Mems Introduction
- 1. Micro Electro Mechanical Systems (MEMS) Dr.K.GOMATHI Department of Mechatronics Engineering Kongu Engineering College, Perundurai
- 2. CONTENTS What is MEMS? Miniaturization Components of MEMS Applications Fabrication Process Micro Machining Process CAD tools
- 3. MEMS MEMS = Micro Electro Mechanical System Any engineering system that performs electrical and mechanical functions with components in micrometers is a MEMS.
- 5. Miniaturization (Courtesy of Denso Research Laboratories, Denso Corporation, Aichi, Japan)
- 6. Timeline of MEMS • 1959 - “There’s Plenty of Room at the Bottom” –Richard Feynman gives a milestone presentation at California Institute of Technology. He issues a public challenge by offering $1000 to the first person to create an electrical motor smaller than 1/64th of an inch.
- 8. What do MEMS Do? Airbag ADXL (Analog Devices 2000) Microsystem The sense Sensors Signal Treatment The Brain Actuators The muscle US name : MEMS European name : Microsystems Technology Japanese name : Micromachines or Micromechatronics
- 9. APPLICATIONS Automotive Industry Health care Aerospace Industry Industrial Products Consumer Products Telecommunication
- 10. MEMS Fabrication Process Photolithography Ion implantation Diffusion Oxidation Chemical vapour deposition Physical vapour deposition (Sputtering) Deposition by expitaxy Etching
- 11. Photolithography
- 12. Two Kind of Photo resists Positive resists Negative resists (1)PMMA (Polymethymethacrylate) resists, (2)two-component DQN resist involving diazoquinone ester (DQ) and phenolic novolak resin (N). (1) Two-component bis (aryl) azide rubber resists, and (2) Kodak KTFR (azide-sensitized polyisotroprene rubber). Positive resists are sensitive to UV lights with the maximum sensitivity at a wavelength of 220 nm. Negative resists are less sensitive to optical and x-ray exposures but more sensitive to electron beams Solvents KOH (potassium peroxide), TMAH (tetramethylammonium hydroxide), ketones or acetates. Xylene is the most commonly used solvent
- 14. Fabrication Process -Contd • Ion Implantation It is physical process used to dope silicon substrates. • Diffusion Diffusion is another common technique for doping silicon substrates. Unlike ion implantation, diffusion takes place at high temperature.
- 15. Oxidation
- 16. Chemical Vapour Deposition (CVD)
- 17. Chemical Vapour Deposition (CVD)
- 18. • Physical Vapor Deposition- Sputtering It is used to deposit thin metal films • Deposition by Epitaxy Similar Material • Etching Wet etching or chemical Etching Dry etching or Plasma Etching Fabrication Process -Contd
- 20. • Bulk Micromachining - removing materials from thick substrates • Surface Micromachining - adding material to the substrate. • LIGA -“Lithography (Lithographie),electroforming (Galvanoformung), and molding (Abformung)”. • SLIGA Micromachining Process
- 21. Simulation software package’s • Coventorware • Intellisuite • Comsol Multiphysics • Ansys • TCAD • SUGAR
- 22. Cantilever Beam
- 23. THANK YOU