1. The document discusses the mechanisms of adhesion, which can be divided into chemical bonding and physical bonding. Chemical bonding involves primary bonds formed by electron sharing or exchange, and secondary bonds formed through mechanical linking. Physical bonding involves mechanical interlocking, diffusion, adsorption, and electrostatic forces.
2. Mechanical interlocking occurs when an adhesive penetrates pores and irregularities in a substrate to create a mechanical link. Diffusion bonding is caused by compatibility between polymer chains that allows for mixing and penetration. Adsorption bonding is through intermolecular attraction like van der Waals forces, requiring wetting of the substrate. Electrostatic bonding arises from separation of charges at interfaces, affecting polar adhesives.