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Chapter 1
Semiconductor Diodes
1
Introduction
Electronic Device:
 An Electronic Device is that in which current flows through a vacuum or
gas or semiconductor.
 Electronic devices are capable of performing the following functions :
 Rectification: The conversion of a.c into d.c
 Amplification: The process of raising the strength of a weak signal
 Generation: Conversion of d.c power into a.c power-Oscillation
 Photo-electricity: Conversion of light into electricity
Used for Burglar alarms , sound recording for motion pictures etc
 Conversion of electricity into light:
 used in television and Radar
2
Continued...
 Integrated Circuit (IC) is a combination of several Electronic
Devices
 Intel Pentium®4 processor has more than 42 million transistor
and a host of other components
 1 Billion transistors will soon be placed on a silver of silicon
smaller than a fingernail !!!
This is being possible through Miniaturization 
Further Miniaturization is limited by three factors –
 Quality of the semiconductor material
 Network Design Technique
 Limits of manufacturing and processing equipment
3
Semiconductor Materials
 Semiconductors are a special class of elements having a
conductivity between that of a good conductor and that of
insulator.
 There are two classes of Semiconductors-
 Single Crystal (Si, Ge)- Repetitive Crystal Structure
 Compound (GaAs, GaN, CdS)- Constructed of two or more
materials of different atomic structures
The three semiconductors used most frequently in the construction of
electronic devices are Ge, Si, GaAs.
 Earlier – Germanium (Ge)
 Now – Silicon (Si)
 Future- Gallium Arsenide (GaAs)
4
Continued...
 Ge- Sensitive to changes in temperature
------Hence devices suffer from low levels of reliability
 Si- Improved temperature sensitivity and easily available
------Electronics became more sensitive to “Speed” issues
 GaAs Transistors have speeds of operation up to 5 times that of Si
GaAs –Expensive, Difficult to manufacture at high level of purity
Si-Still the leading material for electronic components and ICs.
GaAs will soon begin to challenge Si !!!
5
Elements
6
Bohr Model
 atom is composed of three
basic particles: the electron,
the proton, and the neutron.
 Neutrons and Protons form
the Nucleus
 Electrons appear in fixed
orbits around the Nucleus
Atomic Structure: (a) Germanium (b) Silicon
7
Some Basic Concepts
 The electrons at the valence shell are known as Valence
Electrons
 Atoms with -
 Four Valence Electrons –Tetravalent
 Three Valence Electrons- Trivalent
 Five Valence Electrons- Pentavalent
Valence: Potential required to remove any one of the
electrons at the outermost shell from the atomic
structure is lower than that required for any other
electron in the structure.
8
Covalent Bonding
 When two Silicon or Germanium atoms are placed
close to one another , the valence electrons are shared
between the two atoms , forming a Covalent Bond.
9
Covalent Bonding
Covalent Bond in the Silicon Atom
10
Free Electrons
 Covalent bond results in a stronger bond between the
valence electrons and their parent atom
 The valence electrons can still absorb sufficient kinetic
energy from external natural sources to break the covalent
bond
 The External Sources---------
 Thermal Energy from the surrounding medium
 Light energy in the form of Photons
At room Temperature there are approx. 15 Billion free electrons
1 cm3 of intrinsic silicon material
11
Intrinsic Materials
 Intrinsic materials are those semiconductors that have been carefully refined to
reduce the impurities to a very low level—essentially as pure as can be made
available through modern technology.
 Free Electrons-Due only to External natural Causes-Intrinsic Carriers
 Ability of the free carriers to move throughout the material-Relative Mobility
 Ge is used in High Speed Radio Frequency applications (Because of
Higher Relative Mobility than Si)
Semiconductor
Intrinsic Carriers
(Per Cubic cm)
GaAs 1.7 x 106
Si 1.5 x 106
Ge 2.5 x 10 13
Semiconductor Relative Mobility (µn)
Si 1500
Ge 3900
GaAs 8500
12
Effect of Temperature on Material
 Conductor: Resistance increase with increase in
temperature and have a Positive Temperature Coefficient.
 The number of carriers in a conductor do not increase significantly
with temperature, but their vibration pattern about a relatively fixed
location make it increasingly difficult for electrons to pass through.
 Semiconductor: Resistance decreases with increase in
temperature and have a Negative Temperature Coefficient.
 As the temperature rises , an increasing number of valence electrons
absorb sufficient thermal energy to break the covalent bond and
contribute to the number of free carriers which increase the
conductivity index and result in a lower resistance level.
13
Energy Level
 There are specific energy levels associated
with each shell and orbiting electron
 The further an electron is from the
nucleus, the higher is the energy state
 Free electrons has a higher energy state
than any electron in the atomic structure
 Only specific energy levels can exist for the
electrons in the atomic structure
 This results in a series of gaps where no
electrons (carriers) are permitted
14
Energy Level
Conduction and Valence bands of an Insulator, Semiconductor and Conductor
15
Extrinsic Materials
 The characteristics of semiconductor materials can be altered
significantly by the addition of certain impurity atoms into the
relatively pure semiconductor material.
 These impurities, although only added to perhaps 1 part in 10 million,
can alter the band structure sufficiently to totally change the electrical
properties of the material
 This addition of foreign atoms to the semiconductor is known as doping
 A semiconductor material that has been subjected to the doping
process is called an Extrinsic material.
 There are two types of Extrinsic Materials-
 n-type
 p-type
16
n-Type Material
 n-type material is created by introducing
impurity elements having five valence
electrons (Antimony, arsenic, phosphorus)
 An additional fifth valence electron is
introduced ,which is unassociated with any
particular covalent bond
 Material is still charge neutral, but very little
energy is required to free the electron for
conduction since it’s not participating in any
bond
 Diffused impurities with five valence
electrons are called donor atomsAntimony Impurity in n-type
17
p-Type Material
 p-type material is created by introducing
impurity elements having three valence
electrons (Boron, Gallium, Indium)
 There is now an incomplete bond pair,
creating a vacancy for an electron
 Little energy is required to move a near
by electron into the vacancy (hole)
 As the ‘hole’ propagates, charge is
moved across the semiconductor
 Diffused impurities with three valence
electrons are called acceptor atomsBoron impurity in p-type
18

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Lecture 1 introduction to diodes edited

  • 2. Introduction Electronic Device:  An Electronic Device is that in which current flows through a vacuum or gas or semiconductor.  Electronic devices are capable of performing the following functions :  Rectification: The conversion of a.c into d.c  Amplification: The process of raising the strength of a weak signal  Generation: Conversion of d.c power into a.c power-Oscillation  Photo-electricity: Conversion of light into electricity Used for Burglar alarms , sound recording for motion pictures etc  Conversion of electricity into light:  used in television and Radar 2
  • 3. Continued...  Integrated Circuit (IC) is a combination of several Electronic Devices  Intel Pentium®4 processor has more than 42 million transistor and a host of other components  1 Billion transistors will soon be placed on a silver of silicon smaller than a fingernail !!! This is being possible through Miniaturization  Further Miniaturization is limited by three factors –  Quality of the semiconductor material  Network Design Technique  Limits of manufacturing and processing equipment 3
  • 4. Semiconductor Materials  Semiconductors are a special class of elements having a conductivity between that of a good conductor and that of insulator.  There are two classes of Semiconductors-  Single Crystal (Si, Ge)- Repetitive Crystal Structure  Compound (GaAs, GaN, CdS)- Constructed of two or more materials of different atomic structures The three semiconductors used most frequently in the construction of electronic devices are Ge, Si, GaAs.  Earlier – Germanium (Ge)  Now – Silicon (Si)  Future- Gallium Arsenide (GaAs) 4
  • 5. Continued...  Ge- Sensitive to changes in temperature ------Hence devices suffer from low levels of reliability  Si- Improved temperature sensitivity and easily available ------Electronics became more sensitive to “Speed” issues  GaAs Transistors have speeds of operation up to 5 times that of Si GaAs –Expensive, Difficult to manufacture at high level of purity Si-Still the leading material for electronic components and ICs. GaAs will soon begin to challenge Si !!! 5
  • 7. Bohr Model  atom is composed of three basic particles: the electron, the proton, and the neutron.  Neutrons and Protons form the Nucleus  Electrons appear in fixed orbits around the Nucleus Atomic Structure: (a) Germanium (b) Silicon 7
  • 8. Some Basic Concepts  The electrons at the valence shell are known as Valence Electrons  Atoms with -  Four Valence Electrons –Tetravalent  Three Valence Electrons- Trivalent  Five Valence Electrons- Pentavalent Valence: Potential required to remove any one of the electrons at the outermost shell from the atomic structure is lower than that required for any other electron in the structure. 8
  • 9. Covalent Bonding  When two Silicon or Germanium atoms are placed close to one another , the valence electrons are shared between the two atoms , forming a Covalent Bond. 9
  • 10. Covalent Bonding Covalent Bond in the Silicon Atom 10
  • 11. Free Electrons  Covalent bond results in a stronger bond between the valence electrons and their parent atom  The valence electrons can still absorb sufficient kinetic energy from external natural sources to break the covalent bond  The External Sources---------  Thermal Energy from the surrounding medium  Light energy in the form of Photons At room Temperature there are approx. 15 Billion free electrons 1 cm3 of intrinsic silicon material 11
  • 12. Intrinsic Materials  Intrinsic materials are those semiconductors that have been carefully refined to reduce the impurities to a very low level—essentially as pure as can be made available through modern technology.  Free Electrons-Due only to External natural Causes-Intrinsic Carriers  Ability of the free carriers to move throughout the material-Relative Mobility  Ge is used in High Speed Radio Frequency applications (Because of Higher Relative Mobility than Si) Semiconductor Intrinsic Carriers (Per Cubic cm) GaAs 1.7 x 106 Si 1.5 x 106 Ge 2.5 x 10 13 Semiconductor Relative Mobility (µn) Si 1500 Ge 3900 GaAs 8500 12
  • 13. Effect of Temperature on Material  Conductor: Resistance increase with increase in temperature and have a Positive Temperature Coefficient.  The number of carriers in a conductor do not increase significantly with temperature, but their vibration pattern about a relatively fixed location make it increasingly difficult for electrons to pass through.  Semiconductor: Resistance decreases with increase in temperature and have a Negative Temperature Coefficient.  As the temperature rises , an increasing number of valence electrons absorb sufficient thermal energy to break the covalent bond and contribute to the number of free carriers which increase the conductivity index and result in a lower resistance level. 13
  • 14. Energy Level  There are specific energy levels associated with each shell and orbiting electron  The further an electron is from the nucleus, the higher is the energy state  Free electrons has a higher energy state than any electron in the atomic structure  Only specific energy levels can exist for the electrons in the atomic structure  This results in a series of gaps where no electrons (carriers) are permitted 14
  • 15. Energy Level Conduction and Valence bands of an Insulator, Semiconductor and Conductor 15
  • 16. Extrinsic Materials  The characteristics of semiconductor materials can be altered significantly by the addition of certain impurity atoms into the relatively pure semiconductor material.  These impurities, although only added to perhaps 1 part in 10 million, can alter the band structure sufficiently to totally change the electrical properties of the material  This addition of foreign atoms to the semiconductor is known as doping  A semiconductor material that has been subjected to the doping process is called an Extrinsic material.  There are two types of Extrinsic Materials-  n-type  p-type 16
  • 17. n-Type Material  n-type material is created by introducing impurity elements having five valence electrons (Antimony, arsenic, phosphorus)  An additional fifth valence electron is introduced ,which is unassociated with any particular covalent bond  Material is still charge neutral, but very little energy is required to free the electron for conduction since it’s not participating in any bond  Diffused impurities with five valence electrons are called donor atomsAntimony Impurity in n-type 17
  • 18. p-Type Material  p-type material is created by introducing impurity elements having three valence electrons (Boron, Gallium, Indium)  There is now an incomplete bond pair, creating a vacancy for an electron  Little energy is required to move a near by electron into the vacancy (hole)  As the ‘hole’ propagates, charge is moved across the semiconductor  Diffused impurities with three valence electrons are called acceptor atomsBoron impurity in p-type 18