readability.
• Physical damage is greater than 10% of the label area
or affects form, fit or function.
• Damage affects legibility or the barcode readability.

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