OpenCAPI next generation accelerator
- 1. OpenCAPI: Next Generation of Acceleration for the Cognitive Area — Brian Allison OpenCAPI Technology and Enablement E-mail: ballis@us.ibm.com
- 2. Industry Collaboration and Innovation 2
- 3. OpenCAPI Topics Key Messages Industry Background Technology Overview Possible Solutions OpenCAPI Based Systems OpenCAPI & CAPI2 Adapters Design Enablement Performance Metrics OpenCAPI Consortium 3
- 4. Key Messages Throughout IBM’s Strong History in IO Offerings OpenCAPI is an Open IO Standard Not tied to Power – Architecture Agnostic High Performance – No OS/Hypervisor/FW Overhead with Low Latency and High Bandwidth Programing Ease Very Low Accelerator Design Overhead Supports heterogeneous environment – Use Cases Ideal for Accelerated Computing and SCM Optimized for within a single system node Products exist today! 4
- 5. OpenCAPI Topics Key Messages Industry Background Technology Overview Possible Solutions OpenCAPI Based Systems OpenCAPI & CAPI2 Adapters Design Enablement Performance Metrics OpenCAPI Consortium 5
- 6. What’s Driving the Creation of a High Perf. Bus • Historical silicon technology improvements out of steam • More cores on a processor help but you’ll never have enough; especially for today’s emerging workloads (analytics, artificial intelligence, machine learning, real time analysis, etc.) • New advanced memory technologies are changing the economics of computing • Companies realizing the need to off load the microprocessors from routine algorithms to meet demand and improve system performance Accelerated Computing • Accelerators - If you are going to use them, you need a lot of data in/out quickly 6 Computation Data Access
- 7. © 2018 IBM Corporation POWER Processor Technology Roadmap 2H12 POWER7+ 32 nm - 2.5x Larger L3 cache - On-die acceleration - Zero-power core idle state - Up to 12 Cores - SMT8 - CAPI Acceleration - High Bandwidth GPU Attach 1H14 – 2H161H10 POWER7 45 nm - 8 Cores - SMT4 - eDRAM L3 Cache POWER9 Family 14nm POWER8 Family 22nm 7 Enterprise Enterprise Enterprise & Big Data Optimized 2H17 – 2H18+ Built for the Cognitive Era − Enhanced Core and Chip Architecture Optimized for Emerging Workloads − Processor Family with Scale-Up and Scale-Out Optimized Silicon − Premier Platform for Accelerated Computing
- 8. Open Coherent Accelerator Processor Interface Industry driving these necessary Accelerator attributes • High performance (move a lot of data quickly; bandwidth, latency) • Fulfill various accelerator form factors (e.g., GPUs, FPGAs, ASICs) • Introduction of device coherency requirements • Emergence of complex Storage and Memory solutions • Growing demand for network performance with increased computational demand • Need to be architecture agnostic to enable the ecosystem growth and adaption 8
- 9. Accelerated Computing Example IBM’s AC922 built for Accelerated Computing Classic system topology setup with two POWER9 sockets, each socket having at least two NVIDIA GPUs Does Accelerated Computing work? • Summit Supercomputer, an IBM-built supercomputer now running at the Department of Energy’s (DOE) Oak Ridge National Laboratory, captured the number one spot with a performance of 143,5 petaflops on High Performance Linpack (HPL), the benchmark used to rank the TOP500 list. Summit has 4,356 nodes, each one equipped with two 22-core Power9 CPUs, and six NVIDIA Tesla V100 GPUs. The nodes are linked together with a Mellanox dual-rail EDR InfiniBand network. 9
- 10. OpenCAPI Topics Key Messages Industry Background Technology Overview Possible Solutions OpenCAPI Based Systems OpenCAPI & CAPI2 Adapters Design Enablement Performance Metrics OpenCAPI Consortium 10
- 11. Why OpenCAPI and what is it? OpenCAPI is a new ‘bottom’s up’ IO standard Key Attributes of OpenCAPI 3.0 • Open IO Standard – Choice for developers and others to contribute and grow an ecosystem • Coherent interface – Microprocessor memory, accelerator and caches share the same memory space • Architecture agnostic – Capable going beyond Power Architecture • Not tied to Power – Architecture Agnostic • High performance – No OS/Hypervisor/FW Overhead for Low Latency and High Bandwidth • Ease of programing • Ease of implementation with minimal accelerator design overhead • Ideal for accelerated computing and SCM including various form factors (FPGA, GPU, ASIC, TPU, etc.) • Optimized for within a single system node • Supports heterogeneous environment – Use Cases OpenCAPI 3.1 Applies OpenCAPI technology for use of standard DRAM off the microprocessor Based on an Open Memory Interface (OMI) Further tuned for extreme lower latency 11
- 12. Accelerated OpenCAPI Device OpenCAPI Key Attributes 12 TL/DL 25Gb I/O Any OpenCAPI Enabled Processor U Accelerated Function TLx/DLx 1. Architecture agnostic bus – Applicable with any system/microprocessor architecture 2. Optimized for High Bandwidth and Low Latency 3. High performance 25Gbps PHY design with zero ‘overhead’ 4. Coherency - Attached devices operate natively within application’s user space and coherently with host microprocessor 5. Virtual addressing enables low overhead with no Kernel, hypervisor or firmware involvement; security benefit 6. Wide range of Use Cases and access semantics 7. CPU coherent device memory (Home Agent Memory) 8. Architected for both Classic Memory and emerging Advanced Storage Class Memory 9. Minimal OpenCAPI design overhead (FPGA less than 5%) Caches Application Storage/Compute/Network etc ASIC/FPGA/FFSA FPGA, SOC, GPU Accelerator Load/Store or Block Access Standard System Memory Advanced SCM Solutions BufferedSystemMemory OpenCAPIMemoryBuffers Device Memory
- 13. Use Cases - A True Heterogeneous Architecture Built Upon OpenCAPI OpenCAPI 3.0 OpenCAPI 3.1 OpenCAPI specifications are downloadable from the website at www.opencapi.org - Register - Download 13
- 14. © 2018 IBM Corporation Proposed POWER Processor Technology and I/O Roadmap POWER8 Architecture POWER9 Architecture 2014 POWER8 12 cores 22nm New Micro- Architecture New Process Technology 2016 POWER8 w/ NVLink 12 cores 22nm Enhanced Micro- Architecture With NVLink 2017 P9 SO 12/24 cores 14nm New Micro- Architecture Direct attach memory New Process Technology 2018 P9 SU 12/24 cores 14nm Enhanced Micro- Architecture Buffered Memory POWER7 Architecture 2010 POWER7 8 cores 45nm New Micro- Architecture New Process Technology 2012 POWER7+ 8 cores 32nm Enhanced Micro- Architecture New Process Technology 2020+ P10 TBA cores New Micro- Architecture New Technology POWER10 2019 P9 w/ Adv. I/O 12/24 cores 14nm Enhanced Micro- Architecture New Memory Subsystem 150 GB/s PCIe Gen4 x48 25 GT/s 300GB/s CAPI 2.0, OpenCAPI3.0, NVLink Sustained Memory Bandwidth Standard I/O Interconnect Advanced I/O Signaling Advanced I/O Architecture 210 GB/s PCIe Gen4 x48 25 GT/s 300GB/s CAPI 2.0, OpenCAPI3.0, NVLink 350+ GB/s PCIe Gen4 x48 25 GT/s 300GB/s CAPI 2.0, OpenCAPI4.0, NVLink 435+ GB/s PCIe Gen5 32 & 50 GT/s TBA 210 GB/s PCIe Gen3 N/A CAPI 1.0 210 GB/s PCIe Gen3 20 GT/s 160GB/s CAPI 1.0 , NVLink 65 GB/s PCIe Gen2 N/A N/A 65 GB/s PCIe Gen2 N/A N/A Statement of Direction, Subject to Change 14
- 15. POWER9 IO Features 8 and 16Gbps PHY Protocols Supported • PCIe Gen3 x16 and PCIe Gen4 x8 • CAPI 2.0 on PCIe Gen4 PCIeGen4 P9 25Gbs 25Gbps PHY Protocols Supported • OpenCAPI 3.0 • NVLink 2.0 Silicon Die Various packages (scale-out, scale-up) POWER9 IO Leading the Industry • PCIe Gen4 • CAPI 2.0 (Power) • NVLink 2.0 • OpenCAPI 3.0 POWER9 15
- 16. Why do I care about Virtual Addressing? An OpenCAPI device operates in the virtual address spaces of the applications that it supports • Eliminates kernel and device driver software overhead • Allows device to operate on application memory without kernel-level data copies/pinned pages • Simplifies programming effort to integrate accelerators into applications • Culmination => Improves Accelerator Performance The Virtual-to-Physical Address Translation occurs in the host CPU • Reduces design complexity of OpenCAPI accelerator development • Makes it easier to ensure interoperability between OpenCAPI devices and different CPU architectures • Security - Since the OpenCAPI device never has access to a physical address, this eliminates the possibility of a defective or malicious device accessing memory locations belonging to the kernel or other applications that it is not authorized to access 16
- 17. 17 OpenCAPI vs I/O Device Driver – Because minimizing SW Path Length is crucial for performance Typical I/O Model Flow using Device Driver Flow with a OpenCAPI Model Shared Memory Notify Accelerator Acceleration Shared memory completion or fast thread wake up DD Call Copy or Pin Source Data MMIO Notify Accelerator Acceleration Poll / Intr Completion Copy or Unpin Result Data Return From DD Completion TL/DL 25Gb I/O Processor FPGA/SoC/GPU Functionn Function0 Function1 Function2 OpenCAPI TLx/DLx Device Memory Host Memory Total ~13µs for data prep Total 0.36µs 400 Instructions 100 Instructions 0.3µs 0.06µs Application Dependent, but Equal to above 3,000 Instructions 1,000 Instructions 1,000 Instructions 4.9µs 300 Instructions 10,000 Instructions 7.9µs Application Dependent, but Equal to below
- 18. OpenCAPI Topics Key Messages Industry Background Technology Overview Possible Solutions OpenCAPI Based Systems OpenCAPI & CAPI2 Adapters Design Enablement Performance Metrics OpenCAPI Consortium 18
- 19. So How is Accelerated Computing Leveraged? Okay, I’m sold. But how do I leverage this technology? Isolate and identify your heavily used workloads, algorithms and/or applications Place this workload onto an accelerator Path of least resistance and flexibility is an FPGA that is programmable Purchase any of the OpenCAPI vendor FPGA cards and an OpenCAPI enabled system and start developing your solution! 19
- 20. Comparison of Memory Paradigms Emerging Storage Class Memory Processor Chip DLx/TLx SCMData OpenCAPI 3.1 Architecture Ultra Low Latency ASIC Memory buffer chip adding ~ +7-10 ns on top of native DDR direct connect!! Storage Class Memory tiered with traditional DDR Memory all built upon OpenCAPI 3.1 & 3.0 architecture. Still have the ability to use Load/Store Semantics Storage Class Memories have the potential to be the next disruptive technology….. Examples include ReRAM, MRAM, Z-NAND…… All are racing to become the defacto Main Memory Processor Chip DLx/TLx DDR4/5 Example: Basic DDR attach Data Tiered Memory Processor Chip DLx/TLx DDR4/5 DLx/TLx SCM Data Data Tier 1 Memory Tier 2 Memory
- 21. Acceleration Paradigms with Great Performance 21 Examples: Encryption, Compression, Erasure prior to delivering data to the network or storage Processor Chip Acc Data Egress Transform DLx/TLx Processor Chip Acc Data Bi-Directional Transform Acc DLx/TLx Examples: NoSQL such as Neo4J with Graph Node Traversals, etc Needle-in-a-haystack Engine Examples: Machine or Deep Learning such as Natural Language processing, sentiment analysis or other Actionable Intelligence using OpenCAPI attached memory Memory Transform Processor Chip Acc DataDLx/TLx Example: Basic work offload Processor Chip Acc NeedlesDLx/TLx Examples: Database searches, joins, intersections, merges Only the Needles are sent to the processor Ingress Transform Processor Chip Acc DataDLx/TLx Examples: Video Analytics, Network Security, Deep Packet Inspection, Data Plane Accelerator, Video Encoding (H.265), High Frequency Trading etc Needle-In-A-Haystack Engine Large Haystack Of Data OpenCAPI is ideal for acceleration due to Bandwidth to/from accelerators, best of breed latency, and flexibility of an Open architecture
- 22. OpenCAPI Topics Key Messages Industry Background Technology Overview Possible Solutions OpenCAPI Based Systems OpenCAPI & CAPI2 Adapters Design Enablement Performance Metrics OpenCAPI Consortium 22
- 23. IBM AC922 Air Cooled 23 Power9 Systems with OpenCAPI System Details • 2 – Socket 2U • Up to 40 cores • Up to 2TB memory (16 DDR4 Dimms) • 4 Gen4 PCIe Slots, 3 CAPI2.0 Enabled • 2 2.5” SFF Drive Bays • 4 OpenPOWER Mezzanine Sockets • Up to 4 NVLink V100 GPUs • Up to 4 socketed OpenCAPI Adapters* • Up to 1 cabled OpenCAPI Cards w/ SlimSAS adapter* * Future Support
- 24. 24 Power9 Systems with OpenCAPI • Dual Socket • OCP 48V • Up to 4TB memory (32 DDR4 Dimms) • 5 PCIe Gen4 Slots, 3 CAPI2.0 Enabled • 2 x8 OCP Gen4 PCIe Mezz Slots CAPI2.0 Enabled • 4 x8 25 Gbps SlimSAS Accelerator Ports • Supports up to 4 OpenCAPI cabled adapters Google & Rackspace Zaius Motherboard
- 25. Rackspace BarrelEye G2 ServerSed 25 • Zaius Motherboard • Full-depth 48V Open Rack V2 • 2OU Chassis • High Density, Hot Swap Storage Bay • 4 x8 25Gb/s Coherent Attach Ports “The OpenCAPI accelerator and software ecosystem is growing rapidly. With collateral available via the Open Compute website, accelerator developers find it easy to design and test their solutions on our platform.” Adi Gangidi, Senior Design Engineer with Rackspace
- 26. Power9 Systems with OpenCAPI 26 • 2 Socket 2U • Up to 48 cores • Up to 4TB memory (32 DDR4 DIMMs) • 4 Gen4 PCIe Slots, CAPI2.0 Enabled • 6 Gen3 PCIe Slots • Up to 24 SFF / 12 LFF Drives • 4 x8 25 Gbps Ports • Up to 4 cabled OpenCAPI Adapters* Mihawk “In order to provide the best backend architecture in AI, Big Data, and Cloud applications, Wistron POWER9 system design incorporates OpenCAPI technology through 25Gbps high speed link to dramatically change the traditional data transition method. This design not only improves GPU performance, but also utilizes next generation advanced memory, coherent network, storage, and FPGA. This is an ideal system infrastructure to meet next decade computing world challenges.” Donald Hwang, CTO and President of EBG at Wistron Corporation.
- 27. OpenCAPI Topics Key Messages Industry Background Technology Overview Possible Solutions OpenCAPI Based Systems OpenCAPI & CAPI2 Adapters Design Enablement Performance Metrics OpenCAPI Consortium 27
- 28. 28 OpenCAPI and CAPI2 Adapters Nallatech 250S+ Storage Expansion • Xilinx US+ KU15P FPGA • 4 GB DDR4 • PCIe Gen4 x8 and CAPI2 • 4x M.2 Slots • M.2 to MiniSAS or Oculink for U.2 drive support CAPI Flash API, Accelerated DB, Burst Buffer Nallatech 250-SoC Multipurpose Converged Network / Storage • Xilinx Zynq US+ ZU19EG FPGA • 8/16 GB DDR4, 4/8 GB DDR4 ARM • PCIe Gen4 x8 or Gen3 x16, CAPI2 • 4 x8 Oculink Ports support NVMe, Network, or OpenCAPI • 2 100Gb QSFP28 Cages Mellanox Innova2 Network + FPGA • Xilinx US+ KU15P FPGA • Mellanox CX5 NIC • 16 GB DDR4 • PCIe Gen4 x8 • 2 25Gb SFP Cages • X8 25Gb/s OpenCAPI Support Network Acceleration (NFV, Packet Classification), Security Acceleration
- 29. 29 OpenCAPI and CAPI2 Adapters AlphaData ADM-9V3 High Performance Reconfigurable Computing • Xilinx US+ VU3P FPGA • 16 / 32 GB DDR4 • PCIe Gen3 x16 or Gen4 x8 and CAPI2 • 2 QSFP28 Cages • X8 25Gb/s OpenCAPI SlimSAS Data Center, Network Accel, HPC, HFT Bittware XUPVV4 Massive FPGA • Xilinx US+ VU13P FPGA • 4 288-pin DIMM Slots, DDR4 or Dual QDR • Up to 512GB DDR4 • PCIe Gen3 x16, CAPI2 Capable • 4 100Gb QSFP28 Cages • 2 x8 25Gb/s OpenCAPI Support Optimized for Thermal Performance for Large acceleration in the Data Center AlphaData ADM-9H7 Large FPGA with 8GB HBM • Xilinx US+ VU37P FPGA + HBM • 8GB High Bandwidth Memory • PCIe Gen4 x8 or Gen3 x16, CAPI2 • 2 x8 25 Gb/s OpenCAPI Ports (support up to 50 GB/s) • 4 100Gb QSFP28 Cages AlphaData ADM-9H3 Large FPGA with 8GB HBM • Xilinx Virtex US+ VU33P-3 FPGA + HBM • 8GB High Bandwidth Memory • PCIe Gen4 x8 or Gen3 x16, CAPI2 • 1 x8 25 Gb/s OpenCAPI Ports (support up to 50 GB/s) • 2 100Gb QSFP28 Cages ML/DL, Inference, System Modeling, HPC
- 30. OpenCAPI Topics Key Messages Industry Background Technology Overview Possible Solutions OpenCAPI Based Systems OpenCAPI & CAPI2 Adapters Design Enablement Performance Metrics OpenCAPI Consortium 30
- 31. TLx and DLx Reference Designs in an FPGA TLX and DLX will be provided as reference designs to OpenCAPI consortium members • Associated reference design specifications for TLx and DLx will also be delivered along with RTL Open Verilog – free to enhance, improve or leverage pieces of reference design for your own accelerator development Designed for 64B packet flow running at 400MHz Xilinx Vivado 2017.1 TLX and DLX Statistics on VU3P Device 31 VU3P Resources CLB FlipFlops LUT as Logic LUT Memory Block Ram Tile DLx 9392/788160 (1.19%) 19026/394080 (4.82%) 0/197280 (0%) 7.5/720 (1.0%) TLx 13806/788160 (1.75%) 8463/394080 (2.14%) 2156/197280 (1.09%) 0/720 (0%) Total 23108/788160 (2.94%) 27849/394080 (6.98%) 2156/197280 (1.09%) 7.5/720 (1.0%) Because power efficiency and size do matter
- 32. OpenCAPI Device • Customer application and accelerator • Operation system enablement • Little Endian Linux • Reference Kernel Driver (ocxl) • Reference User Library (libocxl) • Hardware and reference designs to enable coherent acceleration Core Processor OS App (software) Memory (Coherent) Accelerated Function(s) TLx DLx 25G ocxl libocxl OCSE (OpenCAPI Simulation Environment) models the red outlined area OCSE enables AFU and Application co- simulation when the reference libocxl and reference TLx/DLx are used Contributed to the Enablement Workgroup under the OpenCAPI consortium Cable Memory (Coherent) Elements of the OpenCAPI Simulation Environment 25G DL TL 32
- 33. Exerciser Examples – Provided to OCC Members MemCopy • The MemCopy example is a data mover from source address -> destination address using Virtual Addressing and includes these features • Configuration and MMIO Register Space • acTag Table used for Bus/Device/Function and Process ID identification • 512 processes/contexts and 32 engines supporting up to 2K transfers using 64B, 128B, or 256B operations Memory Home Agent • The Memory Home Agent example implements memory off the endpoint OpenCAPI accelerator to act as a coherent extension to the host processor memory • The Memory Home Agent example includes these features • Configuration and MMIO Register Space • Individual and pipelined operation for memory loads and stores • Interrupts, with error details reported to software through MMIO registers • Sparse Address Mapping feature to extend 1 MB of real space to 4 TB of address Open Examples – free to enhance, improve or leverage pieces of exerciser examples for your own accelerator development 33
- 34. Reference Card Design Number 1 Definition of the FPGA reference card(s) is driven as part of the Enablement Work Group Definition of the cable(s) is driven as part of the PHY Mechanical Work Group Representative Diagram is articulated below 34 FPGA OpenCAPI Protocol Over the 25Gbps link Including Discovery, Configuration and Enumeration Power and Ground only Convenient Fixture Amphenol SlimSAS OpenCAPI Connector
- 35. Reference Card Design Number 2 Definition of the FPGA reference card(s) is driven as part of the Enablement Work Group Definition of the cable(s) will be driven as part of the PHY Mechanical Work Group Representative Diagram is articulated below 35 Amphenol SlimSAS OpenCAPI Connector Mezzanine based Form Factor
- 36. Table of Enablement Deliveries 36 Item Delivery Name Where to Obtain Available OpenCAPI 3.0 TLx and DLx Reference Xilinx FPGA Designs (RTL and Specifications) <snapshot>.tar.gz Enablement WG Today Xilinx Vivado Project Build with Memcopy Exerciser Vivado Project Flow Enablement WG Today Device Discovery and Configuration Specification and RTL OpenCAPI 3.0 Configuration Sub- System Reference Design Specification Enablement WG Causeway Today AFU Interface Specification TLX 3.0 Reference Design.pdf Enablement WG Causeway Today 25Gbps PHY Signal Specification OC PHY 25G Specification PHY Signaling WG Causeway Today 25Gbps PHY Mechanical Specification 25Gbps Interface Mechanical Spec PHY Mechanical WG Causeway Today OpenCAPI Simulation Environment (OCSE) ocse-<version>.tar.gz OpenCAPIDemokit.pdf Enablement WG Today Today Memcopy and Memory Home Agent Exercisers MCP3 and LPC <snapshot>.tar.gz Enablement WG Today Reference Driver Available LIBOCXL Ubuntu 18.04 GitHub Today u
- 37. SmartDV OpenCAPI VIP Environment contains: • Complete regression suite • Usage examples • Detailed documentation • User’s Guide and Release Notes Benefits • Complete Verification of OpenCAPI Design • Easy to Use • Simplify Result Analysis • Runs in every sim environment 37 SmartDV OpenCAPI Verification IP http://www.smart-dv.com/vip/opencapi.html
- 38. OpenCAPI Topics Key Messages Industry Background Technology Overview Possible Solutions Design Enablement Performance Metrics OpenCAPI Consortium 38
- 39. CAPI and OpenCAPI Performance 39 CAPI 1.0 PCIE Gen3 x8 Measured BW @8Gb/s CAPI 2.0 PCIE Gen4 x8 Measured BW @16Gb/s OpenCAPI 3.0 25 Gb/s x8 Measured BW @25Gb/s 128B DMA Read 3.81 GB/s 12.57 GB/s 22.1 GB/s 128B DMA Write 4.16 GB/s 11.85 GB/s 21.6 GB/s 256B DMA Read N/A 13.94 GB/s 22.1 GB/s 256B DMA Write N/A 14.04 GB/s 22.0 GB/s POWER8 Introduced in 2013 POWER9 Second Generation POWER9 Open Architecture with a Clean Slate Focused on Bandwidth and Latency POWER8 CAPI 1.0 POWER9 CAPI 2.0 and OpenCAPI 3.0 Xilinx KU60/VU3P FPGA
- 40. Latency Test Results OpenCAPI Link P9 OpenCAPI 3.9GHz Core, 2.4GHz Nest Xilinx FPGA VU3P 298ns‡ 2ns Jitter TL, DL, PHY TLx, DLx, PHYx (80ns‖) 378ns† Total Latency PCIe G4 Link P9 PCIe Gen4 Xilinx FPGA VU3P est. <337ns PCIe Stack Xilinx PCIe HIP (218ns¶) est. <555ns§ Total Latency PCIe G3 Link P9 PCIe Gen3 3.9GHz Core, 2.4GHz Nest Altera FPGA Stratix V 337ns 7ns Jitter PCIe Stack Altera PCIe HIP (400ns¶) 737ns§ Total Latency PCIe G3 Link Kaby Lake PCIe Gen3* 3.9GHz Core, 2.4GHz Nest Altera FPGA Stratix V 376ns 31ns Jitter PCIe Stack Altera PCIe HIP (400ns¶) 776ns§ Total Latency * Intel Core i7 7700 Quad-Core 3.6GHz (4.2GHz Turbo Boost) † Derived from round-trip time minus simulated FPGA app time ‡ Derived from round-trip time minus simulated FPGA app time and simulated FPGA TLx/DLx/PHYx time § Derived from measured CPU turnaround time plus vendor provided HIP latency ‖ Derived from simulation ¶ Vendor provided latency statistic RACE TO ZERO LATENCY BECAUSE JITTER MATTERS 40
- 41. OpenCAPI Topics Key Messages Industry Background Technology Overview Possible Solutions Design Enablement Performance Metrics OpenCAPI Consortium 41
- 42. OpenCAPI Consortium Overview Goals 1. Provide a forum to give the industry ability to innovate the next generation bus protocol 2. Drive hardware/software innovation to enable choice and efficiency in data center architectures 3. Build an ecosystem with the flexibility to build servers and data centers best suited for their computational demands Mission Create an open coherent high performance bus interface based on a new bus standard called Open Coherent Accelerator Processor Interface (OpenCAPI) and grow the ecosystem that utilizes this interface. Incorporated September 13, 2016 Announced October 14, 2016 42
- 43. OpenCAPI Consortium • Open forum founded by AMD, Google, IBM, Mellanox, and Micron • Manage the OpenCAPI specification, establish enablement, grow the ecosystem • Currently about 40 members • Why its own consortium? Architecture agnostic thus capable of going beyond Power Architecture • Consortium now established • Established Board of Directors (AMD, Google, IBM, Mellanox Technologies, Micron, NVIDIA, Western Digital, Xilinx) • Governing Documents (Bylaws, IPR Policy, Membership) with established Membership Levels • Technical Steering Committee and Marketing/Communications Committee • Website www.opencapi.org • OpenCAPI 3.0 and 3.1 Specifications available as contributed to consortium as starting point for the Work Groups • OpenCAPI 4.0 now added to the web site ! • AFU Coherent Data Caching of System Memory • AFU Address Translation Caching (allows posted operations to system memory) Incorporated September 13, 2016 Announced October 14, 2016 43
- 44. OpenCAPI Workgroup Status 39 Item OpenCAPI Technical Steering Committee Marketing & Communications Committee PHY Signaling Workgroup PHY Mechanical Workgroup TL Architecture Specification Workgroup DL Architecture Specification Workgroup Enablement Workgroup Compliance Workgroup Accelerator/Memory Workgroup
- 45. OpenCAPI Workgroup Status 45 Item Availability OpenCAPI Technical Steering Committee Up and running Marketing & Communications Committee Up and running PHY Signaling Workgroup Up and running PHY Mechanical Workgroup Up and running TL Architecture Specification Workgroup Up and running DL Architecture Specification Workgroup Up and running Enablement Workgroup Up and running Compliance Workgroup Up and running Accelerator/Memory Workgroup Forthcoming
- 46. OpenCAPI Workgroup Status 46 Item Availability Specs Available for Review OpenCAPI Technical Steering Committee Up and running WG Process Spec Marketing & Communications Committee Up and running Regular News Letters PHY Signaling Workgroup Up and running Today PHY Mechanical Workgroup Up and running May 2019 TL Architecture Specification Workgroup Up and running Today DL Architecture Specification Workgroup Up and running April 2019 Enablement Workgroup Up and running Today Compliance Workgroup Up and running Ongoing Accelerator/Memory Workgroup Forthcoming --
- 47. Cross Industry Collaboration and Innovation 47 OpenCAPI Protocol Welcoming new members in all areas of the ecosystem Systems and Software SW Research & Academic Products and Services Deployment SOC Accelerator Solutions
- 48. Membership Entitlement Details Strategic level - $25K • Draft and Final Specifications and enablement • License for Product development • Workgroup participation and voting • TSC participation • Vote on new Board Members • Nominate and/or run for officer election • Prominent listing in appropriate materials Observing level - $5K • Final Specifications and enablement • License for Product development Contributor level - $15K • Draft and Final Specifications and enablement • License for Product development • Workgroup participation and voting • TSC participation • Submit proposals Academic and Non-Profit level - Free • Final Specifications and enablement • Workgroup participation and voting 48
- 49. OpenCAPI Consortium Next Steps JOIN TODAY! www.opencapi.org 49