![PIC16(L)F1934/6/7
DS41364E-page 28 2008-2011 Microchip Technology Inc.
3.1.1.2 Indirect Read with FSR
The program memory can be accessed as data by set-
ting bit 7 of the FSRxH register and reading the match-
ing INDFx register. The MOVIW instruction will place the
lower 8 bits of the addressed word in the W register.
Writes to the program memory cannot be performed via
the INDF registers. Instructions that access the pro-
gram memory via the FSR require one extra instruction
cycle to complete. Example 3-2 demonstrates access-
ing the program memory via an FSR.
The HIGH directive will set bit<7> if a label points to a
location in program memory.
EXAMPLE 3-2: ACCESSING PROGRAM
MEMORY VIA FSR
3.2 Data Memory Organization
The data memory is partitioned in 32 memory banks
with 128 bytes in a bank. Each bank consists of
(Figure 3-3):
• 12 core registers
• 20 Special Function Registers (SFR)
• Up to 80 bytes of General Purpose RAM (GPR)
• 16 bytes of common RAM
The active bank is selected by writing the bank number
into the Bank Select Register (BSR). Unimplemented
memory will read as ‘0’. All data memory can be
accessed either directly (via instructions that use the
file registers) or indirectly via the two File Select
Registers (FSR). See Section 3.5 “Indirect
Addressing” for more information.
3.2.1 CORE REGISTERS
The core registers contain the registers that directly
affect the basic operation of the PIC16(L)F1934/6/7.
These registers are listed below:
• INDF0
• INDF1
• PCL
• STATUS
• FSR0 Low
• FSR0 High
• FSR1 Low
• FSR1 High
• BSR
• WREG
• PCLATH
• INTCON
constants
RETLW DATA0 ;Index0 data
RETLW DATA1 ;Index1 data
RETLW DATA2
RETLW DATA3
my_function
;… LOTS OF CODE…
MOVLW LOW constants
MOVWF FSR1L
MOVLW HIGH constants
MOVWF FSR1H
MOVIW 0[FSR1]
;THE PROGRAM MEMORY IS IN W
Note: The core registers are the first 12
addresses of every data memory bank.](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-28-320.jpg)
![ 2008-2011 Microchip Technology Inc. DS41364E-page 167
PIC16(L)F1934/6/7
15.3 A/D Acquisition Requirements
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 15-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge
the capacitor CHOLD. The sampling switch (RSS)
impedance varies over the device voltage (VDD), refer
to Figure 15-4. The maximum recommended
impedance for analog sources is 10 k. As the
source impedance is decreased, the acquisition time
may be decreased. After the analog input channel is
selected (or changed), an A/D acquisition must be
done before the conversion can be started. To calculate
the minimum acquisition time, Equation 15-1 may be
used. This equation assumes that 1/2 LSb error is used
(1,024 steps for the ADC). The 1/2 LSb error is the
maximum error allowed for the ADC to meet its
specified resolution.
EQUATION 15-1: ACQUISITION TIME EXAMPLE
TACQ Amplifier Settling Time Hold Capacitor Charging Time Temperature Coefficient
+ +
=
TAMP TC TCOFF
+ +
=
2µs TC Temperature - 25°C
0.05µs/°C
+ +
=
TC CHOLD RIC RSS RS
+ +
ln(1/511)
–
=
10pF 1k 7k 10k
+ +
– ln(0.001957)
=
1.12
= µs
VAPPLIED 1 e
Tc
–
RC
--------
-
–
VAPPLIED 1
1
2
n 1
+
1
–
--------------------------
–
=
VAPPLIED 1
1
2
n 1
+
1
–
--------------------------
–
VCHOLD
=
VAPPLIED 1 e
TC
–
RC
---------
-
–
VCHOLD
=
;[1] VCHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
The value for TC can be approximated with the following equations:
Solving for TC:
Therefore:
Temperature 50°C and external impedance of 10k 5.0V VDD
=
Assumptions:
Note: Where n = number of bits of the ADC.
TACQ 2µs 1.12µs 50°C- 25°C
0.05µs/°C
+ +
=
4.42µs
=
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-167-320.jpg)
![ 2008-2011 Microchip Technology Inc. DS41364E-page 173
PIC16(L)F1934/6/7
17.0 DIGITAL-TO-ANALOG
CONVERTER (DAC) MODULE
The Digital-to-Analog Converter supplies a variable
voltage reference, ratiometric with the input source,
with 32 selectable output levels.
The input of the DAC can be connected to:
• External VREF pins
• VDD supply voltage
• FVR (Fixed Voltage Reference)
The output of the DAC can be configured to supply a
reference voltage to the following:
• Comparator positive input
• ADC input channel
• DACOUT pin
• Capacitive Sensing module (CSM)
The Digital-to-Analog Converter (DAC) can be enabled
by setting the DACEN bit of the DACCON0 register.
17.1 Output Voltage Selection
The DAC has 32 voltage level ranges. The 32 levels
are set with the DACR<4:0> bits of the DACCON1
register.
The DAC output voltage is determined by the following
equations:
EQUATION 17-1: DAC OUTPUT VOLTAGE
17.2 Ratiometric Output Level
The DAC output value is derived using a resistor ladder
with each end of the ladder tied to a positive and
negative voltage reference input source. If the voltage
of either input source fluctuates, a similar fluctuation will
result in the DAC output value.
The value of the individual resistors within the ladder
can be found in the applicable Electrical Specifications
chapter.
17.3 DAC Voltage Reference Output
The DAC can be output to the DACOUT pin by setting
the DACOE bit of the DACCON0 register to ‘1’.
Selecting the DAC reference voltage for output on the
DACOUT pin automatically overrides the digital output
buffer and digital input threshold detector functions of
that pin. Reading the DACOUT pin when it has been
configured for DAC reference voltage output will
always return a ‘0’.
Due to the limited current drive capability, a buffer must
be used on the DAC voltage reference output for
external connections to DACOUT. Figure 17-2 shows
an example buffering technique.
IF DACEN = 1
IF DACEN = 0 & DACLPS = 1 & DACR[4:0] = 11111
VOUT VSOURCE +
=
IF DACEN = 0 & DACLPS = 0 & DACR[4:0] = 00000
VOUT VSOURCE –
=
VSOURCE+ = VDD, VREF, or FVR BUFFER 2
VSOURCE- = VSS
VOUT VSOURCE+ VSOURCE-
–
DACR 4:0
2
5
-----------------------------
VSOURCE-
+
=](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-173-320.jpg)
![PIC16(L)F1934/6/7
DS41364E-page 228 2008-2011 Microchip Technology Inc.
23.4.3 ENHANCED PWM
AUTO-SHUTDOWN MODE
The PWM mode supports an Auto-Shutdown mode that
will disable the PWM outputs when an external
shutdown event occurs. Auto-Shutdown mode places
the PWM output pins into a predetermined state. This
mode is used to help prevent the PWM from damaging
the application.
The auto-shutdown sources are selected using the
CCPxAS<2:0> bits of the CCPxAS register. A shutdown
event may be generated by:
• A logic ‘0’ on the INT pin
• A logic ‘1’ on a Comparator (Cx) output
A shutdown condition is indicated by the CCPxASE
(Auto-Shutdown Event Status) bit of the CCPxAS
register. If the bit is a ‘0’, the PWM pins are operating
normally. If the bit is a ‘1’, the PWM outputs are in the
shutdown state.
When a shutdown event occurs, two things happen:
The CCPxASE bit is set to ‘1’. The CCPxASE will
remain set until cleared in firmware or an auto-restart
occurs (see Section 23.4.4 “Auto-Restart Mode”).
The enabled PWM pins are asynchronously placed in
their shutdown states. The PWM output pins are
grouped into pairs [PxA/PxC] and [PxB/PxD]. The state
of each pin pair is determined by the PSSxAC and
PSSxBD bits of the CCPxAS register. Each pin pair may
be placed into one of three states:
• Drive logic ‘1’
• Drive logic ‘0’
• Tri-state (high-impedance)
FIGURE 23-14: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PXRSEN = 0)
Note 1: The auto-shutdown condition is a
level-based signal, not an edge-based
signal. As long as the level is present, the
auto-shutdown will persist.
2: Writing to the CCPxASE bit is disabled
while an auto-shutdown condition
persists.
3: Once the auto-shutdown condition has
been removed and the PWM restarted
(either through firmware or auto-restart)
the PWM signal will always restart at the
beginning of the next PWM period.
4: Prior to an auto-shutdown event caused
by a comparator output or INT pin event,
a software shutdown can be triggered in
firmware by setting the CCPxASE bit of
the CCPxAS register to ‘1’. The
Auto-Restart feature tracks the active sta-
tus of a shutdown caused by a compara-
tor output or INT pin event only. If it is
enabled at this time, it will immediately
clear this bit and restart the ECCP mod-
ule at the beginning of the next PWM
period.
Shutdown
PWM
CCPxASE bit
Activity
Event
Shutdown
Event Occurs
Shutdown
Event Clears
PWM
Resumes
PWM Period
Start of
PWM Period
CCPxASE
Cleared by
Firmware
Timer
Overflow
Timer
Overflow
Timer
Overflow
Timer
Overflow
Missing Pulse
(Auto-Shutdown)
Missing Pulse
(CCPxASE not clear)
Timer
Overflow](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-228-320.jpg)
![PIC16(L)F1934/6/7
DS41364E-page 240 2008-2011 Microchip Technology Inc.
The I2
C interface supports the following modes and
features:
• Master mode
• Slave mode
• Byte NACKing (Slave mode)
• Limited Multi-master support
• 7-bit and 10-bit addressing
• Start and Stop interrupts
• Interrupt masking
• Clock stretching
• Bus collision detection
• General call address matching
• Address masking
• Address Hold and Data Hold modes
• Selectable SDA hold times
Figure 24-2 is a block diagram of the I2
C interface mod-
ule in Master mode. Figure 24-3 is a diagram of the I2
C
interface module in Slave mode.
FIGURE 24-2: MSSP BLOCK DIAGRAM (I2C™ MASTER MODE)
Read Write
SSPSR
Start bit, Stop bit,
Start bit detect,
SSPBUF
Internal
data bus
Set/Reset: S, P, SSPSTAT, WCOL, SSPOV
Shift
Clock
MSb LSb
SDA
Acknowledge
Generate (SSPCON2)
Stop bit detect
Write collision detect
Clock arbitration
State counter for
end of XMIT/RCV
SCL
SCL in
Bus Collision
SDA in
Receive
Enable
(RCEN)
Clock
Cntl
Clock
arbitrate/BCOL
detect
(Hold
off
clock
source)
[SSPM 3:0]
Baud Rate
Reset SEN, PEN (SSPCON2)
Generator
(SSPADD)
Address Match detect
Set SSPIF, BCLIF](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-240-320.jpg)
![ 2008-2011 Microchip Technology Inc. DS41364E-page 303
PIC16(L)F1934/6/7
25.3 EUSART Baud Rate Generator
(BRG)
The Baud Rate Generator (BRG) is an 8-bit or 16-bit
timer that is dedicated to the support of both the
asynchronous and synchronous EUSART operation.
By default, the BRG operates in 8-bit mode. Setting the
BRG16 bit of the BAUDCON register selects 16-bit
mode.
The SPBRGH, SPBRGL register pair determines the
period of the free running baud rate timer. In
Asynchronous mode the multiplier of the baud rate
period is determined by both the BRGH bit of the TXSTA
register and the BRG16 bit of the BAUDCON register. In
Synchronous mode, the BRGH bit is ignored.
Table 25-3 contains the formulas for determining the
baud rate. Example 25-1 provides a sample calculation
for determining the baud rate and baud rate error.
Typical baud rates and error values for various
asynchronous modes have been computed for your
convenience and are shown in Table 25-3. It may be
advantageous to use the high baud rate (BRGH = 1),
or the 16-bit BRG (BRG16 = 1) to reduce the baud rate
error. The 16-bit BRG mode is used to achieve slow
baud rates for fast oscillator frequencies.
Writing a new value to the SPBRGH, SPBRGL register
pair causes the BRG timer to be reset (or cleared). This
ensures that the BRG does not wait for a timer overflow
before outputting the new baud rate.
If the system clock is changed during an active receive
operation, a receive error or data loss may result. To
avoid this problem, check the status of the RCIDL bit to
make sure that the receive operation is Idle before
changing the system clock.
EXAMPLE 25-1: CALCULATING BAUD
RATE ERROR
For a device with FOSC of 16 MHz, desired baud rate
of 9600, Asynchronous mode, 8-bit BRG:
Solving for SPBRGH:SPBRGL:
X
FOSC
Desired Baud Rate
--------------------------------------------
-
64
--------------------------------------------- 1
–
=
Desired Baud Rate
FOSC
64 [SPBRGH:SPBRG] 1
+
--------------------------------------------------------------------
-
=
16000000
9600
-----------------------
-
64
-----------------------
- 1
–
=
25.042
25
= =
Calculated Baud Rate
16000000
64 25 1
+
--------------------------
-
=
9615
=
Error
Calc. Baud Rate Desired Baud Rate
–
Desired Baud Rate
-------------------------------------------------------------------------------------------
-
=
9615 9600
–
9600
---------------------------------- 0.16%
= =](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-303-320.jpg)
![PIC16(L)F1934/6/7
DS41364E-page 304 2008-2011 Microchip Technology Inc.
TABLE 25-3: BAUD RATE FORMULAS
TABLE 25-4: SUMMARY OF REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR
Configuration Bits
BRG/EUSART Mode Baud Rate Formula
SYNC BRG16 BRGH
0 0 0 8-bit/Asynchronous FOSC/[64 (n+1)]
0 0 1 8-bit/Asynchronous
FOSC/[16 (n+1)]
0 1 0 16-bit/Asynchronous
0 1 1 16-bit/Asynchronous
FOSC/[4 (n+1)]
1 0 x 8-bit/Synchronous
1 1 x 16-bit/Synchronous
Legend: x = Don’t care, n = value of SPBRGH, SPBRGL register pair
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 302
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 301
SPBRGL BRG<7:0> 303*
SPBRGH BRG<15:8> 303*
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 300
Legend: — = unimplemented read as ‘0’. Shaded cells are not used for the Baud Rate Generator.
* Page provides register information.](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-304-320.jpg)
![PIC16(L)F1934/6/7
DS41364E-page 368 2008-2011 Microchip Technology Inc.
TABLE 29-3: PIC16(L)F1938/9 ENHANCED INSTRUCTION SET (CONTINUED)
Mnemonic,
Operands
Description Cycles
14-Bit Opcode Status
Affected
Notes
MSb LSb
CONTROL OPERATIONS
BRA
BRW
CALL
CALLW
GOTO
RETFIE
RETLW
RETURN
k
–
k
–
k
k
k
–
Relative Branch
Relative Branch with W
Call Subroutine
Call Subroutine with W
Go to address
Return from interrupt
Return with literal in W
Return from Subroutine
2
2
2
2
2
2
2
2
11
00
10
00
10
00
11
00
001k
0000
0kkk
0000
1kkk
0000
0100
0000
kkkk
0000
kkkk
0000
kkkk
0000
kkkk
0000
kkkk
1011
kkkk
1010
kkkk
1001
kkkk
1000
INHERENT OPERATIONS
CLRWDT
NOP
OPTION
RESET
SLEEP
TRIS
–
–
–
–
–
f
Clear Watchdog Timer
No Operation
Load OPTION_REG register with W
Software device Reset
Go into Standby mode
Load TRIS register with W
1
1
1
1
1
1
00
00
00
00
00
00
0000
0000
0000
0000
0000
0000
0110
0000
0110
0000
0110
0110
0100
0000
0010
0001
0011
0fff
TO, PD
TO, PD
C-COMPILER OPTIMIZED
ADDFSR
MOVIW
MOVWI
n, k
n mm
k[n]
n mm
k[n]
Add Literal k to FSRn
Move Indirect FSRn to W with pre/post inc/dec
modifier, mm
Move INDFn to W, Indexed Indirect.
Move W to Indirect FSRn with pre/post inc/dec
modifier, mm
Move W to INDFn, Indexed Indirect.
1
1
1
1
1
11
00
11
00
11
0001
0000
1111
0000
1111
0nkk
0001
0nkk
0001
1nkk
kkkk
0nmm
kkkk
1nmm
kkkk
Z
Z
2, 3
2
2, 3
2
Note 1:If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require
one additional instruction cycle.
3: See Table in the MOVIW and MOVWI instruction descriptions.](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-368-320.jpg)
![ 2008-2011 Microchip Technology Inc. DS41364E-page 369
PIC16(L)F1934/6/7
29.2 Instruction Descriptions
ADDFSR Add Literal to FSRn
Syntax: [ label ] ADDFSR FSRn, k
Operands: -32 k 31
n [ 0, 1]
Operation: FSR(n) + k FSR(n)
Status Affected: None
Description: The signed 6-bit literal ‘k’ is added to
the contents of the FSRnH:FSRnL
register pair.
FSRn is limited to the range 0000h -
FFFFh. Moving beyond these bounds
will cause the FSR to wrap around.
ADDLW Add literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register are
added to the eight-bit literal ‘k’ and the
result is placed in the W register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Description: Add the contents of the W register
with register ‘f’. If ‘d’ is ‘0’, the result is
stored in the W register. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
ADDWFC ADD W and CARRY bit to f
Syntax: [ label ] ADDWFC f {,d}
Operands: 0 f 127
d [0,1]
Operation: (W) + (f) + (C) dest
Status Affected: C, DC, Z
Description: Add W, the Carry flag and data mem-
ory location ‘f’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed in data memory location ‘f’.
ANDLW AND literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W register are
AND’ed with the eight-bit literal ‘k’.
The result is placed in the W register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) .AND. (f) (destination)
Status Affected: Z
Description: AND the W register with register ‘f’. If
‘d’ is ‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
ASRF Arithmetic Right Shift
Syntax: [ label ] ASRF f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f<7>) dest<7>
(f<7:1>) dest<6:0>,
(f<0>) C,
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the right through the Carry
flag. The MSb remains unchanged. If
‘d’ is ‘0’, the result is placed in W. If ‘d’
is ‘1’, the result is stored back in reg-
ister ‘f’.
register f C](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-369-320.jpg)
![PIC16(L)F1934/6/7
DS41364E-page 370 2008-2011 Microchip Technology Inc.
BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is cleared.
BRA Relative Branch
Syntax: [ label ] BRA label
[ label ] BRA $+k
Operands: -256 label - PC + 1 255
-256 k 255
Operation: (PC) + 1 + k PC
Status Affected: None
Description: Add the signed 9-bit literal ‘k’ to the
PC. Since the PC will have incre-
mented to fetch the next instruction,
the new address will be PC + 1 + k.
This instruction is a two-cycle instruc-
tion. This branch has a limited range.
BRW Relative Branch with W
Syntax: [ label ] BRW
Operands: None
Operation: (PC) + (W) PC
Status Affected: None
Description: Add the contents of W (unsigned) to
the PC. Since the PC will have incre-
mented to fetch the next instruction,
the new address will be PC + 1 + (W).
This instruction is a two-cycle instruc-
tion.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is set.
BTFSC Bit Test f, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’, in register ‘f’, is ‘0’, the next
instruction is discarded, and a NOP is
executed instead, making this a
2-cycle instruction.
BTFSS Bit Test f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is executed.
If bit ‘b’ is ‘1’, then the next
instruction is discarded and a NOP is
executed instead, making this a
2-cycle instruction.](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-370-320.jpg)
![ 2008-2011 Microchip Technology Inc. DS41364E-page 371
PIC16(L)F1934/6/7
CALL Call Subroutine
Syntax: [ label ] CALL k
Operands: 0 k 2047
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<6:3>) PC<14:11>
Status Affected: None
Description: Call Subroutine. First, return address
(PC + 1) is pushed onto the stack.
The eleven-bit immediate address is
loaded into PC bits <10:0>. The upper
bits of the PC are loaded from
PCLATH. CALL is a two-cycle instruc-
tion.
CALLW Subroutine Call With W
Syntax: [ label ] CALLW
Operands: None
Operation: (PC) +1 TOS,
(W) PC<7:0>,
(PCLATH<6:0>) PC<14:8>
Status Affected: None
Description: Subroutine call with W. First, the
return address (PC + 1) is pushed
onto the return stack. Then, the con-
tents of W is loaded into PC<7:0>,
and the contents of PCLATH into
PC<14:8>. CALLW is a two-cycle
instruction.
CLRF Clear f
Syntax: [ label ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Description: The contents of register ‘f’ are cleared
and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Description: W register is cleared. Zero bit (Z) is
set.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Affected: TO, PD
Description: CLRWDT instruction resets the Watch-
dog Timer. It also resets the prescaler
of the WDT.
Status bits TO and PD are set.
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Description: The contents of register ‘f’ are com-
plemented. If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
Status Affected: Z
Description: Decrement register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f’.](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-371-320.jpg)
![PIC16(L)F1934/6/7
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DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are decre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
If the result is ‘1’, the next instruction is
executed. If the result is ‘0’, then a
NOP is executed instead, making it a
2-cycle instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<6:3> PC<14:11>
Status Affected: None
Description: GOTO is an unconditional branch. The
eleven-bit immediate value is loaded
into PC bits <10:0>. The upper bits of
PC are loaded from PCLATH<4:3>.
GOTO is a two-cycle instruction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Description: The contents of register ‘f’ are incre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are incre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
If the result is ‘1’, the next instruction is
executed. If the result is ‘0’, a NOP is
executed instead, making it a 2-cycle
instruction.
IORLW Inclusive OR literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Affected: Z
Description: The contents of the W register are
OR’ed with the eight-bit literal ‘k’. The
result is placed in the W register.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
Status Affected: Z
Description: Inclusive OR the W register with regis-
ter ‘f’. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-372-320.jpg)
![ 2008-2011 Microchip Technology Inc. DS41364E-page 373
PIC16(L)F1934/6/7
LSLF Logical Left Shift
Syntax: [ label ] LSLF f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f<7>) C
(f<6:0>) dest<7:1>
0 dest<0>
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the left through the Carry flag.
A ‘0’ is shifted into the LSb. If ‘d’ is ‘0’,
the result is placed in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
LSRF Logical Right Shift
Syntax: [ label ] LSLF f {,d}
Operands: 0 f 127
d [0,1]
Operation: 0 dest<7>
(f<7:1>) dest<6:0>,
(f<0>) C,
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the right through the Carry
flag. A ‘0’ is shifted into the MSb. If ‘d’ is
‘0’, the result is placed in W. If ‘d’ is ‘1’,
the result is stored back in register ‘f’.
register f 0
C
register f C
0
MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (dest)
Status Affected: Z
Description: The contents of register f is moved to
a destination dependent upon the
status of d. If d = 0,
destination is W register. If d = 1, the
destination is file register f itself. d = 1
is useful to test a file register since
status flag Z is affected.
Words: 1
Cycles: 1
Example: MOVF FSR, 0
After Instruction
W = value in FSR register
Z = 1](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-373-320.jpg)
![PIC16(L)F1934/6/7
DS41364E-page 374 2008-2011 Microchip Technology Inc.
MOVIW Move INDFn to W
Syntax: [ label ] MOVIW ++FSRn
[ label ] MOVIW --FSRn
[ label ] MOVIW FSRn++
[ label ] MOVIW FSRn--
[ label ] MOVIW k[FSRn]
Operands: n [0,1]
mm [00,01, 10, 11]
-32 k 31
Operation: INDFn W
Effective address is determined by
• FSR + 1 (preincrement)
• FSR - 1 (predecrement)
• FSR + k (relative offset)
After the Move, the FSR value will be
either:
• FSR + 1 (all increments)
• FSR - 1 (all decrements)
• Unchanged
Status Affected: Z
Mode Syntax mm
Preincrement ++FSRn 00
Predecrement --FSRn 01
Postincrement FSRn++ 10
Postdecrement FSRn-- 11
Description: This instruction is used to move data
between W and one of the indirect
registers (INDFn). Before/after this
move, the pointer (FSRn) is updated by
pre/post incrementing/decrementing it.
Note: The INDFn registers are not
physical registers. Any instruction that
accesses an INDFn register actually
accesses the register at the address
specified by the FSRn.
FSRn is limited to the range 0000h -
FFFFh. Incrementing/decrementing it
beyond these bounds will cause it to wrap
around.
MOVLB Move literal to BSR
Syntax: [ label ] MOVLB k
Operands: 0 k 15
Operation: k BSR
Status Affected: None
Description: The five-bit literal ‘k’ is loaded into the
Bank Select Register (BSR).
MOVLP Move literal to PCLATH
Syntax: [ label ] MOVLP k
Operands: 0 k 127
Operation: k PCLATH
Status Affected: None
Description: The seven-bit literal ‘k’ is loaded into the
PCLATH register.
MOVLW Move literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Description: The eight-bit literal ‘k’ is loaded into W
register. The “don’t cares” will assem-
ble as ‘0’s.
Words: 1
Cycles: 1
Example: MOVLW 0x5A
After Instruction
W = 0x5A
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Affected: None
Description: Move data from W register to register
‘f’.
Words: 1
Cycles: 1
Example: MOVWF OPTION_REG
Before Instruction
OPTION_REG = 0xFF
W = 0x4F
After Instruction
OPTION_REG = 0x4F
W = 0x4F](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-374-320.jpg)
![ 2008-2011 Microchip Technology Inc. DS41364E-page 375
PIC16(L)F1934/6/7
MOVWI Move W to INDFn
Syntax: [ label ] MOVWI ++FSRn
[ label ] MOVWI --FSRn
[ label ] MOVWI FSRn++
[ label ] MOVWI FSRn--
[ label ] MOVWI k[FSRn]
Operands: n [0,1]
mm [00,01, 10, 11]
-32 k 31
Operation: W INDFn
Effective address is determined by
• FSR + 1 (preincrement)
• FSR - 1 (predecrement)
• FSR + k (relative offset)
After the Move, the FSR value will be
either:
• FSR + 1 (all increments)
• FSR - 1 (all decrements)
Unchanged
Status Affected: None
Mode Syntax mm
Preincrement ++FSRn 00
Predecrement --FSRn 01
Postincrement FSRn++ 10
Postdecrement FSRn-- 11
Description: This instruction is used to move data
between W and one of the indirect
registers (INDFn). Before/after this
move, the pointer (FSRn) is updated by
pre/post incrementing/decrementing it.
Note: The INDFn registers are not
physical registers. Any instruction that
accesses an INDFn register actually
accesses the register at the address
specified by the FSRn.
FSRn is limited to the range 0000h -
FFFFh. Incrementing/decrementing it
beyond these bounds will cause it to wrap
around.
The increment/decrement operation on
FSRn WILL NOT affect any Status bits.
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
Status Affected: None
Description: No operation.
Words: 1
Cycles: 1
Example: NOP
OPTION
Load OPTION_REG Register
with W
Syntax: [ label ] OPTION
Operands: None
Operation: (W) OPTION_REG
Status Affected: None
Description: Move data from W register to
OPTION_REG register.
Words: 1
Cycles: 1
Example: OPTION
Before Instruction
OPTION_REG = 0xFF
W = 0x4F
After Instruction
OPTION_REG = 0x4F
W = 0x4F
RESET Software Reset
Syntax: [ label ] RESET
Operands: None
Operation: Execute a device Reset. Resets the
nRI flag of the PCON register.
Status Affected: None
Description: This instruction provides a way to
execute a hardware Reset by soft-
ware.](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-375-320.jpg)
![PIC16(L)F1934/6/7
DS41364E-page 376 2008-2011 Microchip Technology Inc.
RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
Description: Return from Interrupt. Stack is POPed
and Top-of-Stack (TOS) is loaded in
the PC. Interrupts are enabled by
setting Global
Interrupt Enable bit, GIE
(INTCON<7>). This is a two-cycle
instruction.
Words: 1
Cycles: 2
Example: RETFIE
After Interrupt
PC = TOS
GIE = 1
RETLW Return with literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Affected: None
Description: The W register is loaded with the eight
bit literal ‘k’. The program counter is
loaded from the top of the stack (the
return address). This is a two-cycle
instruction.
Words: 1
Cycles: 2
Example:
TABLE
CALL TABLE;W contains table
;offset value
• ;W now has table value
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ; End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
Status Affected: None
Description: Return from subroutine. The stack is
POPed and the top of the stack (TOS)
is loaded into the program counter.
This is a two-cycle instruction.
RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are rotated
one bit to the left through the Carry
flag. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
Words: 1
Cycles: 1
Example: RLF REG1,0
Before Instruction
REG1 = 1110 0110
C = 0
After Instruction
REG1 = 1110 0110
W = 1100 1100
C = 1
Register f
C](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-376-320.jpg)
![ 2008-2011 Microchip Technology Inc. DS41364E-page 377
PIC16(L)F1934/6/7
RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are rotated
one bit to the right through the Carry
flag. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
SLEEP Enter Sleep mode
Syntax: [ label ] SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Affected: TO, PD
Description: The power-down Status bit, PD is
cleared. Time-out Status bit, TO is
set. Watchdog Timer and its pres-
caler are cleared.
The processor is put into Sleep mode
with the oscillator stopped.
Register f
C
SUBLW Subtract W from literal
Syntax: [ label ] SUBLW k
Operands: 0 k 255
Operation: k - (W) W)
Status Affected: C, DC, Z
Description: The W register is subtracted (2’s com-
plement method) from the eight-bit
literal ‘k’. The result is placed in the W
register.
SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) destination)
Status Affected: C, DC, Z
Description: Subtract (2’s complement method) W
register from register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f.
SUBWFB Subtract W from f with Borrow
Syntax: SUBWFB f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f) – (W) – (B) dest
Status Affected: C, DC, Z
Description: Subtract W and the BORROW flag
(CARRY) from register ‘f’ (2’s comple-
ment method). If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
C = 0 W k
C = 1 W k
DC = 0 W<3:0> k<3:0>
DC = 1 W<3:0> k<3:0>
C = 0 W f
C = 1 W f
DC = 0 W<3:0> f<3:0>
DC = 1 W<3:0> f<3:0>](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-377-320.jpg)
![PIC16(L)F1934/6/7
DS41364E-page 378 2008-2011 Microchip Technology Inc.
SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of regis-
ter ‘f’ are exchanged. If ‘d’ is ‘0’, the
result is placed in the W register. If ‘d’
is ‘1’, the result is placed in register ‘f’.
TRIS Load TRIS Register with W
Syntax: [ label ] TRIS f
Operands: 5 f 7
Operation: (W) TRIS register ‘f’
Status Affected: None
Description: Move data from W register to TRIS
register.
When ‘f’ = 5, TRISA is loaded.
When ‘f’ = 6, TRISB is loaded.
When ‘f’ = 7, TRISC is loaded.
XORLW Exclusive OR literal with W
Syntax: [ label ] XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k W)
Status Affected: Z
Description: The contents of the W register are
XOR’ed with the eight-bit
literal ‘k’. The result is placed in the
W register.
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) destination)
Status Affected: Z
Description: Exclusive OR the contents of the W
register with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If ‘d’
is ‘1’, the result is stored back in regis-
ter ‘f’.](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-378-320.jpg)
Tape and Reel
Option
-
Device: PIC16F1934, PIC16LF1934, PIC16F1934, PIC16LF1934
PIC16F1936, PIC16LF1936, PIC16F1936, PIC16LF1936
PIC16F1937, PIC16LF1937, PIC16F1937, PIC16LF1937
Tape and Reel
Option:
Blank = Standard packaging (tube or tray)
T = Tape and Reel(1)
Temperature
Range:
I = -40C to +85C
E = -40C to +125C
Package: ML = Micro Lead Frame (QFN)
MV = Micro Lead Frame (UQFN) 4x4
P = Plastic DIP
PT = TQFP (Thin Quad Flatpack)
SO = SOIC
SP = Skinny Plastic DIP
SS = SSOP
Pattern: 3-Digit Pattern Code for QTP (blank otherwise)](https://image.slidesharecdn.com/pic16f1934-230516203042-3531fb30/85/PIC16F1934-PDF-471-320.jpg)
PIC16F1934.PDF
- 1. 2008-2011 Microchip Technology Inc. DS41364E PIC16(L)F1934/6/7 Data Sheet 28/40/44-Pin Flash-Based, 8-Bit CMOS Microcontrollers with LCD Driver and nanoWatt XLP Technology
- 2. DS41364E-page 2 2008-2011 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2008-2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-61341-013-4 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
- 3. 2008-2011 Microchip Technology Inc. DS41364E-page 3 PIC16(L)F1934/6/7 Devices Included In This Data Sheet: Other PIC16(L)F193X Devices Available: High-Performance RISC CPU: • Only 49 Instructions to Learn: - All single-cycle instructions except branches • Operating Speed: - DC – 32 MHz oscillator/clock input - DC – 125 ns instruction cycle • Up to 16K x 14 Words of Flash Program Memory • Up to 1024 Bytes of Data Memory (RAM) • Interrupt Capability with Automatic Context Saving • 16-Level Deep Hardware Stack • Direct, Indirect and Relative Addressing modes • Processor Read Access to Program Memory • Pinout Compatible to other 28/40/44-pin PIC16CXXX and PIC16FXXX Microcontrollers Special Microcontroller Features: • Precision Internal Oscillator: - Factory calibrated to ±1%, typical - Software selectable frequency range from 32 MHz to 31 kHz • Power-Saving Sleep mode • Power-on Reset (POR) • Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) • Brown-out Reset (BOR) - Selectable between two trip points - Disable in Sleep option • Multiplexed Master Clear with Pull-up/Input Pin • Programmable Code Protection • High Endurance Flash/EEPROM cell: - 100,000 write Flash endurance - 1,000,000 write EEPROM endurance - Flash/Data EEPROM retention: > 40 years • Wide Operating Voltage Range: - 1.8V-5.5V (PIC16F193X) - 1.8V-3.6V (PIC16LF193X) PIC16LF193X Low-Power Features: • Standby Current: - 60 nA @ 1.8V, typical • Operating Current: - 7.0 A @ 32 kHz, 1.8V, typical (PIC16LF193X) - 150 A @ 1 MHz, 1.8V, typical (PIC16LF193X) • Timer1 Oscillator Current: - 600 nA @ 32 kHz, 1.8V, typical • Low-Power Watchdog Timer Current: - 500 nA @ 1.8V, typical (PIC16LF193X) Peripheral Features: • Up to 35 I/O Pins and 1 Input-only Pin: - High-current source/sink for direct LED drive - Individually programmable interrupt-on-pin change pins - Individually programmable weak pull-ups • Integrated LCD Controller: - Up to 96 segments - Variable clock input - Contrast control - Internal voltage reference selections • Capacitive Sensing module (mTouchTM ) - Up to 16 selectable channels • A/D Converter: - 10-bit resolution and up to 14 channels - Selectable 1.024/2.048/4.096V voltage reference • Timer0: 8-Bit Timer/Counter with 8-Bit Programmable Prescaler • Enhanced Timer1 - Dedicated low-power 32 kHz oscillator driver - 16-bit timer/counter with prescaler - External Gate Input mode with toggle and single shot modes - Interrupt-on-gate completion • Timer2, 4, 6: 8-Bit Timer/Counter with 8-Bit Period Register, Prescaler and Postscaler • Two Capture, Compare, PWM modules (CCP) - 16-bit Capture, max. resolution 125 ns - 16-bit Compare, max. resolution 125 ns - 10-bit PWM, max. frequency 31.25 kHz • Three Enhanced Capture, Compare, PWM modules (ECCP) - 3 PWM time-base options - Auto-shutdown and auto-restart - PWM steering - Programmable dead-band delay • PIC16F1934 • PIC16LF1934 • PIC16F1936 • PIC16LF1936 • PIC16F1937 • PIC16LF1937 • PIC16(L)F1933 (DS41575) • PIC16(L)F1938/9 (DS41574) Note: PIC16(L)F193X devices referred to in this data sheet apply to PIC16(L)F1934/6/7. 28/40/44-Pin Flash-Based, 8-Bit CMOS Microcontrollers with LCD Driver with nanoWatt XLP Technology
- 4. PIC16(L)F1934/6/7 DS41364E-page 4 2008-2011 Microchip Technology Inc. Peripheral Features (Continued): • Master Synchronous Serial Port (MSSP) with SPI and I2 CTM with: - 7-bit address masking - SMBus/PMBusTM compatibility - Auto-wake-up on start • Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) - RS-232, RS-485 and LIN compatible - Auto-Baud Detect • SR Latch (555 Timer): - Multiple Set/Reset input options - Emulates 555 Timer applications • 2 Comparators: - Rail-to-rail inputs/outputs - Power mode control - Software enable hysteresis • Voltage Reference module: - Fixed Voltage Reference (FVR) with 1.024V, 2.048V and 4.096V output levels - 5-bit rail-to-rail resistive DAC with positive and negative reference selection PIC16(L)F193X Family Types Device Program Memory Flash (words) Data EEPROM (bytes) SRAM (bytes) I/O’s 10-bit A/D (ch) CapSense (ch) Comparators Timers 8/16-bit EUSART I 2 C™/SPI ECCP CCP LCD PIC16F1934 PIC16LF1934 4096 256 256 36 14 16 2 4/1 Yes Yes 3 2 24/4 PIC16F1936 PIC16LF1936 8192 256 512 25 11 8 2 4/1 Yes Yes 3 2 16(1) /4 PIC16F1937 PIC16LF1937 8192 256 512 36 14 16 2 4/1 Yes Yes 3 2 24/4 Note 1: COM3 and SEG15 share the same physical pin on PIC16(L)F1936, therefore, SEG15 is not available when using 1/4 multiplex displays.
- 5. 2008-2011 Microchip Technology Inc. DS41364E-page 5 PIC16(L)F1934/6/7 Pin Diagram – 28-Pin SPDIP/SOIC/SSOP (PIC16(L)F1936) 28-pin SPDIP, SOIC, SSOP PIC16F1936 PIC16LF1936 1 2 3 4 5 6 7 8 9 10 VPP/MCLR/RE3 SEG12/VCAP (2) /SS(1) /SRNQ(1) /C2OUT(1) /C12IN0-/AN0/RA0 SEG7/C12IN1-/AN1/RA1 COM2/DACOUT/VREF-/C2IN+/AN2/RA2 SEG15/COM3/VREF+/C1IN+/AN3/RA3 SEG4/CCP5/SRQ/T0CKI/CPS6/C1OUT/RA4 SEG5/VCAP(2)/SS(1) /SRNQ(1) /CPS7/C2OUT(1) /AN4/RA5 RB6/ICSPCLK/ICDCLK/SEG14 RB5/AN13/CPS5/P2B(1)/CCP3(1)/P3A(1)/T1G(1)/COM1 RB4/AN11/CPS4/P1D/COM0 RB3/AN9/C12IN2-/CPS3/CCP2(1) /P2A(1) /VLCD3 RB2/AN8/CPS2/P1B/VLCD2 RB1/AN10/C12IN3-/CPS1/P1C/VLCD1 RB0/AN12/CPS0/CCP4/SRI/INT/SEG0 VDD VSS 11 12 13 14 15 16 17 18 19 20 28 27 26 25 24 23 22 21 VSS SEG2/CLKIN/OSC1/RA7 SEG1/VCAP(2)/CLKOUT/OSC2/RA6 P2B(1)/T1CKI/T1OSO/RC0 P2A(1)/CCP2(1)/T1OSI/RC1 SEG3/P1A/CCP1/RC2 SEG6/SCL/SCK/RC3 RC5/SDO/SEG10 RC4/SDI/SDA/T1G(1) /SEG11 RC7/RX/DT/P3B/SEG8 RC6/TX/CK/CCP3(1) /P3A(1) /SEG9 RB7/ICSPDAT/ICDDAT/SEG13 Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1936 devices only.
- 6. PIC16(L)F1934/6/7 DS41364E-page 6 2008-2011 Microchip Technology Inc. Pin Diagram – 28-Pin QFN/UQFN (PIC16(L)F1936) 2 3 6 1 18 19 20 21 15 7 16 17 P2B (1) /T1CKI/T1OSO/RC0 5 4 RB7/ICSPDAT/ICDDAT/SEG13 RB6/ICSPCLK/ICDCLK/SEG14 RB5/AN13/CPS5/P2B (1) /CCP3 (1) /P3A (1) /T1G (1) /COM1 RB4/AN11/CPS4/P1D/COM0 RB3/AN9/C12IN2-/CPS3/CCP2(1)/P2A(1)/VLCD3 RB2/AN8/CPS2/P1B/VLCD2 RB1/AN10/C12IN3-/CPS1/P1C/VLCD1 RB0/AN12/CPS0/CCP4/SRI/INT/SEG0 VDD VSS RC7/RX/DT/P3B/SEG8 SEG9/P3A (1) /CCP3 (1) /CK/TX/RC6 SEG10/SDO/RC5 SEG11/T1G (1) /SDA/SDI/RC4 RE3/MCLR/V PP RA0/AN0/C12IN0-/C2OUT (1) /SRNQ (1) /SS (1) /V CAP (2) /SEG12 RA1/AN1/C12IN1-/SEG7 COM2/DACOUT/VREF-/C2IN+/AN2/RA2 SEG15/COM3/VREF+/C1IN+/AN3/RA3 SEG4/CCP5/SRQ/T0CKI/CPS6/C1OUT/RA4 SEG5(1)/VCAP(2)/SS(1)/SRNQ/CPS7/C2OUT(1)/AN4/RA5 VSS SEG2/CLKIN/OSC1/RA7 SEG1/VCAP (2) /CLKOUT/OSC2/RA6 (1) P2A/ (1) CCP2/T1OSI/RC1 SEG3/P1A/CCP1/RC2 SEG6/SCL/SCK/RC3 9 10 13 8 14 12 11 27 26 23 28 22 24 25 PIC16(L)F1936 PIC16LF1936 28-pin QFN/UQFN Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1936 devices only.
- 7. 2008-2011 Microchip Technology Inc. DS41364E-page 7 PIC16(L)F1934/6/7 TABLE 1: 28-PIN SUMMARY (PIC16(L)F1936) I/O 28-Pin SPDIP 28-Pin QFN/UQFN ANSEL A/D Cap Sense Comparator SR Latch Timers CCP EUSART MSSP LCD Interrupt Pull-up Basic RA0 2 27 Y AN0 — C12IN0-/ C2OUT(1) SRNQ(1) — — — SS(1) SEG12 — — VCAP(2) RA1 3 28 Y AN1 — C12IN1- — — — — — SEG7 — — — RA2 4 1 Y AN2/ VREF- — C2IN+/ DACOUT — — — — — COM2 — — — RA3 5 2 Y AN3/ VREF+ — C1IN+ — — — — — SEG15/ COM3 — — — RA4 6 3 Y — CPS6 C1OUT SRQ T0CKI CCP5 — — SEG4 — — — RA5 7 4 Y AN4 CPS7 C2OUT(1) SRNQ(1) — — — SS(1) SEG5 — — VCAP (2) RA6 10 7 — — — — — — — — — SEG1 — — OSC2/ CLKOUT VCAP(2) RA7 9 6 — — — — — — — — — SEG2 — — OSC1/ CLKIN RB0 21 18 Y AN12 CPS0 — SRI — CCP4 — — SEG0 INT/ IOC Y — RB1 22 19 Y AN10 CPS1 C12IN3- — — P1C — — VLCD1 IOC Y — RB2 23 20 Y AN8 CPS2 — — — P1B — — VLCD2 IOC Y — RB3 24 21 Y AN9 CPS3 C12IN2- — — CCP2(1) / P2A(1) — — VLCD3 IOC Y — RB4 25 22 Y AN11 CPS4 — — — P1D — — COM0 IOC Y — RB5 26 23 Y AN13 CPS5 — — T1G(1) P2B(1) CCP3(1)/ P3A(1) — — COM1 IOC Y — RB6 27 24 — — — — — — — — — SEG14 IOC Y ICSPCLK/ ICDCLK RB7 28 25 — — — — — — — — — SEG13 IOC Y ICSPDAT/ ICDDAT RC0 11 8 — — — — — T1OSO/ T1CKI P2B(1) — — — — — — RC1 12 9 — — — — — T1OSI CCP2(1) / P2A(1) — — — — — — RC2 13 10 — — — — — — CCP1/ P1A — — SEG3 — — — RC3 14 11 — — — — — — — — SCK/SCL SEG6 — — — RC4 15 12 — — — — — T1G(1) — — SDI/SDA SEG11 — — — RC5 16 13 — — — — — — — — SDO SEG10 — — — RC6 17 14 — — — — — — CCP3(1) P3A(1) TX/CK — SEG9 — — — RC7 18 15 — — — — — — P3B RX/DT — SEG8 — — — RE3 1 26 — — — — — — — — — — — Y MCLR/VPP VDD 20 17 — — — — — — — — — — — — VDD Vss 8, 19 5, 16 — — — — — — — — — — — — VSS Note 1: Pin functions can be moved using the APFCON register. 2: PIC16F1936 devices only.
- 8. PIC16(L)F1934/6/7 DS41364E-page 8 2008-2011 Microchip Technology Inc. Pin Diagram – 40-Pin PDIP (PIC16(L)F1934/7) 40-Pin PDIP PIC16F1934/7 PIC16LF1934/7 2 3 4 5 6 7 8 9 10 VPP/MCLR/RE3 SEG12/VCAP(2)/SS(1) /SRNQ(1) /C2OUT(1) /C12IN0-/AN0/RA0 SEG7/C12IN1-/AN1/RA1 COM2/DACOUT/VREF-/C2IN+/AN2/RA2 SEG15/VREF+/C1IN+/AN3/RA3 SEG4/SRQ/T0CKI/CPS6/C1OUT/RA4 SEG5/VCAP(2)/SS(1)/SRNQ(1)/CPS7/C2OUT(1)/AN4/RA5 SEG21/CCP3(1)/P3A(1)/AN5/RE0 SEG22/P3B/AN6/RE1 SEG23/CCP5/AN7/RE2 RB6/ICSPCLK/ICDCLK/SEG14 RB5/AN13/CPS5/CCP3(1)/P3A(1)/T1G(1)/COM1 RB4/AN11/CPS4/COM0 RB3/AN9/C12IN2-/CPS3/CCP2(1)/P2A(1)/VLCD3 RB2/AN8/CPS2/VLCD2 RB1/AN10/C12IN3-/CPS1/VLCD1 RB0/AN12/CPS0/SRI/INT/SEG0 VDD VSS RD2/CPS10/P2B(1) 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 VDD VSS SEG2/CLKIN/OSC1/RA7 SEG1/VCAP(2)/CLKOUT/OSC2/RA6 P2B(1)/T1CKI/T1OSO/RC0 P2A(1) /CCP2(1) /T1OSI/RC1 SEG3/P1A/CCP1/RC2 SEG6/SCK/SCL/RC3 COM3/CPS8/RD0 CCP4/CPS9/RD1 RC5/SDO/SEG10 RC4/SDI/SDA/T1G(1) /SEG11 RD3/CPS11/P2C/SEG16 RD4/CPS12/P2D/SEG17 RC7/RX/DT/SEG8 RC6/TX/CK/SEG9 RD7/CPS15/P1D/SEG20 RD6/CPS14/P1C/SEG19 RD5/CPS13/P1B/SEG18 RB7/ICSPDAT/ICDDAT/SEG13 1 Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1934/7 devices only.
- 9. 2008-2011 Microchip Technology Inc. DS41364E-page 9 PIC16(L)F1934/6/7 Pin Diagram – 40-Pin UQFN 5X5 (PIC16(L)F1934/7) 40-pin UQFN Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1934/7 devices only. 10 2 3 4 5 6 1 17 18 19 20 11 12 13 14 35 8 7 40 39 38 37 36 15 16 27 28 29 30 21 22 23 24 25 26 33 31 32 9 34 PIC16F1934/7 PIC16LF1934/7 SEG15/C1IN+/V REF +/AN3/RA3 COM2/DACOUT/C2IN+/V REF -/AN2/RA2 SEG7/C12IN1-/AN1/RA1 SEG12/SRNQ (1) /C2OUT (1) /C12IN0-/V CAP (2) /SS (1) /AN0/RA0 V PP /MCLR/RE3 SEG13/ICDDAT/ICSPDAT/RB7 SEG14/ICDCLK/ICSPCLK/RB6 COM1/T1G (1) /CCP3 (1) /P3A (1) /CPS5/AN13/RB5 COM0/CPS4/AN11/RB4 VSS VDD SEG0/SRI/INT/CPS0/AN12/RB0 VLCD1/C12IN3-/CPS1/AN10/RB1 VLCD2/CPS2/AN8/RB2 VLCD3/P2A (1) /CCP2 (1) /C12IN2-/CPS3/AN9/RB3 SEG8/DT/RX/RC7 SEG17/P2D/CPS12/RD4 SEG18/P1B/CPS13/RD5 SEG19/P1C/CPS14/RD6 SEG20/P1D/CPS15/RD7 RC6/TX/CK/SEG9 RC5/SDO/SEG10 RC4/SDI/SDA/T1G (1) /SEG11 RD3/CPS11/P2C/SEG16 RD2/CPS10/P2B (1) RD1/CPS9/CCP4 RD0/CPS8/COM3 RC3/SCK/SCL/SEG6 RC2/CCP1/P1A/SEG3 RC1/T1OSI/CCP2 (1) /P2A (1) RC0/T1OSO/T1CKI/P2B RA6/OSC2/CLKOUT/VCAP(2)/SEG1 RA7/OSC1/CLKIN/SEG2 VSS VDD RE2/AN7/CCP5/SEG23 RE1/AN6/P3B/SEG22 RE0/AN5/CCP3(1) /P3A(1) /SEG21 RA4/CPS6/T0CKI/C1OUT/SRQ/SEG4 RA5/AN4/CPS7/SS(1)/VCAP(2)/SRNQ(1)/C2OUT(1)/SEG5
- 10. PIC16(L)F1934/6/7 DS41364E-page 10 2008-2011 Microchip Technology Inc. Pin Diagram – 44-Pin QFN (PIC16(L)F1934/7) 10 11 2 3 4 5 6 1 18 19 20 21 22 12 13 14 15 38 8 7 44 43 42 41 40 39 16 17 29 30 31 32 33 23 24 25 26 27 28 36 34 35 9 37 SEG7/C12IN1-/AN1/RA1 SEG12/V CAP (2) /SS (1) /SRNQ (1) /C2OUT (1) /C12IN0-/AN0/RA0 V PP /MCLR/RE3 VLCD3/P2A (1) /CCP2 (1) /CPS3/C12IN2-/AN9/RB3 SEG13/ICDDAT/ICSPDAT/RB7 SEG14/ICDCLK/ICSPCLK/RB6 COM1/T1G (1) /P3A (1) /CCP3 (1) /CPS5/AN13/RB5 COM0/CPS4/AN11/RB4 NC RC6/TX/CK/SEG9 RC5/SDO/SEG10 RC4/SDI/SDA/T1G (1) /SEG11 RD3/CPS11/P2C/SEG16 RD2/CPS10/P2B (1) RD1/CPS9/CCP4 RD0/CPS8/COM3 RC3/SCL/SCK/SEG6 RC2/CCP1/P1A/SEG3 RC1/T1OSI/CCP2 (1) /P2A (1) RC0/T1OSO/T1CKI/P2B (1) RA6/OSC2/CLKOUT/VCAP(2)/SEG1 RA7/OSC1/CLKIN/SEG2 VSS VSS NC VDD RE2/AN7/CCP5/SEG23 RE1/AN6/P3B/SEG22 RE0/AN5/CCP3(1) /P3A(1) /SEG21 RA5/AN4/C2OUT(1) /CPS7/SRNQ(1) /SS(1) /VCAP (2) /SEG5 RA4/C1OUT/CPS6/T0CKI/SRQ/SEG4 SEG8/DT/RX/RC7 SEG17/P2D/CPS12/RD4 SEG18/P1B/CPS13/RD5 SEG19/P1C/CPS14/RD6 SEG20/P1D/CPS15/RD7 VSS VDD VDD SEG0/INT/SRI/CPS0/AN12/RB0 VLCD1/CPS1/C12IN3-/AN10/RB1 VLCD2/CPS2/AN8/RB2 44-pin QFN PIC16F1934/7 PIC16LF1934/7 SEG15V REF +/C1IN+/AN3/RA3 COM2/DACOUT/V REF -/C2IN+/AN2/RA2 Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1934/7 devices only.
- 11. 2008-2011 Microchip Technology Inc. DS41364E-page 11 PIC16(L)F1934/6/7 Pin Diagram – 44-Pin TQFP (PIC16(L)F1934/7) 44-pin TQFP 10 11 2 3 6 1 18 19 20 21 22 12 13 14 15 38 8 7 44 43 42 41 40 39 16 17 29 30 31 32 33 23 24 25 26 27 28 36 34 35 9 37 SEG15/V REF +/C1IN+/AN3/RA3 COM2/DACOUT/V REF -/C2IN+/AN2/RA2 SEG7/C12IN1-/AN1/RA1 SEG12/V CAP (2) /SS (1) /SRNQ (1) /C2OUT (1) /C12IN0-/AN0/RA0 V PP /MCLR/RE3 NC SEG13/ICDDAT/ICSPDAT/RB7 SEG14/ICDCLK/ICSPCLK/RB6 COM1/T1G (1) /P3A (1) /CCP3 (1) /CPS5/AN13/RB5 COM0/CPS4/AN11/RB4 NC NC NC RC0/T1OSO/T1CKI/P2B(1) VSS VDD SEG0/INT/SRI/CPS0/AN12/RB0 VLCD1/CPS1/C12IN3-/AN10/RB1 VLCD2/CPS2/AN8/RB2 VLCD3/P2A(1)/CCP2(1)/CPS3/C12IN2-/AN9/RB3 5 4 PIC16F1934/7 PIC16LF1934/7 RA6/OSC2/CLKOUT/VCAP(2)/SEG1 RA7/OSC1/CLKIN/SEG2 VSS VDD RE2/AN7/CCP5/SEG23 RE1/AN6/P3B/SEG22 RE0/AN5/CCP3(1)/P3A(1)/SEG21 RA5/AN4/C2OUT(1)/CPS7/SRNQ(1)/SS(1)/VCAP(2)/SEG5 RA4/C1OUT/CPS6/T0CKI/SRQ/SEG4 SEG8/DT/RX/RC7 SEG17/P2D/CPS12/RD4 SEG18/P1B/CPS13/RD5 SEG19/P1C/CPS14/RD6 SEG20/P1D/CPS15/RD7 RC6/TX/CK/SEG9 RC5/SDO/SEG10 RC4/SDI/SDA/T1G (1) /SEG11 RD3/CPS11/P2C/SEG16 RD2/CPS10/P2B (1) RD1/CPS9/CCP4 RD0/CPS8/COM3 RC3/SCL/SCK/SEG6 RC2/CCP1/P1A/SEG3 RC1/T1OSI/CCP2 (1) /P2A (1) Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1934/7 devices only.
- 12. PIC16(L)F1934/6/7 DS41364E-page 12 2008-2011 Microchip Technology Inc. TABLE 2: 40/44-PIN SUMMARY(PIC16(L)F1934/7) I/O 40-Pin PDIP 40-Pin UQFN 44-Pin TQFP 44-Pin QFN ANSEL A/D Cap Sense Comparator SR Latch Timers CCP EUSART MSSP LCD Interrupt Pull-up Basic RA0 2 17 19 19 Y AN0 — C12IN0-/ C2OUT(1) SRNQ(1) — — — SS(1) SEG12 — — VCAP RA1 3 18 20 20 Y AN1 — C12IN1- — — — — — SEG7 — — — RA2 4 19 21 21 Y AN2/ VREF- — C2IN+/ DACOUT — — — — — COM2 — — — RA3 5 20 22 22 Y AN3/ VREF+ — C1IN+ — — — — — SEG15 — — — RA4 6 21 23 23 Y — CPS6 C1OUT SRQ T0CKI — — SEG4 — — — RA5 7 22 24 24 Y AN4 CPS7 C2OUT(1) SRNQ(1) — — — SS(1) SEG5 — — VCAP RA6 14 29 31 33 — — — — — — — — — SEG1 — — OSC2/ CLKOUT VCAP RA7 13 28 30 32 — — — — — — — — — SEG2 — — OSC1/ CLKIN RB0 33 8 8 9 Y AN12 CPS0 — SRI — — — — SEG0 INT/ IOC Y — RB1 34 9 9 10 Y AN10 CPS1 C12IN3- — — — — — VLCD1 IOC Y — RB2 35 10 10 11 Y AN8 CPS2 — — — — — — VLCD2 IOC Y — RB3 36 11 11 12 Y AN9 CPS3 C12IN2- — — CCP2(1) / P2A(1) — — VLCD3 IOC Y — RB4 37 12 14 14 Y AN11 CPS4 — — — — — — COM0 IOC Y — RB5 38 13 15 15 Y AN13 CPS5 — — T1G(1) CCP3(1) / P3A(1) — — COM1 IOC Y — RB6 39 14 16 16 — — — — — — — — — SEG14 IOC Y ICSPCLK/ ICDCLK RB7 40 15 17 17 — — — — — — — — — SEG13 IOC Y ICSPDAT/ ICDDAT RC0 15 30 32 34 — — — — — T1OSO/ T1CKI P2B(1) — — — — — — RC1 16 31 35 35 — — — — — T1OSI CCP2(1) / P2A(1) — — — — — — RC2 17 32 36 36 — — — — — — CCP1/ P1A — — SEG3 — — — RC3 18 33 37 37 — — — — — — — — SCK/SCL SEG6 — — — RC4 23 38 42 42 — — — — — T1G(1) — — SDI/SDA SEG11 — — — RC5 24 39 43 43 — — — — — — — — SDO SEG10 — — — RC6 25 40 44 44 — — — — — — — TX/CK — SEG9 — — — RC7 26 1 1 1 — — — — — — — RX/DT — SEG8 — — — RD0 19 34 38 38 Y — CPS8 — — — — — — COM3 — — — RD1 20 35 39 39 Y — CPS9 — — — CCP4 — — — — — — RD2 21 36 40 40 Y — CPS10 — — — P2B(1) — — — — — — RD3 22 37 41 41 Y — CPS11 — — — P2C — — SEG16 — — — RD4 27 2 2 2 Y — CPS12 — — — P2D — — SEG17 — — — RD5 28 3 3 3 Y — CPS13 — — — P1B — — SEG18 — — — RD6 29 4 4 4 Y — CPS14 — — — P1C — — SEG19 — — — RD7 30 5 5 5 Y — CPS15 — — — P1D — — SEG20 — — — RE0 8 23 25 25 Y AN5 — — — — CCP3(1) P3A(1) — — SEG21 — — — RE1 9 24 26 26 Y AN6 — — — — P3B — — SEG22 — — — RE2 10 25 27 27 Y AN7 — — — — CCP5 — — SEG23 — — — RE3 1 16 18 18 — — — — — — — — — — — Y MCLR/VPP VDD 11, 32 7, 26 7, 28 7,8, 28 — — — — — — — — — — — — VDD Vss 12, 31 6, 27 6, 29 6,30, 31 — — — — — — — — — — — — VSS Note 1: Pin functions can be moved using the APFCON register.
- 13. 2008-2011 Microchip Technology Inc. DS41364E-page 13 PIC16(L)F1934/6/7 Table of Contents 1.0 Device Overview ........................................................................................................................................................................ 15 2.0 Enhanced Mid-Range CPU........................................................................................................................................................ 23 3.0 Memory Organization................................................................................................................................................................. 25 4.0 Device Configuration.................................................................................................................................................................. 61 5.0 Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 67 6.0 Resets ........................................................................................................................................................................................ 85 7.0 Interrupts .................................................................................................................................................................................... 93 8.0 Low Dropout (LDO) Voltage Regulator .................................................................................................................................... 107 9.0 Power-Down Mode (Sleep) ...................................................................................................................................................... 109 10.0 Watchdog Timer (WDT) ........................................................................................................................................................... 111 11.0 Data EEPROM and Flash Program Memory Control............................................................................................................... 115 12.0 I/O Ports ................................................................................................................................................................................... 129 13.0 Interrupt-On-Change ................................................................................................................................................................ 151 14.0 Fixed Voltage Reference.......................................................................................................................................................... 155 15.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 157 16.0 Temperature Indicator Module ................................................................................................................................................. 171 17.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 173 18.0 Comparator Module.................................................................................................................................................................. 177 19.0 SR Latch................................................................................................................................................................................... 187 20.0 Timer0 Module ......................................................................................................................................................................... 191 21.0 Timer1 Module with Gate Control............................................................................................................................................. 197 22.0 Timer2/4/6 Modules.................................................................................................................................................................. 207 23.0 Capture/Compare/PWM Modules (ECCP1, ECCP2, ECCP3, CCP4, CCP5).......................................................................... 211 24.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 239 25.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 291 26.0 Capacitive Sensing Module...................................................................................................................................................... 319 27.0 Liquid Crystal Display (LCD) Driver Module............................................................................................................................. 327 28.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 361 29.0 Instruction Set Summary.......................................................................................................................................................... 365 30.0 Electrical Specifications............................................................................................................................................................ 379 31.0 DC and AC Characteristics Graphs and Charts....................................................................................................................... 411 32.0 Development Support............................................................................................................................................................... 439 33.0 Packaging Information.............................................................................................................................................................. 443 Appendix A: Data Sheet Revision History.......................................................................................................................................... 459 Appendix B: Migrating From Other PIC® Devices.............................................................................................................................. 459 Index .................................................................................................................................................................................................. 461 The Microchip Web Site..................................................................................................................................................................... 469 Customer Change Notification Service .............................................................................................................................................. 469 Customer Support.............................................................................................................................................................................. 469 Reader Response .............................................................................................................................................................................. 470 Product Identification System ............................................................................................................................................................ 471
- 14. PIC16(L)F1934/6/7 DS41364E-page 14 2008-2011 Microchip Technology Inc. TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products.
- 15. 2008-2011 Microchip Technology Inc. DS41364E-page 15 PIC16(L)F1934/6/7 1.0 DEVICE OVERVIEW The PIC16(L)F1934/6/7 are described within this data sheet. They are available in 28/40/44-pin packages. Figure 1-1 shows a block diagram of the PIC16(L)F1934/6/7 devices. Table 1-2 shows the pinout descriptions. Reference Table 1-1 for peripherals available per device. TABLE 1-1: DEVICE PERIPHERAL SUMMARY Peripheral PIC16F193X PIC16LF193X ADC ● ● Capacitive Sensing Module ● ● Digital-to-Analog Converter (DAC) ● ● EUSART ● ● Fixed Voltage Reference (FVR) ● ● LCD ● ● SR Latch ● ● Temperature Indicator ● ● Capture/Compare/PWM Modules ECCP1 ● ● ECCP2 ● ● ECCP3 ● ● CCP4 ● ● CCP5 ● ● Comparators C1 ● ● C2 ● ● Operational Amplifiers OPA1 ● ● OPA2 ● ● Master Synchronous Serial Ports MSSP1 ● ● Timers Timer0 ● ● Timer1 ● ● Timer2 ● ● Timer4 ● ● Timer6 ● ●
- 16. PIC16(L)F1934/6/7 DS41364E-page 16 2008-2011 Microchip Technology Inc. FIGURE 1-1: PIC16(L)F1934/6/7 BLOCK DIAGRAM PORTA EUSART Comparators MSSP Timer2 Timer1 Timer4 Timer0 ECCP1 ADC 10-Bit ECCP2 ECCP3 CCP4 CCP5 Timer6 PORTB PORTC PORTD PORTE LCD SR Latch Note 1: See applicable chapters for more information on peripherals. CPU Program Flash Memory EEPROM RAM Timing Generation INTRC Oscillator MCLR Figure 2-1 OSC1/CLKIN OSC2/CLKOUT
- 17. 2008-2011 Microchip Technology Inc. DS41364E-page 17 PIC16(L)F1934/6/7 TABLE 1-2: PIC16(L)F1934/6/7 PINOUT DESCRIPTION Name Function Input Type Output Type Description RA0/AN0/C12IN0-/C2OUT(1) / SRNQ(1)/SS(1)/VCAP(2)/SEG12 RA0 TTL CMOS General purpose I/O. AN0 AN — A/D Channel 0 input. C12IN0- AN — Comparator C1 or C2 negative input. C2OUT — CMOS Comparator C2 output. SRNQ — CMOS SR Latch inverting output. SS ST — Slave Select input. VCAP Power Power Filter capacitor for Voltage Regulator (PIC16F1934/6/7 only). SEG12 — AN LCD Analog output. RA1/AN1/C12IN1-/SEG7 RA1 TTL CMOS General purpose I/O. AN1 AN — A/D Channel 1 input. C12IN1- AN — Comparator C1 or C2 negative input. SEG7 — AN LCD Analog output. RA2/AN2/C2IN+/VREF-/ DACOUT/COM2 RA2 TTL CMOS General purpose I/O. AN2 AN — A/D Channel 2 input. C2IN+ AN — Comparator C2 positive input. VREF- AN — A/D Negative Voltage Reference input. DACOUT — AN Voltage Reference output. COM2 — AN LCD Analog output. RA3/AN3/C1IN+/VREF+/ COM3(3)/SEG15 RA3 TTL CMOS General purpose I/O. AN3 AN — A/D Channel 3 input. C1IN+ AN — Comparator C1 positive input. VREF+ AN — A/D Voltage Reference input. COM3(3) — AN LCD Analog output. SEG15 — AN LCD Analog output. RA4/C1OUT/CPS6/T0CKI/SRQ/ CCP5/SEG4 RA4 TTL CMOS General purpose I/O. C1OUT — CMOS Comparator C1 output. CPS6 AN — Capacitive sensing input 6. T0CKI ST — Timer0 clock input. SRQ — CMOS SR Latch non-inverting output. CCP5 ST CMOS Capture/Compare/PWM5. SEG4 — AN LCD Analog output. RA5/AN4/C2OUT(1) /CPS7/ SRNQ(1) /SS(1) /VCAP (2) /SEG5 RA5 TTL CMOS General purpose I/O. AN4 AN — A/D Channel 4 input. C2OUT — CMOS Comparator C2 output. CPS7 AN — Capacitive sensing input 7. SRNQ — CMOS SR Latch inverting output. SS ST — Slave Select input. VCAP Power Power Filter capacitor for Voltage Regulator (PIC16F1934/6/7 only). SEG5 — AN LCD Analog output. Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2 C™ = Schmitt Trigger input with I2 C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1934/6/7 devices only. 3: PIC16(L)F1936 devices only. 4: PORTD is available on PIC16(L)F1934/7 devices only. 5: RE<2:0> are available on PIC16(L)F1934/7 devices only.
- 18. PIC16(L)F1934/6/7 DS41364E-page 18 2008-2011 Microchip Technology Inc. RA6/OSC2/CLKOUT/VCAP(2)/ SEG1 RA6 TTL CMOS General purpose I/O. OSC2 — XTAL Crystal/Resonator (LP, XT, HS modes). CLKOUT — CMOS FOSC/4 output. VCAP Power Power Filter capacitor for Voltage Regulator (PIC16F1934/6/7 only). SEG1 — AN LCD Analog output. RA7/OSC1/CLKIN/SEG2 RA7 TTL CMOS General purpose I/O. OSC1 XTAL — Crystal/Resonator (LP, XT, HS modes). CLKIN CMOS — External clock input (EC mode). SEG2 — AN LCD Analog output. RB0/AN12/CPS0/CCP4/SRI/INT/ SEG0 RB0 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. AN12 AN — A/D Channel 12 input. CPS0 AN — Capacitive sensing input 0. CCP4 ST CMOS Capture/Compare/PWM4. SRI — ST SR Latch input. INT ST — External interrupt. SEG0 — AN LCD analog output. RB1/AN10/C12IN3-/CPS1/P1C/ VLCD1 RB1 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. AN10 AN — A/D Channel 10 input. C12IN3- AN — Comparator C1 or C2 negative input. CPS1 AN — Capacitive sensing input 1. P1C — CMOS PWM output. VLCD1 AN — LCD analog input. RB2/AN8/CPS2/P1B/VLCD2 RB2 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. AN8 AN — A/D Channel 8 input. CPS2 AN — Capacitive sensing input 2. P1B — CMOS PWM output. VLCD2 AN — LCD analog input. RB3/AN9/C12IN2-/CPS3/ CCP2(1) /P2A(1) /VLCD3 RB3 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. AN9 AN — A/D Channel 9 input. C12IN2- AN — Comparator C1 or C2 negative input. CPS3 AN — Capacitive sensing input 3. CCP2 ST CMOS Capture/Compare/PWM2. P2A — CMOS PWM output. VLCD3 AN — LCD analog input. TABLE 1-2: PIC16(L)F1934/6/7 PINOUT DESCRIPTION (CONTINUED) Name Function Input Type Output Type Description Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2 C™ = Schmitt Trigger input with I2 C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1934/6/7 devices only. 3: PIC16(L)F1936 devices only. 4: PORTD is available on PIC16(L)F1934/7 devices only. 5: RE<2:0> are available on PIC16(L)F1934/7 devices only.
- 19. 2008-2011 Microchip Technology Inc. DS41364E-page 19 PIC16(L)F1934/6/7 RB4/AN11/CPS4/P1D/COM0 RB4 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. AN11 AN — A/D Channel 11 input. CPS4 AN — Capacitive sensing input 4. P1D — CMOS PWM output. COM0 — AN LCD Analog output. RB5/AN13/CPS5/P2B/CCP3(1)/ P3A(1) /T1G(1) /COM1 RB5 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. AN13 AN — A/D Channel 13 input. CPS5 AN — Capacitive sensing input 5. P2B — CMOS PWM output. CCP3 ST CMOS Capture/Compare/PWM3. P3A — CMOS PWM output. T1G ST — Timer1 Gate input. COM1 — AN LCD Analog output. RB6/ICSPCLK/ICDCLK/SEG14 RB6 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. ICSPCLK ST — Serial Programming Clock. ICDCLK ST — In-Circuit Debug Clock. SEG14 — AN LCD Analog output. RB7/ICSPDAT/ICDDAT/SEG13 RB7 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. ICSPDAT ST CMOS ICSP™ Data I/O. ICDDAT ST CMOS In-Circuit Data I/O. SEG13 — AN LCD Analog output. RC0/T1OSO/T1CKI/P2B(1) RC0 ST CMOS General purpose I/O. T1OSO XTAL XTAL Timer1 oscillator connection. T1CKI ST — Timer1 clock input. P2B — CMOS PWM output. RC1/T1OSI/CCP2(1) /P2A(1) RC1 ST CMOS General purpose I/O. T1OSI XTAL XTAL Timer1 oscillator connection. CCP2 ST CMOS Capture/Compare/PWM2. P2A — CMOS PWM output. RC2/CCP1/P1A/SEG3 RC2 ST CMOS General purpose I/O. CCP1 ST CMOS Capture/Compare/PWM1. P1A — CMOS PWM output. SEG3 — AN LCD Analog output. RC3/SCK/SCL/SEG6 RC3 ST CMOS General purpose I/O. SCK ST CMOS SPI clock. SCL I2 C OD I2 C™ clock. SEG6 — AN LCD Analog output. TABLE 1-2: PIC16(L)F1934/6/7 PINOUT DESCRIPTION (CONTINUED) Name Function Input Type Output Type Description Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2 C™ = Schmitt Trigger input with I2 C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1934/6/7 devices only. 3: PIC16(L)F1936 devices only. 4: PORTD is available on PIC16(L)F1934/7 devices only. 5: RE<2:0> are available on PIC16(L)F1934/7 devices only.
- 20. PIC16(L)F1934/6/7 DS41364E-page 20 2008-2011 Microchip Technology Inc. RC4/SDI/SDA/T1G(1)/SEG11 RC4 ST CMOS General purpose I/O. SDI ST — SPI data input. SDA I2 C OD I2 C™ data input/output. T1G ST — Timer1 Gate input. SEG11 — AN LCD Analog output. RC5/SDO/SEG10 RC5 ST CMOS General purpose I/O. SDO — CMOS SPI data output. SEG10 — AN LCD Analog output. RC6/TX/CK/CCP3/P3A/SEG9 RC6 ST CMOS General purpose I/O. TX — CMOS USART asynchronous transmit. CK ST CMOS USART synchronous clock. CCP3 ST CMOS Capture/Compare/PWM3. P3A — CMOS PWM output. SEG9 — AN LCD Analog output. RC7/RX/DT/P3B/SEG8 RC7 ST CMOS General purpose I/O. RX ST — USART asynchronous input. DT ST CMOS USART synchronous data. P3B — CMOS PWM output. SEG8 — AN LCD Analog output. RD0(4) /CPS8/COM3 RD0 ST CMOS General purpose I/O. CPS8 AN — Capacitive sensing input 8. COM3 — AN LCD analog output. RD1(4) /CPS9/CCP4 RD1 ST CMOS General purpose I/O. CPS9 AN — Capacitive sensing input 9. CCP4 ST CMOS Capture/Compare/PWM4. RD2(4) /CPS10/P2B RD2 ST CMOS General purpose I/O. CPS10 AN — Capacitive sensing input 10. P2B — CMOS PWM output. RD3(4) /CPS11/P2C/SEG16 RD3 ST CMOS General purpose I/O. CPS11 AN — Capacitive sensing input 11. P2C — CMOS PWM output. SEG16 — AN LCD analog output. RD4(4) /CPS12/P2D/SEG17 RD4 ST CMOS General purpose I/O. CPS12 AN — Capacitive sensing input 12. P2D — CMOS PWM output. SEG17 — AN LCD analog output. RD5(4)/CPS13/P1B/SEG18 RD5 ST CMOS General purpose I/O. CPS13 AN — Capacitive sensing input 13. P1D — CMOS PWM output. SEG18 — AN LCD analog output. TABLE 1-2: PIC16(L)F1934/6/7 PINOUT DESCRIPTION (CONTINUED) Name Function Input Type Output Type Description Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1934/6/7 devices only. 3: PIC16(L)F1936 devices only. 4: PORTD is available on PIC16(L)F1934/7 devices only. 5: RE<2:0> are available on PIC16(L)F1934/7 devices only.
- 21. 2008-2011 Microchip Technology Inc. DS41364E-page 21 PIC16(L)F1934/6/7 RD6(4)/CPS14/P1C/SEG19 RD6 ST CMOS General purpose I/O. CPS14 AN — Capacitive sensing input 14. P1C — CMOS PWM output. SEG19 — AN LCD analog output. RD7(4) /CPS15/P1D/SEG20 RD7 ST CMOS General purpose I/O. CPS15 AN — Capacitive sensing input 15. P1D — CMOS PWM output. SEG20 — AN LCD analog output. RE0(5) /AN5/P3A(1) /CCP3(1) / SEG21 RE0 ST CMOS General purpose I/O. AN5 AN — A/D Channel 5 input. P3A — CMOS PWM output. CCP3 ST CMOS Capture/Compare/PWM3. SEG21 — AN LCD analog output. RE1(5) /AN6/P3B/SEG22 RE1 ST CMOS General purpose I/O. AN6 AN — A/D Channel 6 input. P3B — CMOS PWM output. SEG22 — AN LCD analog output. RE2(5) /AN7/CCP5/SEG23 RE2 ST CMOS General purpose I/O. AN7 AN — A/D Channel 7 input. CCP5 ST CMOS Capture/Compare/PWM5. SEG23 — AN LCD analog output. RE3/MCLR/VPP RE3 TTL — General purpose input. MCLR ST — Master Clear with internal pull-up. VPP HV — Programming voltage. VDD VDD Power — Positive supply. VSS VSS Power — Ground reference. TABLE 1-2: PIC16(L)F1934/6/7 PINOUT DESCRIPTION (CONTINUED) Name Function Input Type Output Type Description Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1934/6/7 devices only. 3: PIC16(L)F1936 devices only. 4: PORTD is available on PIC16(L)F1934/7 devices only. 5: RE<2:0> are available on PIC16(L)F1934/7 devices only.
- 22. PIC16(L)F1934/6/7 DS41364E-page 22 2008-2011 Microchip Technology Inc. NOTES:
- 23. 2008-2011 Microchip Technology Inc. DS41364E-page 23 PIC16(L)F1934/6/7 2.0 ENHANCED MID-RANGE CPU This family of devices contain an enhanced mid-range 8-bit CPU core. The CPU has 49 instructions. Interrupt capability includes automatic context saving. The hardware stack is 16 levels deep and has Overflow and Underflow Reset capability. Direct, Indirect, and Relative Addressing modes are available. Two File Select Registers (FSRs) provide the ability to read program and data memory. • Automatic Interrupt Context Saving • 16-level Stack with Overflow and Underflow • File Select Registers • Instruction Set 2.1 Automatic Interrupt Context Saving During interrupts, certain registers are automatically saved in shadow registers and restored when returning from the interrupt. This saves stack space and user code. See Section 7.5 “Automatic Context Saving”, for more information. 2.2 16-level Stack with Overflow and Underflow These devices have an external stack memory 15 bits wide and 16 words deep. A Stack Overflow or Under- flow will set the appropriate bit (STKOVF or STKUNF) in the PCON register, and if enabled will cause a soft- ware Reset. See section Section 3.4 “Stack” for more details. 2.3 File Select Registers There are two 16-bit File Select Registers (FSR). FSRs can access all file registers and program memory, which allows one Data Pointer for all memory. When an FSR points to program memory, there is 1 additional instruction cycle in instructions using INDF to allow the data to be fetched. General purpose memory can now also be addressed linearly, providing the ability to access contiguous data larger than 80 bytes. There are also new instructions to support the FSRs. See Section 3.5 “Indirect Addressing” for more details. 2.4 Instruction Set There are 49 instructions for the enhanced mid-range CPU to support the features of the CPU. See Section 29.0 “Instruction Set Summary” for more details.
- 24. PIC16(L)F1934/6/7 DS41364E-page 24 2008-2011 Microchip Technology Inc. FIGURE 2-1: CORE BLOCK DIAGRAM Data Bus 8 14 Program Bus Instruction reg Program Counter 8 Level Stack (13-bit) Direct Addr 7 9 Addr MUX FSR reg STATUS reg MUX ALU Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer Instruction Decode & Control Timing Generation OSC1/CLKIN OSC2/CLKOUT VDD 8 8 Brown-out Reset 12 3 VSS Internal Oscillator Block Configuration Data Bus 8 14 Program Bus Instruction reg Program Counter 8 Level Stack (13-bit) Direct Addr 7 Addr MUX FSR reg STATUS reg MUX ALU W reg Instruction Decode & Control Timing Generation VDD 8 8 3 VSS Internal Oscillator Block Configuration 15 Data Bus 8 14 Program Bus Instruction Reg Program Counter 16-Level Stack (15-bit) Direct Addr 7 RAM Addr Addr MUX Indirect Addr FSR0 Reg STATUS Reg MUX ALU Instruction Decode and Control Timing Generation VDD 8 8 3 VSS Internal Oscillator Block Configuration Flash Program Memory RAM FSR reg FSR reg FSR1 Reg 15 15 MUX 15 Program Memory Read (PMR) 12
- 25. 2008-2011 Microchip Technology Inc. DS41364E-page 25 PIC16(L)F1934/6/7 3.0 MEMORY ORGANIZATION There are three types of memory in PIC16(L)F1934/6/7 devices: Data Memory, Program Memory and Data EEPROM Memory(1) . • Program Memory • Data Memory - Core Registers - Special Function Registers - General Purpose RAM - Common RAM - Device Memory Maps - Special Function Registers Summary • Data EEPROM memory(1) The following features are associated with access and control of program memory and data memory: • PCL and PCLATH • Stack • Indirect Addressing 3.1 Program Memory Organization The enhanced mid-range core has a 15-bit program counter capable of addressing 32K x 14 program memory space. Table 3-1 shows the memory sizes implemented for the PIC16(L)F1934/6/7 family. Accessing a location above these boundaries will cause a wrap-around within the implemented memory space. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figures 3-1 and 3-2). Note 1: The data EEPROM memory and the method to access Flash memory through the EECON registers is described in Section 11.0 “Data EEPROM and Flash Program Memory Control”. TABLE 3-1: DEVICE SIZES AND ADDRESSES Device Program Memory Space (Words) Last Program Memory Address PIC16F1934/PIC16LF1934 4,096 0FFFh PIC16F1936/PIC16LF1936 8,192 1FFFh PIC16F1937/PIC16LF1937 8,192 1FFFh
- 26. PIC16(L)F1934/6/7 DS41364E-page 26 2008-2011 Microchip Technology Inc. FIGURE 3-1: PROGRAM MEMORY MAP AND STACK FOR 4KW PARTS FIGURE 3-2: PROGRAM MEMORY MAP AND STACK FOR 8KW PARTS PC<14:0> 15 0000h 0004h Stack Level 0 Stack Level 15 Reset Vector Interrupt Vector CALL, CALLW RETURN, RETLW Stack Level 1 0005h On-chip Program Memory Page 0 07FFh Rollover to Page 0 0800h 0FFFh 1000h 7FFFh Page 1 Rollover to Page 1 Interrupt, RETFIE PC<14:0> 15 0000h 0004h Stack Level 0 Stack Level 15 Reset Vector Interrupt Vector Stack Level 1 0005h On-chip Program Memory Page 0 07FFh Rollover to Page 0 0800h 0FFFh 1000h 7FFFh Page 1 Rollover to Page 3 Page 2 Page 3 17FFh 1800h 1FFFh 2000h CALL, CALLW RETURN, RETLW Interrupt, RETFIE
- 27. 2008-2011 Microchip Technology Inc. DS41364E-page 27 PIC16(L)F1934/6/7 3.1.1 READING PROGRAM MEMORY AS DATA There are two methods of accessing constants in pro- gram memory. The first method is to use tables of RETLW instructions. The second method is to set an FSR to point to the program memory. 3.1.1.1 RETLW Instruction The RETLW instruction can be used to provide access to tables of constants. The recommended way to create such a table is shown in Example 3-1. EXAMPLE 3-1: RETLW INSTRUCTION The BRW instruction makes this type of table very sim- ple to implement. If your code must remain portable with previous generations of microcontrollers, then the BRW instruction is not available so the older table read method must be used. constants BRW ;Add Index in W to ;program counter to ;select data RETLW DATA0 ;Index0 data RETLW DATA1 ;Index1 data RETLW DATA2 RETLW DATA3 my_function ;… LOTS OF CODE… MOVLW DATA_INDEX call constants ;… THE CONSTANT IS IN W
- 28. PIC16(L)F1934/6/7 DS41364E-page 28 2008-2011 Microchip Technology Inc. 3.1.1.2 Indirect Read with FSR The program memory can be accessed as data by set- ting bit 7 of the FSRxH register and reading the match- ing INDFx register. The MOVIW instruction will place the lower 8 bits of the addressed word in the W register. Writes to the program memory cannot be performed via the INDF registers. Instructions that access the pro- gram memory via the FSR require one extra instruction cycle to complete. Example 3-2 demonstrates access- ing the program memory via an FSR. The HIGH directive will set bit<7> if a label points to a location in program memory. EXAMPLE 3-2: ACCESSING PROGRAM MEMORY VIA FSR 3.2 Data Memory Organization The data memory is partitioned in 32 memory banks with 128 bytes in a bank. Each bank consists of (Figure 3-3): • 12 core registers • 20 Special Function Registers (SFR) • Up to 80 bytes of General Purpose RAM (GPR) • 16 bytes of common RAM The active bank is selected by writing the bank number into the Bank Select Register (BSR). Unimplemented memory will read as ‘0’. All data memory can be accessed either directly (via instructions that use the file registers) or indirectly via the two File Select Registers (FSR). See Section 3.5 “Indirect Addressing” for more information. 3.2.1 CORE REGISTERS The core registers contain the registers that directly affect the basic operation of the PIC16(L)F1934/6/7. These registers are listed below: • INDF0 • INDF1 • PCL • STATUS • FSR0 Low • FSR0 High • FSR1 Low • FSR1 High • BSR • WREG • PCLATH • INTCON constants RETLW DATA0 ;Index0 data RETLW DATA1 ;Index1 data RETLW DATA2 RETLW DATA3 my_function ;… LOTS OF CODE… MOVLW LOW constants MOVWF FSR1L MOVLW HIGH constants MOVWF FSR1H MOVIW 0[FSR1] ;THE PROGRAM MEMORY IS IN W Note: The core registers are the first 12 addresses of every data memory bank.
- 29. 2008-2011 Microchip Technology Inc. DS41364E-page 29 PIC16(L)F1934/6/7 3.2.1.1 STATUS Register The STATUS register, shown in Register 3-1, contains: • the arithmetic status of the ALU • the Reset status The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as ‘000u u1uu’ (where u = unchanged). It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits (Refer to Section 29.0 “Instruction Set Summary”). Note 1: The C and DC bits operate as Borrow and Digit Borrow out bits, respectively, in subtraction. REGISTER 3-1: STATUS: STATUS REGISTER U-0 U-0 U-0 R-1/q R-1/q R/W-0/u R/W-0/u R/W-0/u — — — TO PD Z DC(1) C(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-5 Unimplemented: Read as ‘0’ bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Digit Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)(1) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register.
- 30. PIC16(L)F1934/6/7 DS41364E-page 30 2008-2011 Microchip Technology Inc. 3.2.2 SPECIAL FUNCTION REGISTER The Special Function Registers (SFR) are registers used by the application to control the desired operation of peripheral functions in the device. The registers associated with the operation of the peripherals are described in the appropriate peripheral chapter of this data sheet. 3.2.3 GENERAL PURPOSE RAM There are up to 80 bytes of GPR in each data memory bank. 3.2.3.1 Linear Access to GPR The general purpose RAM can be accessed in a non-banked method via the FSRs. This can simplify access to large memory structures. See Section 3.5.2 “Linear Data Memory” for more information. 3.2.4 COMMON RAM There are 16 bytes of common RAM accessible from all banks. FIGURE 3-3: BANKED MEMORY PARTITIONING 3.2.5 DEVICE MEMORY MAPS The memory maps for the device family are as shown in Table 3-2. 0Bh 0Ch 1Fh 20h 6Fh 70h 7Fh 00h Common RAM (16 bytes) General Purpose RAM (80 bytes maximum) Core Registers (12 bytes) Special Function Registers (20 bytes maximum) Memory Region 7-bit Bank Offset TABLE 3-2: MEMORY MAP TABLES Device Banks Table No. PIC16F1934 PIC16LF1934 0-7 Table 3-3 8-15 Table 3-4,Table 3-10 16-23 Table 3-7 23-31 Table 3-8, Table 3-11 PIC16F1936 PIC16LF1936 0-7 Table 3-5 8-15 Table 3-6, Table 3-9 16-23 Table 3-7 23-31 Table 3-8, Table 3-11 PIC16F1937 PIC16LF1937 0-7 Table 3-5 8-15 Table 3-6, Table 3-10 16-23 Table 3-7 23-31 Table 3-8, Table 3-11
- 31. PIC16(L)F1934/6/7 DS41364E-page 31 2008-2011 Microchip Technology Inc. TABLE 3-3: PIC16(L)F1934 MEMORY MAP, BANKS 0-7 Legend: = Unimplemented data memory locations, read as ‘0’. Note 1: Not available on PIC16(L)F1936. BANK 0 BANK 1 BANK 2 BANK 3 BANK 4 BANK 5 BANK 6 BANK 7 000h INDF0 080h INDF0 100h INDF0 180h INDF0 200h INDF0 280h INDF0 300h INDF0 380h INDF0 001h INDF1 081h INDF1 101h INDF1 181h INDF1 201h INDF1 281h INDF1 301h INDF1 381h INDF1 002h PCL 082h PCL 102h PCL 182h PCL 202h PCL 282h PCL 302h PCL 382h PCL 003h STATUS 083h STATUS 103h STATUS 183h STATUS 203h STATUS 283h STATUS 303h STATUS 383h STATUS 004h FSR0L 084h FSR0L 104h FSR0L 184h FSR0L 204h FSR0L 284h FSR0L 304h FSR0L 384h FSR0L 005h FSR0H 085h FSR0H 105h FSR0H 185h FSR0H 205h FSR0H 285h FSR0H 305h FSR0H 385h FSR0H 006h FSR1L 086h FSR1L 106h FSR1L 186h FSR1L 206h FSR1L 286h FSR1L 306h FSR1L 386h FSR1L 007h FSR1H 087h FSR1H 107h FSR1H 187h FSR1H 207h FSR1H 287h FSR1H 307h FSR1H 387h FSR1H 008h BSR 088h BSR 108h BSR 188h BSR 208h BSR 288h BSR 308h BSR 388h BSR 009h WREG 089h WREG 109h WREG 189h WREG 209h WREG 289h WREG 309h WREG 389h WREG 00Ah PCLATH 08Ah PCLATH 10Ah PCLATH 18Ah PCLATH 20Ah PCLATH 28Ah PCLATH 30Ah PCLATH 38Ah PCLATH 00Bh INTCON 08Bh INTCON 10Bh INTCON 18Bh INTCON 20Bh INTCON 28Bh INTCON 30Bh INTCON 38Bh INTCON 00Ch PORTA 08Ch TRISA 10Ch LATA 18Ch ANSELA 20Ch — 28Ch — 30Ch — 38Ch — 00Dh PORTB 08Dh TRISB 10Dh LATB 18Dh ANSELB 20Dh WPUB 28Dh — 30Dh — 38Dh — 00Eh PORTC 08Eh TRISC 10Eh LATC 18Eh — 20Eh — 28Eh — 30Eh — 38Eh — 00Fh PORTD(1) 08Fh TRISD(1) 10Fh LATD(1) 18Fh ANSELD(1) 20Fh — 28Fh — 30Fh — 38Fh — 010h PORTE 090h TRISE 110h LATE(1) 190h ANSELE(1) 210h WPUE 290h — 310h — 390h — 011h PIR1 091h PIE1 111h CM1CON0 191h EEADRL 211h SSPBUF 291h CCPR1L 311h CCPR3L 391h — 012h PIR2 092h PIE2 112h CM1CON1 192h EEADRH 212h SSPADD 292h CCPR1H 312h CCPR3H 392h — 013h PIR3 093h PIE3 113h CM2CON0 193h EEDATL 213h SSPMSK 293h CCP1CON 313h CCP3CON 393h — 014h — 094h — 114h CM2CON1 194h EEDATH 214h SSPSTAT 294h PWM1CON 314h PWM3CON 394h IOCBP 015h TMR0 095h OPTION_REG 115h CMOUT 195h EECON1 215h SSPCON1 295h CCP1AS 315h CCP3AS 395h IOCBN 016h TMR1L 096h PCON 116h BORCON 196h EECON2 216h SSPCON2 296h PSTR1CON 316h PSTR3CON 396h IOCBF 017h TMR1H 097h WDTCON 117h FVRCON 197h — 217h SSPCON3 297h — 317h — 397h — 018h T1CON 098h OSCTUNE 118h DACCON0 198h — 218h — 298h CCPR2L 318h CCPR4L 398h — 019h T1GCON 099h OSCCON 119h DACCON1 199h RCREG 219h — 299h CCPR2H 319h CCPR4H 399h — 01Ah TMR2 09Ah OSCSTAT 11Ah SRCON0 19Ah TXREG 21Ah — 29Ah CCP2CON 31Ah CCP4CON 39Ah — 01Bh PR2 09Bh ADRESL 11Bh SRCON1 19Bh SPBRGL 21Bh — 29Bh PWM2CON 31Bh — 39Bh — 01Ch T2CON 09Ch ADRESH 11Ch — 19Ch SPBRGH 21Ch — 29Ch CCP2AS 31Ch CCPR5L 39Ch — 01Dh — 09Dh ADCON0 11Dh APFCON 19Dh RCSTA 21Dh — 29Dh PSTR2CON 31Dh CCPR5H 39Dh — 01Eh CPSCON0 09Eh ADCON1 11Eh — 19Eh TXSTA 21Eh — 29Eh CCPTMRS0 31Eh CCP5CON 39Eh — 01Fh CPSCON1 09Fh — 11Fh — 19Fh BAUDCTR 21Fh — 29Fh CCPTMRS1 31Fh — 39Fh — 020h General Purpose Register 96 Bytes 0A0h General Purpose Register 80 Bytes 120h General Purpose Register 80 Bytes 1A0h Unimplemented Read as ‘0’ 220h Unimplemented Read as ‘0’ 2A0h Unimplemented Read as ‘0’ 320h Unimplemented Read as ‘0’ 3A0h Unimplemented Read as ‘0’ 06Fh 0EFh 16Fh 1EFh 26Fh 2EFh 36Fh 3EFh 070h 0F0h Accesses 70h – 7Fh 170h Accesses 70h – 7Fh 1F0h Accesses 70h – 7Fh 270h Accesses 70h – 7Fh 2F0h Accesses 70h – 7Fh 370h Accesses 70h – 7Fh 3F0h Accesses 70h – 7Fh 07Fh 0FFh 17Fh 1FFh 27Fh 2FFh 37Fh 3FFh
- 32. PIC16(L)F1934/6/7 DS41364E-page 32 2008-2011 Microchip Technology Inc. TABLE 3-4: PIC16(L)F1934 MEMORY MAP, BANKS 8-15 Legend: = Unimplemented data memory locations, read as ‘0’. BANK 8 BANK 9 BANK 10 BANK 11 BANK 12 BANK 13 BANK 14 BANK 15 400h INDF0 480h INDF0 500h INDF0 580h INDF0 600h INDF0 680h INDF0 700h INDF0 780h INDF0 401h INDF1 481h INDF1 501h INDF1 581h INDF1 601h INDF1 681h INDF1 701h INDF1 781h INDF1 402h PCL 482h PCL 502h PCL 582h PCL 602h PCL 682h PCL 702h PCL 782h PCL 403h STATUS 483h STATUS 503h STATUS 583h STATUS 603h STATUS 683h STATUS 703h STATUS 783h STATUS 404h FSR0L 484h FSR0L 504h FSR0L 584h FSR0L 604h FSR0L 684h FSR0L 704h FSR0L 784h FSR0L 405h FSR0H 485h FSR0H 505h FSR0H 585h FSR0H 605h FSR0H 685h FSR0H 705h FSR0H 785h FSR0H 406h FSR1L 486h FSR1L 506h FSR1L 586h FSR1L 606h FSR1L 686h FSR1L 706h FSR1L 786h FSR1L 407h FSR1H 487h FSR1H 507h FSR1H 587h FSR1H 607h FSR1H 687h FSR1H 707h FSR1H 787h FSR1H 408h BSR 488h BSR 508h BSR 588h BSR 608h BSR 688h BSR 708h BSR 788h BSR 409h WREG 489h WREG 509h WREG 589h WREG 609h WREG 689h WREG 709h WREG 789h WREG 40Ah PCLATH 48Ah PCLATH 50Ah PCLATH 58Ah PCLATH 60Ah PCLATH 68Ah PCLATH 70Ah PCLATH 78Ah PCLATH 40Bh INTCON 48Bh INTCON 50Bh INTCON 58Bh INTCON 60Bh INTCON 68Bh INTCON 70Bh INTCON 78Bh INTCON 40Ch — 48Ch — 50Ch — 58Ch — 60Ch — 68Ch — 70Ch — 78Ch — 40Dh — 48Dh — 50Dh — 58Dh — 60Dh — 68Dh — 70Dh — 78Dh — 40Eh — 48Eh — 50Eh — 58Eh — 60Eh — 68Eh — 70Eh — 78Eh — 40Fh — 48Fh — 50Fh — 58Fh — 60Fh — 68Fh — 70Fh — 78Fh — 410h — 490h — 510h — 590h — 610h — 690h — 710h — 790h — 411h — 491h — 511h — 591h — 611h — 691h — 711h — 791h See Table 3-9 or Table 3-10 412h — 492h — 512h — 592h — 612h — 692h — 712h — 792h 413h — 493h — 513h — 593h — 613h — 693h — 713h — 793h 414h — 494h — 514h — 594h — 614h — 694h — 714h — 794h 415h TMR4 495h — 515h — 595h — 615h — 695h — 715h — 795h 416h PR4 496h — 516h — 596h — 616h — 696h — 716h — 796h 417h T4CON 497h — 517h — 597h — 617h — 697h — 717h — 797h 418h — 498h — 518h — 598h — 618h — 698h — 718h — 798h 419h — 499h — 519h — 599h — 619h — 699h — 719h — 799h 41Ah — 49Ah — 51Ah — 59Ah — 61Ah — 69Ah — 71Ah — 79Ah 41Bh — 49Bh — 51Bh — 59Bh — 61Bh — 69Bh — 71Bh — 79Bh 41Ch TMR6 49Ch — 51Ch — 59Ch — 61Ch — 69Ch — 71Ch — 79Ch 41Dh PR6 49Dh — 51Dh — 59Dh — 61Dh — 69Dh — 71Dh — 79Dh 41Eh T6CON 49Eh — 51Eh — 59Eh — 61Eh — 69Eh — 71Eh — 79Eh 41Fh — 49Fh — 51Fh — 59Fh — 61Fh — 69Fh — 71Fh — 79Fh 420h Unimplemented Read as ‘0’ 4A0h Unimplemented Read as ‘0’ 520h Unimplemented Read as ‘0’ 5A0h Unimplemented Read as ‘0’ 620h Unimplemented Read as ‘0’ 6A0h Unimplemented Read as ‘0’ 720h Unimplemented Read as ‘0’ 7A0h 46Fh 4EFh 56Fh 5EFh 66Fh 6EFh 76Fh 7EFh 470h Accesses 70h – 7Fh 4F0h Accesses 70h – 7Fh 570h Accesses 70h – 7Fh 5F0h Accesses 70h – 7Fh 670h Accesses 70h – 7Fh 6F0h Accesses 70h – 7Fh 770h Accesses 70h – 7Fh 7F0h Accesses 70h – 7Fh 47Fh 4FFh 57Fh 5FFh 67Fh 6FFh 77Fh 7FFh
- 33. PIC16(L)F1934/6/7 DS41364E-page 33 2008-2011 Microchip Technology Inc. TABLE 3-5: PIC16(L)F1936/1937 MEMORY MAP, BANKS 0-7 Legend: = Unimplemented data memory locations, read as ‘0’. Note 1: Not available on PIC16(L)F1936. BANK 0 BANK 1 BANK 2 BANK 3 BANK 4 BANK 5 BANK 6 BANK 7 000h INDF0 080h INDF0 100h INDF0 180h INDF0 200h INDF0 280h INDF0 300h INDF0 380h INDF0 001h INDF1 081h INDF1 101h INDF1 181h INDF1 201h INDF1 281h INDF1 301h INDF1 381h INDF1 002h PCL 082h PCL 102h PCL 182h PCL 202h PCL 282h PCL 302h PCL 382h PCL 003h STATUS 083h STATUS 103h STATUS 183h STATUS 203h STATUS 283h STATUS 303h STATUS 383h STATUS 004h FSR0L 084h FSR0L 104h FSR0L 184h FSR0L 204h FSR0L 284h FSR0L 304h FSR0L 384h FSR0L 005h FSR0H 085h FSR0H 105h FSR0H 185h FSR0H 205h FSR0H 285h FSR0H 305h FSR0H 385h FSR0H 006h FSR1L 086h FSR1L 106h FSR1L 186h FSR1L 206h FSR1L 286h FSR1L 306h FSR1L 386h FSR1L 007h FSR1H 087h FSR1H 107h FSR1H 187h FSR1H 207h FSR1H 287h FSR1H 307h FSR1H 387h FSR1H 008h BSR 088h BSR 108h BSR 188h BSR 208h BSR 288h BSR 308h BSR 388h BSR 009h WREG 089h WREG 109h WREG 189h WREG 209h WREG 289h WREG 309h WREG 389h WREG 00Ah PCLATH 08Ah PCLATH 10Ah PCLATH 18Ah PCLATH 20Ah PCLATH 28Ah PCLATH 30Ah PCLATH 38Ah PCLATH 00Bh INTCON 08Bh INTCON 10Bh INTCON 18Bh INTCON 20Bh INTCON 28Bh INTCON 30Bh INTCON 38Bh INTCON 00Ch PORTA 08Ch TRISA 10Ch LATA 18Ch ANSELA 20Ch — 28Ch — 30Ch — 38Ch — 00Dh PORTB 08Dh TRISB 10Dh LATB 18Dh ANSELB 20Dh WPUB 28Dh — 30Dh — 38Dh — 00Eh PORTC 08Eh TRISC 10Eh LATC 18Eh — 20Eh — 28Eh — 30Eh — 38Eh — 00Fh PORTD(1) 08Fh TRISD(1) 10Fh LATD(1) 18Fh ANSELD(1) 20Fh — 28Fh — 30Fh — 38Fh — 010h PORTE 090h TRISE 110h LATE(1) 190h ANSELE(1) 210h WPUE 290h — 310h — 390h — 011h PIR1 091h PIE1 111h CM1CON0 191h EEADRL 211h SSPBUF 291h CCPR1L 311h CCPR3L 391h — 012h PIR2 092h PIE2 112h CM1CON1 192h EEADRH 212h SSPADD 292h CCPR1H 312h CCPR3H 392h — 013h PIR3 093h PIE3 113h CM2CON0 193h EEDATL 213h SSPMSK 293h CCP1CON 313h CCP3CON 393h — 014h — 094h — 114h CM2CON1 194h EEDATH 214h SSPSTAT 294h PWM1CON 314h PWM3CON 394h IOCBP 015h TMR0 095h OPTION_REG 115h CMOUT 195h EECON1 215h SSPCON1 295h CCP1AS 315h CCP3AS 395h IOCBN 016h TMR1L 096h PCON 116h BORCON 196h EECON2 216h SSPCON2 296h PSTR1CON 316h PSTR3CON 396h IOCBF 017h TMR1H 097h WDTCON 117h FVRCON 197h — 217h SSPCON3 297h — 317h — 397h — 018h T1CON 098h OSCTUNE 118h DACCON0 198h — 218h — 298h CCPR2L 318h CCPR4L 398h — 019h T1GCON 099h OSCCON 119h DACCON1 199h RCREG 219h — 299h CCPR2H 319h CCPR4H 399h — 01Ah TMR2 09Ah OSCSTAT 11Ah SRCON0 19Ah TXREG 21Ah — 29Ah CCP2CON 31Ah CCP4CON 39Ah — 01Bh PR2 09Bh ADRESL 11Bh SRCON1 19Bh SPBRGL 21Bh — 29Bh PWM2CON 31Bh — 39Bh — 01Ch T2CON 09Ch ADRESH 11Ch — 19Ch SPBRGH 21Ch — 29Ch CCP2AS 31Ch CCPR5L 39Ch — 01Dh — 09Dh ADCON0 11Dh APFCON 19Dh RCSTA 21Dh — 29Dh PSTR2CON 31Dh CCPR5H 39Dh — 01Eh CPSCON0 09Eh ADCON1 11Eh — 19Eh TXSTA 21Eh — 29Eh CCPTMRS0 31Eh CCP5CON 39Eh — 01Fh CPSCON1 09Fh — 11Fh — 19Fh BAUDCON 21Fh — 29Fh CCPTMRS1 31Fh — 39Fh — 020h General Purpose Register 96 Bytes 0A0h General Purpose Register 80 Bytes 120h General Purpose Register 80 Bytes 1A0h General Purpose Register 80 Bytes 220h General Purpose Register 80 Bytes 2A0h General Purpose Register 80 Bytes 320h General Purpose Register 16 Bytes 3A0h Unimplemented Read as ‘0’ 32Fh 330h Unimplemented Read as ‘0’ 06Fh 0EFh 16Fh 1EFh 26Fh 2EFh 36Fh 3EFh 070h 0F0h Accesses 70h – 7Fh 170h Accesses 70h – 7Fh 1F0h Accesses 70h – 7Fh 270h Accesses 70h – 7Fh 2F0h Accesses 70h – 7Fh 370h Accesses 70h – 7Fh 3F0h Accesses 70h – 7Fh 07Fh 0FFh 17Fh 1FFh 27Fh 2FFh 37Fh 3FFh
- 34. PIC16(L)F1934/6/7 DS41364E-page 34 2008-2011 Microchip Technology Inc. TABLE 3-6: PIC16(L)F1936/1937 MEMORY MAP, BANKS 8-15 Legend: = Unimplemented data memory locations, read as ‘0’. BANK 8 BANK 9 BANK 10 BANK 11 BANK 12 BANK 13 BANK 14 BANK 15 400h INDF0 480h INDF0 500h INDF0 580h INDF0 600h INDF0 680h INDF0 700h INDF0 780h INDF0 401h INDF1 481h INDF1 501h INDF1 581h INDF1 601h INDF1 681h INDF1 701h INDF1 781h INDF1 402h PCL 482h PCL 502h PCL 582h PCL 602h PCL 682h PCL 702h PCL 782h PCL 403h STATUS 483h STATUS 503h STATUS 583h STATUS 603h STATUS 683h STATUS 703h STATUS 783h STATUS 404h FSR0L 484h FSR0L 504h FSR0L 584h FSR0L 604h FSR0L 684h FSR0L 704h FSR0L 784h FSR0L 405h FSR0H 485h FSR0H 505h FSR0H 585h FSR0H 605h FSR0H 685h FSR0H 705h FSR0H 785h FSR0H 406h FSR1L 486h FSR1L 506h FSR1L 586h FSR1L 606h FSR1L 686h FSR1L 706h FSR1L 786h FSR1L 407h FSR1H 487h FSR1H 507h FSR1H 587h FSR1H 607h FSR1H 687h FSR1H 707h FSR1H 787h FSR1H 408h BSR 488h BSR 508h BSR 588h BSR 608h BSR 688h BSR 708h BSR 788h BSR 409h WREG 489h WREG 509h WREG 589h WREG 609h WREG 689h WREG 709h WREG 789h WREG 40Ah PCLATH 48Ah PCLATH 50Ah PCLATH 58Ah PCLATH 60Ah PCLATH 68Ah PCLATH 70Ah PCLATH 78Ah PCLATH 40Bh INTCON 48Bh INTCON 50Bh INTCON 58Bh INTCON 60Bh INTCON 68Bh INTCON 70Bh INTCON 78Bh INTCON 40Ch — 48Ch — 50Ch — 58Ch — 60Ch — 68Ch — 70Ch — 78Ch — 40Dh — 48Dh — 50Dh — 58Dh — 60Dh — 68Dh — 70Dh — 78Dh — 40Eh — 48Eh — 50Eh — 58Eh — 60Eh — 68Eh — 70Eh — 78Eh — 40Fh — 48Fh — 50Fh — 58Fh — 60Fh — 68Fh — 70Fh — 78Fh — 410h — 490h — 510h — 590h — 610h — 690h — 710h — 790h — 411h — 491h — 511h — 591h — 611h — 691h — 711h — 791h See Table 3-9 or Table 3-10 412h — 492h — 512h — 592h — 612h — 692h — 712h — 792h 413h — 493h — 513h — 593h — 613h — 693h — 713h — 793h 414h — 494h — 514h — 594h — 614h — 694h — 714h — 794h 415h TMR4 495h — 515h — 595h — 615h — 695h — 715h — 795h 416h PR4 496h — 516h — 596h — 616h — 696h — 716h — 796h 417h T4CON 497h — 517h — 597h — 617h — 697h — 717h — 797h 418h — 498h — 518h — 598h — 618h — 698h — 718h — 798h 419h — 499h — 519h — 599h — 619h — 699h — 719h — 799h 41Ah — 49Ah — 51Ah — 59Ah — 61Ah — 69Ah — 71Ah — 79Ah 41Bh — 49Bh — 51Bh — 59Bh — 61Bh — 69Bh — 71Bh — 79Bh 41Ch TMR6 49Ch — 51Ch — 59Ch — 61Ch — 69Ch — 71Ch — 79Ch 41Dh PR6 49Dh — 51Dh — 59Dh — 61Dh — 69Dh — 71Dh — 79Dh 41Eh T6CON 49Eh — 51Eh — 59Eh — 61Eh — 69Eh — 71Eh — 79Eh 41Fh — 49Fh — 51Fh — 59Fh — 61Fh — 69Fh — 71Fh — 79Fh 420h Unimplemented Read as ‘0’ 4A0h Unimplemented Read as ‘0’ 520h Unimplemented Read as ‘0’ 5A0h Unimplemented Read as ‘0’ 620h Unimplemented Read as ‘0’ 6A0h Unimplemented Read as ‘0’ 720h Unimplemented Read as ‘0’ 7A0h 46Fh 4EFh 56Fh 5EFh 66Fh 6EFh 76Fh 7EFh 470h Accesses 70h – 7Fh 4F0h Accesses 70h – 7Fh 570h Accesses 70h – 7Fh 5F0h Accesses 70h – 7Fh 670h Accesses 70h – 7Fh 6F0h Accesses 70h – 7Fh 770h Accesses 70h – 7Fh 7F0h Accesses 70h – 7Fh 47Fh 4FFh 57Fh 5FFh 67Fh 6FFh 77Fh 7FFh
- 35. 2008-2011 Microchip Technology Inc. DS41364E-page 35 PIC16(L)F1934/6/7 TABLE 3-7: PIC16(L)F1934/6/7 MEMORY MAP, BANKS 16-23 Legend: = Unimplemented data memory locations, read as ‘0’. BANK 16 BANK 17 BANK 18 BANK 19 BANK 20 BANK 21 BANK 22 BANK 23 800h INDF0 880h INDF0 900h INDF0 980h INDF0 A00h INDF0 A80h INDF0 B00h INDF0 B80h INDF0 801h INDF1 881h INDF1 901h INDF1 981h INDF1 A01h INDF1 A81h INDF1 B01h INDF1 B81h INDF1 802h PCL 882h PCL 902h PCL 982h PCL A02h PCL A82h PCL B02h PCL B82h PCL 803h STATUS 883h STATUS 903h STATUS 983h STATUS A03h STATUS A83h STATUS B03h STATUS B83h STATUS 804h FSR0L 884h FSR0L 904h FSR0L 984h FSR0L A04h FSR0L A84h FSR0L B04h FSR0L B84h FSR0L 805h FSR0H 885h FSR0H 905h FSR0H 985h FSR0H A05h FSR0H A85h FSR0H B05h FSR0H B85h FSR0H 806h FSR1L 886h FSR1L 906h FSR1L 986h FSR1L A06h FSR1L A86h FSR1L B06h FSR1L B86h FSR1L 807h FSR1H 887h FSR1H 907h FSR1H 987h FSR1H A07h FSR1H A87h FSR1H B07h FSR1H B87h FSR1H 808h BSR 888h BSR 908h BSR 988h BSR A08h BSR A88h BSR B08h BSR B88h BSR 809h WREG 889h WREG 909h WREG 989h WREG A09h WREG A89h WREG B09h WREG B89h WREG 80Ah PCLATH 88Ah PCLATH 90Ah PCLATH 98Ah PCLATH A0Ah PCLATH A8Ah PCLATH B0Ah PCLATH B8Ah PCLATH 80Bh INTCON 88Bh INTCON 90Bh INTCON 98Bh INTCON A0Bh INTCON A8Bh INTCON B0Bh INTCON B8Bh INTCON 80Ch — 88Ch — 90Ch — 98Ch — A0Ch — A8Ch — B0Ch — B8Ch — 80Dh — 88Dh — 90Dh — 98Dh — A0Dh — A8Dh — B0Dh — B8Dh — 80Eh — 88Eh — 90Eh — 98Eh — A0Eh — A8Eh — B0Eh — B8Eh — 80Fh — 88Fh — 90Fh — 98Fh — A0Fh — A8Fh — B0Fh — B8Fh — 810h — 890h — 910h — 990h — A10h — A90h — B10h — B90h — 811h — 891h — 911h — 991h — A11h — A91h — B11h — B91h — 812h — 892h — 912h — 992h — A12h — A92h — B12h — B92h — 813h — 893h — 913h — 993h — A13h — A93h — B13h — B93h — 814h — 894h — 914h — 994h — A14h — A94h — B14h — B94h — 815h — 895h — 915h — 995h — A15h — A95h — B15h — B95h — 816h — 896h — 916h — 996h — A16h — A96h — B16h — B96h — 817h — 897h — 917h — 997h — A17h — A97h — B17h — B97h — 818h — 898h — 918h — 998h — A18h — A98h — B18h — B98h — 819h — 899h — 919h — 999h — A19h — A99h — B19h — B99h — 81Ah — 89Ah — 91Ah — 99Ah — A1Ah — A9Ah — B1Ah — B9Ah — 81Bh — 89Bh — 91Bh — 99Bh — A1Bh — A9Bh — B1Bh — B9Bh — 81Ch — 89Ch — 91Ch — 99Ch — A1Ch — A9Ch — B1Ch — B9Ch — 81Dh — 89Dh — 91Dh — 99Dh — A1Dh — A9Dh — B1Dh — B9Dh — 81Eh — 89Eh — 91Eh — 99Eh — A1Eh — A9Eh — B1Eh — B9Eh — 81Fh — 89Fh — 91Fh — 99Fh — A1Fh — A9Fh — B1Fh — B9Fh — 820h Unimplemented Read as ‘0’ 8A0h Unimplemented Read as ‘0’ 920h Unimplemented Read as ‘0’ 9A0h Unimplemented Read as ‘0’ A20h Unimplemented Read as ‘0’ AA0h Unimplemented Read as ‘0’ B20h Unimplemented Read as ‘0’ BA0h Unimplemented Read as ‘0’ 86Fh 8EFh 96Fh 9EFh A6Fh AEFh B6Fh BEFh 870h Accesses 70h – 7Fh 8F0h Accesses 70h – 7Fh 970h Accesses 70h – 7Fh 9F0h Accesses 70h – 7Fh A70h Accesses 70h – 7Fh AF0h Accesses 70h – 7Fh B70h Accesses 70h – 7Fh BF0h Accesses 70h – 7Fh 87Fh 8FFh 97Fh 9FFh A7Fh AFFh B7Fh BFFh
- 36. PIC16(L)F1934/6/7 DS41364E-page 36 2008-2011 Microchip Technology Inc. TABLE 3-8: PIC16(L)F1934/6/7 MEMORY MAP, BANKS 24-31 Legend: = Unimplemented data memory locations, read as ‘0’. BANK 24 BANK 25 BANK 26 BANK 27 BANK 28 BANK 29 BANK 30 BANK 31 C00h INDF0 C80h INDF0 D00h INDF0 D80h INDF0 E00h INDF0 E80h INDF0 F00h INDF0 F80h INDF0 C01h INDF1 C81h INDF1 D01h INDF1 D81h INDF1 E01h INDF1 E81h INDF1 F01h INDF1 F81h INDF1 C02h PCL C82h PCL D02h PCL D82h PCL E02h PCL E82h PCL F02h PCL F82h PCL C03h STATUS C83h STATUS D03h STATUS D83h STATUS E03h STATUS E83h STATUS F03h STATUS F83h STATUS C04h FSR0L C84h FSR0L D04h FSR0L D84h FSR0L E04h FSR0L E84h FSR0L F04h FSR0L F84h FSR0L C05h FSR0H C85h FSR0H D05h FSR0H D85h FSR0H E05h FSR0H E85h FSR0H F05h FSR0H F85h FSR0H C06h FSR1L C86h FSR1L D06h FSR1L D86h FSR1L E06h FSR1L E86h FSR1L F06h FSR1L F86h FSR1L C07h FSR1H C87h FSR1H D07h FSR1H D87h FSR1H E07h FSR1H E87h FSR1H F07h FSR1H F87h FSR1H C08h BSR C88h BSR D08h BSR D88h BSR E08h BSR E88h BSR F08h BSR F88h BSR C09h WREG C89h WREG D09h WREG D89h WREG E09h WREG E89h WREG F09h WREG F89h WREG C0Ah PCLATH C8Ah PCLATH D0Ah PCLATH D8Ah PCLATH E0Ah PCLATH E8Ah PCLATH F0Ah PCLATH F8Ah PCLATH C0Bh INTCON C8Bh INTCON D0Bh INTCON D8Bh INTCON E0Bh INTCON E8Bh INTCON F0Bh INTCON F8Bh INTCON C0Ch — C8Ch — D0Ch — D8Ch — E0Ch — E8Ch — F0Ch — F8Ch See Table 3-11 C0Dh — C8Dh — D0Dh — D8Dh — E0Dh — E8Dh — F0Dh — F8Dh C0Eh — C8Eh — D0Eh — D8Eh — E0Eh — E8Eh — F0Eh — F8Eh C0Fh — C8Fh — D0Fh — D8Fh — E0Fh — E8Fh — F0Fh — F8Fh C10h — C90h — D10h — D90h — E10h — E90h — F10h — F90h C11h — C91h — D11h — D91h — E11h — E91h — F11h — F91h C12h — C92h — D12h — D92h — E12h — E92h — F12h — F92h C13h — C93h — D13h — D93h — E13h — E93h — F13h — F93h C14h — C94h — D14h — D94h — E14h — E94h — F14h — F94h C15h — C95h — D15h — D95h — E15h — E95h — F15h — F95h C16h — C96h — D16h — D96h — E16h — E96h — F16h — F96h C17h — C97h — D17h — D97h — E17h — E97h — F17h — F97h C18h — C98h — D18h — D98h — E18h — E98h — F18h — F98h C19h — C99h — D19h — D99h — E19h — E99h — F19h — F99h C1Ah — C9Ah — D1Ah — D9Ah — E1Ah — E9Ah — F1Ah — F9Ah C1Bh — C9Bh — D1Bh — D9Bh — E1Bh — E9Bh — F1Bh — F9Bh C1Ch — C9Ch — D1Ch — D9Ch — E1Ch — E9Ch — F1Ch — F9Ch C1Dh — C9Dh — D1Dh — D9Dh — E1Dh — E9Dh — F1Dh — F9Dh C1Eh — C9Eh — D1Eh — D9Eh — E1Eh — E9Eh — F1Eh — F9Eh C1Fh — C9Fh — D1Fh — D9Fh — E1Fh — E9Fh — F1Fh — F9Fh C20h Unimplemented Read as ‘0’ CA0h Unimplemented Read as ‘0’ D20h Unimplemented Read as ‘0’ DA0h Unimplemented Read as ‘0’ E20h Unimplemented Read as ‘0’ EA0h Unimplemented Read as ‘0’ F20h Unimplemented Read as ‘0’ FA0h C6Fh CEFh D6Fh DEFh E6Fh EEFh F6Fh FEFh C70h Accesses 70h – 7Fh CF0h Accesses 70h – 7Fh D70h Accesses 70h – 7Fh DF0h Accesses 70h – 7Fh E70h Accesses 70h – 7Fh EF0h Accesses 70h – 7Fh F70h Accesses 70h – 7Fh FF0h Accesses 70h – 7Fh CFFh CFFh D7Fh DFFh E7Fh EFFh F7Fh FFFh
- 37. 2008-2011 Microchip Technology Inc. DS41364E-page 37 PIC16(L)F1934/6/7 TABLE 3-9: PIC16(L)F1936 MEMORY MAP, BANK 15 TABLE 3-10: PIC16(L)F1934/7 MEMORY MAP, BANK 15 Legend: = Unimplemented data memory locations, read as ‘0’. Bank 15 791h LCDCON 792h LCDPS 793h LCDREF 794h LCDCST 795h LCDRL 796h — 797h — 798h LCDSE0 799h LCDSE1 79Ah — 79Bh — 79Ch — 79Dh — 79Eh — 79Fh — 7A0h LCDDATA0 7A1h LCDDATA1 7A2h — 7A3h LCDDATA3 7A4h LCDDATA4 7A5h — 7A6h LCDDATA6 7A7h LCDDATA7 7A8h — 7A9h LCDDATA9 7AAh LCDDATA10 7ABh — 7ACh — 7ADh — 7AEh — 7AFh — 7B0h — 7B1h — 7B2h — 7B3h — 7B4h — 7B5h — 7B6h — 7B7h — 7B8h Unimplemented Read as ‘0’ 7EFh Legend: = Unimplemented data memory locations, read as ‘0’. Bank 15 791h LCDCON 792h LCDPS 793h LCDREF 794h LCDCST 795h LCDRL 796h — 797h — 798h LCDSE0 799h LCDSE1 79Ah LCDSE2 79Bh — 79Ch — 79Dh — 79Eh — 79Fh — 7A0h LCDDATA0 7A1h LCDDATA1 7A2h LCDDATA2 7A3h LCDDATA3 7A4h LCDDATA4 7A5h LCDDATA5 7A6h LCDDATA6 7A7h LCDDATA7 7A8h LCDDATA8 7A9h LCDDATA9 7AAh LCDDATA10 7ABh LCDDATA11 7ACh — 7ADh — 7AEh — 7AFh — 7B0h — 7B1h — 7B2h — 7B3h — 7B4h — 7B5h — 7B6h — 7B7h — 7B8h Unimplemented Read as ‘0’ 7EFh
- 38. PIC16(L)F1934/6/7 DS41364E-page 38 2008-2011 Microchip Technology Inc. TABLE 3-11: PIC16(L)F1934/6/7 MEMORY MAP, BANK 31 3.2.6 SPECIAL FUNCTION REGISTERS SUMMARY The Special Function Register Summary for the device family are as follows: Legend: = Unimplemented data memory locations, read as ‘0’. Bank 31 F8Ch Unimplemented Read as ‘0’ FE3h FE4h STATUS_SHAD FE5h WREG_SHAD FE6h BSR_SHAD FE7h PCLATH_SHAD FE8h FSR0L_SHAD FE9h FSR0H_SHAD FEAh FSR1L_SHAD FEBh FSR1H_SHAD FECh — FEDh STKPTR FEEh TOSL FEFh TOSH Device Bank(s) Page No. PIC16(L)F1934/6/7 0 39 1 40 2 41 3 42 4 43 5 44 6 45 7 46 8 47 9-14 48 15 49 16-30 51 31 52
- 39. 2008-2011 Microchip Technology Inc. DS41364E-page 39 PIC16(L)F1934/6/7 = TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 0 000h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 001h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 002h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 003h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 004h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 005h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 006h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 007h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 008h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 009h(2) WREG Working Register 0000 0000 uuuu uuuu 00Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 00Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 00Ch PORTA PORTA Data Latch when written: PORTA pins when read xxxx xxxx uuuu uuuu 00Dh PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu 00Eh PORTC PORTC Data Latch when written: PORTC pins when read xxxx xxxx uuuu uuuu 00Fh(3) PORTD PORTD Data Latch when written: PORTD pins when read xxxx xxxx uuuu uuuu 010h PORTE — — — — RE3 RE2(3) RE1(3) RE0(3) ---- xxxx ---- uuuu 011h PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 012h PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 0000 00-0 0000 00-0 013h PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — -000 0-0- -000 0-0- 014h — Unimplemented — — 015h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu 016h TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 017h TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 018h T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 0000 00-0 uuuu uu-u 019h T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ DONE T1GVAL T1GSS<1:0> 0000 0x00 uuuu uxuu 01Ah TMR2 Timer2 Module Register 0000 0000 0000 0000 01Bh PR2 Timer2 Period Register 1111 1111 1111 1111 01Ch T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> -000 0000 -000 0000 01Dh — Unimplemented — — 01Eh CPSCON0 CPSON — — — CPSRNG1 CPSRNG0 CPSOUT T0XCS 0--- 0000 0--- 0000 01Fh CPSCON1 — — — — CPSCH<3:0> ---- 0000 ---- 0000 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 40. PIC16(L)F1934/6/7 DS41364E-page 40 2008-2011 Microchip Technology Inc. Bank 1 080h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 081h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 082h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 083h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 084h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 085h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 086h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 087h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 088h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 089h(2) WREG Working Register 0000 0000 uuuu uuuu 08Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 08Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 08Ch TRISA PORTA Data Direction Register 1111 1111 1111 1111 08Dh TRISB PORTB Data Direction Register 1111 1111 1111 1111 08Eh TRISC PORTC Data Direction Register 1111 1111 1111 1111 08Fh(3) TRISD PORTD Data Direction Register 1111 1111 1111 1111 090h TRISE — — — — —(4) TRISE2(3) TRISE1(3) TRISE0(3) ---- 1111 ---- 1111 091h PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 092h PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 0000 00-0 0000 00-0 093h PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — -000 0-0- -000 0-0- 094h — Unimplemented — — 095h OPTION_R EG WPUEN INTEDG TMROCS TMROSE PSA PS<2:0> 1111 1111 1111 1111 096h PCON STKOVF STKUNF — — RMCLR RI POR BOR 00-- 11qq qq-- qquu 097h WDTCON — — WDTPS<4:0> SWDTEN --01 0110 --01 0110 098h OSCTUNE — — TUN<5:0> --00 0000 --00 0000 099h OSCCON SPLLEN IRCF<3:0> — SCS<1:0> 0011 1-00 0011 1-00 09Ah OSCSTAT T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS 00q0 0q0- qqqq qq0- 09Bh ADRESL A/D Result Register Low xxxx xxxx uuuu uuuu 09Ch ADRESH A/D Result Register High xxxx xxxx uuuu uuuu 09Dh ADCON0 — CHS<4:0> GO/DONE ADON -000 0000 -000 0000 09Eh ADCON1 ADFM ADCS<2:0> — ADNREF ADPREF1 ADPREF0 0000 -000 0000 -000 09Fh — Unimplemented — — TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 41. 2008-2011 Microchip Technology Inc. DS41364E-page 41 PIC16(L)F1934/6/7 Bank 2 100h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 101h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 102h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 103h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 104h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 105h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 106h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 107h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 108h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 109h(2) WREG Working Register 0000 0000 uuuu uuuu 10Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 10Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 10Ch LATA PORTA Data Latch xxxx xxxx uuuu uuuu 10Dh LATB PORTB Data Latch xxxx xxxx uuuu uuuu 10Eh LATC PORTC Data Latch xxxx xxxx uuuu uuuu 10Fh(3) LATD PORTD Data Latch xxxx xxxx uuuu uuuu 110h LATE — — — — — LATE2(3) LATE1(3) LATE0(3) ---- -xxx ---- -uuu 111h CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 0000 -100 0000 -100 112h CM1CON1 C1INTP C1INTN C1PCH1 C1PCH0 — — C1NCH<1:0> 0000 --00 0000 --00 113h CM2CON0 C2ON C2OUT C2OE C2POL — C2SP C2HYS C2SYNC 0000 -100 0000 -100 114h CM2CON1 C2INTP C2INTN C2PCH1 C2PCH0 — — C2NCH<1:0> 0000 --00 0000 --00 115h CMOUT — — — — — — MC2OUT MC1OUT ---- --00 ---- --00 116h BORCON SBOREN — — — — — — BORRDY 1--- ---q u--- ---u 117h FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR1 CDAFVR0 ADFVR<1:0> 0q00 0000 0q00 0000 118h DACCON0 DACEN DACLPS DACOE --- DACPSS<1:0> --- DACNSS 000- 00-0 000- 00-0 119h DACCON1 --- --- --- DACR<4:0> ---0 0000 ---0 0000 11Ah SRCON0 SRLEN SRCLK2 SRCLK1 SRCLK0 SRQEN SRNQEN SRPS SRPR 0000 0000 0000 0000 11Bh SRCON1 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E 0000 0000 0000 0000 11Ch — Unimplemented — — 11Dh APFCON — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL -000 0000 -000 0000 11Eh — Unimplemented — — 11Fh — Unimplemented — — TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 42. PIC16(L)F1934/6/7 DS41364E-page 42 2008-2011 Microchip Technology Inc. Bank 3 180h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 181h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 182h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 183h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 184h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 185h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 186h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 187h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 188h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 189h(2) WREG Working Register 0000 0000 uuuu uuuu 18Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 18Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 18Ch ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 --11 1111 --11 1111 18Dh ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 --11 1111 --11 1111 18Eh — Unimplemented — — 18Fh(3) ANSELD ANSD7 ANSD6 ANSD5 ANSD4 ANSD3 ANSD2 ANSD1 ANSD0 1111 1111 1111 1111 190h(3) ANSELE — — — — — ANSE2 ANSE1 ANSE0 ---- -111 ---- -111 191h EEADRL EEPROM / Program Memory Address Register Low Byte 0000 0000 0000 0000 192h EEADRH — EEPROM / Program Memory Address Register High Byte -000 0000 -000 0000 193h EEDATL EEPROM / Program Memory Read Data Register Low Byte xxxx xxxx uuuu uuuu 194h EEDATH — — EEPROM / Program Memory Read Data Register High Byte --xx xxxx --uu uuuu 195h EECON1 EEPGD CFGS LWLO FREE WRERR WREN WR RD 0000 x000 0000 q000 196h EECON2 EEPROM control register 2 0000 0000 0000 0000 197h — Unimplemented — — 198h — Unimplemented — — 199h RCREG USART Receive Data Register 0000 0000 0000 0000 19Ah TXREG USART Transmit Data Register 0000 0000 0000 0000 19Bh SPBRGL BRG<7:0> 0000 0000 0000 0000 19Ch SPBRGH BRG<15:8> 0000 0000 0000 0000 19Dh RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x 19Eh TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010 19Fh BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 01-0 0-00 01-0 0-00 TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 43. 2008-2011 Microchip Technology Inc. DS41364E-page 43 PIC16(L)F1934/6/7 Bank 4 200h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 201h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 202h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 203h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 204h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 205h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 206h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 207h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 208h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 209h(2) WREG Working Register 0000 0000 uuuu uuuu 20Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 20Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 20Ch — Unimplemented — — 20Dh WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 1111 1111 1111 1111 20Eh — Unimplemented — — 20Fh — Unimplemented — — 210h WPUE — — — — WPUE3 — — — ---- 1--- ---- 1--- 211h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu 212h SSPADD ADD<7:0> 0000 0000 0000 0000 213h SSPMSK MSK<7:0> 1111 1111 1111 1111 214h SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000 215h SSPCON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 0000 0000 0000 0000 216h SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000 217h SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000 218h — Unimplemented — — 219h — Unimplemented — — 21Ah — Unimplemented — — 21Bh — Unimplemented — — 21Ch — Unimplemented — — 21Dh — Unimplemented — — 21Eh — Unimplemented — — 21Fh — Unimplemented — — TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 44. PIC16(L)F1934/6/7 DS41364E-page 44 2008-2011 Microchip Technology Inc. Bank 5 280h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 281h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 282h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 283h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 284h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 285h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 286h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 287h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 288h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 289h(2) WREG Working Register 0000 0000 uuuu uuuu 28Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 28Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 28Ch — Unimplemented — — 28Dh — Unimplemented — — 28Eh — Unimplemented — — 28Fh — Unimplemented — — 290h — Unimplemented — — 291h CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx uuuu uuuu 292h CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx uuuu uuuu 293h CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 0000 0000 0000 0000 294h PWM1CON P1RSEN P1DC<6:0> 0000 0000 0000 0000 295h CCP1AS CCP1ASE CCP1AS<2:0> PSS1AC<1:0> PSS1BD<1:0> 0000 0000 0000 0000 296h PSTR1CON — — — STR1SYNC STR1D STR1C STR1B STR1A ---0 0001 ---0 0001 297h — Unimplemented — — 298h CCPR2L Capture/Compare/PWM Register 2 (LSB) xxxx xxxx uuuu uuuu 299h CCPR2H Capture/Compare/PWM Register 2 (MSB) xxxx xxxx uuuu uuuu 29Ah CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0> 0000 0000 0000 0000 29Bh PWM2CON P2RSEN P2DC<6:0> 0000 0000 0000 0000 29Ch CCP2AS CCP2ASE CCP2AS<2:0> PSS2AC<1:0> PSS2BD<1:0> 0000 0000 0000 0000 29Dh PSTR2CON — — — STR2SYNC STR2D STR2C STR2B STR2A ---0 0001 ---0 0001 29Eh CCPTMRS 0 C4TSEL1 C4TSEL0 C3TSEL1 C3TSEL0 C2TSEL1 C2TSEL0 C1TSEL1 C1TSEL0 0000 0000 0000 0000 29Fh CCPTMRS 1 — — — — — — C5TSEL<1:0> ---- --00 ---- --00 TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 45. 2008-2011 Microchip Technology Inc. DS41364E-page 45 PIC16(L)F1934/6/7 Bank 6 300h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 301h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 302h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 303h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 304h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 305h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 306h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 307h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 308h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 309h(2) WREG Working Register 0000 0000 uuuu uuuu 30Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 30Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 30Ch — Unimplemented — — 30Dh — Unimplemented — — 30Eh — Unimplemented — — 30Fh — Unimplemented — — 310h — Unimplemented — — 311h CCPR3L Capture/Compare/PWM Register 3 (LSB) xxxx xxxx uuuu uuuu 312h CCPR3H Capture/Compare/PWM Register 3 (MSB) xxxx xxxx uuuu uuuu 313h CCP3CON P3M<1:0> DC3B<1:0> CCP3M<1:0> 0000 0000 0000 0000 314h PWM3CON P3RSEN P3DC<6:0> 0000 0000 0000 0000 315h CCP3AS CCP3ASE CCP3AS<2:0> PSS3AC<1:0> PSS3BD<1:0> 0000 0000 0000 0000 316h PSTR3CON — — — STR3SYNC STR3D STR3C STR3B STR3A ---0 0001 ---0 0001 317h — Unimplemented — — 318h CCPR4L Capture/Compare/PWM Register 4 (LSB) xxxx xxxx uuuu uuuu 319h CCPR4H Capture/Compare/PWM Register 4 (MSB) xxxx xxxx uuuu uuuu 31Ah CCP4CON — — DC4B<1:0> CCP4M<3:0> --00 0000 --00 0000 31Bh — Unimplemented — — 31Ch CCPR5L Capture/Compare/PWM Register 5 (LSB) xxxx xxxx uuuu uuuu 31Dh CCPR5H Capture/Compare/PWM Register 5 (MSB) xxxx xxxx uuuu uuuu 31Eh CCP5CON — — DC5B<1:0> CCP5M<3:0> --00 0000 --00 0000 31Fh — Unimplemented — — TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 46. PIC16(L)F1934/6/7 DS41364E-page 46 2008-2011 Microchip Technology Inc. Bank 7 380h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 381h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 382h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 383h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 384h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 385h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 386h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 387h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 388h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 389h(2) WREG Working Register 0000 0000 uuuu uuuu 38Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 38Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 38Ch — Unimplemented — — 38Dh — Unimplemented — — 38Eh — Unimplemented — — 38Fh — Unimplemented — — 390h — Unimplemented — — 391h — Unimplemented — — 392h — Unimplemented — — 393h — Unimplemented — — 394h IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 0000 0000 0000 0000 395h IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 0000 0000 0000 0000 396h IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 0000 0000 0000 0000 397h — Unimplemented — — 398h — Unimplemented — — 399h — Unimplemented — — 39Ah — Unimplemented — — 39Bh — Unimplemented — — 39Ch — Unimplemented — — 39Dh — Unimplemented — — 39Eh — Unimplemented — — 39Fh — Unimplemented — — TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 47. 2008-2011 Microchip Technology Inc. DS41364E-page 47 PIC16(L)F1934/6/7 Bank 8 400h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 401h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 402h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 403h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 404h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 405h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 406h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 407h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 408h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 409h(2) WREG Working Register 0000 0000 uuuu uuuu 40Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 40Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 40Ch — Unimplemented — — 40Dh — Unimplemented — — 40Eh — Unimplemented — — 40Fh — Unimplemented — — 410h — Unimplemented — — 411h — Unimplemented — — 412h — Unimplemented — — 413h — Unimplemented — — 414h — Unimplemented — — 415h TMR4 Timer4 Module Register 0000 0000 0000 0000 416h PR4 Timer4 Period Register 1111 1111 1111 1111 417h T4CON — T4OUTPS<3:0> TMR4ON T4CKPS<1:0> -000 0000 -000 0000 418h — Unimplemented — — 419h — Unimplemented — — 41Ah — Unimplemented — — 41Bh — Unimplemented — — 41Ch TMR6 Timer6 Module Register 0000 0000 0000 0000 41Dh PR6 Timer6 Period Register 1111 1111 1111 1111 41Eh T6CON — T6OUTPS<3:0> TMR6ON T6CKPS<1:0> -000 0000 -000 0000 41Fh — Unimplemented — — TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 48. PIC16(L)F1934/6/7 DS41364E-page 48 2008-2011 Microchip Technology Inc. Banks 9-14 x00h/ x80h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx x00h/ x81h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx x02h/ x82h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 x03h/ x83h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu x04h/ x84h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu x05h/ x85h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 x06h/ x86h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu x07h/ x87h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 x08h/ x88h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 x09h/ x89h(2) WREG Working Register 0000 0000 uuuu uuuu x0Ah/ x8Ah(1),(2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 x0Bh/ x8Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 x0Ch/ x8Ch — x1Fh/ x9Fh — Unimplemented — — TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 49. 2008-2011 Microchip Technology Inc. DS41364E-page 49 PIC16(L)F1934/6/7 Bank 15 780h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 781h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 782h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 783h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 784h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 785h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 786h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 787h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 788h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 789h(2) WREG Working Register 0000 0000 uuuu uuuu 78Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 78Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 78Ch — Unimplemented — — 78Dh — Unimplemented — — 78Eh — Unimplemented — — 78Fh — Unimplemented — — 790h — Unimplemented — — 791h LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 000- 0011 000- 0011 792h LCDPS WFT BIASMD LCDA WA LP<3:0> 0000 0000 0000 0000 793h LCDREF LCDIRE LCDIRS LCDIRI — VLCD3PE VLCD2PE VLCD1PE — 000- 000- 000- 000- 794h LCDCST — — — — — LCDCST<2:0> ---- -000 ---- -000 795h LCDRL LRLAP<1:0> LRLBP<1:0> — LRLAT<2:0> 0000 -000 0000 -000 796h — Unimplemented — — 797h — Unimplemented — — 798h LCDSE0 SE<7:0> 0000 0000 uuuu uuuu 799h LCDSE1 SE<15:8> 0000 0000 uuuu uuuu 79Ah LCDSE2(3) SE<23:16> 0000 0000 uuuu uuuu 79Bh — Unimplemented — — 79Ch — Unimplemented — — 79Dh — Unimplemented — — 79Eh — Unimplemented — — 79Fh — Unimplemented — — 7A0h LCDDATA0 SEG7 COM0 SEG6 COM0 SEG5 COM0 SEG4 COM0 SEG3 COM0 SEG2 COM0 SEG1 COM0 SEG0 COM0 xxxx xxxx uuuu uuuu 7A1h LCDDATA1 SEG15 COM0 SEG14 COM0 SEG13 COM0 SEG12 COM0 SEG11 COM0 SEG10 COM0 SEG9 COM0 SEG8 COM0 xxxx xxxx uuuu uuuu 7A2h LCDDATA2( 3) SEG23 COM0 SEG22 COM0 SEG21 COM0 SEG20 COM0 SEG19 COM0 SEG18 COM0 SEG17 COM0 SEG16 COM0 xxxx xxxx uuuu uuuu 7A3h LCDDATA3 SEG7 COM1 SEG6 COM1 SEG5 COM1 SEG4 COM1 SEG3 COM1 SEG2 COM1 SEG1 COM1 SEG0 COM1 xxxx xxxx uuuu uuuu 7A4h LCDDATA4 SEG15 COM1 SEG14 COM1 SEG13 COM1 SEG12 COM1 SEG11 COM1 SEG10 COM1 SEG9 COM1 SEG8 COM1 xxxx xxxx uuuu uuuu 7A5h LCDDATA5( 3) SEG23 COM1 SEG22 COM1 SEG21 COM1 SEG20 COM1 SEG19 COM1 SEG18 COM1 SEG17 COM1 SEG16 COM1 xxxx xxxx uuuu uuuu TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 50. PIC16(L)F1934/6/7 DS41364E-page 50 2008-2011 Microchip Technology Inc. Bank 15 (Continued) 7A6h LCDDATA6 SEG7 COM2 SEG6 COM2 SEG5 COM2 SEG4 COM2 SEG3 COM2 SEG2 COM2 SEG1 COM2 SEG0 COM2 xxxx xxxx uuuu uuuu 7A7h LCDDATA7 SEG15 COM2 SEG14 COM2 SEG13 COM2 SEG12 COM2 SEG11 COM2 SEG10 COM2 SEG9 COM2 SEG8 COM2 xxxx xxxx uuuu uuuu 7A8h LCDDATA8( 3) SEG23 COM2 SEG22 COM2 SEG21 COM2 SEG20 COM2 SEG19 COM2 SEG18 COM2 SEG17 COM2 SEG16 COM2 xxxx xxxx uuuu uuuu 7A9h LCDDATA9 SEG7 COM3 SEG6 COM3 SEG5 COM3 SEG4 COM3 SEG3 COM3 SEG2 COM3 SEG1 COM3 SEG0 COM3 xxxx xxxx uuuu uuuu 7AAh LCDDATA1 0 SEG15 COM3 SEG14 COM3 SEG13 COM3 SEG12 COM3 SEG11 COM3 SEG10 COM3 SEG9 COM3 SEG8 COM3 xxxx xxxx uuuu uuuu 7ABh LCDDATA11( 3) SEG23 COM3 SEG22 COM3 SEG21 COM3 SEG20 COM3 SEG19 COM3 SEG18 COM3 SEG17 COM3 SEG16 COM3 xxxx xxxx uuuu uuuu 7ACh — 7EFh — Unimplemented — — TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 51. 2008-2011 Microchip Technology Inc. DS41364E-page 51 PIC16(L)F1934/6/7 Banks 16-30 x00h/ x80h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx x00h/ x81h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx x02h/ x82h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 x03h/ x83h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu x04h/ x84h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu x05h/ x85h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 x06h/ x86h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu x07h/ x87h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 x08h/ x88h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 x09h/ x89h(2) WREG Working Register 0000 0000 uuuu uuuu x0Ah/ x8Ah(1),(2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 x0Bh/ x8Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 x0Ch/ x8Ch — x1Fh/ x9Fh — Unimplemented — — TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 52. PIC16(L)F1934/6/7 DS41364E-page 52 2008-2011 Microchip Technology Inc. Bank 31 F80h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx F81h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx F82h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 F83h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu F84h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu F85h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 F86h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu F87h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 F88h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 F89h(2) WREG Working Register 0000 0000 uuuu uuuu F8Ah(1),(2 ) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 F8Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 F8Ch — FE3h — Unimplemented — — FE4h STATUS_ SHAD Z_SHAD DC_SHAD C_SHAD ---- -xxx ---- -uuu FE5h WREG_ SHAD Working Register Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu FE6h BSR_ SHAD Bank Select Register Normal (Non-ICD) Shadow ---x xxxx ---u uuuu FE7h PCLATH_ SHAD Program Counter Latch High Register Normal (Non-ICD) Shadow -xxx xxxx uuuu uuuu FE8h FSR0L_ SHAD Indirect Data Memory Address 0 Low Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu FE9h FSR0H_ SHAD Indirect Data Memory Address 0 High Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu FEAh FSR1L_ SHAD Indirect Data Memory Address 1 Low Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu FEBh FSR1H_ SHAD Indirect Data Memory Address 1 High Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu FECh — Unimplemented — — FEDh STKPTR — — — Current Stack pointer ---1 1111 ---1 1111 FEEh TOSL Top of Stack Low byte xxxx xxxx uuuu uuuu FEFh TOSH — Top of Stack High byte -xxx xxxx -uuu uuuu TABLE 3-12: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 4: Unimplemented, read as ‘1’.
- 53. 2008-2011 Microchip Technology Inc. DS41364E-page 53 PIC16(L)F1934/6/7 3.3 PCL and PCLATH The Program Counter (PC) is 15 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<14:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 3-4 shows the five situations for the loading of the PC. FIGURE 3-4: LOADING OF PC IN DIFFERENT SITUATIONS 3.3.1 MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Coun- ter PC<14:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the program counter to be changed by writing the desired upper 7 bits to the PCLATH register. When the lower 8 bits are written to the PCL register, all 15 bits of the program counter will change to the values con- tained in the PCLATH register and those being written to the PCL register. 3.3.2 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to Application Note AN556, “Implementing a Table Read” (DS00556). 3.3.3 COMPUTED FUNCTION CALLS A computed function CALL allows programs to maintain tables of functions and provide another way to execute state machines or look-up tables. When performing a table read using a computed function CALL, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). If using the CALL instruction, the PCH<2:0> and PCL registers are loaded with the operand of the CALL instruction. PCH<6:3> is loaded with PCLATH<6:3>. The CALLW instruction enables computed calls by com- bining PCLATH and W to form the destination address. A computed CALLW is accomplished by loading the W register with the desired address and executing CALLW. The PCL register is loaded with the value of W and PCH is loaded with PCLATH. 3.3.4 BRANCHING The branching instructions add an offset to the PC. This allows relocatable code and code that crosses page boundaries. There are two forms of branching, BRW and BRA. The PC will have incremented to fetch the next instruction in both cases. When using either branching instruction, a PCL memory boundary may be crossed. If using BRW, load the W register with the desired unsigned address and execute BRW. The entire PC will be loaded with the address PC + 1 + W. If using BRA, the entire PC will be loaded with PC + 1 +, the signed value of the operand of the BRA instruction. PCL PCH 0 14 PC 0 6 7 ALU Result 8 PCLATH PCL PCH 0 14 PC 0 6 4 OPCODE <10:0> 11 PCLATH PCL PCH 0 14 PC 0 6 7 W 8 PCLATH Instruction with PCL as Destination GOTO, CALL CALLW PCL PCH 0 14 PC PC + W 15 BRW PCL PCH 0 14 PC PC + OPCODE <8:0> 15 BRA
- 54. PIC16(L)F1934/6/7 DS41364E-page 54 2008-2011 Microchip Technology Inc. 3.4 Stack All devices have a 16-level x 15-bit wide hardware stack (refer to Figure 3-1 and Figure 3-2). The stack space is not part of either program or data space. The PC is PUSHed onto the stack when CALL or CALLW instructions are executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer if the STVREN bit is programmed to ‘0‘ (Configuration Word 2). This means that after the stack has been PUSHed sixteen times, the seventeenth PUSH overwrites the value that was stored from the first PUSH. The eighteenth PUSH overwrites the second PUSH (and so on). The STKOVF and STKUNF flag bits will be set on an Over- flow/Underflow, regardless of whether the Reset is enabled. 3.4.1 ACCESSING THE STACK The stack is available through the TOSH, TOSL and STKPTR registers. STKPTR is the current value of the Stack Pointer. TOSH:TOSL register pair points to the TOP of the stack. Both registers are read/writable. TOS is split into TOSH and TOSL due to the 15-bit size of the PC. To access the stack, adjust the value of STKPTR, which will position TOSH:TOSL, then read/write to TOSH:TOSL. STKPTR is 5 bits to allow detection of overflow and underflow. During normal program operation, CALL, CALLW and Interrupts will increment STKPTR while RETLW, RETURN, and RETFIE will decrement STKPTR. At any time STKPTR can be inspected to see how much stack is left. The STKPTR always points at the currently used place on the stack. Therefore, a CALL or CALLW will increment the STKPTR and then write the PC, and a return will unload the PC and then decrement the STKPTR. Reference Figure 3-5 through Figure 3-8 for examples of accessing the stack. FIGURE 3-5: ACCESSING THE STACK EXAMPLE 1 Note 1: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, CALLW, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. Note: Care should be taken when modifying the STKPTR while interrupts are enabled. 0x0F 0x0E 0x0D 0x0C 0x0B 0x0A 0x09 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 0x00 0x0000 STKPTR = 0x1F Initial Stack Configuration: After Reset, the stack is empty. The empty stack is initialized so the Stack Pointer is pointing at 0x1F. If the Stack Overflow/Underflow Reset is enabled, the TOSH/TOSL registers will return ‘0’. If the Stack Overflow/Underflow Reset is disabled, the TOSH/TOSL registers will return the contents of stack address 0x0F. 0x1F STKPTR = 0x1F Stack Reset Disabled (STVREN = 0) Stack Reset Enabled (STVREN = 1) TOSH:TOSL TOSH:TOSL
- 55. 2008-2011 Microchip Technology Inc. DS41364E-page 55 PIC16(L)F1934/6/7 FIGURE 3-6: ACCESSING THE STACK EXAMPLE 2 FIGURE 3-7: ACCESSING THE STACK EXAMPLE 3 0x0F 0x0E 0x0D 0x0C 0x0B 0x0A 0x09 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 Return Address 0x00 STKPTR = 0x00 This figure shows the stack configuration after the first CALL or a single interrupt. If a RETURN instruction is executed, the return address will be placed in the Program Counter and the Stack Pointer decremented to the empty state (0x1F). TOSH:TOSL 0x0F 0x0E 0x0D 0x0C 0x0B 0x0A 0x09 0x08 0x07 Return Address 0x06 Return Address 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address 0x00 STKPTR = 0x06 After seven CALLs or six CALLs and an interrupt, the stack looks like the figure on the left. A series of RETURN instructions will repeatedly place the return addresses into the Program Counter and pop the stack. TOSH:TOSL
- 56. PIC16(L)F1934/6/7 DS41364E-page 56 2008-2011 Microchip Technology Inc. FIGURE 3-8: ACCESSING THE STACK EXAMPLE 4 3.4.2 OVERFLOW/UNDERFLOW RESET If the STVREN bit in Configuration Word 2 is programmed to ‘1’, the device will be reset if the stack is PUSHed beyond the sixteenth level or POPed beyond the first level, setting the appropriate bits (STKOVF or STKUNF, respectively) in the PCON register. 3.5 Indirect Addressing The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the File Select Registers (FSR). If the FSRn address specifies one of the two INDFn registers, the read will return ‘0’ and the write will not occur (though Status bits may be affected). The FSRn register value is created by the pair FSRnH and FSRnL. The FSR registers form a 16-bit address that allows an addressing space with 65536 locations. These locations are divided into three memory regions: • Traditional Data Memory • Linear Data Memory • Program Flash Memory 0x0F 0x0E 0x0D 0x0C 0x0B 0x0A 0x09 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 Return Address 0x00 STKPTR = 0x10 When the stack is full, the next CALL or an interrupt will set the Stack Pointer to 0x10. This is identical to address 0x00 so the stack will wrap and overwrite the return address at 0x00. If the Stack Overflow/Underflow Reset is enabled, a Reset will occur and location 0x00 will not be overwritten. Return Address Return Address Return Address Return Address Return Address Return Address Return Address Return Address Return Address Return Address Return Address Return Address Return Address Return Address Return Address TOSH:TOSL
- 57. 2008-2011 Microchip Technology Inc. DS41364E-page 57 PIC16(L)F1934/6/7 FIGURE 3-9: INDIRECT ADDRESSING 0x0000 0x0FFF Traditional FSR Address Range Data Memory 0x1000 Reserved Linear Data Memory Reserved 0x2000 0x29AF 0x29B0 0x7FFF 0x8000 0xFFFF 0x0000 0x0FFF 0x0000 0x7FFF Program Flash Memory Note: Not all memory regions are completely implemented. Consult device memory tables for memory limits. 0x1FFF
- 58. PIC16(L)F1934/6/7 DS41364E-page 58 2008-2011 Microchip Technology Inc. 3.5.1 TRADITIONAL DATA MEMORY The traditional data memory is a region from FSR address 0x000 to FSR address 0xFFF. The addresses correspond to the absolute addresses of all SFR, GPR and common registers. FIGURE 3-10: TRADITIONAL DATA MEMORY MAP Indirect Addressing Direct Addressing Bank Select Location Select 4 BSR 6 0 From Opcode FSRxL 7 0 Bank Select Location Select 0000 0001 0010 1111 0x00 0x7F Bank 0 Bank 1 Bank 2 Bank 31 0 FSRxH 7 0 0 0 0 0
- 59. 2008-2011 Microchip Technology Inc. DS41364E-page 59 PIC16(L)F1934/6/7 3.5.2 LINEAR DATA MEMORY The linear data memory is the region from FSR address 0x2000 to FSR address 0x29AF. This region is a virtual region that points back to the 80-byte blocks of GPR memory in all the banks. Unimplemented memory reads as 0x00. Use of the linear data memory region allows buffers to be larger than 80 bytes because incrementing the FSR beyond one bank will go directly to the GPR memory of the next bank. The 16 bytes of common memory are not included in the linear data memory region. FIGURE 3-11: LINEAR DATA MEMORY MAP 3.5.3 PROGRAM FLASH MEMORY To make constant data access easier, the entire program Flash memory is mapped to the upper half of the FSR address space. When the MSB of FSRnH is set, the lower 15 bits are the address in program memory which will be accessed through INDF. Only the lower 8 bits of each memory location is accessible via INDF. Writing to the program Flash memory cannot be accomplished via the FSR/INDF interface. All instructions that access program Flash memory via the FSR/INDF interface will require one additional instruction cycle to complete. FIGURE 3-12: PROGRAM FLASH MEMORY MAP 7 0 1 7 0 0 Location Select 0x2000 FSRnH FSRnL 0x020 Bank 0 0x06F 0x0A0 Bank 1 0x0EF 0x120 Bank 2 0x16F 0xF20 Bank 30 0xF6F 0x29AF 0 7 1 7 0 0 Location Select 0x8000 FSRnH FSRnL 0x0000 0x7FFF 0xFFFF Program Flash Memory (low 8 bits)
- 60. PIC16(L)F1934/6/7 DS41364E-page 60 2008-2011 Microchip Technology Inc. NOTES:
- 61. 2008-2011 Microchip Technology Inc. DS41364E-page 61 PIC16(L)F1934/6/7 4.0 DEVICE CONFIGURATION Device Configuration consists of Configuration Word 1 and Configuration Word 2, Code Protection and Device ID. 4.1 Configuration Words There are several Configuration Word bits that allow different oscillator and memory protection options. These are implemented as Configuration Word 1 at 8007h and Configuration Word 2 at 8008h. Note: The DEBUG bit in Configuration Word 2 is managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’.
- 62. PIC16(L)F1934/6/7 DS41364E-page 62 2008-2011 Microchip Technology Inc. REGISTER 4-1: CONFIGURATION WORD 1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 FCMEN IESO CLKOUTEN BOREN1 BOREN0 CPD CP bit 13 bit 7 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 MCLRE PWRTE WDTE1 WDTE0 FOSC2 FOSC1 FOSC0 bit 6 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13 FCMEN: Fail-Safe Clock Monitor Enable bit 1 = Fail-Safe Clock Monitor is enabled 0 = Fail-Safe Clock Monitor is disabled bit 12 IESO: Internal External Switchover bit 1 = Internal/External Switchover mode is enabled 0 = Internal/External Switchover mode is disabled bit 11 CLKOUTEN: Clock Out Enable bit 1 = CLKOUT function is disabled. I/O or oscillator function on RA6/CLKOUT 0 = CLKOUT function is enabled on RA6/CLKOUT bit 10-9 BOREN<1:0>: Brown-out Reset Enable bits(1) 11 = BOR enabled 10 = BOR enabled during operation and disabled in Sleep 01 = BOR controlled by SBOREN bit of the PCON register 00 = BOR disabled bit 8 CPD: Data Code Protection bit(2) 1 = Data memory code protection is disabled 0 = Data memory code protection is enabled bit 7 CP: Code Protection bit(3) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 6 MCLRE: RE3/MCLR/VPP Pin Function Select bit If LVP bit = 1: This bit is ignored. If LVP bit = 0: 1 = RE3/MCLR/VPP pin function is MCLR; Weak pull-up enabled. 0 = RE3/MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUE3 bit.. bit 5 PWRTE: Power-up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled bit 4-3 WDTE<1:0>: Watchdog Timer Enable bit 11 = WDT enabled 10 = WDT enabled while running and disabled in Sleep 01 = WDT controlled by the SWDTEN bit in the WDTCON register 00 = WDT disabled Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer. 2: The entire data EEPROM will be erased when the code protection is turned off during an erase. 3: The entire program memory will be erased when the code protection is turned off.
- 63. 2008-2011 Microchip Technology Inc. DS41364E-page 63 PIC16(L)F1934/6/7 bit 2-0 FOSC<2:0>: Oscillator Selection bits 111 = ECH: External Clock, High-Power mode: CLKIN on RA7/OSC1/CLKIN 110 = ECM: External Clock, Medium-Power mode: CLKIN on RA7/OSC1/CLKIN 101 = ECL: External Clock, Low-Power mode: CLKIN on RA7/OSC1/CLKIN 100 = INTOSC oscillator: I/O function on RA7/OSC1/CLKIN 011 = EXTRC oscillator: RC function on RA7/OSC1/CLKIN 010 = HS oscillator: High-speed crystal/resonator on RA6/OSC2/CLKOUT pin and RA7/OSC1/CLKIN 001 = XT oscillator: Crystal/resonator on RA6/OSC2/CLKOUT pin and RA7/OSC1/CLKIN 000 = LP oscillator: Low-power crystal on RA6/OSC2/CLKOUT pin and RA7/OSC1/CLKIN REGISTER 4-1: CONFIGURATION WORD 1 (CONTINUED) Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer. 2: The entire data EEPROM will be erased when the code protection is turned off during an erase. 3: The entire program memory will be erased when the code protection is turned off.
- 64. PIC16(L)F1934/6/7 DS41364E-page 64 2008-2011 Microchip Technology Inc. REGISTER 4-2: CONFIGURATION WORD 2 R/P-1/1 R/P-1/1 U-1 R/P-1/1 R/P-1/1 R/P-1/1 U-1 LVP(1) DEBUG(3) — BORV STVREN PLLEN — bit 13 bit 7 U-1 R/P-1/1 R/P-1/1 U-1 U-1 R/P-1/1 R/P-1/1 — VCAPEN<1:0>(2) — — WRT1 WRT0 bit 6 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13 LVP: Low-Voltage Programming Enable bit(1) 1 = Low-voltage programming enabled 0 = High-voltage on MCLR/VPP must be used for programming bit 12 DEBUG: In-Circuit Debugger Mode bit(3) 1 = In-Circuit Debugger disabled, RB6/ICSPCLK and RB7/ICSPDAT are general purpose I/O pins 0 = In-Circuit Debugger enabled, RB6/ICSPCLK and RB7/ICSPDAT are dedicated to the debugger bit 11 Unimplemented: Read as ‘1’ bit 10 BORV: Brown-out Reset Voltage Selection bit 1 = Brown-out Reset voltage set to 1.9V 0 = Brown-out Reset voltage set to 2.5V bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit 1 = Stack Overflow or Underflow will cause a Reset 0 = Stack Overflow or Underflow will not cause a Reset bit 8 PLLEN: PLL Enable bit 1 = 4xPLL enabled 0 = 4xPLL disabled bit 7-6 Unimplemented: Read as ‘1’ bit 5-4 VCAPEN<1:0>: Voltage Regulator Capacitor Enable bits(2) 00 = VCAP functionality is enabled on RA0 01 = VCAP functionality is enabled on RA5 10 = VCAP functionality is enabled on RA6 11 = No capacitor on VCAP pin bit 3-2 Unimplemented: Read as ‘1’ bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits 4 kW Flash memory PIC16(L)F1934 only): 11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to FFFh may be modified by EECON control 01 = 000h to 7FFh write-protected, 800h to FFFh may be modified by EECON control 00 = 000h to FFFh write-protected, no addresses may be modified by EECON control 8 kW Flash memory (PIC16(L)F1936 and PIC16(L)F1937 only): 11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to 1FFFh may be modified by EECON control 01 = 000h to FFFh write-protected, 1000h to 1FFFh may be modified by EECON control 00 = 000h to 1FFFh write-protected, no addresses may be modified by EECON control Note 1: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP. 2: Reads as ‘11’ on PIC16LF193X only. 3: The DEBUG bit in Configuration Word is managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’.
- 65. 2008-2011 Microchip Technology Inc. DS41364E-page 65 PIC16(L)F1934/6/7 4.2 Code Protection Code protection allows the device to be protected from unauthorized access. Program memory protection and data EEPROM protection are controlled independently. Internal access to the program memory and data EEPROM are unaffected by any code protection setting. 4.2.1 PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in Configuration Word 1. When CP = 0, external reads and writes of program memory are inhibited and a read will return all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. See Section 4.3 “Write Protection” for more information. 4.2.2 DATA EEPROM PROTECTION The entire data EEPROM is protected from external reads and writes by the CPD bit. When CPD = 0, external reads and writes of data EEPROM are inhibited. The CPU can continue to read and write data EEPROM regardless of the protection bit settings. 4.3 Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as bootloader software, can be protected while allowing other regions of the program memory to be modified. The WRT<1:0> bits in Configuration Word 2 define the size of the program memory block that is protected. 4.4 User ID Four memory locations (8000h-8003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are readable and writable during normal execution. See Section 4.5 “Device ID and Revision ID” for more information on accessing these memory locations. For more information on checksum calculation, see the “PIC16F193X/LF193X/PIC16F194X/LF194X/PIC16LF 190X Memory Programming Specification” (DS41397).
- 66. PIC16(L)F1934/6/7 DS41364E-page 66 2008-2011 Microchip Technology Inc. 4.5 Device ID and Revision ID The memory location 8006h is where the Device ID and Revision ID are stored. The upper nine bits hold the Device ID. The lower five bits hold the Revision ID. See Section 11.5 “User ID, Device ID and Configuration Word Access” for more information on accessing these memory locations. Development tools, such as device programmers and debuggers, may be used to read the Device ID and Revision ID. REGISTER 4-3: DEVICEID: DEVICE ID REGISTER(1) R R R R R R R DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 DEV2 bit 13 bit 7 R R R R R R R DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 bit 6 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit W = Writable bit ‘0’ = Bit is cleared -n = Value at POR ‘1’ = Bit is set x = Bit is unknown bit 13-5 DEV<8:0>: Device ID bits 100011010 = PIC16F1934 100011011 = PIC16F1936 100011100 = PIC16F1937 100100010 = PIC16LF1934 100100011 = PIC16LF1936 100100100 = PIC16LF1937 bit 4-0 REV<4:0>: Revision ID bits These bits are used to identify the revision. Note 1: This location cannot be written.
- 67. 2008-2011 Microchip Technology Inc. DS41364E-page 67 PIC16(L)F1934/6/7 5.0 OSCILLATOR MODULE (WITH FAIL-SAFE CLOCK MONITOR) 5.1 Overview The oscillator module has a wide variety of clock sources and selection features that allow it to be used in a wide range of applications while maximizing perfor- mance and minimizing power consumption. Figure 5-1 illustrates a block diagram of the oscillator module. Clock sources can be supplied from external oscillators, quartz crystal resonators, ceramic resonators and Resistor-Capacitor (RC) circuits. In addition, the system clock source can be supplied from one of two internal oscillators and PLL circuits, with a choice of speeds selectable via software. Additional clock features include: • Selectable system clock source between external or internal sources via software. • Two-Speed Start-up mode, which minimizes latency between external oscillator start-up and code execution. • Fail-Safe Clock Monitor (FSCM) designed to detect a failure of the external clock source (LP, XT, HS, EC or RC modes) and switch automatically to the internal oscillator. • Oscillator Start-up Timer (OST) ensures stability of crystal oscillator sources The oscillator module can be configured in one of eight clock modes. 1. ECL – External Clock Low-Power mode (0 MHz to 0.5 MHz) 2. ECM – External Clock Medium-Power mode (0.5 MHz to 4 MHz) 3. ECH – External Clock High-Power mode (4 MHz to 32 MHz) 4. LP – 32 kHz Low-Power Crystal mode. 5. XT – Medium Gain Crystal or Ceramic Resonator Oscillator mode (up to 4 MHz) 6. HS – High Gain Crystal or Ceramic Resonator mode (4 MHz to 20 MHz) 7. RC – External Resistor-Capacitor (RC). 8. INTOSC – Internal oscillator (31 kHz to 32 MHz). Clock Source modes are selected by the FOSC<2:0> bits in the Configuration Word 1. The FOSC bits determine the type of oscillator that will be used when the device is first powered. The EC clock mode relies on an external logic level signal as the device clock source. The LP, XT, and HS clock modes require an external crystal or resonator to be connected to the device. Each mode is optimized for a different frequency range. The RC clock mode requires an external resistor and capacitor to set the oscillator frequency. The INTOSC internal oscillator block produces low, medium, and high frequency clock sources, designated LFINTOSC, MFINTOSC, and HFINTOSC. (see Internal Oscillator Block, Figure 5-1). A wide selection of device clock frequencies may be derived from these three clock sources.
- 68. PIC16(L)F1934/6/7 DS41364E-page 68 2008-2011 Microchip Technology Inc. FIGURE 5-1: SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM 4 x PLL FOSC<2:0> Oscillator T1OSCEN Enable Oscillator T1OSO T1OSI Clock Source Option for other modules OSC1 OSC2 Sleep LP, XT, HS, RC, EC T1OSC CPU and Postscaler MUX MUX 16 MHz 8 MHz 4 MHz 2 MHz 1 MHz 250 kHz 500 kHz IRCF<3:0> 31 kHz 500 kHz Source Internal Oscillator Block WDT, PWRT, Fail-Safe Clock Monitor 16 MHz Internal Oscillator (HFINTOSC) Clock Control SCS<1:0> HFPLL 31 kHz (LFINTOSC) Two-Speed Start-up and other modules Oscillator 31 kHz Source 500 kHz (MFINTOSC) 125 kHz 31.25 kHz 62.5 kHz FOSC<2:0> = 100 Peripherals Sleep External Timer1
- 69. 2008-2011 Microchip Technology Inc. DS41364E-page 69 PIC16(L)F1934/6/7 5.2 Clock Source Types Clock sources can be classified as external or internal. External clock sources rely on external circuitry for the clock source to function. Examples are: oscillator mod- ules (EC mode), quartz crystal resonators or ceramic resonators (LP, XT and HS modes) and Resis- tor-Capacitor (RC) mode circuits. Internal clock sources are contained internally within the oscillator module. The internal oscillator block has two internal oscillators and a dedicated Phase-Lock Loop (HFPLL) that are used to generate three internal system clock sources: the 16 MHz High-Frequency Internal Oscillator (HFINTOSC), 500 kHz (MFINTOSC) and the 31 kHz Low-Frequency Internal Oscillator (LFINTOSC). The system clock can be selected between external or internal clock sources via the System Clock Select (SCS) bits in the OSCCON register. See Section 5.3 “Clock Switching” for additional information. 5.2.1 EXTERNAL CLOCK SOURCES An external clock source can be used as the device system clock by performing one of the following actions: • Program the FOSC<2:0> bits in the Configuration Word 1 to select an external clock source that will be used as the default system clock upon a device Reset. • Write the SCS<1:0> bits in the OSCCON register to switch the system clock source to: - Timer1 Oscillator during run-time, or - An external clock source determined by the value of the FOSC bits. See Section 5.3 “Clock Switching”for more informa- tion. 5.2.1.1 EC Mode The External Clock (EC) mode allows an externally generated logic level signal to be the system clock source. When operating in this mode, an external clock source is connected to the OSC1 input. OSC2/CLKOUT is available for general purpose I/O or CLKOUT. Figure 5-2 shows the pin connections for EC mode. EC mode has 3 power modes to select from through Configuration Word 1: • High power, 4-32 MHz (FOSC = 111) • Medium power, 0.5-4 MHz (FOSC = 110) • Low power, 0-0.5 MHz (FOSC = 101) The Oscillator Start-up Timer (OST) is disabled when EC mode is selected. Therefore, there is no delay in operation after a Power-on Reset (POR) or wake-up from Sleep. Because the PIC® MCU design is fully static, stopping the external clock input will have the effect of halting the device while leaving all data intact. Upon restarting the external clock, the device will resume operation as if no time had elapsed. FIGURE 5-2: EXTERNAL CLOCK (EC) MODE OPERATION 5.2.1.2 LP, XT, HS Modes The LP, XT and HS modes support the use of quartz crystal resonators or ceramic resonators connected to OSC1 and OSC2 (Figure 5-3). The three modes select a low, medium or high gain setting of the internal inverter-amplifier to support various resonator types and speed. LP Oscillator mode selects the lowest gain setting of the internal inverter-amplifier. LP mode current consumption is the least of the three modes. This mode is designed to drive only 32.768 kHz tuning-fork type crystals (watch crystals). XT Oscillator mode selects the intermediate gain setting of the internal inverter-amplifier. XT mode current consumption is the medium of the three modes. This mode is best suited to drive resonators with a medium drive level specification. HS Oscillator mode selects the highest gain setting of the internal inverter-amplifier. HS mode current consumption is the highest of the three modes. This mode is best suited for resonators that require a high drive setting. Figure 5-3 and Figure 5-4 show typical circuits for quartz crystal and ceramic resonators, respectively. OSC1/CLKIN OSC2/CLKOUT Clock from Ext. System PIC® MCU FOSC/4 or I/O(1) Note 1: Output depends upon CLKOUTEN bit of the Configuration Word 1.
- 70. PIC16(L)F1934/6/7 DS41364E-page 70 2008-2011 Microchip Technology Inc. FIGURE 5-3: QUARTZ CRYSTAL OPERATION (LP, XT OR HS MODE) FIGURE 5-4: CERAMIC RESONATOR OPERATION (XT OR HS MODE) 5.2.1.3 Oscillator Start-up Timer (OST) If the oscillator module is configured for LP, XT or HS modes, the Oscillator Start-up Timer (OST) counts 1024 oscillations from OSC1. This occurs following a Power-on Reset (POR) and when the Power-up Timer (PWRT) has expired (if configured), or a wake-up from Sleep. During this time, the program counter does not increment and program execution is suspended. The OST ensures that the oscillator circuit, using a quartz crystal resonator or ceramic resonator, has started and is providing a stable system clock to the oscillator module. In order to minimize latency between external oscillator start-up and code execution, the Two-Speed Clock Start-up mode can be selected (see Section 5.4 “Two-Speed Clock Start-up Mode”). 5.2.1.4 4X PLL The oscillator module contains a 4X PLL that can be used with both external and internal clock sources to provide a system clock source. The input frequency for the 4X PLL must fall within specifications. See the PLL Clock Timing specifications in the applicable Electrical Specifications Chapter. The 4X PLL may be enabled for use by one of two methods: 1. Program the PLLEN bit in Configuration Word 2 to a ‘1’. 2. Write the SPLLEN bit in the OSCCON register to a ‘1’. If the PLLEN bit in Configuration Word 2 is programmed to a ‘1’, then the value of SPLLEN is ignored. Note 1: Quartz crystal characteristics vary according to type, package and manufacturer. The user should consult the manufacturer data sheets for specifications and recommended application. 2: Always verify oscillator performance over the VDD and temperature range that is expected for the application. 3: For oscillator design assistance, reference the following Microchip Applications Notes: • AN826, “Crystal Oscillator Basics and Crystal Selection for rfPIC® and PIC® Devices” (DS00826) • AN849, “Basic PIC® Oscillator Design” (DS00849) • AN943, “Practical PIC® Oscillator Analysis and Design” (DS00943) • AN949, “Making Your Oscillator Work” (DS00949) Note 1: A series resistor (RS) may be required for quartz crystals with low drive level. 2: The value of RF varies with the Oscillator mode selected (typically between 2 M to 10 M. C1 C2 Quartz RS (1) OSC1/CLKIN RF (2) Sleep To Internal Logic PIC® MCU Crystal OSC2/CLKOUT Note 1: A series resistor (RS) may be required for ceramic resonators with low drive level. 2: The value of RF varies with the Oscillator mode selected (typically between 2 M to 10 M. 3: An additional parallel feedback resistor (RP) may be required for proper ceramic resonator operation. C1 C2 Ceramic RS(1) OSC1/CLKIN RF (2) Sleep To Internal Logic PIC® MCU RP(3) Resonator OSC2/CLKOUT
- 71. 2008-2011 Microchip Technology Inc. DS41364E-page 71 PIC16(L)F1934/6/7 5.2.1.5 TIMER1 Oscillator The Timer1 Oscillator is a separate crystal oscillator that is associated with the Timer1 peripheral. It is opti- mized for timekeeping operations with a 32.768 kHz crystal connected between the T1OSO and T1OSI device pins. The Timer1 Oscillator can be used as an alternate sys- tem clock source and can be selected during run-time using clock switching. Refer to Section 5.3 “Clock Switching” for more information. FIGURE 5-5: QUARTZ CRYSTAL OPERATION (TIMER1 OSCILLATOR) 5.2.1.6 External RC Mode The external Resistor-Capacitor (RC) modes support the use of an external RC circuit. This allows the designer maximum flexibility in frequency choice while keeping costs to a minimum when clock accuracy is not required. The RC circuit connects to OSC1. OSC2/CLKOUT is available for general purpose I/O or CLKOUT. The function of the OSC2/CLKOUT pin is determined by the state of the CLKOUTEN bit in Configuration Word 1. Figure 5-6 shows the external RC mode connections. FIGURE 5-6: EXTERNAL RC MODES The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values and the operating temperature. Other factors affecting the oscillator frequency are: • threshold voltage variation • component tolerances • packaging variations in capacitance The user also needs to take into account variation due to tolerance of external RC components used. Note 1: Quartz crystal characteristics vary according to type, package and manufacturer. The user should consult the manufacturer data sheets for specifications and recommended application. 2: Always verify oscillator performance over the VDD and temperature range that is expected for the application. 3: For oscillator design assistance, reference the following Microchip Applications Notes: • AN826, “Crystal Oscillator Basics and Crystal Selection for rfPIC® and PIC® Devices” (DS00826) • AN849, “Basic PIC® Oscillator Design” (DS00849) • AN943, “Practical PIC® Oscillator Analysis and Design” (DS00943) • AN949, “Making Your Oscillator Work” (DS00949) • TB097, “Interfacing a Micro Crystal MS1V-T1K 32.768 kHz Tuning Fork Crystal to a PIC16F690/SS” (DS91097) • AN1288, “Design Practices for Low-Power External Oscillators” (DS01288) C1 C2 32.768 kHz T1OSI To Internal Logic PIC® MCU Crystal T1OSO Quartz OSC2/CLKOUT CEXT REXT PIC® MCU OSC1/CLKIN FOSC/4 or Internal Clock VDD VSS Recommended values: 10 k REXT 100 k, <3V 3 k REXT 100 k, 3-5V CEXT > 20 pF, 2-5V Note 1: Output depends upon CLKOUTEN bit of the Configuration Word 1. I/O(1)
- 72. PIC16(L)F1934/6/7 DS41364E-page 72 2008-2011 Microchip Technology Inc. 5.2.2 INTERNAL CLOCK SOURCES The device may be configured to use the internal oscil- lator block as the system clock by performing one of the following actions: • Program the FOSC<2:0> bits in Configuration Word 1 to select the INTOSC clock source, which will be used as the default system clock upon a device Reset. • Write the SCS<1:0> bits in the OSCCON register to switch the system clock source to the internal oscillator during run-time. See Section 5.3 “Clock Switching”for more information. In INTOSC mode, OSC1/CLKIN is available for general purpose I/O. OSC2/CLKOUT is available for general purpose I/O or CLKOUT. The function of the OSC2/CLKOUT pin is determined by the state of the CLKOUTEN bit in Configuration Word 1. The internal oscillator block has two independent oscillators and a dedicated Phase-Lock Loop, HFPLL that can produce one of three internal system clock sources. 1. The HFINTOSC (High-Frequency Internal Oscillator) is factory calibrated and operates at 16 MHz. The HFINTOSC source is generated from the 500 kHz MFINTOSC source and the dedicated Phase-Lock Loop, HFPLL. The frequency of the HFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 5-3). 2. The MFINTOSC (Medium-Frequency Internal Oscillator) is factory calibrated and operates at 500 kHz. The frequency of the MFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 5-3). 3. The LFINTOSC (Low-Frequency Internal Oscillator) is uncalibrated and operates at 31 kHz. 5.2.2.1 HFINTOSC The High-Frequency Internal Oscillator (HFINTOSC) is a factory calibrated 16 MHz internal clock source. The frequency of the HFINTOSC can be altered via software using the OSCTUNE register (Register 5-3). The output of the HFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). One of nine frequencies derived from the HFINTOSC can be selected via software using the IRCF<3:0> bits of the OSCCON register. See Section 5.2.2.7 “Internal Oscillator Clock Switch Timing” for more information. The HFINTOSC is enabled by: • Configure the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and • FOSC<2:0> = 100, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’. The High-Frequency Internal Oscillator Ready bit (HFIOFR) of the OSCSTAT register indicates when the HFINTOSC is running and can be utilized. The High-Frequency Internal Oscillator Status Locked bit (HFIOFL) of the OSCSTAT register indicates when the HFINTOSC is running within 2% of its final value. The High-Frequency Internal Oscillator Status Stable bit (HFIOFS) of the OSCSTAT register indicates when the HFINTOSC is running within 0.5% of its final value. 5.2.2.2 MFINTOSC The Medium-Frequency Internal Oscillator (MFINTOSC) is a factory calibrated 500 kHz internal clock source. The frequency of the MFINTOSC can be altered via software using the OSCTUNE register (Register 5-3). The output of the MFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). One of nine frequencies derived from the MFINTOSC can be selected via software using the IRCF<3:0> bits of the OSCCON register. See Section 5.2.2.7 “Internal Oscillator Clock Switch Timing” for more information. The MFINTOSC is enabled by: • Configure the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and • FOSC<2:0> = 100, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’ The Medium-Frequency Internal Oscillator Ready bit (MFIOFR) of the OSCSTAT register indicates when the MFINTOSC is running and can be utilized.
- 73. 2008-2011 Microchip Technology Inc. DS41364E-page 73 PIC16(L)F1934/6/7 5.2.2.3 Internal Oscillator Frequency Adjustment The 500 kHz internal oscillator is factory calibrated. This internal oscillator can be adjusted in software by writing to the OSCTUNE register (Register 5-3). Since the HFINTOSC and MFINTOSC clock sources are derived from the 500 kHz internal oscillator a change in the OSCTUNE register value will apply to both. The default value of the OSCTUNE register is ‘0’. The value is a 5-bit two’s complement number. A value of 0Fh will provide an adjustment to the maximum frequency. A value of 10h will provide an adjustment to the minimum frequency. When the OSCTUNE register is modified, the oscillator frequency will begin shifting to the new frequency. Code execution continues during this shift. There is no indication that the shift has occurred. OSCTUNE does not affect the LFINTOSC frequency. Operation of features that depend on the LFINTOSC clock source frequency, such as the Power-up Timer (PWRT), Watchdog Timer (WDT), Fail-Safe Clock Monitor (FSCM) and peripherals, are not affected by the change in frequency. 5.2.2.4 LFINTOSC The Low-Frequency Internal Oscillator (LFINTOSC) is an uncalibrated 31 kHz internal clock source. The output of the LFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). Select 31 kHz, via software, using the IRCF<3:0> bits of the OSCCON register. See Section 5.2.2.7 “Internal Oscillator Clock Switch Timing” for more information. The LFINTOSC is also the frequency for the Power-up Timer (PWRT), Watchdog Timer (WDT) and Fail-Safe Clock Monitor (FSCM). The LFINTOSC is enabled by selecting 31 kHz (IRCF<3:0> bits of the OSCCON register = 000) as the system clock source (SCS bits of the OSCCON register = 1x), or when any of the following are enabled: • Configure the IRCF<3:0> bits of the OSCCON register for the desired LF frequency, and • FOSC<2:0> = 100, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’ Peripherals that use the LFINTOSC are: • Power-up Timer (PWRT) • Watchdog Timer (WDT) • Fail-Safe Clock Monitor (FSCM) The Low-Frequency Internal Oscillator Ready bit (LFIOFR) of the OSCSTAT register indicates when the LFINTOSC is running and can be utilized. 5.2.2.5 Internal Oscillator Frequency Selection The system clock speed can be selected via software using the Internal Oscillator Frequency Select bits IRCF<3:0> of the OSCCON register. The output of the 16 MHz HFINTOSC and 31 kHz LFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). The Internal Oscillator Frequency Select bits IRCF<3:0> of the OSCCON register select the frequency output of the internal oscillators. One of the following frequencies can be selected via software: • 32 MHz (requires 4X PLL) • 16 MHz • 8 MHz • 4 MHz • 2 MHz • 1 MHz • 500 kHz (Default after Reset) • 250 kHz • 125 kHz • 62.5 kHz • 31.25 kHz • 31 kHz (LFINTOSC) The IRCF<3:0> bits of the OSCCON register allow duplicate selections for some frequencies. These dupli- cate choices can offer system design trade-offs. Lower power consumption can be obtained when changing oscillator sources for a given frequency. Faster transi- tion times can be obtained between frequency changes that use the same oscillator source. Note: Following any Reset, the IRCF<3:0> bits of the OSCCON register are set to ‘0111’ and the frequency selection is set to 500 kHz. The user can modify the IRCF bits to select a different frequency.
- 74. PIC16(L)F1934/6/7 DS41364E-page 74 2008-2011 Microchip Technology Inc. 5.2.2.6 32 MHz Internal Oscillator Frequency Selection The Internal Oscillator Block can be used with the 4X PLL associated with the External Oscillator Block to produce a 32 MHz internal system clock source. The following settings are required to use the 32 MHz inter- nal clock source: • The FOSC bits in Configuration Word 1 must be set to use the INTOSC source as the device sys- tem clock (FOSC<2:0> = 100). • The SCS bits in the OSCCON register must be cleared to use the clock determined by FOSC<2:0> in Configuration Word 1 (SCS<1:0> = 00). • The IRCF bits in the OSCCON register must be set to the 8 MHz HFINTOSC set to use (IRCF<3:0> = 1110). • The SPLLEN bit in the OSCCON register must be set to enable the 4xPLL, or the PLLEN bit of the Configuration Word 2 must be programmed to a ‘1’. The 4xPLL is not available for use with the internal oscillator when the SCS bits of the OSCCON register are set to ‘1x’. The SCS bits must be set to ‘00’ to use the 4xPLL with the internal oscillator. 5.2.2.7 Internal Oscillator Clock Switch Timing When switching between the HFINTOSC, MFINTOSC and the LFINTOSC, the new oscillator may already be shut down to save power (see Figure 5-7). If this is the case, there is a delay after the IRCF<3:0> bits of the OSCCON register are modified before the frequency selection takes place. The OSCSTAT register will reflect the current active status of the HFINTOSC, MFINTOSC and LFINTOSC oscillators. The sequence of a frequency selection is as follows: 1. IRCF<3:0> bits of the OSCCON register are modified. 2. If the new clock is shut down, a clock start-up delay is started. 3. Clock switch circuitry waits for a falling edge of the current clock. 4. The current clock is held low and the clock switch circuitry waits for a rising edge in the new clock. 5. The new clock is now active. 6. The OSCSTAT register is updated as required. 7. Clock switch is complete. See Figure 5-7 for more details. If the internal oscillator speed is switched between two clocks of the same source, there is no start-up delay before the new frequency is selected. Clock switching time delays are shown in Table 5-1. Start-up delay specifications are located in the oscillator tables in the applicable Electrical Specifications Chapter. Note: When using the PLLEN bit of the Configuration Word 2, the 4xPLL cannot be disabled by software and the 8 MHz HFINTOSC option will no longer be available.
- 75. 2008-2011 Microchip Technology Inc. DS41364E-page 75 PIC16(L)F1934/6/7 FIGURE 5-7: INTERNAL OSCILLATOR SWITCH TIMING HFINTOSC/ LFINTOSC IRCF <3:0> System Clock HFINTOSC/ LFINTOSC IRCF <3:0> System Clock 0 0 0 0 Start-up Time 2-cycle Sync Running 2-cycle Sync Running HFINTOSC/ LFINTOSC (FSCM and WDT disabled) HFINTOSC/ LFINTOSC (Either FSCM or WDT enabled) LFINTOSC HFINTOSC/ IRCF <3:0> System Clock = 0 0 Start-up Time 2-cycle Sync Running LFINTOSC HFINTOSC/MFINTOSC LFINTOSC turns off unless WDT or FSCM is enabled MFINTOSC MFINTOSC MFINTOSC MFINTOSC MFINTOSC
- 76. PIC16(L)F1934/6/7 DS41364E-page 76 2008-2011 Microchip Technology Inc. 5.3 Clock Switching The system clock source can be switched between external and internal clock sources via software using the System Clock Select (SCS) bits of the OSCCON register. The following clock sources can be selected using the SCS bits: • Default system oscillator determined by FOSC bits in Configuration Word 1 • Timer1 32 kHz crystal oscillator • Internal Oscillator Block (INTOSC) 5.3.1 SYSTEM CLOCK SELECT (SCS) BITS The System Clock Select (SCS) bits of the OSCCON register selects the system clock source that is used for the CPU and peripherals. • When the SCS bits of the OSCCON register = 00, the system clock source is determined by value of the FOSC<2:0> bits in the Configuration Word 1. • When the SCS bits of the OSCCON register = 01, the system clock source is the Timer1 oscillator. • When the SCS bits of the OSCCON register = 1x, the system clock source is chosen by the internal oscillator frequency selected by the IRCF<3:0> bits of the OSCCON register. After a Reset, the SCS bits of the OSCCON register are always cleared. When switching between clock sources, a delay is required to allow the new clock to stabilize. These oscil- lator delays are shown in Table 5-1. 5.3.2 OSCILLATOR START-UP TIME-OUT STATUS (OSTS) BIT The Oscillator Start-up Time-out Status (OSTS) bit of the OSCSTAT register indicates whether the system clock is running from the external clock source, as defined by the FOSC<2:0> bits in the Configuration Word 1, or from the internal clock source. In particular, OSTS indicates that the Oscillator Start-up Timer (OST) has timed out for LP, XT or HS modes. The OST does not reflect the status of the Timer1 oscillator. 5.3.3 TIMER1 OSCILLATOR The Timer1 oscillator is a separate crystal oscillator associated with the Timer1 peripheral. It is optimized for timekeeping operations with a 32.768 kHz crystal connected between the T1OSO and T1OSI device pins. The Timer1 oscillator is enabled using the T1OSCEN control bit in the T1CON register. See Section 21.0 “Timer1 Module with Gate Control” for more information about the Timer1 peripheral. 5.3.4 TIMER1 OSCILLATOR READY (T1OSCR) BIT The user must ensure that the Timer1 oscillator is ready to be used before it is selected as a system clock source. The Timer1 Oscillator Ready (T1OSCR) bit of the OSCSTAT register indicates whether the Timer1 oscillator is ready to be used. After the T1OSCR bit is set, the SCS bits can be configured to select the Timer1 oscillator. Note: Any automatic clock switch, which may occur from Two-Speed Start-up or Fail-Safe Clock Monitor, does not update the SCS bits of the OSCCON register. The user can monitor the OSTS bit of the OSCSTAT register to determine the current system clock source.
- 77. 2008-2011 Microchip Technology Inc. DS41364E-page 77 PIC16(L)F1934/6/7 5.4 Two-Speed Clock Start-up Mode Two-Speed Start-up mode provides additional power savings by minimizing the latency between external oscillator start-up and code execution. In applications that make heavy use of the Sleep mode, Two-Speed Start-up will remove the external oscillator start-up time from the time spent awake and can reduce the overall power consumption of the device. This mode allows the application to wake-up from Sleep, perform a few instructions using the INTOSC internal oscillator block as the clock source and go back to Sleep without waiting for the external oscillator to become stable. Two-Speed Start-up provides benefits when the oscil- lator module is configured for LP, XT or HS modes. The Oscillator Start-up Timer (OST) is enabled for these modes and must count 1024 oscillations before the oscillator can be used as the system clock source. If the oscillator module is configured for any mode other than LP, XT or HS mode, then Two-Speed Start-up is disabled. This is because the external clock oscillator does not require any stabilization time after POR or an exit from Sleep. If the OST count reaches 1024 before the device enters Sleep mode, the OSTS bit of the OSCSTAT reg- ister is set and program execution switches to the external oscillator. However, the system may never operate from the external oscillator if the time spent awake is very short. 5.4.1 TWO-SPEED START-UP MODE CONFIGURATION Two-Speed Start-up mode is configured by the following settings: • IESO (of the Configuration Word 1) = 1; Inter- nal/External Switchover bit (Two-Speed Start-up mode enabled). • SCS (of the OSCCON register) = 00. • FOSC<2:0> bits in the Configuration Word 1 configured for LP, XT or HS mode. Two-Speed Start-up mode is entered after: • Power-on Reset (POR) and, if enabled, after Power-up Timer (PWRT) has expired, or • Wake-up from Sleep. TABLE 5-1: OSCILLATOR SWITCHING DELAYS Note: Executing a SLEEP instruction will abort the oscillator start-up time and will cause the OSTS bit of the OSCSTAT register to remain clear. Switch From Switch To Frequency Oscillator Delay Sleep/POR LFINTOSC(1) MFINTOSC(1) HFINTOSC(1) 31 kHz 31.25 kHz-500 kHz 31.25 kHz-16 MHz Oscillator Warm-up Delay (TWARM) Sleep/POR EC, RC(1) DC – 32 MHz 2 cycles LFINTOSC EC, RC(1) DC – 32 MHz 1 cycle of each Sleep/POR Timer1 Oscillator LP, XT, HS(1) 32 kHz-20 MHz 1024 Clock Cycles (OST) Any clock source MFINTOSC(1) HFINTOSC(1) 31.25 kHz-500 kHz 31.25 kHz-16 MHz 2 s (approx.) Any clock source LFINTOSC(1) 31 kHz 1 cycle of each Any clock source Timer1 Oscillator 32 kHz 1024 Clock Cycles (OST) PLL inactive PLL active 16-32 MHz 2 ms (approx.) Note 1: PLL inactive.
- 78. PIC16(L)F1934/6/7 DS41364E-page 78 2008-2011 Microchip Technology Inc. 5.4.2 TWO-SPEED START-UP SEQUENCE 1. Wake-up from Power-on Reset or Sleep. 2. Instructions begin execution by the internal oscillator at the frequency set in the IRCF<3:0> bits of the OSCCON register. 3. OST enabled to count 1024 clock cycles. 4. OST timed out, wait for falling edge of the internal oscillator. 5. OSTS is set. 6. System clock held low until the next falling edge of new clock (LP, XT or HS mode). 7. System clock is switched to external clock source. 5.4.3 CHECKING TWO-SPEED CLOCK STATUS Checking the state of the OSTS bit of the OSCSTAT register will confirm if the microcontroller is running from the external clock source, as defined by the FOSC<2:0> bits in the Configuration Word 1, or the internal oscillator. FIGURE 5-8: TWO-SPEED START-UP 0 1 1022 1023 PC + 1 TOST T INTOSC OSC1 OSC2 Program Counter System Clock PC - N PC
- 79. 2008-2011 Microchip Technology Inc. DS41364E-page 79 PIC16(L)F1934/6/7 5.5 Fail-Safe Clock Monitor The Fail-Safe Clock Monitor (FSCM) allows the device to continue operating should the external oscillator fail. The FSCM can detect oscillator failure any time after the Oscillator Start-up Timer (OST) has expired. The FSCM is enabled by setting the FCMEN bit in the Configuration Word 1. The FSCM is applicable to all external Oscillator modes (LP, XT, HS, EC, Timer1 oscillator and RC). FIGURE 5-9: FSCM BLOCK DIAGRAM 5.5.1 FAIL-SAFE DETECTION The FSCM module detects a failed oscillator by comparing the external oscillator to the FSCM sample clock. The sample clock is generated by dividing the LFINTOSC by 64. See Figure 5-9. Inside the fail detector block is a latch. The external clock sets the latch on each falling edge of the external clock. The sample clock clears the latch on each rising edge of the sample clock. A failure is detected when an entire half-cycle of the sample clock elapses before the external clock goes low. 5.5.2 FAIL-SAFE OPERATION When the external clock fails, the FSCM switches the device clock to an internal clock source and sets the bit flag OSFIF of the PIR2 register. Setting this flag will generate an interrupt if the OSFIE bit of the PIE2 register is also set. The device firmware can then take steps to mitigate the problems that may arise from a failed clock. The system clock will continue to be sourced from the internal clock source until the device firmware successfully restarts the external oscillator and switches back to external operation. The internal clock source chosen by the FSCM is determined by the IRCF<3:0> bits of the OSCCON register. This allows the internal oscillator to be configured before a failure occurs. 5.5.3 FAIL-SAFE CONDITION CLEARING The Fail-Safe condition is cleared after a Reset, executing a SLEEP instruction or changing the SCS bits of the OSCCON register. When the SCS bits are changed, the OST is restarted. While the OST is running, the device continues to operate from the INTOSC selected in OSCCON. When the OST times out, the Fail-Safe condition is cleared and the device will be operating from the external clock source. The Fail-Safe condition must be cleared before the OSFIF flag can be cleared. 5.5.4 RESET OR WAKE-UP FROM SLEEP The FSCM is designed to detect an oscillator failure after the Oscillator Start-up Timer (OST) has expired. The OST is used after waking up from Sleep and after any type of Reset. The OST is not used with the EC or RC clock modes so that the FSCM will be active as soon as the Reset or wake-up has completed. When the FSCM is enabled, the Two-Speed Start-up is also enabled. Therefore, the device will always be executing code while the OST is operating. External LFINTOSC ÷ 64 S R Q 31 kHz (~32 s) 488 Hz (~2 ms) Clock Monitor Latch Clock Failure Detected Oscillator Clock Q Sample Clock Note: Due to the wide range of oscillator start-up times, the Fail-Safe circuit is not active during oscillator start-up (i.e., after exiting Reset or Sleep). After an appropriate amount of time, the user should check the Status bits in the OSCSTAT register to verify the oscillator start-up and that the system clock switchover has successfully completed.
- 80. PIC16(L)F1934/6/7 DS41364E-page 80 2008-2011 Microchip Technology Inc. FIGURE 5-10: FSCM TIMING DIAGRAM OSCFIF System Clock Output Sample Clock Failure Detected Oscillator Failure Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in this example have been chosen for clarity. (Q) Test Test Test Clock Monitor Output
- 81. 2008-2011 Microchip Technology Inc. DS41364E-page 81 PIC16(L)F1934/6/7 5.6 Oscillator Control Registers REGISTER 5-1: OSCCON: OSCILLATOR CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 R/W-1/1 U-0 R/W-0/0 R/W-0/0 SPLLEN IRCF<3:0> — SCS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SPLLEN: Software PLL Enable bit If PLLEN in Configuration Word 1 = 1: SPLLEN bit is ignored. 4x PLL is always enabled (subject to oscillator requirements) If PLLEN in Configuration Word 1 = 0: 1 = 4x PLL Is enabled 0 = 4x PLL is disabled bit 6-3 IRCF<3:0>: Internal Oscillator Frequency Select bits 000x = 31 kHz LF 0010 = 31.25 kHz MF 0011 = 31.25 kHz HF(1) 0100 = 62.5 kHz MF 0101 = 125 kHz MF 0110 = 250 kHz MF 0111 = 500 kHz MF (default upon Reset) 1000 = 125 kHz HF(1) 1001 = 250 kHz HF(1) 1010 = 500 kHz HF(1) 1011 = 1 MHz HF 1100 = 2 MHz HF 1101 = 4 MHz HF 1110 = 8 MHz or 32 MHz HF(see Section 5.2.2.1 “HFINTOSC”) 1111 = 16 MHz HF bit 2 Unimplemented: Read as ‘0’ bit 1-0 SCS<1:0>: System Clock Select bits 1x = Internal oscillator block 01 = Timer1 oscillator 00 = Clock determined by FOSC<2:0> in Configuration Word 1. Note 1: Duplicate frequency derived from HFINTOSC.
- 82. PIC16(L)F1934/6/7 DS41364E-page 82 2008-2011 Microchip Technology Inc. REGISTER 5-2: OSCSTAT: OSCILLATOR STATUS REGISTER R-1/q R-0/q R-q/q R-0/q R-0/q R-q/q R-0/0 R-0/q T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Conditional bit 7 T1OSCR: Timer1 Oscillator Ready bit If T1OSCEN = 1: 1 = Timer1 oscillator is ready 0 = Timer1 oscillator is not ready If T1OSCEN = 0: 1 = Timer1 clock source is always ready bit 6 PLLR 4x PLL Ready bit 1 = 4x PLL is ready 0 = 4x PLL is not ready bit 5 OSTS: Oscillator Start-up Time-out Status bit 1 = Running from the clock defined by the FOSC<2:0> bits of the Configuration Word 1 0 = Running from an internal oscillator (FOSC<2:0> = 100) bit 4 HFIOFR: High-Frequency Internal Oscillator Ready bit 1 = HFINTOSC is ready 0 = HFINTOSC is not ready bit 3 HFIOFL: High-Frequency Internal Oscillator Locked bit 1 = HFINTOSC is at least 2% accurate 0 = HFINTOSC is not 2% accurate bit 2 MFIOFR: Medium-Frequency Internal Oscillator Ready bit 1 = MFINTOSC is ready 0 = MFINTOSC is not ready bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit 1 = LFINTOSC is ready 0 = LFINTOSC is not ready bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit 1 = HFINTOSC is at least 0.5% accurate 0 = HFINTOSC is not 0.5% accurate
- 83. 2008-2011 Microchip Technology Inc. DS41364E-page 83 PIC16(L)F1934/6/7 TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES TABLE 5-3: SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES REGISTER 5-3: OSCTUNE: OSCILLATOR TUNING REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — TUN<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 TUN<4:0>: Frequency Tuning bits 011111 = Maximum frequency 011110 = • • • 000001 = 000000 = Oscillator module is running at the factory-calibrated frequency. 111111 = • • • 100000 = Minimum frequency Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page OSCCON SPLLEN IRCF<3:0> — SCS<1:0> 81 OSCSTAT T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS 82 OSCTUNE — — TUN<5:0> 83 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE(1) 100 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF(1) 103 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 203 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. Note 1: PIC16F1934 only. Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register on Page CONFIG1 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD 62 7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0> CONFIG2 13:8 — — LVP DEBUG — BORV STVREN PLLEN 64 7:0 — — VCAPEN<1:0>(1) — — WRT<1:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. Note 1: PIC16F1934/6/7 only.
- 84. PIC16(L)F1934/6/7 DS41364E-page 84 2008-2011 Microchip Technology Inc. NOTES:
- 85. 2008-2011 Microchip Technology Inc. DS41364E-page 85 PIC16(L)F1934/6/7 6.0 RESETS There are multiple ways to reset this device: • Power-on Reset (POR) • Brown-out Reset (BOR) • MCLR Reset • WDT Reset • RESET instruction • Stack Overflow • Stack Underflow • Programming mode exit To allow VDD to stabilize, an optional power-up timer can be enabled to extend the Reset time after a BOR or POR event. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 6-1. FIGURE 6-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR VDD WDT Time-out Power-on Reset LFINTOSC PWRT 64 ms PWRTEN Brown-out Reset BOR RESET Instruction Stack Pointer Stack Overflow/Underflow Reset Sleep MCLRE Enable Device Reset Zero Programming Mode Exit
- 86. PIC16(L)F1934/6/7 DS41364E-page 86 2008-2011 Microchip Technology Inc. 6.1 Power-on Reset (POR) The POR circuit holds the device in Reset until VDD has reached an acceptable level for minimum operation. Slow rising VDD, fast operating speeds or analog performance may require greater than minimum VDD. The PWRT, BOR or MCLR features can be used to extend the start-up period until all device operation conditions have been met. 6.1.1 POWER-UP TIMER (PWRT) The Power-up Timer provides a nominal 64 ms time- out on POR or Brown-out Reset. The device is held in Reset as long as PWRT is active. The PWRT delay allows additional time for the VDD to rise to an acceptable level. The Power-up Timer is enabled by clearing the PWRTE bit in Configuration Word 1. The Power-up Timer starts after the release of the POR and BOR. For additional information, refer to Application Note AN607, “Power-up Trouble Shooting” (DS00607). 6.2 Brown-Out Reset (BOR) The BOR circuit holds the device in Reset when VDD reaches a selectable minimum level. Between the POR and BOR, complete voltage range coverage for execution protection can be implemented. The Brown-out Reset module has four operating modes controlled by the BOREN<1:0> bits in Configu- ration Word 1. The four operating modes are: • BOR is always on • BOR is off when in Sleep • BOR is controlled by software • BOR is always off Refer to Table 6-3 for more information. The Brown-out Reset voltage level is selectable by configuring the BORV bit in Configuration Word 2. A VDD noise rejection filter prevents the BOR from trig- gering on small events. If VDD falls below VBOR for a duration greater than parameter TBORDC, the device will reset. See Figure 6-2 for more information. TABLE 6-1: BOR OPERATING MODES 6.2.1 BOR IS ALWAYS ON When the BOREN bits of Configuration Word 1 are set to ‘11’, the BOR is always on. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. BOR protection is active during Sleep. The BOR does not delay wake-up from Sleep. 6.2.2 BOR IS OFF IN SLEEP When the BOREN bits of Configuration Word 1 are set to ‘10’, the BOR is on, except in Sleep. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. BOR protection is not active during Sleep. The device wake-up will be delayed until the BOR is ready. 6.2.3 BOR CONTROLLED BY SOFTWARE When the BOREN bits of Configuration Word 1 are set to ‘01’, the BOR is controlled by the SBOREN bit of the BORCON register. The device start-up is not delayed by the BOR ready condition or the VDD level. BOR protection begins as soon as the BOR circuit is ready. The status of the BOR circuit is reflected in the BORRDY bit of the BORCON register. BOR protection is unchanged by Sleep. BOREN<1:0> SBOREN Device Mode BOR Mode Device Operation upon release of POR Device Operation upon wake- up from Sleep 11 X X Active Waits for BOR ready(1) 10 X Awake Active Waits for BOR ready Sleep Disabled 01 1 X Active Begins immediately 0 Disabled Begins immediately 00 X X Disabled Begins immediately Note 1: Even though this case specifically waits for the BOR, the BOR is already operating, so there is no delay in start-up.
- 87. 2008-2011 Microchip Technology Inc. DS41364E-page 87 PIC16(L)F1934/6/7 FIGURE 6-2: BROWN-OUT SITUATIONS REGISTER 6-1: BORCON: BROWN-OUT RESET CONTROL REGISTER R/W-1/u U-0 U-0 U-0 U-0 U-0 U-0 R-q/u SBOREN — — — — — — BORRDY bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 SBOREN: Software Brown-out Reset Enable bit If BOREN <1:0> in Configuration Word 1 01: SBOREN is read/write, but has no effect on the BOR. If BOREN <1:0> in Configuration Word 1 = 01: 1 = BOR Enabled 0 = BOR Disabled bit 6-1 Unimplemented: Read as ‘0’ bit 0 BORRDY: Brown-out Reset Circuit Ready Status bit 1 = The Brown-out Reset circuit is active 0 = The Brown-out Reset circuit is inactive TPWRT (1) VBOR VDD Internal Reset VBOR VDD Internal Reset TPWRT(1) < TPWRT TPWRT (1) VBOR VDD Internal Reset Note 1: TPWRT delay only if PWRTE bit is programmed to ‘0’.
- 88. PIC16(L)F1934/6/7 DS41364E-page 88 2008-2011 Microchip Technology Inc. 6.3 MCLR The MCLR is an optional external input that can reset the device. The MCLR function is controlled by the MCLRE bit of Configuration Word 1 and the LVP bit of Configuration Word 2 (Table 6-2). 6.3.1 MCLR ENABLED When MCLR is enabled and the pin is held low, the device is held in Reset. The MCLR pin is connected to VDD through an internal weak pull-up. The device has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. 6.3.2 MCLR DISABLED When MCLR is disabled, the pin functions as a general purpose input and the internal weak pull-up is under software control. See Section 12.6 “PORTE Registers” for more information. 6.4 Watchdog Timer (WDT) Reset The Watchdog Timer generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The TO and PD bits in the STATUS register are changed to indicate the WDT Reset. See Section 10.0 “Watchdog Timer” for more information. 6.5 RESET Instruction A RESET instruction will cause a device Reset. The RI bit in the PCON register will be set to ‘0’. See Table 6-4 for default conditions after a RESET instruction has occurred. 6.6 Stack Overflow/Underflow Reset The device can reset when the Stack Overflows or Underflows. The STKOVF or STKUNF bits of the PCON register indicate the Reset condition. These Resets are enabled by setting the STVREN bit in Configuration Word 2. See Section 3.4.2 “Overflow/Underflow Reset” for more information. 6.7 Programming Mode Exit Upon exit of Programming mode, the device will behave as if a POR had just occurred. 6.8 Power-Up Timer The Power-up Timer optionally delays device execution after a BOR or POR event. This timer is typically used to allow VDD to stabilize before allowing the device to start running. The Power-up Timer is controlled by the PWRTE bit of Configuration Word 1. 6.9 Start-up Sequence Upon the release of a POR or BOR, the following must occur before the device will begin executing: 1. Power-up Timer runs to completion (if enabled). 2. Oscillator start-up timer runs to completion (if required for oscillator source). 3. MCLR must be released (if enabled). The total time-out will vary based on oscillator configu- ration and Power-up Timer configuration. See Section 5.0 “Oscillator Module (With Fail-Safe Clock Monitor)” for more information. The Power-up Timer and oscillator start-up timer run independently of MCLR Reset. If MCLR is kept low long enough, the Power-up Timer and oscillator start-up timer will expire. Upon bringing MCLR high, the device will begin execution immediately (see Figure 6-3). This is useful for testing purposes or to synchronize more than one device operating in parallel. TABLE 6-2: MCLR CONFIGURATION MCLRE LVP MCLR 0 0 Disabled 1 0 Enabled x 1 Enabled Note: A Reset does not drive the MCLR pin low.
- 89. 2008-2011 Microchip Technology Inc. DS41364E-page 89 PIC16(L)F1934/6/7 FIGURE 6-3: RESET START-UP SEQUENCE TOST TMCLR TPWRT VDD Internal POR Power-Up Timer MCLR Internal RESET Oscillator Modes Oscillator Start-Up Timer Oscillator FOSC Internal Oscillator Oscillator FOSC External Clock (EC) CLKIN FOSC External Crystal
- 90. PIC16(L)F1934/6/7 DS41364E-page 90 2008-2011 Microchip Technology Inc. 6.10 Determining the Cause of a Reset Upon any Reset, multiple bits in the STATUS and PCON register are updated to indicate the cause of the Reset. Table 6-3 and Table 6-4 show the Reset condi- tions of these registers. TABLE 6-3: RESET STATUS BITS AND THEIR SIGNIFICANCE TABLE 6-4: RESET CONDITION FOR SPECIAL REGISTERS(2) STKOVF STKUNF RMCLR RI POR BOR TO PD Condition 0 0 1 1 0 x 1 1 Power-on Reset 0 0 1 1 0 x 0 x Illegal, TO is set on POR 0 0 1 1 0 x x 0 Illegal, PD is set on POR 0 0 1 1 u 0 1 1 Brown-out Reset u u u u u u 0 u WDT Reset u u u u u u 0 0 WDT Wake-up from Sleep u u u u u u 1 0 Interrupt Wake-up from Sleep u u 0 u u u u u MCLR Reset during normal operation u u 0 u u u 1 0 MCLR Reset during Sleep u u u 0 u u u u RESET Instruction Executed 1 u u u u u u u Stack Overflow Reset (STVREN = 1) u 1 u u u u u u Stack Underflow Reset (STVREN = 1) Condition Program Counter STATUS Register PCON Register Power-on Reset 0000h ---1 1000 00-- 110x MCLR Reset during normal operation 0000h ---u uuuu uu-- 0uuu MCLR Reset during Sleep 0000h ---1 0uuu uu-- 0uuu WDT Reset 0000h ---0 uuuu uu-- uuuu WDT Wake-up from Sleep PC + 1 ---0 0uuu uu-- uuuu Brown-out Reset 0000h ---1 1uuu 00-- 11u0 Interrupt Wake-up from Sleep PC + 1(1) ---1 0uuu uu-- uuuu RESET Instruction Executed 0000h ---u uuuu uu-- u0uu Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1u-- uuuu Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1-- uuuu Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’. Note 1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1. 2: If a Status bit is not implemented, that bit will be read as ‘0’.
- 91. 2008-2011 Microchip Technology Inc. DS41364E-page 91 PIC16(L)F1934/6/7 6.11 Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: • Power-on Reset (POR) • Brown-out Reset (BOR) • Reset Instruction Reset (RI) • Stack Overflow Reset (STKOVF) • Stack Underflow Reset (STKUNF) • MCLR Reset (RMCLR) The PCON register bits are shown in Register 6-2. REGISTER 6-2: PCON: POWER CONTROL REGISTER R/W/HS-0/q R/W/HS-0/q U-0 U-0 R/W/HC-1/q R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u STKOVF STKUNF — — RMCLR RI POR BOR bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 STKOVF: Stack Overflow Flag bit 1 = A Stack Overflow occurred 0 = A Stack Overflow has not occurred or set to ‘0’ by firmware bit 6 STKUNF: Stack Underflow Flag bit 1 = A Stack Underflow occurred 0 = A Stack Underflow has not occurred or set to ‘0’ by firmware bit 5-4 Unimplemented: Read as ‘0’ bit 3 RMCLR: MCLR Reset Flag bit 1 = A MCLR Reset has not occurred or set to ‘1’ by firmware 0 = A MCLR Reset has occurred (set to ‘0’ in hardware when a MCLR Reset occurs) bit 2 RI: RESET Instruction Flag bit 1 = A RESET instruction has not been executed or set to ‘1’ by firmware 0 = A RESET instruction has been executed (set to ‘0’ in hardware upon executing a RESET instruction) bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset occurs)
- 92. PIC16(L)F1934/6/7 DS41364E-page 92 2008-2011 Microchip Technology Inc. TABLE 6-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BORCON SBOREN — — — — — — BORRDY 87 PCON STKOVF STKUNF — — RMCLR RI POR BOR 91 STATUS — — — TO PD Z DC C 29 WDTCON — — WDTPS<4:0> SWDTEN 113 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets. Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
- 93. 2008-2011 Microchip Technology Inc. DS41364E-page 93 PIC16(L)F1934/6/7 7.0 INTERRUPTS The interrupt feature allows certain events to preempt normal program flow. Firmware is used to determine the source of the interrupt and act accordingly. Some interrupts can be configured to wake the MCU from Sleep mode. This chapter contains the following information for Interrupts: • Operation • Interrupt Latency • Interrupts During Sleep • INT Pin • Automatic Context Saving Many peripherals produce Interrupts. Refer to the cor- responding chapters for details. A block diagram of the interrupt logic is shown in Figure 7-1. FIGURE 7-1: INTERRUPT LOGIC D CK R Q D CK R Q RBx IOCBNx IOCBPx Q2 D CK S Q Q4Q1 Data Bus = 0 or 1 Write IOCBFx IOCIE To Data Bus IOCBFx Edge Detect IOC Interrupt to CPU Core From all other IOCBFx individual Pin Detectors Q1 Q2 Q3 Q4 Q4Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q4 Q4Q1 Q4Q1 Q4Q1
- 94. PIC16(L)F1934/6/7 DS41364E-page 94 2008-2011 Microchip Technology Inc. 7.1 Operation Interrupts are disabled upon any device Reset. They are enabled by setting the following bits: • GIE bit of the INTCON register • Interrupt Enable bit(s) for the specific interrupt event(s) • PEIE bit of the INTCON register (if the Interrupt Enable bit of the interrupt event is contained in the PIE1, PIE2 and PIE3 registers) The INTCON, PIR1, PIR2 and PIR3 registers record individual interrupts via interrupt flag bits. Interrupt flag bits will be set, regardless of the status of the GIE, PEIE and individual interrupt enable bits. The following events happen when an interrupt event occurs while the GIE bit is set: • Current prefetched instruction is flushed • GIE bit is cleared • Current Program Counter (PC) is pushed onto the stack • Critical registers are automatically saved to the shadow registers (See Section 7.5 “Automatic Context Saving”) • PC is loaded with the interrupt vector 0004h The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector. The RETFIE instruction exits the ISR by popping the previous address from the stack, restoring the saved context from the shadow registers and setting the GIE bit. For additional information on a specific interrupt’s operation, refer to its peripheral chapter. 7.2 Interrupt Latency Interrupt latency is defined as the time from when the interrupt event occurs to the time code execution at the interrupt vector begins. The latency for synchronous interrupts is 3 or 4 instruction cycles. For asynchronous interrupts, the latency is 3 to 5 instruction cycles, depending on when the interrupt occurs. See Figure 7-2 and Figure 7-3 for more details. Note 1: Individual interrupt flag bits are set, regardless of the state of any other enable bits. 2: All interrupts will be ignored while the GIE bit is cleared. Any interrupt occurring while the GIE bit is clear will be serviced when the GIE bit is set again.
- 95. 2008-2011 Microchip Technology Inc. DS41364E-page 95 PIC16(L)F1934/6/7 FIGURE 7-2: INTERRUPT LATENCY Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT PC 0004h 0005h PC Inst(0004h) NOP GIE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 1 Cycle Instruction at PC PC Inst(0004h) NOP 2 Cycle Instruction at PC FSR ADDR PC+1 PC+2 0004h 0005h PC Inst(0004h) NOP GIE PC PC-1 3 Cycle Instruction at PC Execute Interrupt Inst(PC) Interrupt Sampled during Q1 Inst(PC) PC-1 PC+1 NOP PC New PC/ PC+1 0005h PC-1 PC+1/FSR ADDR 0004h NOP Interrupt GIE Interrupt INST(PC) NOP NOP FSR ADDR PC+1 PC+2 0004h 0005h PC Inst(0004h) NOP GIE PC PC-1 3 Cycle Instruction at PC Interrupt INST(PC) NOP NOP NOP Inst(0005h) Execute Execute Execute
- 96. PIC16(L)F1934/6/7 DS41364E-page 96 2008-2011 Microchip Technology Inc. FIGURE 7-3: INT PIN INTERRUPT TIMING Q2 Q1 Q3 Q4 Q2 Q1 Q3 Q4 Q2 Q1 Q3 Q4 Q2 Q1 Q3 Q4 Q2 Q1 Q3 Q4 OSC1 CLKOUT INT pin INTF GIE INSTRUCTION FLOW PC Instruction Fetched Instruction Executed Interrupt Latency PC PC + 1 PC + 1 0004h 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (PC) Inst (PC + 1) Inst (PC – 1) Inst (0004h) Dummy Cycle Inst (PC) — Note 1: INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: CLKOUT not available in all Oscillator modes. 4: For minimum width of INT pulse, refer to AC specifications in the applicable Electrical Specifications Chapter. 5: INTF is enabled to be set any time during the Q4-Q1 cycles. (1) (2) (3) (4) (5) (1)
- 97. 2008-2011 Microchip Technology Inc. DS41364E-page 97 PIC16(L)F1934/6/7 7.3 Interrupts During Sleep Some interrupts can be used to wake from Sleep. To wake from Sleep, the peripheral must be able to operate without the system clock. The interrupt source must have the appropriate Interrupt Enable bit(s) set prior to entering Sleep. On waking from Sleep, if the GIE bit is also set, the processor will branch to the interrupt vector. Otherwise, the processor will continue executing instructions after the SLEEP instruction. The instruction directly after the SLEEP instruction will always be executed before branching to the ISR. Refer to Section 9.0 “Power- Down Mode (Sleep)” for more details. 7.4 INT Pin The INT pin can be used to generate an asynchronous edge-triggered interrupt. This interrupt is enabled by setting the INTE bit of the INTCON register. The INTEDG bit of the OPTION_REG register determines on which edge the interrupt will occur. When the INTEDG bit is set, the rising edge will cause the interrupt. When the INTEDG bit is clear, the falling edge will cause the interrupt. The INTF bit of the INTCON register will be set when a valid edge appears on the INT pin. If the GIE and INTE bits are also set, the processor will redirect program execution to the interrupt vector. 7.5 Automatic Context Saving Upon entering an interrupt, the return PC address is saved on the stack. Additionally, the following registers are automatically saved in the Shadow registers: • W register • STATUS register (except for TO and PD) • BSR register • FSR registers • PCLATH register Upon exiting the Interrupt Service Routine, these regis- ters are automatically restored. Any modifications to these registers during the ISR will be lost. If modifica- tions to any of these registers are desired, the corre- sponding Shadow register should be modified and the value will be restored when exiting the ISR. The Shadow registers are available in Bank 31 and are readable and writable. Depending on the user’s appli- cation, other registers may also need to be saved.
- 98. PIC16(L)F1934/6/7 DS41364E-page 98 2008-2011 Microchip Technology Inc. 7.6 Interrupt Control Registers 7.6.1 INTCON REGISTER The INTCON register is a readable and writable register, which contains the various enable and flag bits for TMR0 register overflow, interrupt-on-change and external INT pin interrupts. Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropri- ate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 7-1: INTCON: INTERRUPT CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GIE: Global Interrupt Enable bit 1 = Enables all active interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all active peripheral interrupts 0 = Disables all peripheral interrupts bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCIE: Interrupt-on-Change Enable bit 1 = Enables the interrupt-on-change 0 = Disables the interrupt-on-change bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed 0 = TMR0 register did not overflow bit 1 INTF: INT External Interrupt Flag bit 1 = The INT external interrupt occurred 0 = The INT external interrupt did not occur bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit 1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state Note 1: The IOCIF Flag bit is read-only and cleared when all the Interrupt-on-Change flags in the IOCBF register have been cleared by software.
- 99. 2008-2011 Microchip Technology Inc. DS41364E-page 99 PIC16(L)F1934/6/7 7.6.2 PIE1 REGISTER The PIE1 register contains the interrupt enable bits, as shown in Register 7-2. Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. REGISTER 7-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit 1 = Enables the Timer1 Gate Acquisition interrupt 0 = Disables the Timer1 Gate Acquisition interrupt bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5 RCIE: USART Receive Interrupt Enable bit 1 = Enables the USART receive interrupt 0 = Disables the USART receive interrupt bit 4 TXIE: USART Transmit Interrupt Enable bit 1 = Enables the USART transmit interrupt 0 = Disables the USART transmit interrupt bit 3 SSPIE: Synchronous Serial Port (MSSP) Interrupt Enable bit 1 = Enables the MSSP interrupt 0 = Disables the MSSP interrupt bit 2 CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit 1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt
- 100. PIC16(L)F1934/6/7 DS41364E-page 100 2008-2011 Microchip Technology Inc. 7.6.3 PIE2 REGISTER The PIE2 register contains the interrupt enable bits, as shown in Register 7-3. Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. REGISTER 7-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 OSFIE: Oscillator Fail Interrupt Enable bit 1 = Enables the Oscillator Fail interrupt 0 = Disables the Oscillator Fail interrupt bit 6 C2IE: Comparator C2 Interrupt Enable bit 1 = Enables the Comparator C2 interrupt 0 = Disables the Comparator C2 interrupt bit 5 C1IE: Comparator C1 Interrupt Enable bit 1 = Enables the Comparator C1 interrupt 0 = Disables the Comparator C1 interrupt bit 4 EEIE: EEPROM Write Completion Interrupt Enable bit 1 = Enables the EEPROM Write Completion interrupt 0 = Disables the EEPROM Write Completion interrupt bit 3 BCLIE: MSSP Bus Collision Interrupt Enable bit 1 = Enables the MSSP Bus Collision Interrupt 0 = Disables the MSSP Bus Collision Interrupt bit 2 LCDIE: LCD Module Interrupt Enable bit 1 = Enables the LCD module interrupt 0 = Disables the LCD module interrupt bit 1 Unimplemented: Read as ‘0’ bit 0 CCP2IE: CCP2 Interrupt Enable bit 1 = Enables the CCP2 interrupt 0 = Disables the CCP2 interrupt
- 101. 2008-2011 Microchip Technology Inc. DS41364E-page 101 PIC16(L)F1934/6/7 7.6.4 PIE3 REGISTER The PIE3 register contains the interrupt enable bits, as shown in Register 7-4. Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. REGISTER 7-4: PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 CCP5IE: CCP5 Interrupt Enable bit 1 = Enables the CCP5 interrupt 0 = Disables the CCP5 interrupt bit 5 CCP4IE: CCP4 Interrupt Enable bit 1 = Enables the CCP4 interrupt 0 = Disables the CCP4 interrupt bit 4 CCP3IE: CCP3 Interrupt Enable bit 1 = Enables the CCP3 interrupt 0 = Disables the CCP3 interrupt bit 3 TMR6IE: TMR6 to PR6 Match Interrupt Enable bit 1 = Enables the TMR6 to PR6 Match interrupt 0 = Disables the TMR6 to PR6 Match interrupt bit 2 Unimplemented: Read as ‘0’ bit 1 TMR4IE: TMR4 to PR4 Match Interrupt Enable bit 1 = Enables the TMR4 to PR4 Match interrupt 0 = Disables the TMR4 to PR4 Match interrupt bit 0 Unimplemented: Read as ‘0’
- 102. PIC16(L)F1934/6/7 DS41364E-page 102 2008-2011 Microchip Technology Inc. 7.6.5 PIR1 REGISTER The PIR1 register contains the interrupt flag bits, as shown in Register 7-5. Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 7-5: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 R/W-0/0 R/W-0/0 R-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 ADIF: A/D Converter Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 RCIF: USART Receive Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 TXIF: USART Transmit Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 SSPIF: Synchronous Serial Port (MSSP) Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 CCP1IF: CCP1 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending
- 103. 2008-2011 Microchip Technology Inc. DS41364E-page 103 PIC16(L)F1934/6/7 7.6.6 PIR2 REGISTER The PIR2 register contains the interrupt flag bits, as shown in Register 7-6. Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 7-6: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 OSFIF: Oscillator Fail Interrupt Flag 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 C2IF: Comparator C2 Interrupt Flag 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 C1IF: Comparator C1 Interrupt Flag 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 EEIF: EEPROM Write Completion Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 BCLIF: MSSP Bus Collision Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 LCDIF: LCD Module Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1 Unimplemented: Read as ‘0’ bit 0 CCP2IF: CCP2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending
- 104. PIC16(L)F1934/6/7 DS41364E-page 104 2008-2011 Microchip Technology Inc. 7.6.7 PIR3 REGISTER The PIR3 register contains the interrupt flag bits, as shown in Register 7-7. Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 7-7: PIR3: PERIPHERAL INTERRUPT REQUEST REGISTER 3 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 CCP5IF: CCP5 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 CCP4IF: CCP4 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 CCP3IF: CCP3 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 TMR6IF: TMR6 to PR6 Match Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 Unimplemented: Read as ‘0’ bit 1 TMR4IF: TMR4 to PR4 Match Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 Unimplemented: Read as ‘0’
- 105. 2008-2011 Microchip Technology Inc. DS41364E-page 105 PIC16(L)F1934/6/7 TABLE 7-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 OPTION_REG WPUEN INTEDG TMROCS TMROSE PSA PS<2:0> 193 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 100 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 101 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 103 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 104 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Interrupts.
- 106. PIC16(L)F1934/6/7 DS41364E-page 106 2008-2011 Microchip Technology Inc. NOTES:
- 107. 2008-2011 Microchip Technology Inc. DS41364E-page 107 PIC16(L)F1934/6/7 8.0 LOW DROPOUT (LDO) VOLTAGE REGULATOR The PIC16F1934/6/7 has an internal Low Dropout Regulator (LDO) which provides operation above 3.6V. The LDO regulates a voltage for the internal device logic while permitting the VDD and I/O pins to operate at a higher voltage. There is no user enable/disable control available for the LDO, it is always active. The PIC16(L)F1934/6/7 operates at a maximum VDD of 3.6V and does not incorporate an LDO. A device I/O pin may be configured as the LDO voltage output, identified as the VCAP pin. Although not required, an external low-ESR capacitor may be con- nected to the VCAP pin for additional regulator stability. The VCAPEN<1:0> bits of Configuration Word 2 deter- mines which pin is assigned as the VCAP pin. Refer to Table 8-1. On power-up, the external capacitor will load the LDO voltage regulator. To prevent erroneous operation, the device is held in Reset while a constant current source charges the external capacitor. After the cap is fully charged, the device is released from Reset. For more information on recommended capacitor values and the constant current rate, refer to the LDO Regulator Characteristics Table in the applicable Electrical Specifications Chapter. TABLE 8-2: SUMMARY OF CONFIGURATION WORD WITH LDO TABLE 8-1: VCAPEN<1:0> SELECT BITS VCAPEN<1:0> Pin 00 RA0 01 RA5 10 RA6 11 No Vcap Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register on Page CONFIG2 13:8 — — LVP DEBUG — BORV STVREN PLLEN 64 7:0 — — VCAPEN1(1) VCAPEN0(1) — — WRT1 WRT0 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by LDO. Note 1: PIC16F1934/6/7 only.
- 108. PIC16(L)F1934/6/7 DS41364E-page 108 2008-2011 Microchip Technology Inc. NOTES:
- 109. 2008-2011 Microchip Technology Inc. DS41364E-page 109 PIC16(L)F1934/6/7 9.0 POWER-DOWN MODE (SLEEP) The Power-down mode is entered by executing a SLEEP instruction. Upon entering Sleep mode, the following conditions exist: 1. WDT will be cleared but keeps running, if enabled for operation during Sleep. 2. PD bit of the STATUS register is cleared. 3. TO bit of the STATUS register is set. 4. CPU clock is disabled. 5. 31 kHz LFINTOSC is unaffected and peripherals that operate from it may continue operation in Sleep. 6. Timer1 oscillator is unaffected and peripherals that operate from it may continue operation in Sleep. 7. ADC is unaffected, if the dedicated FRC clock is selected. 8. Capacitive Sensing oscillator is unaffected. 9. I/O ports maintain the status they had before SLEEP was executed (driving high, low or high- impedance). 10. Resets other than WDT are not affected by Sleep mode. Refer to individual chapters for more details on peripheral operation during Sleep. To minimize current consumption, the following condi- tions should be considered: • I/O pins should not be floating • External circuitry sinking current from I/O pins • Internal circuitry sourcing current from I/O pins • Current draw from pins with internal weak pull-ups • Modules using 31 kHz LFINTOSC • Modules using Timer1 oscillator I/O pins that are high-impedance inputs should be pulled to VDD or VSS externally to avoid switching cur- rents caused by floating inputs. Examples of internal circuitry that might be sourcing current include modules such as the DAC and FVR modules. See Section 17.0 “Digital-to-Analog Con- verter (DAC) Module” and Section 14.0 “Fixed Volt- age Reference (FVR)” for more information on these modules. 9.1 Wake-up from Sleep The device can wake-up from Sleep through one of the following events: 1. External Reset input on MCLR pin, if enabled 2. BOR Reset, if enabled 3. POR Reset 4. Watchdog Timer, if enabled 5. Any external interrupt 6. Interrupts by peripherals capable of running dur- ing Sleep (see individual peripheral for more information) The first three events will cause a device Reset. The last three events are considered a continuation of pro- gram execution. To determine whether a device Reset or wake-up event occurred, refer to Section 6.10 “Determining the Cause of a Reset”. When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE bit is disabled, the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is enabled, the device executes the instruction after the SLEEP instruction, the device will call the Interrupt Ser- vice Routine. In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up.
- 110. PIC16(L)F1934/6/7 DS41364E-page 110 2008-2011 Microchip Technology Inc. 9.1.1 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: • If the interrupt occurs before the execution of a SLEEP instruction - SLEEP instruction will execute as a NOP. - WDT and WDT prescaler will not be cleared - TO bit of the STATUS register will not be set - PD bit of the STATUS register will not be cleared. • If the interrupt occurs during or after the execu- tion of a SLEEP instruction - SLEEP instruction will be completely exe- cuted - Device will immediately wake-up from Sleep - WDT and WDT prescaler will be cleared - TO bit of the STATUS register will be set - PD bit of the STATUS register will be cleared. Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. FIGURE 9-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT TABLE 9-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1(1) CLKOUT(2) Interrupt flag GIE bit (INTCON reg.) Instruction Flow PC Instruction Fetched Instruction Executed PC PC + 1 PC + 2 Inst(PC) = Sleep Inst(PC - 1) Inst(PC + 1) Sleep Processor in Sleep Interrupt Latency(4) Inst(PC + 2) Inst(PC + 1) Inst(0004h) Inst(0005h) Inst(0004h) Dummy Cycle PC + 2 0004h 0005h Dummy Cycle TOST(3) PC + 2 Note 1: XT, HS or LP Oscillator mode assumed. 2: CLKOUT is not available in XT, HS, or LP Oscillator modes, but shown here for timing reference. 3: TOST = 1024 TOSC (drawing not to scale). This delay applies only to XT, HS or LP Oscillator modes. 4: GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 152 IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 152 IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 152 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 100 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 101 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 103 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 104 STATUS — — — TO PD Z DC C 29 WDTCON — — WDTPS<4:0> SWDTEN 113 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used in Power-down mode.
- 111. 2008-2011 Microchip Technology Inc. DS41364E-page 111 PIC16(L)F1934/6/7 10.0 WATCHDOG TIMER The Watchdog Timer is a system timer that generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The Watchdog Timer is typically used to recover the system from unexpected events. The WDT has the following features: • Independent clock source • Multiple operating modes - WDT is always on - WDT is off when in Sleep - WDT is controlled by software - WDT is always off • Configurable time-out period is from 1 ms to 256 seconds (typical) • Multiple Reset conditions • Operation during Sleep FIGURE 10-1: WATCHDOG TIMER BLOCK DIAGRAM LFINTOSC 23-bit Programmable Prescaler WDT WDT Time-out WDTPS<4:0> SWDTEN Sleep WDTE<1:0> = 11 WDTE<1:0> = 01 WDTE<1:0> = 10
- 112. PIC16(L)F1934/6/7 DS41364E-page 112 2008-2011 Microchip Technology Inc. 10.1 Independent Clock Source The WDT derives its time base from the 31 kHz LFINTOSC internal oscillator. Time intervals in this chapter are based on a nominal interval of 1 ms. See the Electrical Specifications Chapters for the LFINTOSC tolerances. 10.2 WDT Operating Modes The Watchdog Timer module has four operating modes controlled by the WDTE<1:0> bits in Configuration Word 1. See Table 10-1. 10.2.1 WDT IS ALWAYS ON When the WDTE bits of Configuration Word 1 are set to ‘11’, the WDT is always on. WDT protection is active during Sleep. 10.2.2 WDT IS OFF IN SLEEP When the WDTE bits of Configuration Word 1 are set to ‘10’, the WDT is on, except in Sleep. WDT protection is not active during Sleep. 10.2.3 WDT CONTROLLED BY SOFTWARE When the WDTE bits of Configuration Word 1 are set to ‘01’, the WDT is controlled by the SWDTEN bit of the WDTCON register. WDT protection is unchanged by Sleep. See Table 10-1 for more details. TABLE 10-1: WDT OPERATING MODES 10.3 Time-Out Period The WDTPS bits of the WDTCON register set the time-out period from 1 ms to 256 seconds (nominal). After a Reset, the default time-out period is 2 seconds. 10.4 Clearing the WDT The WDT is cleared when any of the following condi- tions occur: • Any Reset • CLRWDT instruction is executed • Device enters Sleep • Device wakes up from Sleep • Oscillator fail event • WDT is disabled • Oscillator Start-up TImer (OST) is running See Table 10-2 for more information. 10.5 Operation During Sleep When the device enters Sleep, the WDT is cleared. If the WDT is enabled during Sleep, the WDT resumes counting. When the device exits Sleep, the WDT is cleared again. The WDT remains clear until the OST, if enabled, completes. See Section 5.0 “Oscillator Module (With Fail-Safe Clock Monitor)” for more information on the OST. When a WDT time-out occurs while the device is in Sleep, no Reset is generated. Instead, the device wakes up and resumes operation. The TO and PD bits in the STATUS register are changed to indicate the event. See Section 3.0 “Memory Organization” and STATUS register (Register 3-1) for more information. WDTE<1:0> SWDTEN Device Mode WDT Mode 11 X X Active 10 X Awake Active Sleep Disabled 01 1 X Active 0 Disabled 00 X X Disabled TABLE 10-2: WDT CLEARING CONDITIONS Conditions WDT WDTE<1:0> = 00 Cleared WDTE<1:0> = 01 and SWDTEN = 0 WDTE<1:0> = 10 and enter Sleep CLRWDT Command Oscillator Fail Detected Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST Change INTOSC divider (IRCF bits) Unaffected
- 113. 2008-2011 Microchip Technology Inc. DS41364E-page 113 PIC16(L)F1934/6/7 10.6 Watchdog Control Register REGISTER 10-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0 — — WDTPS<4:0> SWDTEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits Bit Value = Prescale Rate 00000 = 1:32 (Interval 1 ms typ) 00001 = 1:64 (Interval 2 ms typ) 00010 = 1:128 (Interval 4 ms typ) 00011 = 1:256 (Interval 8 ms typ) 00100 = 1:512 (Interval 16 ms typ) 00101 = 1:1024 (Interval 32 ms typ) 00110 = 1:2048 (Interval 64 ms typ) 00111 = 1:4096 (Interval 128 ms typ) 01000 = 1:8192 (Interval 256 ms typ) 01001 = 1:16384 (Interval 512 ms typ) 01010 = 1:32768 (Interval 1s typ) 01011 = 1:65536 (Interval 2s typ) (Reset value) 01100 = 1:131072 (217 ) (Interval 4s typ) 01101 = 1:262144 (218 ) (Interval 8s typ) 01110 = 1:524288 (219 ) (Interval 16s typ) 01111 = 1:1048576 (220 ) (Interval 32s typ) 10000 = 1:2097152 (221 ) (Interval 64s typ) 10001 = 1:4194304 (222 ) (Interval 128s typ) 10010 = 1:8388608 (223 ) (Interval 256s typ) 10011 = Reserved. Results in minimum interval (1:32) • • • 11111 = Reserved. Results in minimum interval (1:32) bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit If WDTE<1:0> = 00: This bit is ignored. If WDTE<1:0> = 01: 1 = WDT is turned on 0 = WDT is turned off If WDTE<1:0> = 1x: This bit is ignored.
- 114. PIC16(L)F1934/6/7 DS41364E-page 114 2008-2011 Microchip Technology Inc. TABLE 10-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER TABLE 10-4: SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page OSCCON SPLLEN IRCF<3:0> — SCS<1:0> 64 STATUS — — — TO PD Z DC C 29 WDTCON — — WDTPS<4:0> SWDTEN 113 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer. Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register on Page CONFIG1 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD 62 7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer.
- 115. 2008-2011 Microchip Technology Inc. DS41364E-page 115 PIC16(L)F1934/6/7 11.0 DATA EEPROM AND FLASH PROGRAM MEMORY CONTROL The data EEPROM and Flash program memory are readable and writable during normal operation (full VDD range). These memories are not directly mapped in the register file space. Instead, they are indirectly addressed through the Special Function Registers (SFRs). There are six SFRs used to access these memories: • EECON1 • EECON2 • EEDATL • EEDATH • EEADRL • EEADRH When interfacing the data memory block, EEDATL holds the 8-bit data for read/write, and EEADRL holds the address of the EEDATL location being accessed. These devices have 256 bytes of data EEPROM with an address range from 0h to 0FFh. When accessing the program memory block, the EEDATH:EEDATL register pair forms a 2-byte word that holds the 14-bit data for read/write, and the EEADRL and EEADRH registers form a 2-byte word that holds the 15-bit address of the program memory location being read. The EEPROM data memory allows byte read and write. An EEPROM byte write automatically erases the loca- tion and writes the new data (erase before write). The write time is controlled by an on-chip timer. The write/erase voltages are generated by an on-chip charge pump rated to operate over the voltage range of the device for byte or word operations. Depending on the setting of the Flash Program Memory Self Write Enable bits WRT<1:0> of the Configuration Word 2, the device may or may not be able to write certain blocks of the program memory. However, reads from the program memory are always allowed. When the device is code-protected, the device programmer can no longer access data or program memory. When code-protected, the CPU may continue to read and write the data EEPROM memory and Flash program memory. 11.1 EEADRL and EEADRH Registers The EEADRH:EEADRL register pair can address up to a maximum of 256 bytes of data EEPROM or up to a maximum of 32K words of program memory. When selecting a program address value, the MSB of the address is written to the EEADRH register and the LSB is written to the EEADRL register. When selecting a EEPROM address value, only the LSB of the address is written to the EEADRL register. 11.1.1 EECON1 AND EECON2 REGISTERS EECON1 is the control register for EE memory accesses. Control bit EEPGD determines if the access will be a program or data memory access. When clear, any subsequent operations will operate on the EEPROM memory. When set, any subsequent operations will operate on the program memory. On Reset, EEPROM is selected by default. Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set, in software. They are cleared in hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental, premature termination of a write operation. The WREN bit, when set, will allow a write operation to occur. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit and execute the appropriate error handling routine. Interrupt flag bit EEIF of the PIR2 register is set when write is complete. It must be cleared in the software. Reading EECON2 will read all ‘0’s. The EECON2 reg- ister is used exclusively in the data EEPROM write sequence. To enable writes, a specific pattern must be written to EECON2.
- 116. PIC16(L)F1934/6/7 DS41364E-page 116 2008-2011 Microchip Technology Inc. 11.2 Using the Data EEPROM The data EEPROM is a high-endurance, byte address- able array that has been optimized for the storage of frequently changing information (e.g., program vari- ables or other data that are updated often). When vari- ables in one section change frequently, while variables in another section do not change, it is possible to exceed the total number of write cycles to the EEPROM without exceeding the total number of write cycles to a single byte. Refer to the applicable Electri- cal Specifications Chapter. If this is the case, then a refresh of the array must be performed. For this reason, variables that change infrequently (such as constants, IDs, calibration, etc.) should be stored in Flash program memory. 11.2.1 READING THE DATA EEPROM MEMORY To read a data memory location, the user must write the address to the EEADRL register, clear the EEPGD and CFGS control bits of the EECON1 register, and then set control bit RD. The data is available at the very next cycle, in the EEDATL register; therefore, it can be read in the next instruction. EEDATL will hold this value until another read or until it is written to by the user (during a write operation). EXAMPLE 11-1: DATA EEPROM READ 11.2.2 WRITING TO THE DATA EEPROM MEMORY To write an EEPROM data location, the user must first write the address to the EEADRL register and the data to the EEDATL register. Then the user must follow a specific sequence to initiate the write for each byte. The write will not initiate if the above sequence is not followed exactly (write 55h to EECON2, write AAh to EECON2, then set the WR bit) for each byte. Interrupts should be disabled during this code segment. Additionally, the WREN bit in EECON1 must be set to enable write. This mechanism prevents accidental writes to data EEPROM due to errant (unexpected) code execution (i.e., lost programs). The user should keep the WREN bit clear at all times, except when updating EEPROM. The WREN bit is not cleared by hardware. After a write sequence has been initiated, clearing the WREN bit will not affect this write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. At the completion of the write cycle, the WR bit is cleared in hardware and the EE Write Complete Interrupt Flag bit (EEIF) is set. The user can either enable this interrupt or poll this bit. EEIF must be cleared by software. 11.2.3 PROTECTION AGAINST SPURIOUS WRITE There are conditions when the user may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been built-in. On power-up, WREN is cleared. Also, the Power-up Timer (64 ms duration) prevents EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during: • Brown-out • Power Glitch • Software Malfunction 11.2.4 DATA EEPROM OPERATION DURING CODE-PROTECT Data memory can be code-protected by programming the CPD bit in the Configuration Word 1 (Register 5-1) to ‘0’. When the data memory is code-protected, only the CPU is able to read and write data to the data EEPROM. It is recommended to code-protect the pro- gram memory when code-protecting data memory. This prevents anyone from replacing your program with a program that will access the contents of the data EEPROM. Note: Data EEPROM can be read regardless of the setting of the CPD bit. BANKSEL EEADRL ; MOVLW DATA_EE_ADDR ; MOVWF EEADRL ;Data Memory ;Address to read BCF EECON1, CFGS ;Deselect Config space BCF EECON1, EEPGD;Point to DATA memory BSF EECON1, RD ;EE Read MOVF EEDATL, W ;W = EEDATL
- 117. 2008-2011 Microchip Technology Inc. DS41364E-page 117 PIC16(L)F1934/6/7 EXAMPLE 11-2: DATA EEPROM WRITE FIGURE 11-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION BANKSEL EEADRL ; MOVLW DATA_EE_ADDR ; MOVWF EEADRL ;Data Memory Address to write MOVLW DATA_EE_DATA ; MOVWF EEDATL ;Data Memory Value to write BCF EECON1, CFGS ;Deselect Configuration space BCF EECON1, EEPGD ;Point to DATA memory BSF EECON1, WREN ;Enable writes BCF INTCON, GIE ;Disable INTs. MOVLW 55h ; MOVWF EECON2 ;Write 55h MOVLW 0AAh ; MOVWF EECON2 ;Write AAh BSF EECON1, WR ;Set WR bit to begin write BSF INTCON, GIE ;Enable Interrupts BCF EECON1, WREN ;Disable writes BTFSC EECON1, WR ;Wait for write to complete GOTO $-2 ;Done Required Sequence Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 BSF EECON1,RD executed here INSTR(PC + 1) executed here Forced NOP executed here PC PC + 1 EEADRH,EEADRL PC+3 PC + 5 Flash ADDR RD bit EEDATH,EEDATL PC + 3 PC + 4 INSTR (PC + 1) INSTR(PC - 1) executed here INSTR(PC + 3) executed here INSTR(PC + 4) executed here Flash Data EEDATH EEDATL Register EERHLT INSTR (PC) INSTR (PC + 3) INSTR (PC + 4)
- 118. PIC16(L)F1934/6/7 DS41364E-page 118 2008-2011 Microchip Technology Inc. 11.3 Flash Program Memory Overview It is important to understand the Flash program mem- ory structure for erase and programming operations. Flash Program memory is arranged in rows. A row con- sists of a fixed number of 14-bit program memory words. A row is the minimum block size that can be erased by user software. Flash program memory may only be written or erased if the destination address is in a segment of memory that is not write-protected, as defined in bits WRT<1:0> of Configuration Word 2. After a row has been erased, the user can reprogram all or a portion of this row. Data to be written into the program memory row is written to 14-bit wide data write latches. These write latches are not directly accessible to the user, but may be loaded via sequential writes to the EEDATH:EEDATL register pair. The number of data write latches may not be equivalent to the number of row locations. During programming, user software may need to fill the set of write latches and initiate a programming operation multiple times in order to fully reprogram an erased row. For example, a device with a row size of 32 words and eight write latches will need to load the write latches with data and initiate a programming operation four times. The size of a program memory row and the number of program memory write latches may vary by device. See Table 11-1 for details. 11.3.1 READING THE FLASH PROGRAM MEMORY To read a program memory location, the user must: 1. Write the Least and Most Significant address bits to the EEADRH:EEADRL register pair. 2. Clear the CFGS bit of the EECON1 register. 3. Set the EEPGD control bit of the EECON1 register. 4. Then, set control bit RD of the EECON1 register. Once the read control bit is set, the program memory Flash controller will use the second instruction cycle to read the data. This causes the second instruction immediately following the “BSF EECON1,RD” instruction to be ignored. The data is available in the very next cycle, in the EEDATH:EEDATL register pair; therefore, it can be read as two bytes in the following instructions. EEDATH:EEDATL register pair will hold this value until another read or until it is written to by the user. Note: If the user wants to modify only a portion of a previously programmed row, then the contents of the entire row must be read and saved in RAM prior to the erase. TABLE 11-1: FLASH MEMORY ORGANIZATION BY DEVICE Device Erase Block (Row) Size/ Boundary Number of Write Latches/ Boundary PIC16(L)F1934/6/7 32 words, EEADRL<4:0> = 00000 8 words, EEADRL<2:0> = 000 Note 1: The two instructions following a program memory read are required to be NOPs. This prevents the user from executing a two-cycle instruction on the next instruction after the RD bit is set. 2: Flash program memory can be read regardless of the setting of the CP bit.
- 119. 2008-2011 Microchip Technology Inc. DS41364E-page 119 PIC16(L)F1934/6/7 EXAMPLE 11-3: FLASH PROGRAM MEMORY READ * This code block will read 1 word of program * memory at the memory address: PROG_ADDR_HI: PROG_ADDR_LO * data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL EEADRL ; Select Bank for EEPROM registers MOVLW PROG_ADDR_LO ; MOVWF EEADRL ; Store LSB of address MOVLW PROG_ADDR_HI ; MOVWL EEADRH ; Store MSB of address BCF EECON1,CFGS ; Do not select Configuration Space BSF EECON1,EEPGD ; Select Program Memory BCF INTCON,GIE ; Disable interrupts BSF EECON1,RD ; Initiate read NOP ; Executed (Figure 11-1) NOP ; Ignored (Figure 11-1) BSF INTCON,GIE ; Restore interrupts MOVF EEDATL,W ; Get LSB of word MOVWF PROG_DATA_LO ; Store in user location MOVF EEDATH,W ; Get MSB of word MOVWF PROG_DATA_HI ; Store in user location
- 120. PIC16(L)F1934/6/7 DS41364E-page 120 2008-2011 Microchip Technology Inc. 11.3.2 ERASING FLASH PROGRAM MEMORY While executing code, program memory can only be erased by rows. To erase a row: 1. Load the EEADRH:EEADRL register pair with the address of new row to be erased. 2. Clear the CFGS bit of the EECON1 register. 3. Set the EEPGD, FREE, and WREN bits of the EECON1 register. 4. Write 55h, then AAh, to EECON2 (Flash programming unlock sequence). 5. Set control bit WR of the EECON1 register to begin the erase operation. 6. Poll the FREE bit in the EECON1 register to determine when the row erase has completed. See Example 11-4. After the “BSF EECON1,WR” instruction, the processor requires two cycles to set up the erase operation. The user must place two NOP instructions after the WR bit is set. The processor will halt internal operations for the typical 2 ms erase time. This is not Sleep mode as the clocks and peripherals will continue to run. After the erase cycle, the processor will resume operation with the third instruction after the EECON1 write instruction. 11.3.3 WRITING TO FLASH PROGRAM MEMORY Program memory is programmed using the following steps: 1. Load the starting address of the word(s) to be programmed. 2. Load the write latches with data. 3. Initiate a programming operation. 4. Repeat steps 1 through 3 until all data is written. Before writing to program memory, the word(s) to be written must be erased or previously unwritten. Pro- gram memory can only be erased one row at a time. No automatic erase occurs upon the initiation of the write. Program memory can be written one or more words at a time. The maximum number of words written at one time is equal to the number of write latches. See Figure 11-2 (block writes to program memory with 8 write latches) for more details. The write latches are aligned to the address boundary defined by EEADRL as shown in Table 11-1. Write operations do not cross these boundaries. At the completion of a program memory write operation, the write latches are reset to contain 0x3FFF. The following steps should be completed to load the write latches and program a block of program memory. These steps are divided into two parts. First, all write latches are loaded with data except for the last program memory location. Then, the last write latch is loaded and the programming sequence is initiated. A special unlock sequence is required to load a write latch with data or initiate a Flash programming operation. This unlock sequence should not be interrupted. 1. Set the EEPGD and WREN bits of the EECON1 register. 2. Clear the CFGS bit of the EECON1 register. 3. Set the LWLO bit of the EECON1 register. When the LWLO bit of the EECON1 register is ‘1’, the write sequence will only load the write latches and will not initiate the write to Flash program memory. 4. Load the EEADRH:EEADRL register pair with the address of the location to be written. 5. Load the EEDATH:EEDATL register pair with the program memory data to be written. 6. Write 55h, then AAh, to EECON2, then set the WR bit of the EECON1 register (Flash programming unlock sequence). The write latch is now loaded. 7. Increment the EEADRH:EEADRL register pair to point to the next location. 8. Repeat steps 5 through 7 until all but the last write latch has been loaded. 9. Clear the LWLO bit of the EECON1 register. When the LWLO bit of the EECON1 register is ‘0’, the write sequence will initiate the write to Flash program memory. 10. Load the EEDATH:EEDATL register pair with the program memory data to be written. 11. Write 55h, then AAh, to EECON2, then set the WR bit of the EECON1 register (Flash programming unlock sequence). The entire latch block is now written to Flash program memory. It is not necessary to load the entire write latch block with user program data. However, the entire write latch block will be written to program memory. An example of the complete write sequence for eight words is shown in Example 11-5. The initial address is loaded into the EEADRH:EEADRL register pair; the eight words of data are loaded using indirect addressing. Note: The code sequence provided in Example 11-5 must be repeated multiple times to fully program an erased program memory row.
- 121. 2008-2011 Microchip Technology Inc. DS41364E-page 121 PIC16(L)F1934/6/7 After the “BSF EECON1,WR” instruction, the processor requires two cycles to set up the write operation. The user must place two NOP instructions after the WR bit is set. The processor will halt internal operations for the typical 2 ms, only during the cycle in which the write takes place (i.e., the last word of the block write). This is not Sleep mode as the clocks and peripherals will continue to run. The processor does not stall when LWLO = 1, loading the write latches. After the write cycle, the processor will resume operation with the third instruction after the EECON1 write instruction. FIGURE 11-2: BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 8 WRITE LATCHES 14 14 14 14 Program Memory Buffer Register EEADRL<2:0> = 000 Buffer Register EEADRL<2:0> = 001 Buffer Register EEADRL<2:0> = 010 Buffer Register EEADRL<2:0> = 111 EEDATA EEDATH 7 5 0 7 0 6 8 First word of block to be written Last word of block to be written
- 122. PIC16(L)F1934/6/7 DS41364E-page 122 2008-2011 Microchip Technology Inc. EXAMPLE 11-4: ERASING ONE ROW OF PROGRAM MEMORY - ; This row erase routine assumes the following: ; 1. A valid address within the erase block is loaded in ADDRH:ADDRL ; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF INTCON,GIE ; Disable ints so required sequences will execute properly BANKSEL EEADRL MOVF ADDRL,W ; Load lower 8 bits of erase address boundary MOVWF EEADRL MOVF ADDRH,W ; Load upper 6 bits of erase address boundary MOVWF EEADRH BSF EECON1,EEPGD ; Point to program memory BCF EECON1,CFGS ; Not configuration space BSF EECON1,FREE ; Specify an erase operation BSF EECON1,WREN ; Enable writes MOVLW 55h ; Start of required sequence to initiate erase MOVWF EECON2 ; Write 55h MOVLW 0AAh ; MOVWF EECON2 ; Write AAh BSF EECON1,WR ; Set WR bit to begin erase NOP ; Any instructions here are ignored as processor ; halts to begin erase sequence NOP ; Processor will stop here and wait for erase complete. ; after erase processor continues with 3rd instruction BCF EECON1,WREN ; Disable writes BSF INTCON,GIE ; Enable interrupts Required Sequence
- 123. 2008-2011 Microchip Technology Inc. DS41364E-page 123 PIC16(L)F1934/6/7 EXAMPLE 11-5: WRITING TO FLASH PROGRAM MEMORY ; This write routine assumes the following: ; 1. The 16 bytes of data are loaded, starting at the address in DATA_ADDR ; 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR, ; stored in little endian format ; 3. A valid starting address (the least significant bits = 000) is loaded in ADDRH:ADDRL ; 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) ; BCF INTCON,GIE ; Disable ints so required sequences will execute properly BANKSEL EEADRH ; Bank 3 MOVF ADDRH,W ; Load initial address MOVWF EEADRH ; MOVF ADDRL,W ; MOVWF EEADRL ; MOVLW LOW DATA_ADDR ; Load initial data address MOVWF FSR0L ; MOVLW HIGH DATA_ADDR ; Load initial data address MOVWF FSR0H ; BSF EECON1,EEPGD ; Point to program memory BCF EECON1,CFGS ; Not configuration space BSF EECON1,WREN ; Enable writes BSF EECON1,LWLO ; Only Load Write Latches LOOP MOVIW FSR0++ ; Load first data byte into lower MOVWF EEDATL ; MOVIW FSR0++ ; Load second data byte into upper MOVWF EEDATH ; MOVF EEADRL,W ; Check if lower bits of address are '000' XORLW 0x07 ; Check if we're on the last of 8 addresses ANDLW 0x07 ; BTFSC STATUS,Z ; Exit if last of eight words, GOTO START_WRITE ; MOVLW 55h ; Start of required write sequence: MOVWF EECON2 ; Write 55h MOVLW 0AAh ; MOVWF EECON2 ; Write AAh BSF EECON1,WR ; Set WR bit to begin write NOP ; Any instructions here are ignored as processor ; halts to begin write sequence NOP ; Processor will stop here and wait for write to complete. ; After write processor continues with 3rd instruction. INCF EEADRL,F ; Still loading latches Increment address GOTO LOOP ; Write next latches START_WRITE BCF EECON1,LWLO ; No more loading latches - Actually start Flash program ; memory write MOVLW 55h ; Start of required write sequence: MOVWF EECON2 ; Write 55h MOVLW 0AAh ; MOVWF EECON2 ; Write AAh BSF EECON1,WR ; Set WR bit to begin write NOP ; Any instructions here are ignored as processor ; halts to begin write sequence NOP ; Processor will stop here and wait for write complete. ; after write processor continues with 3rd instruction BCF EECON1,WREN ; Disable writes BSF INTCON,GIE ; Enable interrupts Required Sequence Required Sequence
- 124. PIC16(L)F1934/6/7 DS41364E-page 124 2008-2011 Microchip Technology Inc. 11.4 Modifying Flash Program Memory When modifying existing data in a program memory row, and data within that row must be preserved, it must first be read and saved in a RAM image. Program memory is modified using the following steps: 1. Load the starting address of the row to be mod- ified. 2. Read the existing data from the row into a RAM image. 3. Modify the RAM image to contain the new data to be written into program memory. 4. Load the starting address of the row to be rewrit- ten. 5. Erase the program memory row. 6. Load the write latches with data from the RAM image. 7. Initiate a programming operation. 8. Repeat steps 6 and 7 as many times as required to reprogram the erased row. 11.5 User ID, Device ID and Configuration Word Access Instead of accessing program memory or EEPROM data memory, the User ID’s, Device ID/Revision ID and Configuration Words can be accessed when CFGS = 1 in the EECON1 register. This is the region that would be pointed to by PC<15> = 1, but not all addresses are accessible. Different access may exist for reads and writes. Refer to Table 11-2. When read access is initiated on an address outside the parameters listed in Table 11-2, the EEDATH:EEDATL register pair is cleared. TABLE 11-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS = 1) EXAMPLE 11-3: CONFIGURATION WORD AND DEVICE ID ACCESS Address Function Read Access Write Access 8000h-8003h User IDs Yes Yes 8006h Device ID/Revision ID Yes No 8007h-8008h Configuration Words 1 and 2 Yes No * This code block will read 1 word of program memory at the memory address: * PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL EEADRL ; Select correct Bank MOVLW PROG_ADDR_LO ; MOVWF EEADRL ; Store LSB of address CLRF EEADRH ; Clear MSB of address BSF EECON1,CFGS ; Select Configuration Space BCF INTCON,GIE ; Disable interrupts BSF EECON1,RD ; Initiate read NOP ; Executed (See Figure 11-1) NOP ; Ignored (See Figure 11-1) BSF INTCON,GIE ; Restore interrupts MOVF EEDATL,W ; Get LSB of word MOVWF PROG_DATA_LO ; Store in user location MOVF EEDATH,W ; Get MSB of word MOVWF PROG_DATA_HI ; Store in user location
- 125. 2008-2011 Microchip Technology Inc. DS41364E-page 125 PIC16(L)F1934/6/7 11.6 Write Verify Depending on the application, good programming practice may dictate that the value written to the data EEPROM or program memory should be verified (see Example 11-6) to the desired value to be written. Example 11-6 shows how to verify a write to EEPROM. EXAMPLE 11-6: EEPROM WRITE VERIFY BANKSEL EEDATL ; MOVF EEDATL, W ;EEDATL not changed ;from previous write BSF EECON1, RD ;YES, Read the ;value written XORWF EEDATL, W ; BTFSS STATUS, Z ;Is data the same GOTO WRITE_ERR ;No, handle error : ;Yes, continue
- 126. PIC16(L)F1934/6/7 DS41364E-page 126 2008-2011 Microchip Technology Inc. REGISTER 11-1: EEDATL: EEPROM DATA LOW BYTE REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u EEDAT<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 EEDAT<7:0>: Read/write value for EEPROM data byte or Least Significant bits of program memory REGISTER 11-2: EEDATH: EEPROM DATA HIGH BYTE REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — EEDAT<13:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 EEDAT<13:8>: Read/write value for Most Significant bits of program memory REGISTER 11-3: EEADRL: EEPROM ADDRESS LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 EEADR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 EEADR<7:0>: Specifies the Least Significant bits for program memory address or EEPROM address REGISTER 11-4: EEADRH: EEPROM ADDRESS HIGH BYTE REGISTER U-1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — EEADR<14:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘1’ bit 6-0 EEADR<14:8>: Specifies the Most Significant bits for program memory address or EEPROM address
- 127. 2008-2011 Microchip Technology Inc. DS41364E-page 127 PIC16(L)F1934/6/7 REGISTER 11-5: EECON1: EEPROM CONTROL 1 REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W-x/q R/W-0/0 R/S/HC-0/0 R/S/HC-0/0 EEPGD CFGS LWLO FREE WRERR WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 EEPGD: Flash Program/Data EEPROM Memory Select bit 1 = Accesses program space Flash memory 0 = Accesses data EEPROM memory bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit 1 = Accesses Configuration, User ID and Device ID Registers 0 = Accesses Flash Program or data EEPROM Memory bit 5 LWLO: Load Write Latches Only bit If CFGS = 1 (Configuration space) OR CFGS = 0 and EEPGD = 1 (program Flash): 1 = The next WR command does not initiate a write; only the program memory latches are updated. 0 = The next WR command writes a value from EEDATH:EEDATL into program memory latches and initiates a write of all the data stored in the program memory latches. If CFGS = 0 and EEPGD = 0: (Accessing data EEPROM) LWLO is ignored. The next WR command initiates a write to the data EEPROM. bit 4 FREE: Program Flash Erase Enable bit If CFGS = 1 (Configuration space) OR CFGS = 0 and EEPGD = 1 (program Flash): 1 = Performs an erase operation on the next WR command (cleared by hardware after comple- tion of erase). 0 = Performs a write operation on the next WR command. If EEPGD = 0 and CFGS = 0: (Accessing data EEPROM) FREE is ignored. The next WR command will initiate both a erase cycle and a write cycle. bit 3 WRERR: EEPROM Error Flag bit 1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set automatically on any set attempt (write ‘1’) of the WR bit). 0 = The program or erase operation completed normally. bit 2 WREN: Program/Erase Enable bit 1 = Allows program/erase cycles 0 = Inhibits programming/erasing of program Flash and data EEPROM bit 1 WR: Write Control bit 1 = Initiates a program Flash or data EEPROM program/erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete. The WR bit can only be set (not cleared) in software. 0 = Program/erase operation to the Flash or data EEPROM is complete and inactive. bit 0 RD: Read Control bit 1 = Initiates an program Flash or data EEPROM read. Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. 0 = Does not initiate a program Flash or data EEPROM data read.
- 128. PIC16(L)F1934/6/7 DS41364E-page 128 2008-2011 Microchip Technology Inc. TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH DATA EEPROM REGISTER 11-6: EECON2: EEPROM CONTROL 2 REGISTER W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 EEPROM Control Register 2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Data EEPROM Unlock Pattern bits To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the EECON1 register. The value written to this register is used to unlock the writes. There are specific timing requirements on these writes. Refer to Section 11.2.2 “Writing to the Data EEPROM Memory” for more information. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page EECON1 EEPGD CFGS LWLO FREE WRERR WREN WR RD 127 EECON2 EEPROM Control Register 2 (not a physical register) 115* EEADRL EEADRL<7:0> 126 EEADRH — EEADRH<6:0 126 EEDATL EEDATL<7:0> 126 EEDATH — — EEDATH<5:0> 126 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 100 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 103 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the data EEPROM module. * Page provides register information.
- 129. 2008-2011 Microchip Technology Inc. DS41364E-page 129 PIC16(L)F1934/6/7 12.0 I/O PORTS Depending on the device selected and peripherals enabled, there are up to five ports available. In general, when a peripheral is enabled on a port pin, that pin cannot be used as a general purpose output. However, the pin can still be read. Each port has three standard registers for its operation. These registers are: • TRISx registers (data direction) • PORTx registers (reads the levels on the pins of the device) • LATx registers (output latch) Some ports may have one or more of the following additional registers. These registers are: • ANSELx (analog select) • WPUx (weak pull-up) • INLVLx (input level control) The Data Latch (LATx registers) is useful for read-modify-write operations on the value that the I/O pins are driving. A write operation to the LATx register has the same effect as a write to the corresponding PORTx register. A read of the LATx register reads of the values held in the I/O PORT latches, while a read of the PORTx register reads the actual I/O pin value. Ports that support analog inputs have an associated ANSELx register. When an ANSEL bit is set, the digital input buffer associated with that bit is disabled. Disabling the input buffer prevents analog signal levels on the pin between a logic high and low from causing excessive current in the logic input circuitry. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 12-1. FIGURE 12-1: GENERIC I/O PORT OPERATION EXAMPLE 12-1: INITIALIZING PORTA TABLE 12-1: PORT AVAILABILITY PER DEVICE Device PORTA PORTB PORTC PORTD PORTE PIC16(L)F1934 ● ● ● ● ● PIC16(L)F1936 ● ● ● ● PIC16(L)F1937 ● ● ● ● ● Q D CK Write LATx Data Register I/O pin Read PORTx Write PORTx TRISx Read LATx Data Bus To peripherals ANSELx VDD VSS ; This code example illustrates ; initializing the PORTA register. The ; other ports are initialized in the same ; manner. BANKSEL PORTA ; CLRF PORTA ;Init PORTA BANKSEL LATA ;Data Latch CLRF LATA ; BANKSEL ANSELA ; CLRF ANSELA ;digital I/O BANKSEL TRISA ; MOVLW B'00111000' ;Set RA<5:3> as inputs MOVWF TRISA ;and set RA<2:0> as ;outputs
- 130. PIC16(L)F1934/6/7 DS41364E-page 130 2008-2011 Microchip Technology Inc. 12.1 Alternate Pin Function The Alternate Pin Function Control (APFCON) register is used to steer specific peripheral input and output functions between different pins. The APFCON register is shown in Register 12-1. For this device family, the following functions can be moved between different pins. • SS (Slave Select) • P2B output • CCP2/P2A output • CCP3/P3A output • Timer1 Gate • SR Latch SRNQ output • Comparator C2 output These bits have no effect on the values of any TRIS register. PORT and TRIS overrides will be routed to the correct pin. The unselected pin will be unaffected.
- 131. 2008-2011 Microchip Technology Inc. DS41364E-page 131 PIC16(L)F1934/6/7 REGISTER 12-1: APFCON: ALTERNATE PIN FUNCTION CONTROL REGISTER U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’. bit 6 CCP3SEL: CCP3 Input/Output Pin Selection bit For 28-Pin Devices (PIC16F1936): 0 = CCP3/P3A function is on RC6/TX/CK/CCP3/P3A/SEG9 1 = CCP3/P3A function is on RB5/AN13/CPS5/CCP3/P3A/T1G/COM1 For 40-Pin Devices (PIC16F1934/7): 0 = CCP3/P3A function is on RE0/AN5/CCP3/P3A/SEG21 1 = CCP3/P3A function is on RB5/AN13/CPS5/CCP3/P3A/T1G/COM1 bit 5 T1GSEL: Timer1 Gate Input Pin Selection bit 0 = T1G function is on RB5/AN13/CPS5/CCP3/P3A/T1G/COM1 1 = T1G function is on RC4/SDI/SDA/T1G/SEG11 bit 4 P2BSEL: CCP2 PWM B Output Pin Selection bit For 28-Pin Devices (PIC16F1936): 0 = P2B function is on RC0/T1OSO/T1CKI/P2B 1 = P2B function is on RB5/AN13/P2B/CPS5/T1G/COM1 For 40-Pin Devices (PIC16F1934/7): 0 = P2B function is on RC0/T1OSO/T1CKI/P2B 1 = P2B function is on RD2/CPS10/P2B bit 3 SRNQSEL: SR Latch nQ Output Pin Selection bit 0 = SRnQ function is on RA5/AN4/C2OUT/SRnQ/SS/CPS7/SEG5/VCAP 1 = SRnQ function is on RA0/AN0/C12IN0-/C2OUT/SRnQ/SS/SEG12/VCAP bit 2 C2OUTSEL: Comparator C2 Output Pin Selection bit 0 = C2OUT function is on RA5/AN4/C2OUT/SRnQ/SS/CPS7/SEG5/VCAP 1 = C2OUT function is on RA0/AN0/C12IN0-/C2OUT/SRnQ/SS/SEG12/VCAP bit 1 SSSEL: SS Input Pin Selection bit 0 = SS function is on RA5/AN4/C2OUT/SRNQ/SS/CPS7/SEG5/VCAP 1 = SS function is on RA0/AN0/C12IN0-/C2OUT/SRNQ/SS/SEG12/VCAP bit 0 CCP2SEL: CCP2 Input/Output Pin Selection bit 0 = CCP2/P2A function is on RC1/T1OSI/CCP2/P2A 1 = CCP2/P2A function is on RB3/AN9/C12IN2-/CPS3/CCP2/P2A/VLCD3
- 132. PIC16(L)F1934/6/7 DS41364E-page 132 2008-2011 Microchip Technology Inc. 12.2 PORTA Registers PORTA is a 8-bit wide, bidirectional port. The corresponding data direction register is TRISA (Register 12-3). Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input (i.e., disable the output driver). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., enables output driver and puts the contents of the output latch on the selected pin). Example 12-1 shows how to initialize an I/O port. Reading the PORTA register (Register 12-2) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATA). The TRISA register (Register 12-3) controls the PORTA pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISA register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. 12.2.1 ANSELA REGISTER The ANSELA register (Register 12-5) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELA bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELA bits has no effect on digital output functions. A pin with TRIS clear and ANSEL set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. 12.2.2 PORTA FUNCTIONS AND OUTPUT PRIORITIES Each PORTA pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 12-2. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input functions, such as ADC, comparator and CapSense inputs, are not shown in the priority lists. These inputs are active when the I/O pin is set for Analog mode using the ANSELx registers. Digital output functions may control the pin when it is in Analog mode with the priority shown in Table 12-2. Note: The ANSELA bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software. TABLE 12-2: PORTA OUTPUT PRIORITY Pin Name Function Priority(1) RA0 VCAP SEG12 (LCD) SRNQ (SR Latch) C2OUT (Comparator) RA0 RA1 SEG7 (LCD) RA1 RA2 COM2 (LCD) AN2 (DAC) RA2 RA3 COM3 (LCD) 28-pin only SEG15 RA3 RA4 SEG4 (LCD) SRQ (SR Latch) C1OUT (Comparator) CCP5, 28-pin only RA4 RA5 VCAP (enabled by Config. Word) SEG5 (LCD) SRNQ (SR Latch) C2OUT (Comparator) RA5 RA6 VCAP (enabled by Config. Word) OSC2 (enabled by Config. Word) CLKOUT (enabled by Config. Word) SEG1 (LCD) RA6 RA7 OSC1/CLKIN (enabled by Config. Word) SEG2 (LCD) RA7 Note 1: Priority listed from highest to lowest.
- 133. 2008-2011 Microchip Technology Inc. DS41364E-page 133 PIC16(L)F1934/6/7 REGISTER 12-2: PORTA: PORTA REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RA<7:0>: PORTA I/O Value bits(1) 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values. REGISTER 12-3: TRISA: PORTA TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISA<7:0>: PORTA Tri-State Control bit 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output REGISTER 12-4: LATA: PORTA DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATA7 LATA6 LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 LATA<7:0>: PORTA Output Latch Value bits(1) Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values.
- 134. PIC16(L)F1934/6/7 DS41364E-page 134 2008-2011 Microchip Technology Inc. REGISTER 12-5: ANSELA: PORTA ANALOG SELECT REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 ANSA<5:0>: Analog Select between Analog or Digital Function on pins RA<5:0>, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1) . Digital input buffer disabled. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin.
- 135. 2008-2011 Microchip Technology Inc. DS41364E-page 135 PIC16(L)F1934/6/7 TABLE 12-3: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA TABLE 12-4: SUMMARY OF CONFIGURATION WORD WITH PORTA Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ADCON0 — CHS<4:0> GO/DONE ADON 163 ADCON1 ADFM ADCS<2:0> — ADNREF ADPREF<1:0> 164 ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 134 APFCON — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL 131 CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 183 CM2CON0 C2ON C2OUT C2OE C2POL — C2SP C2HYS C2SYNC 183 CM1CON1 C1NTP C1INTN C1PCH<1:0> — — C1NCH<1:0> 184 CM2CON1 C2NTP C2INTN C2PCH<1:0> — — C2NCH<1:0> 184 CPSCON0 CPSON — — — CPSRNG<1:0> CPSOUT T0XCS 323 CPSCON1 — — — — CPSCH<3:0> 324 DACCON0 DACEN DACLPS DACOE --- DACPSS<1:0> --- DACNSS 176 LATA LATA7 LATA6 LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 133 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 329 LCDSE0 SE7 SE6 SE5 SE4 SE3 SE2 SE1 SE0 333 LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE9 SE8 333 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 193 PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 133 SRCON0 SRLEN SRCLK<2:0> SRQEN SRNQEN SRPS SRPR 189 SSPCON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 287 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register on Page CONFIG1 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD 62 7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0> CONFIG2 13:8 — — LVP DEBUG — BORV STVREN PLLEN 64 7:0 — — VCAPEN<1:0>(1) — — WRT<1:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA. Note 1: PIC16F1934/6/7 only.
- 136. PIC16(L)F1934/6/7 DS41364E-page 136 2008-2011 Microchip Technology Inc. 12.3 PORTB Registers PORTB is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISB (Register 12-7). Setting a TRISB bit (= 1) will make the corresponding PORTB pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISB bit (= 0) will make the corresponding PORTB pin an output (i.e., enable the output driver and put the contents of the output latch on the selected pin). Example 12-1 shows how to initialize an I/O port. Reading the PORTB register (Register 12-6) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATB). The TRISB register (Register 12-7) controls the PORTB pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISB register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. 12.3.1 WEAK PULL-UPS Each of the PORTB pins has an individually configurable internal weak pull-up. Control bits WPUB<7:0> enable or disable each pull-up (see Register 12-10). Each weak pull-up is automatically turned off when the port pin is configured as an output. All pull-ups are disabled on a Power-on Reset by the WPUEN bit of the OPTION_REG register. 12.3.2 INTERRUPT-ON-CHANGE All of the PORTB pins are individually configurable as an interrupt-on-change pin. Control bits IOCB<7:0> enable or disable the interrupt function for each pin. The interrupt-on-change feature is disabled on a Power-on Reset. Reference Section 13.0 “Interrupt-On-Change” for more information. 12.3.3 ANSELB REGISTER The ANSELB register (Register 12-9) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELB bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELB bits has no effect on digital output functions. A pin with TRIS clear and ANSELB set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: The ANSELB bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software.
- 137. 2008-2011 Microchip Technology Inc. DS41364E-page 137 PIC16(L)F1934/6/7 12.3.4 PORTB FUNCTIONS AND OUTPUT PRIORITIES Each PORTB pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 12-5. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input and some digital input functions are not included in the list below. These input functions can remain active when the pin is configured as an output. Certain digital input functions override other port functions and are included in Table 12-5. TABLE 12-5: PORTB OUTPUT PRIORITY Pin Name Function Priority(1) RB0 SEG0 (LCD) CCP4, 28-pin only RB0 RB1 P1C (ECCP1), 28-pin only RB1 RB2 P1B (ECCP1), 28-pin only RB2 RB3 CCP2/P2A RB3 RB4 COM0 P1D, 28-pin only RB4 RB5 COM1 P2B, 28-pin only CCP3/P3A RB5 RB6 ICSPCLK (Programming) ICDCLK (enabled by Config. Word) SEG14 (LCD) RB6 RB7 ICSPDAT (Programming) ICDDAT (enabled by Config. Word) SEG13 (LCD) RB7 Note 1: Priority listed from highest to lowest.
- 138. PIC16(L)F1934/6/7 DS41364E-page 138 2008-2011 Microchip Technology Inc. REGISTER 12-6: PORTB: PORTB REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RB<7:0>: PORTB I/O Pin bit 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 12-7: TRISB: PORTB TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISB<7:0>: PORTB Tri-State Control bit 1 = PORTB pin configured as an input (tri-stated) 0 = PORTB pin configured as an output REGISTER 12-8: LATB: PORTB DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 LATB<7:0>: PORTB Output Latch Value bits(1) Note 1: Writes to PORTB are actually written to corresponding LATB register. Reads from PORTB register is return of actual I/O pin values.
- 139. 2008-2011 Microchip Technology Inc. DS41364E-page 139 PIC16(L)F1934/6/7 REGISTER 12-9: ANSELB: PORTB ANALOG SELECT REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 ANSB<5:0>: Analog Select between Analog or Digital Function on Pins RB<5:0>, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. REGISTER 12-10: WPUB: WEAK PULL-UP PORTB REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 WPUB<7:0>: Weak Pull-up Register bits 1 = Pull-up enabled 0 = Pull-up disabled Note 1: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. 2: The weak pull-up device is automatically disabled if the pin is in configured as an output.
- 140. PIC16(L)F1934/6/7 DS41364E-page 140 2008-2011 Microchip Technology Inc. TABLE 12-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ADCON0 — CHS<4:0> GO/DONE ADON 163 ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 139 APFCON — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL 131 CCPxCON PxM<1:0> DCxB<1:0> CCPxM<3:0> 234 CPSCON0 CPSON — — — CPSRNG<1:0> CPSOUT T0XCS 323 CPSCON1 — — — — CPSCH<3:> 324 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 152 IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 152 IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 152 LATB LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 138 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 329 LCDSE0 SE7 SE6 SE5 SE4 SE3 SE2 SE1 SE0 333 LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE9 SE8 333 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 193 PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 138 T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/DONE T1GVAL T1GSS<1:0> 204 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 138 WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 139 Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTB.
- 141. 2008-2011 Microchip Technology Inc. DS41364E-page 141 PIC16(L)F1934/6/7 12.4 PORTC Registers PORTC is a 8-bit wide, bidirectional port. The corresponding data direction register is TRISC (Register 12-12). Setting a TRISC bit (= 1) will make the corresponding PORTC pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISC bit (= 0) will make the corresponding PORTC pin an output (i.e., enable the output driver and put the contents of the output latch on the selected pin). Example 12-1 shows how to initialize an I/O port. Reading the PORTC register (Register 12-11) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATC). The TRISC register (Register 12-12) controls the PORTC pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISC register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. 12.4.1 PORTC FUNCTIONS AND OUTPUT PRIORITIES Each PORTC pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 12-7. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input and some digital input functions are not included in the list below. These input functions can remain active when the pin is configured as an output. Certain digital input functions override other port functions and are included in Table 12-7. TABLE 12-7: PORTC OUTPUT PRIORITY Pin Name Function Priority(1) RC0 T1OSO (Timer1 Oscillator) CCP2/P2B RC0 RC1 T1OSI (Timer1 Oscillator) CCP2/P2A RC1 RC2 SEG3 (LCD) CCP1/P1A RC2 RC3 SEG6 (LCD) SCL (MSSP) SCK (MSSP) RC3 RC4 SEG11 (LCD) SDA (MSSP) RC4 RC5 SEG10 (LCD) SDO (MSSP) RC5 RC6 ISEG9 (LCD) TX (EUSART) CK (EUSART) CCP3/P3A, 28-pin only RC6 RC7 SEG8 (LCD) DT (EUSART) CCP3/P3B, 28 pin only RC7 Note 1: Priority listed from highest to lowest.
- 142. PIC16(L)F1934/6/7 DS41364E-page 142 2008-2011 Microchip Technology Inc. REGISTER 12-11: PORTC: PORTC REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RC<7:0>: PORTC General Purpose I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 12-12: TRISC: PORTC TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISC<7:0>: PORTC Tri-State Control bits 1 = PORTC pin configured as an input (tri-stated) 0 = PORTC pin configured as an output REGISTER 12-13: LATC: PORTC DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 LATC<7:0>: PORTC Output Latch Value bits(1) Note 1: Writes to PORTC are actually written to corresponding LATC register. Reads from PORTC register is return of actual I/O pin values.
- 143. 2008-2011 Microchip Technology Inc. DS41364E-page 143 PIC16(L)F1934/6/7 TABLE 12-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page APFCON — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL 131 CCPxCON PxM<1:0> DCxB<1:0> CCPxM<3:0> 234 LATC LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 142 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 329 LCDSE0 SE7 SE6 SE5 SE4 SE3 SE2 SE1 SE0 333 LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE9 SE8 333 PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 142 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 301 SSPCON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 287 SSPSTAT SMP CKE D/A P S R/W UA BF 286 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 203 TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 300 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTC.
- 144. PIC16(L)F1934/6/7 DS41364E-page 144 2008-2011 Microchip Technology Inc. 12.5 PORTD Registers PORTD is a 8-bit wide, bidirectional port. The corresponding data direction register is TRISD (Register 12-14). Setting a TRISD bit (= 1) will make the corresponding PORTD pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISD bit (= 0) will make the corresponding PORTD pin an output (i.e., enable the output driver and put the contents of the output latch on the selected pin). Example 12-1 shows how to initialize an I/O port. Reading the PORTD register (Register 12-14) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATD). The TRISD register (Register 12-15) controls the PORTD pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISD register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. 12.5.1 ANSELD REGISTER The ANSELD register (Register 12-17) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELD bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELD bits has no effect on digital output functions. A pin with TRIS clear and ANSEL set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. 12.5.2 PORTD FUNCTIONS AND OUTPUT PRIORITIES Each PORTD pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 12-9. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input and some digital input functions are not included in the list below. These input functions can remain active when the pin is configured as an output. Certain digital input functions override other port functions and are included in Table 12-9. Note: PORTD is available on PIC16(L)F1934 and PIC16(L)F1937 only. Note: The ANSELD bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software. TABLE 12-9: PORTD OUTPUT PRIORITY Pin Name Function Priority(1) RD0 COM3 (LCD) RD0 RD1 CCP4 (CCP) RD1 RD2 P2B (CCP) RD2 RD3 SEG16 (LCD) P2C (CCP) RD3 RD4 SEG17 (LCD) P2D (CCP) RD4 RD5 SEG18 (LCD) P1B (CCP) RD5 RD6 SEG19 (LCD) P1C (CCP) RD6 RD7 SEG20 (LCD) P1D (CCP) RD7 Note 1: Priority listed from highest to lowest.
- 145. 2008-2011 Microchip Technology Inc. DS41364E-page 145 PIC16(L)F1934/6/7 REGISTER 12-14: PORTD: PORTD REGISTER(1) R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RD<7:0>: PORTD General Purpose I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: PORTD is not implemented on PIC16(L)F1936 devices, read as ‘0’. REGISTER 12-15: TRISD: PORTD TRI-STATE REGISTER(1) R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISD<7:0>: PORTD Tri-State Control bits 1 = PORTD pin configured as an input (tri-stated) 0 = PORTD pin configured as an output Note 1: TRISD is not implemented on PIC16(L)F1936 devices, read as ‘0’. 2: PORTD implemented on PIC16(L)F1934/7 devices only. REGISTER 12-16: LATD: PORTD DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 LATD<7:0>: PORTD Output Latch Value bits(1,2) Note 1: Writes to PORTD are actually written to corresponding LATD register. Reads from PORTD register is return of actual I/O pin values. 2: PORTD implemented on PIC16(L)F1934/7 devices only.
- 146. PIC16(L)F1934/6/7 DS41364E-page 146 2008-2011 Microchip Technology Inc. TABLE 12-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD(1) REGISTER 12-17: ANSELD: PORTD ANALOG SELECT REGISTER(2) R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 ANSD7 ANSD6 ANSD5 ANSD4 ANSD3 ANSD2 ANSD1 ANSD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ANSD<7:0>: Analog Select between Analog or Digital Function on Pins RD<7:0>, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1) . Digital input buffer disabled. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. 2: ANSELD register is not implemented on the PIC16(L)F1936. Read as ‘0’. 3: PORTD implemented on PIC16(L)F1934/7 devices only. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELD ANSD7 ANSD6 ANSD5 ANSD4 ANSD3 ANSD2 ANSD1 ANSD0 146 CCPxCON PxM<1:0> DCxB<1:0> CCPxM<3:0> 234 CPSCON0 CPSON — — — CPSRNG<1:0> CPSOUT T0XCS 323 CPSCON1 — — — — CPSCH<3:0> 324 LATD LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 145 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 329 LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16 333 PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 145 TRISD TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 145 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTD. Note 1: These registers are not implemented on the PIC16(L)F1936 devices, read as ‘0’.
- 147. 2008-2011 Microchip Technology Inc. DS41364E-page 147 PIC16(L)F1934/6/7 12.6 PORTE Registers PORTE is a 4-bit wide, bidirectional port. The corresponding data direction register is TRISE. Setting a TRISE bit (= 1) will make the corresponding PORTE pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISE bit (= 0) will make the corresponding PORTE pin an output (i.e., enable the output driver and put the contents of the output latch on the selected pin). The exception is RE3, which is input only and its TRIS bit will always read as ‘1’. Example 12-1 shows how to initialize an I/O port. Reading the PORTE register (Register 12-18) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATE). RE3 reads ‘0’ when MCLRE = 1. 12.6.1 ANSELE REGISTER The ANSELE register (Register 12-21) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELE bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELE bits has no effect on digital output functions. A pin with TRIS clear and ANSEL set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. The TRISE register (Register 12-19) controls the PORTE pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISE register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. 12.6.2 PORTE FUNCTIONS AND OUTPUT PRIORITIES Each PORTD pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 12-11. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input and some digital input functions are not included in the list below. These input functions can remain active when the pin is configured as an output. Certain digital input functions override other port functions and are included in Table 12-11. Note: RE<2:0> and TRISE<2:0> pins are available on PIC16(L)F1934 and PIC16(L)F1937 only. Note: The ANSELE bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software. TABLE 12-11: PORTE OUTPUT PRIORITY Pin Name Function Priority(1) RE0 SEG21 (LCD) CCP3/P3A (CCP) RE0 RE1 SEG22 (LCD) P3B (CCP) RE1 RE2 SEG23 (LCD) CCP5 (CCP) RE2 Note 1: Priority listed from highest to lowest.
- 148. PIC16(L)F1934/6/7 DS41364E-page 148 2008-2011 Microchip Technology Inc. REGISTER 12-18: PORTE: PORTE REGISTER U-0 U-0 U-0 U-0 R-x/u R/W-x/u R/W-x/u R/W-x/u — — — — RE3 RE2(1) RE1(1) RE0(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 RE<3:0>: PORTE I/O Pin bits(1) 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: RE<2:0> are not implemented on the PIC16(L)F1936. Read as ‘0’. REGISTER 12-19: TRISE: PORTE TRI-STATE REGISTER U-0 U-0 U-0 U-0 U-1(2) R/W-1 R/W-1 R/W-1 — — — — — TRISE2(1) TRISE1(1) TRISE0(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3 Unimplemented: Read as ‘1’ bit 2-0 TRISE<2:0>: RE<2:0> Tri-State Control bits(1) 1 = PORTE pin configured as an input (tri-stated) 0 = PORTE pin configured as an output Note 1: TRISE<2:0> are not implemented on the PIC16(L)F1936. Read as ‘0’. 2: Unimplemented, read as ‘1’.
- 149. 2008-2011 Microchip Technology Inc. DS41364E-page 149 PIC16(L)F1934/6/7 REGISTER 12-20: LATE: PORTE DATA LATCH REGISTER U-0 U-0 U-0 U-0 U-0 R/W-x/u R/W-x/u R/W-x/u — — — — — LATE2 LATE1 LATE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 LATE<2:0>: PORTE Output Latch Value bits(1) Note 1: Writes to PORTE are actually written to corresponding LATE register. Reads from PORTE register is return of actual I/O pin values. REGISTER 12-21: ANSELE: PORTE ANALOG SELECT REGISTER U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 — — — — — ANSE2(2) ANSE1(2) ANSE0(2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 ANSE<2:0>: Analog Select between Analog or Digital Function on Pins RE<2:0>, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1) . Digital input buffer disabled. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. 2: ANSELE register is not implemented on the PIC16(L)F1936. Read as ‘0’
- 150. PIC16(L)F1934/6/7 DS41364E-page 150 2008-2011 Microchip Technology Inc. TABLE 12-12: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE REGISTER 12-22: WPUE: WEAK PULL-UP PORTE REGISTER U-0 U-0 U-0 U-0 R/W-1/1 U-0 U-0 U-0 — — — — WPUE3 — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3 WPUE: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 2-0 Unimplemented: Read as ‘0’ Note 1: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. 2: The weak pull-up device is automatically disabled if the pin is in configured as an output. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ADCON0 — CHS<4:0> GO/DONE ADON 163 ANSELE — — — — — ANSE2(1) ANSE1(1) ANSE0(1) 149 CCPxCON PxM<1:0> DCxB<1:0> CCPxM<3:0> 234 LATE — — — — — LATE2(1) LATE1(1) LATE0(1) 149 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 329 LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16 333 PORTE — — — — RE3 RE2(1) RE1(1) RE0(1) 148 TRISE — — — — —(2) TRISE2(1) TRISE1(1) TRISE0(1) 148 WPUE — — — — WPUE3 — — — 150 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTE. Note 1: These bits are not implemented on the PIC16(L)F1936 devices, read as ‘0’. 2: Unimplemented, read as ‘1’. 3: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’.
- 151. 2008-2011 Microchip Technology Inc. DS41364E-page 151 PIC16(L)F1934/6/7 13.0 INTERRUPT-ON-CHANGE The PORTB pins can be configured to operate as Interrupt-On-Change (IOC) pins. An interrupt can be generated by detecting a signal that has either a rising edge or a falling edge. Any individual PORT IOC pin, or combination of PORT IOC pins, can be configured to generate an interrupt. The interrupt-on-change module has the following features: • Interrupt-on-Change enable (Master Switch) • Individual pin configuration • Rising and falling edge detection • Individual pin interrupt flags Figure 13-1 is a block diagram of the IOC module. 13.1 Enabling the Module To allow individual PORTB pins to generate an interrupt, the IOCIE bit of the INTCON register must be set. If the IOCIE bit is disabled, the edge detection on the pin will still occur, but an interrupt will not be generated. 13.2 Individual Pin Configuration For each PORTB pin, a rising edge detector and a falling edge detector are present. To enable a pin to detect a rising edge, the associated IOCBPx bit of the IOCBP register is set. To enable a pin to detect a falling edge, the associated IOCBNx bit of the IOCBN register is set. A pin can be configured to detect rising and falling edges simultaneously by setting both the IOCBPx bit and the IOCBNx bit of the IOCBP and IOCBN registers, respectively. 13.3 Interrupt Flags The IOCBFx bits located in the IOCBF register are status flags that correspond to the interrupt-on-change pins of PORTB. If an expected edge is detected on an appropriately enabled pin, then the status flag for that pin will be set, and an interrupt will be generated if the IOCIE bit is set. The IOCIF bit of the INTCON register reflects the status of all IOCBFx bits. 13.4 Clearing Interrupt Flags The individual status flags, (IOCBFx bits), can be cleared by resetting them to zero. If another edge is detected during this clearing operation, the associated status flag will be set at the end of the sequence, regardless of the value actually being written. In order to ensure that no detected edge is lost while clearing flags, only AND operations masking out known changed bits should be performed. The following sequence is an example of what should be performed. EXAMPLE 13-1: 13.5 Operation in Sleep The interrupt-on-change interrupt sequence will wake the device from Sleep mode, if the IOCIE bit is set. If an edge is detected while in Sleep mode, the IOCBF register will be updated prior to the first instruction executed out of Sleep. FIGURE 13-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM MOVLW 0xff XORWF IOCBF, W ANDWF IOCBF, F RBx From all other IOCBFx individual pin detectors D Q CK R D Q CK R IOCBNx IOCBPx Q2 Clock Cycle IOCIE IOC Interrupt to CPU Core IOCBFx
- 152. PIC16(L)F1934/6/7 DS41364E-page 152 2008-2011 Microchip Technology Inc. 13.6 Interrupt-On-Change Registers REGISTER 13-1: IOCBP: INTERRUPT-ON-CHANGE POSITIVE EDGE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 IOCBP<7:0>: Interrupt-on-Change Positive Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a positive going edge. Associated Status bit and interrupt flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 13-2: IOCBN: INTERRUPT-ON-CHANGE NEGATIVE EDGE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 IOCBN<7:0>: Interrupt-on-Change Negative Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a negative going edge. Associated Status bit and interrupt flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 13-3: IOCBF: INTERRUPT-ON-CHANGE FLAG REGISTER R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware bit 7-0 IOCBF<7:0>: Interrupt-on-Change Flag bits 1 = An enabled change was detected on the associated pin. Set when IOCBPx = 1 and a rising edge was detected on RBx, or when IOCBNx = 1 and a falling edge was detected on RBx. 0 = No change was detected, or the user cleared the detected change.
- 153. 2008-2011 Microchip Technology Inc. DS41364E-page 153 PIC16(L)F1934/6/7 TABLE 13-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 139 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 152 IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 152 IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 152 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 138 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Interrupt-on-Change.
- 154. PIC16(L)F1934/6/7 DS41364E-page 154 2008-2011 Microchip Technology Inc. NOTES:
- 155. 2008-2011 Microchip Technology Inc. DS41364E-page 155 PIC16(L)F1934/6/7 14.0 FIXED VOLTAGE REFERENCE (FVR) The Fixed Voltage Reference, or FVR, is a stable voltage reference, independent of VDD, with 1.024V, 2.048V or 4.096V selectable output levels. The output of the FVR can be configured to supply a reference voltage to the following: • ADC input channel • ADC positive reference • Comparator positive input • Digital-to-Analog Converter (DAC) • Capacitive Sensing (CPS) module • LCD bias generator The FVR can be enabled by setting the FVREN bit of the FVRCON register. 14.1 Independent Gain Amplifiers The output of the FVR supplied to the ADC, Comparators, DAC and CPS is routed through two independent programmable gain amplifiers. Each amplifier can be configured to amplify the reference voltage by 1x, 2x or 4x, to produce the three possible voltage levels. The ADFVR<1:0> bits of the FVRCON register are used to enable and configure the gain amplifier settings for the reference supplied to the ADC module. Refer- ence Section 15.0 “Analog-to-Digital Converter (ADC) Module” for additional information. The CDAFVR<1:0> bits of the FVRCON register are used to enable and configure the gain amplifier settings for the reference supplied to the DAC, CPS and comparator module. Reference Section 17.0 “Digital-to-Analog Converter (DAC) Module”, Section 18.0 “Comparator Module” and Section 26.0 “Capacitive Sensing (CPS) Module” for additional information. 14.2 FVR Stabilization Period When the Fixed Voltage Reference module is enabled, it requires time for the reference and amplifier circuits to stabilize. Once the circuits stabilize and are ready for use, the FVRRDY bit of the FVRCON register will be set. See in the applicable Electrical Specifications Chapter for the minimum delay requirement. FIGURE 14-1: VOLTAGE REFERENCE BLOCK DIAGRAM ADFVR<1:0> CDAFVR<1:0> X1 X2 X4 X1 X2 X4 2 2 FVR BUFFER1 (To ADC Module) FVR BUFFER2 (To Comparators, DAC) FVR VREF (To LCD Bias Generator) + _ FVREN FVRRDY 1.024V Fixed Reference
- 156. PIC16(L)F1934/6/7 DS41364E-page 156 2008-2011 Microchip Technology Inc. 14.3 FVR Control Registers TABLE 14-1: SUMMARY OF REGISTERS ASSOCIATED WITH FIXED VOLTAGE REFERENCE REGISTER 14-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER R/W-0/0 R-q/q R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 FVREN FVRRDY(1) TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 FVREN: Fixed Voltage Reference Enable bit 0 = Fixed Voltage Reference is disabled 1 = Fixed Voltage Reference is enabled bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(1) 0 = Fixed Voltage Reference output is not ready or not enabled 1 = Fixed Voltage Reference output is ready for use bit 5 TSEN: Temperature Indicator Enable bit(3) 0 = Temperature Indicator is disabled 1 = Temperature Indicator is enabled bit 4 TSRNG: Temperature Indicator Range Selection bit(3) 0 = VOUT = VDD - 2VT (Low Range) 1 = VOUT = VDD - 4VT (High Range) bit 3-2 CDAFVR<1:0>: Comparator and DAC Fixed Voltage Reference Selection bit 00 = Comparator and DAC Fixed Voltage Reference Peripheral output is off. 01 = Comparator and DAC Fixed Voltage Reference Peripheral output is 1x (1.024V) 10 = Comparator and DAC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2) 11 = Comparator and DAC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2) bit 1-0 ADFVR<1:0>: ADC Fixed Voltage Reference Selection bit 00 = ADC Fixed Voltage Reference Peripheral output is off. 01 = ADC Fixed Voltage Reference Peripheral output is 1x (1.024V) 10 = ADC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2) 11 = ADC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2) Note 1: FVRRDY is always ‘1’ on devices with LDO (PIC16F1934/6/7). 2: Fixed Voltage Reference output cannot exceed VDD. 3: See Section 16.0 “Temperature Indicator Module” for additional information. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on page FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 156 Legend: Shaded cells are not used with the Fixed Voltage Reference.
- 157. 2008-2011 Microchip Technology Inc. DS41364E-page 157 PIC16(L)F1934/6/7 15.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESH:ADRESL register pair). Figure 15-1 shows the block diagram of the ADC. The ADC voltage reference is software selectable to be either internally generated or externally supplied. The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. FIGURE 15-1: ADC BLOCK DIAGRAM DAC VDD VREF+ ADPREF = 10 ADPREF = 00 ADPREF = 11 FVR Buffer1 VSS VREF- ADNREF = 1 ADNREF = 0 Note 1: When ADON = 0, all multiplexer inputs are disconnected. 2: Not available on PIC16(L)F1936. ADON(1) GO/DONE VSS ADC 00000 00001 00010 00011 00100 00101 00111 00110 01000 01001 01010 01011 01100 01101 11110 CHS<4:0> AN0 AN1 AN2 AN4 AN5(2) AN6(2) AN7(2) AN3 AN8 AN9 AN10 AN11 AN12 AN13 11111 ADRESH ADRESL 10 16 ADFM 0 = Left Justify 1 = Right Justify Temperature Sensor 11101
- 158. PIC16(L)F1934/6/7 DS41364E-page 158 2008-2011 Microchip Technology Inc. 15.1 ADC Configuration When configuring and using the ADC the following functions must be considered: • Port configuration • Channel selection • ADC voltage reference selection • ADC conversion clock source • Interrupt control • Result formatting 15.1.1 PORT CONFIGURATION The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ANSEL bits. Refer to Section 12.0 “I/O Ports” for more information. 15.1.2 CHANNEL SELECTION There are 17 channel selections available: • AN<13:0> pins • Temperature Indicator • DAC Output • FVR (Fixed Voltage Reference) Output Refer to Section 16.0 “Temperature Indicator Mod- ule”, Section 17.0 “Digital-to-Analog Converter (DAC) Module” and Section 14.0 “Fixed Voltage Reference (FVR)” for more information on these chan- nel selections. The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section 15.2 “ADC Operation” for more information. 15.1.3 ADC VOLTAGE REFERENCE The ADPREF bits of the ADCON1 register provides control of the positive voltage reference. The positive voltage reference can be: • VREF+ pin • VDD • FVR 2.048V • FVR 4.096V (Not available on LF devices) The ADNREF bits of the ADCON1 register provides control of the negative voltage reference. The negative voltage reference can be: • VREF- pin • VSS See Section 14.0 “Fixed Voltage Reference (FVR)” for more details on the fixed voltage reference. 15.1.4 CONVERSION CLOCK The source of the conversion clock is software select- able via the ADCS bits of the ADCON1 register. There are seven possible clock options: • FOSC/2 • FOSC/4 • FOSC/8 • FOSC/16 • FOSC/32 • FOSC/64 • FRC (dedicated internal oscillator) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11.5 TAD periods as shown in Figure 15-2. For correct conversion, the appropriate TAD specifica- tion must be met. Refer to the A/D conversion require- ments in the applicable Electrical Specifications Chapter for more information. Table 15-1 gives exam- ples of appropriate ADC clock selections. Note: Analog voltages on any pin that is defined as a digital input may cause the input buf- fer to conduct excess current. Note: Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result.
- 159. 2008-2011 Microchip Technology Inc. DS41364E-page 159 PIC16(L)F1934/6/7 TABLE 15-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES FIGURE 15-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES ADC Clock Period (TAD) Device Frequency (FOSC) Device Frequency (FOSC) ADC Clock Source ADCS<2:0> 32 MHz 20 MHz 16 MHz 8 MHz 4 MHz 1 MHz Fosc/2 000 62.5ns(2) 100 ns(2) 125 ns(2) 250 ns(2) 500 ns(2) 2.0 s Fosc/4 100 125 ns(2) 200 ns(2) 250 ns(2) 500 ns(2) 1.0 s 4.0 s Fosc/8 001 0.5 s(2) 400 ns(2) 0.5 s(2) 1.0 s 2.0 s 8.0 s(3) Fosc/16 101 800 ns 800 ns 1.0 s 2.0 s 4.0 s 16.0 s(3) Fosc/32 010 1.0 s 1.6 s 2.0 s 4.0 s 8.0 s(3) 32.0 s(3) Fosc/64 110 2.0 s 3.2 s 4.0 s 8.0 s(3) 16.0 s(3) 64.0 s(3) FRC x11 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) Legend: Shaded cells are outside of recommended range. Note 1: The FRC source has a typical TAD time of 1.6 s for VDD. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: The ADC clock period (TAD) and total ADC conversion time can be minimized when the ADC clock is derived from the system clock FOSC. However, the FRC clock source must be used when conversions are to be performed with the device in Sleep mode. TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD11 Set GO bit Holding capacitor is disconnected from analog input (typically 100 ns) TAD9 TAD10 TCY - TAD ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. Conversion starts b0 b9 b6 b5 b4 b3 b2 b1 b8 b7 On the following cycle:
- 160. PIC16(L)F1934/6/7 DS41364E-page 160 2008-2011 Microchip Technology Inc. 15.1.5 INTERRUPTS The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC Interrupt Flag is the ADIF bit in the PIR1 register. The ADC Interrupt Enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruc- tion is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execu- tion, the GIE and PEIE bits of the INTCON register must be disabled. If the GIE and PEIE bits of the INTCON register are enabled, execution will switch to the Interrupt Service Routine. Please refer to Section 15.1.5 “Interrupts” for more information. 15.1.6 RESULT FORMATTING The 10-bit A/D conversion result can be supplied in two formats, left justified or right justified. The ADFM bit of the ADCON1 register controls the output format. Figure 15-3 shows the two output formats. FIGURE 15-3: 10-BIT A/D CONVERSION RESULT FORMAT Note 1: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. 2: The ADC operates during Sleep only when the FRC oscillator is selected. ADRESH ADRESL (ADFM = 0) MSB LSB bit 7 bit 0 bit 7 bit 0 10-bit A/D Result Unimplemented: Read as ‘0’ (ADFM = 1) MSB LSB bit 7 bit 0 bit 7 bit 0 Unimplemented: Read as ‘0’ 10-bit A/D Result
- 161. 2008-2011 Microchip Technology Inc. DS41364E-page 161 PIC16(L)F1934/6/7 15.2 ADC Operation 15.2.1 STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a ‘1’. Setting the GO/ DONE bit of the ADCON0 register to a ‘1’ will start the Analog-to-Digital conversion. 15.2.2 COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: • Clear the GO/DONE bit • Set the ADIF Interrupt Flag bit • Update the ADRESH and ADRESL registers with new conversion result 15.2.3 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH and ADRESL registers will be updated with the partially complete Analog-to-Digital conversion sample. Incomplete bits will match the last bit converted. 15.2.4 ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. When the FRC clock source is selected, the ADC waits one additional instruction before starting the conversion. This allows the SLEEP instruction to be executed, which can reduce system noise during the conversion. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conver- sion to be aborted and the ADC module is turned off, although the ADON bit remains set. 15.2.5 SPECIAL EVENT TRIGGER The Special Event Trigger of the CCPx/ECCPX module allows periodic ADC measurements without software intervention. When this trigger occurs, the GO/DONE bit is set by hardware and the Timer1 counter resets to zero. Using the Special Event Trigger does not assure proper ADC timing. It is the user’s responsibility to ensure that the ADC timing requirements are met. Refer to Section 23.0 “Capture/Compare/PWM Modules” for more information. Note: The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 15.2.6 “A/D Conver- sion Procedure”. Note: A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. TABLE 15-2: SPECIAL EVENT TRIGGER Device CCPx/ECCPx PIC16(L)F1934/6/7 CCP5
- 162. PIC16(L)F1934/6/7 DS41364E-page 162 2008-2011 Microchip Technology Inc. 15.2.6 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. Configure Port: • Disable pin output driver (Refer to the TRIS register) • Configure pin as analog (Refer to the ANSEL register) 2. Configure the ADC module: • Select ADC conversion clock • Configure voltage reference • Select ADC input channel • Turn on ADC module 3. Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) 4. Wait the required acquisition time(2) . 5. Start conversion by setting the GO/DONE bit. 6. Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) 7. Read ADC Result. 8. Clear the ADC interrupt flag (required if interrupt is enabled). EXAMPLE 15-1: A/D CONVERSION Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Refer to Section 15.3 “A/D Acquisition Requirements”. ;This code block configures the ADC ;for polling, Vdd and Vss references, Frc ;clock and AN0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSEL ADCON1 ; MOVLW B’11110000’ ;Right justify, Frc ;clock MOVWF ADCON1 ;Vdd and Vss Vref BANKSEL TRISA ; BSF TRISA,0 ;Set RA0 to input BANKSEL ANSEL ; BSF ANSEL,0 ;Set RA0 to analog BANKSEL ADCON0 ; MOVLW B’00000001’ ;Select channel AN0 MOVWF ADCON0 ;Turn ADC On CALL SampleTime ;Acquisiton delay BSF ADCON0,ADGO ;Start conversion BTFSC ADCON0,ADGO ;Is conversion done? GOTO $-1 ;No, test again BANKSEL ADRESH ; MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;store in GPR space BANKSEL ADRESL ; MOVF ADRESL,W ;Read lower 8 bits MOVWF RESULTLO ;Store in GPR space
- 163. 2008-2011 Microchip Technology Inc. DS41364E-page 163 PIC16(L)F1934/6/7 15.2.7 ADC REGISTER DEFINITIONS The following registers are used to control the operation of the ADC. REGISTER 15-1: ADCON0: A/D CONTROL REGISTER 0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — CHS<4:0> GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-2 CHS<4:0>: Analog Channel Select bits 00000 = AN0 00001 = AN1 00010 = AN2 00011 = AN3 00100 = AN4 00101 = AN5(4) 00110 = AN6(4) 00111 = AN7(4) 01000 = AN8 01001 = AN9 01010 = AN10 01011 = AN11 01100 = AN12 01101 = AN13 01110 = Reserved. No channel connected. • • • 11100 = Reserved. No channel connected. 11101 = Temperature Indicator(3) 11110 = DAC output(1) 11111 =FVR (Fixed Voltage Reference) Buffer 1 Output(2) bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: See Section 17.0 “Digital-to-Analog Converter (DAC) Module” for more information. 2: See Section 14.0 “Fixed Voltage Reference (FVR)” for more information. 3: See Section 16.0 “Temperature Indicator Module” for more information. 4: Not available on the PIC16(L)F1936.
- 164. PIC16(L)F1934/6/7 DS41364E-page 164 2008-2011 Microchip Technology Inc. REGISTER 15-2: ADCON1: A/D CONTROL REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 ADFM ADCS<2:0> — ADNREF ADPREF<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ADFM: A/D Result Format Select bit 1 = Right justified. Six Most Significant bits of ADRESH are set to ‘0’ when the conversion result is loaded. 0 = Left justified. Six Least Significant bits of ADRESL are set to ‘0’ when the conversion result is loaded. bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits 000 = FOSC/2 001 = FOSC/8 010 = FOSC/32 011 = FRC (clock supplied from a dedicated RC oscillator) 100 = FOSC/4 101 = FOSC/16 110 = FOSC/64 111 = FRC (clock supplied from a dedicated RC oscillator) bit 3 Unimplemented: Read as ‘0’ bit 2 ADNREF: A/D Negative Voltage Reference Configuration bit 0 = VREF- is connected to VSS 1 = VREF- is connected to external VREF- pin(1) bit 1-0 ADPREF<1:0>: A/D Positive Voltage Reference Configuration bits 00 = VREF+ is connected to VDD 01 = Reserved 10 = VREF+ is connected to external VREF+ pin(1) 11 = VREF+ is connected to internal Fixed Voltage Reference (FVR) module(1) Note 1: When selecting the FVR or the VREF+ pin as the source of the positive reference, be aware that a minimum voltage specification exists. See the applicable Electrical Specifications Chapter for details.
- 165. 2008-2011 Microchip Technology Inc. DS41364E-page 165 PIC16(L)F1934/6/7 REGISTER 15-3: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<9:2> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES<9:2>: ADC Result Register bits Upper 8 bits of 10-bit conversion result REGISTER 15-4: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<1:0> — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 ADRES<1:0>: ADC Result Register bits Lower 2 bits of 10-bit conversion result bit 5-0 Reserved: Do not use.
- 166. PIC16(L)F1934/6/7 DS41364E-page 166 2008-2011 Microchip Technology Inc. REGISTER 15-5: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — — — — — ADRES<9:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Reserved: Do not use. bit 1-0 ADRES<9:8>: ADC Result Register bits Upper 2 bits of 10-bit conversion result REGISTER 15-6: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES<7:0>: ADC Result Register bits Lower 8 bits of 10-bit conversion result
- 167. 2008-2011 Microchip Technology Inc. DS41364E-page 167 PIC16(L)F1934/6/7 15.3 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 15-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), refer to Figure 15-4. The maximum recommended impedance for analog sources is 10 k. As the source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 15-1 may be used. This equation assumes that 1/2 LSb error is used (1,024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. EQUATION 15-1: ACQUISITION TIME EXAMPLE TACQ Amplifier Settling Time Hold Capacitor Charging Time Temperature Coefficient + + = TAMP TC TCOFF + + = 2µs TC Temperature - 25°C 0.05µs/°C + + = TC CHOLD RIC RSS RS + + ln(1/511) – = 10pF 1k 7k 10k + + – ln(0.001957) = 1.12 = µs VAPPLIED 1 e Tc – RC -------- - – VAPPLIED 1 1 2 n 1 + 1 – -------------------------- – = VAPPLIED 1 1 2 n 1 + 1 – -------------------------- – VCHOLD = VAPPLIED 1 e TC – RC --------- - – VCHOLD = ;[1] VCHOLD charged to within 1/2 lsb ;[2] VCHOLD charge response to VAPPLIED ;combining [1] and [2] The value for TC can be approximated with the following equations: Solving for TC: Therefore: Temperature 50°C and external impedance of 10k 5.0V VDD = Assumptions: Note: Where n = number of bits of the ADC. TACQ 2µs 1.12µs 50°C- 25°C 0.05µs/°C + + = 4.42µs = Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification.
- 168. PIC16(L)F1934/6/7 DS41364E-page 168 2008-2011 Microchip Technology Inc. FIGURE 15-4: ANALOG INPUT MODEL FIGURE 15-5: ADC TRANSFER FUNCTION CPIN VA Rs Analog 5 pF VDD VT 0.6V VT 0.6V I LEAKAGE(1) RIC 1k Sampling Switch SS Rss CHOLD = 10 pF VSS/VREF- 6V Sampling Switch 5V 4V 3V 2V 5 6 7 8 9 10 11 (k) VDD Legend: CPIN VT I LEAKAGE RIC SS CHOLD = Input Capacitance = Threshold Voltage = Leakage current at the pin due to = Interconnect Resistance = Sampling Switch = Sample/Hold Capacitance various junctions RSS Note 1: Refer to in the applicable Electrical Specifications Chapter. RSS = Resistance of Sampling Switch Input pin 3FFh 3FEh ADC Output Code 3FDh 3FCh 03h 02h 01h 00h Full-Scale 3FBh 0.5 LSB VREF- Zero-Scale Transition VREF+ Transition 1.5 LSB Full-Scale Range Analog Input Voltage
- 169. 2008-2011 Microchip Technology Inc. DS41364E-page 169 PIC16(L)F1934/6/7 TABLE 15-3: SUMMARY OF REGISTERS ASSOCIATED WITH ADC Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ADCON0 — CHS<4:0> GO/DONE ADON 163 ADCON1 ADFM ADCS<2:0> — ADNREF ADPREF<1:0> 164 ADRESH A/D Result Register High 165 ADRESL A/D Result Register Low 165 ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 134 ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 139 ANSELE — — — — — ANSE2 ANSE1 ANSE0 149 CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 234 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 138 TRISE — — — — —(1) TRISE2(2) TRISE1(2) TRISE0(2) 148 FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 156 DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — DACNSS 176 DACCON1 — — — DACR<4:0> 176 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not used for ADC module. Note 1: Unimplemented, read as ‘1’. 2: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’.
- 170. PIC16(L)F1934/6/7 DS41364E-page 170 2008-2011 Microchip Technology Inc. NOTES:
- 171. 2008-2011 Microchip Technology Inc. DS41364E-page 171 PIC16(L)F1934/6/7 16.0 TEMPERATURE INDICATOR MODULE This family of devices is equipped with a temperature circuit designed to measure the operating temperature of the silicon die. The circuit’s range of operating temperature falls between -40°C and +85°C. The output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. The circuit may be used as a temperature threshold detector or a more accurate temperature indicator, depending on the level of calibration performed. A one- point calibration allows the circuit to indicate a temperature closely surrounding that point. A two-point calibration allows the circuit to sense the entire range of temperature more accurately. Reference Application Note AN1333, “Use and Calibration of the Internal Temperature Indicator” (DS01333) for more details regarding the calibration process. 16.1 Circuit Operation Figure 16-1 shows a simplified block diagram of the temperature circuit. The proportional voltage output is achieved by measuring the forward voltage drop across multiple silicon junctions. Equation 16-1 describes the output characteristics of the temperature indicator. EQUATION 16-1: VOUT RANGES The temperature sense circuit is integrated with the Fixed Voltage Reference (FVR) module. See Section 14.0 “Fixed Voltage Reference (FVR)” for more information. The circuit is enabled by setting the TSEN bit of the FVRCON register. When disabled, the circuit draws no current. The circuit operates in either high or low range. The high range, selected by setting the TSRNG bit of the FVRCON register, provides a wider output voltage. This provides more resolution over the temperature range, but may be less consistent from part to part. This range requires a higher bias voltage to operate and thus, a higher VDD is needed. The low range is selected by clearing the TSRNG bit of the FVRCON register. The low range generates a lower voltage drop and thus, a lower bias voltage is needed to operate the circuit. The low range is provided for low voltage operation. FIGURE 16-1: TEMPERATURE CIRCUIT DIAGRAM 16.2 Minimum Operating VDD vs. Minimum Sensing Temperature When the temperature circuit is operated in low range, the device may be operated at any operating voltage that is within specifications. When the temperature circuit is operated in high range, the device operating voltage, VDD, must be high enough to ensure that the temperature circuit is cor- rectly biased. Table 16-1 shows the recommended minimum VDD vs. range setting. TABLE 16-1: RECOMMENDED VDD VS. RANGE 16.3 Temperature Output The output of the circuit is measured using the internal Analog-to-Digital Converter. A channel is reserved for the temperature circuit output. Refer to Section 16.0 “Analog-to-Digital Converter (ADC) Module” for detailed information. 16.4 ADC Acquisition Time To ensure accurate temperature measurements, the user must wait at least 200 s after the ADC input multiplexer is connected to the temperature indicator output before the conversion is performed. In addition, the user must wait 200 s between sequential conversions of the temperature indicator output. High Range: VOUT = VDD - 4VT Low Range: VOUT = VDD - 2VT Min. VDD, TSRNG = 1 Min. VDD, TSRNG = 0 3.6V 1.8V TSEN ADC MUX TSRNG VDD ADC CHS bits (ADCON0 register) n VOUT
- 172. PIC16(L)F1934/6/7 DS41364E-page 172 2008-2011 Microchip Technology Inc. NOTES:
- 173. 2008-2011 Microchip Technology Inc. DS41364E-page 173 PIC16(L)F1934/6/7 17.0 DIGITAL-TO-ANALOG CONVERTER (DAC) MODULE The Digital-to-Analog Converter supplies a variable voltage reference, ratiometric with the input source, with 32 selectable output levels. The input of the DAC can be connected to: • External VREF pins • VDD supply voltage • FVR (Fixed Voltage Reference) The output of the DAC can be configured to supply a reference voltage to the following: • Comparator positive input • ADC input channel • DACOUT pin • Capacitive Sensing module (CSM) The Digital-to-Analog Converter (DAC) can be enabled by setting the DACEN bit of the DACCON0 register. 17.1 Output Voltage Selection The DAC has 32 voltage level ranges. The 32 levels are set with the DACR<4:0> bits of the DACCON1 register. The DAC output voltage is determined by the following equations: EQUATION 17-1: DAC OUTPUT VOLTAGE 17.2 Ratiometric Output Level The DAC output value is derived using a resistor ladder with each end of the ladder tied to a positive and negative voltage reference input source. If the voltage of either input source fluctuates, a similar fluctuation will result in the DAC output value. The value of the individual resistors within the ladder can be found in the applicable Electrical Specifications chapter. 17.3 DAC Voltage Reference Output The DAC can be output to the DACOUT pin by setting the DACOE bit of the DACCON0 register to ‘1’. Selecting the DAC reference voltage for output on the DACOUT pin automatically overrides the digital output buffer and digital input threshold detector functions of that pin. Reading the DACOUT pin when it has been configured for DAC reference voltage output will always return a ‘0’. Due to the limited current drive capability, a buffer must be used on the DAC voltage reference output for external connections to DACOUT. Figure 17-2 shows an example buffering technique. IF DACEN = 1 IF DACEN = 0 & DACLPS = 1 & DACR[4:0] = 11111 VOUT VSOURCE + = IF DACEN = 0 & DACLPS = 0 & DACR[4:0] = 00000 VOUT VSOURCE – = VSOURCE+ = VDD, VREF, or FVR BUFFER 2 VSOURCE- = VSS VOUT VSOURCE+ VSOURCE- – DACR 4:0 2 5 ----------------------------- VSOURCE- + =
- 174. PIC16(L)F1934/6/7 DS41364E-page 174 2008-2011 Microchip Technology Inc. FIGURE 17-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM FIGURE 17-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE 32-to-1 MUX DACR<4:0> R VREF- DACNSS R R R R R R 32 DAC DACOUT 5 (To Comparator, CPS and ADC Modules) DACOE VDD VREF+ DACPSS<1:0> 2 DACEN Steps Digital-to-Analog Converter (DAC) FVR BUFFER2 R VSOURCE- VSOURCE+ VSS DACLPS DACOUT Buffered DAC Output + – DAC Module Voltage Reference Output Impedance R PIC® MCU
- 175. 2008-2011 Microchip Technology Inc. DS41364E-page 175 PIC16(L)F1934/6/7 17.4 Low-Power Voltage State In order for the DAC module to consume the least amount of power, one of the two voltage reference input sources to the resistor ladder must be disconnected. Either the positive voltage source, (VSOURCE+), or the negative voltage source, (VSOURCE-) can be disabled. The negative voltage source is disabled by setting the DACLPS bit in the DACCON0 register. Clearing the DACLPS bit in the DACCON0 register disables the positive voltage source. 17.4.1 OUTPUT CLAMPED TO POSITIVE VOLTAGE SOURCE The DAC output voltage can be set to VSOURCE+ with the least amount of power consumption by performing the following: • Clearing the DACEN bit in the DACCON0 register. • Setting the DACLPS bit in the DACCON0 register. • Configuring the DACPSS bits to the proper positive source. • Configuring the DACR<4:0> bits to ‘11111’ in the DACCON1 register. This is also the method used to output the voltage level from the FVR to an output pin. See Section 17.5 “Operation During Sleep” for more information. Reference Figure 17-3 for output clamping examples. 17.4.2 OUTPUT CLAMPED TO NEGATIVE VOLTAGE SOURCE The DAC output voltage can be set to VSOURCE- with the least amount of power consumption by performing the following: • Clearing the DACEN bit in the DACCON0 register. • Clearing the DACLPS bit in the DACCON0 register. • Configuring the DACNSS bits to the proper negative source. • Configuring the DACR<4:0> bits to ‘00000’ in the DACCON1 register. This allows the comparator to detect a zero-crossing while not consuming additional current through the DAC module. Reference Figure 17-3 for output clamping examples. FIGURE 17-3: OUTPUT VOLTAGE CLAMPING EXAMPLES 17.5 Operation During Sleep When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the DACCON0 register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 17.6 Effects of a Reset A device Reset affects the following: • DAC is disabled. • DAC output voltage is removed from the DACOUT pin. • The DACR<4:0> range select bits are cleared. R R R DAC Voltage Ladder (see Figure 17-1) VSOURCE+ DACEN = 0 DACLPS = 1 DACR<4:0> = 11111 VSOURCE- R R R DAC Voltage Ladder (see Figure 17-1) VSOURCE+ DACEN = 0 DACLPS = 0 DACR<4:0> = 00000 VSOURCE- Output Clamped to Positive Voltage Source Output Clamped to Negative Voltage Source
- 176. PIC16(L)F1934/6/7 DS41364E-page 176 2008-2011 Microchip Technology Inc. TABLE 17-1: SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC MODULE REGISTER 17-1: DACCON0: VOLTAGE REFERENCE CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 DACEN DACLPS DACOE — DACPSS<1:0> — DACNSS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 DACEN: DAC Enable bit 1 = DAC is enabled 0 = DAC is disabled bit 6 DACLPS: DAC Low-Power Voltage State Select bit 1 = DAC Positive reference source selected 0 = DAC Negative reference source selected bit 5 DACOE: DAC Voltage Output Enable bit 1 = DAC voltage level is also an output on the DACOUT pin 0 = DAC voltage level is disconnected from the DACOUT pin bit 4 Unimplemented: Read as ‘0’ bit 3-2 DACPSS<1:0>: DAC Positive Source Select bits 00 = VDD 01 = VREF+ pin 10 = FVR Buffer2 output 11 = Reserved, do not use bit 1 Unimplemented: Read as ‘0’ bit 0 DACNSS: DAC Negative Source Select bits 1 = VREF- 0 = VSS REGISTER 17-2: DACCON1: VOLTAGE REFERENCE CONTROL REGISTER 1 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — — DACR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 DACR<4:0>: DAC Voltage Output Select bits Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on page FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 156 DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — DACNSS 176 DACCON1 — — — DACR<4:0> 176 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used with the DAC Module.
- 177. 2008-2011 Microchip Technology Inc. DS41364E-page 177 PIC16(L)F1934/6/7 18.0 COMPARATOR MODULE Comparators are used to interface analog circuits to a digital circuit by comparing two analog voltages and providing a digital indication of their relative magnitudes. Comparators are very useful mixed signal building blocks because they provide analog functionality independent of program execution. The analog comparator module includes the following features: • Independent comparator control • Programmable input selection • Comparator output is available internally/externally • Programmable output polarity • Interrupt-on-change • Wake-up from Sleep • Programmable Speed/Power optimization • PWM shutdown • Programmable and fixed voltage reference 18.1 Comparator Overview A single comparator is shown in Figure 18-1 along with the relationship between the analog input levels and the digital output. When the analog voltage at VIN+ is less than the analog voltage at VIN-, the output of the comparator is a digital low level. When the analog voltage at VIN+ is greater than the analog voltage at VIN-, the output of the comparator is a digital high level. FIGURE 18-1: SINGLE COMPARATOR – + VIN+ VIN- Output Output VIN+ VIN- Note: The black areas of the output of the comparator represents the uncertainty due to input offsets and response time.
- 178. PIC16(L)F1934/6/7 DS41364E-page 178 2008-2011 Microchip Technology Inc. FIGURE 18-2: COMPARATOR MODULE SIMPLIFIED BLOCK DIAGRAM Note 1: When CxON = 0, the Comparator will produce a ‘0’ at the output. 2: When CxON = 0, all multiplexer inputs are disconnected. 3: Output of comparator can be frozen during debugging. MUX Cx(3) 0 1 2 3 CxON(1) CxNCH<1:0> 2 0 1 CXPCH<1:0> C12IN1- C12IN2- C12IN3- CXIN+ MUX - + CxVN CxVP CXOUT To ECCP PWM Logic Q1 D EN Q CXPOL MCXOUT Set CxIF 0 1 CXSYNC CXOE CXOUT D Q SYNCCXOUT DAC FVR Buffer2 C12IN0- 2 CxSP CxHYS det Interrupt det Interrupt To Timer1 or SR Latch CxINTN CxINTP To Data Bus 2 3 VSS TRIS bit CxON (2) (2) (from Timer1) T1CLK
- 179. 2008-2011 Microchip Technology Inc. DS41364E-page 179 PIC16(L)F1934/6/7 18.2 Comparator Control Each comparator has 2 control registers: CMxCON0 and CMxCON1. The CMxCON0 registers (see Register 18-1) contain Control and Status bits for the following: • Enable • Output selection • Output polarity • Speed/Power selection • Hysteresis enable • Output synchronization The CMxCON1 registers (see Register 18-2) contain Control bits for the following: • Interrupt enable • Interrupt edge polarity • Positive input channel selection • Negative input channel selection 18.2.1 COMPARATOR ENABLE Setting the CxON bit of the CMxCON0 register enables the comparator for operation. Clearing the CxON bit disables the comparator resulting in minimum current consumption. 18.2.2 COMPARATOR OUTPUT SELECTION The output of the comparator can be monitored by reading either the CxOUT bit of the CMxCON0 register or the MCxOUT bit of the CMOUT register. In order to make the output available for an external connection, the following conditions must be true: • CxOE bit of the CMxCON0 register must be set • Corresponding TRIS bit must be cleared • CxON bit of the CMxCON0 register must be set 18.2.3 COMPARATOR OUTPUT POLARITY Inverting the output of the comparator is functionally equivalent to swapping the comparator inputs. The polarity of the comparator output can be inverted by setting the CxPOL bit of the CMxCON0 register. Clearing the CxPOL bit results in a non-inverted output. Table 18-1 shows the output state versus input conditions, including polarity control. 18.2.4 COMPARATOR SPEED/POWER SELECTION The trade-off between speed or power can be opti- mized during program execution with the CxSP control bit. The default state for this bit is ‘1’ which selects the normal speed mode. Device power consumption can be optimized at the cost of slower comparator propaga- tion delay by clearing the CxSP bit to ‘0’. Note 1: The CxOE bit of the CMxCON0 register overrides the PORT data latch. Setting the CxON bit of the CMxCON0 register has no impact on the port override. 2: The internal output of the comparator is latched with each instruction cycle. Unless otherwise specified, external outputs are not latched. TABLE 18-1: COMPARATOR OUTPUT STATE VS. INPUT CONDITIONS Input Condition CxPOL CxOUT CxVN > CxVP 0 0 CxVN < CxVP 0 1 CxVN > CxVP 1 1 CxVN < CxVP 1 0
- 180. PIC16(L)F1934/6/7 DS41364E-page 180 2008-2011 Microchip Technology Inc. 18.3 Comparator Hysteresis A selectable amount of separation voltage can be added to the input pins of each comparator to provide a hysteresis function to the overall operation. Hysteresis is enabled by setting the CxHYS bit of the CMxCON0 register. See the applicable Electrical Specifications Chapter for more information. 18.4 Timer1 Gate Operation The output resulting from a comparator operation can be used as a source for gate control of Timer1. See Section 21.6 “Timer1 Gate” for more information. This feature is useful for timing the duration or interval of an analog event. It is recommended that the comparator output be syn- chronized to Timer1. This ensures that Timer1 does not increment while a change in the comparator is occur- ring. 18.4.1 COMPARATOR OUTPUT SYNCHRONIZATION The output from either comparator, C1 or C2, can be synchronized with Timer1 by setting the CxSYNC bit of the CMxCON0 register. Once enabled, the comparator output is latched on the falling edge of the Timer1 source clock. If a prescaler is used with Timer1, the comparator output is latched after the prescaling function. To prevent a race condition, the comparator output is latched on the falling edge of the Timer1 clock source and Timer1 increments on the rising edge of its clock source. See the Comparator Block Diagram (Figure 18-2) and the Timer1 Block Diagram (Figure 22-1) for more information. 18.5 Comparator Interrupt An interrupt can be generated upon a change in the output value of the comparator for each comparator, a rising edge detector and a falling edge detector are present. When either edge detector is triggered and its associ- ated enable bit is set (CxINTP and/or CxINTN bits of the CMxCON1 register), the Corresponding Interrupt Flag bit (CxIF bit of the PIR2 register) will be set. To enable the interrupt, you must set the following bits: • CxON, CxPOL and CxSP bits of the CMxCON0 register • CxIE bit of the PIE2 register • CxINTP bit of the CMxCON1 register (for a rising edge detection) • CxINTN bit of the CMxCON1 register (for a falling edge detection) • PEIE and GIE bits of the INTCON register The associated interrupt flag bit, CxIF bit of the PIR2 register, must be cleared in software. If another edge is detected while this flag is being cleared, the flag will still be set at the end of the sequence. 18.6 Comparator Positive Input Selection Configuring the CxPCH<1:0> bits of the CMxCON1 register directs an internal voltage reference or an analog pin to the non-inverting input of the comparator: • CxIN+ analog pin • DAC • FVR (Fixed Voltage Reference) • VSS (Ground) See Section 14.0 “Fixed Voltage Reference (FVR)” for more information on the Fixed Voltage Reference module. See Section 17.0 “Digital-to-Analog Converter (DAC) Module” for more information on the DAC input signal. Any time the comparator is disabled (CxON = 0), all comparator inputs are disabled. Note: Although a comparator is disabled, an interrupt can be generated by changing the output polarity with the CxPOL bit of the CMxCON0 register, or by switching the comparator on or off with the CxON bit of the CMxCON0 register.
- 181. 2008-2011 Microchip Technology Inc. DS41364E-page 181 PIC16(L)F1934/6/7 18.7 Comparator Negative Input Selection The CxNCH<1:0> bits of the CMxCON0 register direct one of four analog pins to the comparator inverting input. 18.8 Comparator Response Time The comparator output is indeterminate for a period of time after the change of an input source or the selection of a new reference voltage. This period is referred to as the response time. The response time of the comparator differs from the settling time of the voltage reference. Therefore, both of these times must be considered when determining the total response time to a comparator input change. See the Comparator and Voltage Refer- ence Specifications in the applicable Electrical Specifi- cations Chapter for more details. 18.9 Interaction with ECCP Logic The C1 and C2 comparators can be used as general purpose comparators. Their outputs can be brought out to the C1OUT and C2OUT pins. When the ECCP Auto-Shutdown is active it can use one or both comparator signals. If auto-restart is also enabled, the comparators can be configured as a closed loop analog feedback to the ECCP, thereby, creating an analog controlled PWM. 18.10 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 18-3. Since the analog input pins share their connection with a digital input, they have reverse biased ESD protection diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is for- ward biased and a latch-up may occur. A maximum source impedance of 10 k is recommended for the analog sources. Also, any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current to minimize inaccuracies introduced. Note: To use CxIN+ and CxINx- pins as analog input, the appropriate bits must be set in the ANSEL register and the correspond- ing TRIS bits must also be set to disable the output drivers. Note: When the comparator module is first initialized the output state is unknown. Upon initialization, the user should verify the output state of the comparator prior to relying on the result, primarily when using the result in connection with other peripheral features, such as the ECCP Auto-Shutdown mode. Note 1: When reading a PORT register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert as an analog input, according to the input specification. 2: Analog levels on any pin defined as a digital input, may cause the input buffer to consume more current than is specified.
- 182. PIC16(L)F1934/6/7 DS41364E-page 182 2008-2011 Microchip Technology Inc. FIGURE 18-3: ANALOG INPUT MODEL VA Rs < 10K CPIN 5 pF VDD VT 0.6V VT 0.6V RIC ILEAKAGE(1) Vss Legend: CPIN = Input Capacitance ILEAKAGE = Leakage Current at the pin due to various junctions RIC = Interconnect Resistance RS = Source Impedance VA = Analog Voltage VT = Threshold Voltage To Comparator Note 1: See the applicable Electrical Specifications Chapter. Analog Input pin
- 183. 2008-2011 Microchip Technology Inc. DS41364E-page 183 PIC16(L)F1934/6/7 REGISTER 18-1: CMxCON0: COMPARATOR X CONTROL REGISTER 0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 U-0 R/W-1/1 R/W-0/0 R/W-0/0 CxON CxOUT CxOE CxPOL — CxSP CxHYS CxSYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxON: Comparator Enable bit 1 = Comparator is enabled and consumes no active power 0 = Comparator is disabled bit 6 CxOUT: Comparator Output bit If CxPOL = 1 (inverted polarity): 1 = CxVP < CxVN 0 = CxVP > CxVN If CxPOL = 0 (non-inverted polarity): 1 = CxVP > CxVN 0 = CxVP < CxVN bit 5 CxOE: Comparator Output Enable bit 1 = CxOUT is present on the CxOUT pin. Requires that the associated TRIS bit be cleared to actually drive the pin. Not affected by CxON. 0 = CxOUT is internal only bit 4 CxPOL: Comparator Output Polarity Select bit 1 = Comparator output is inverted 0 = Comparator output is not inverted bit 3 Unimplemented: Read as ‘0’ bit 2 CxSP: Comparator Speed/Power Select bit 1 = Comparator operates in normal power, higher speed mode 0 = Comparator operates in low-power, low-speed mode bit 1 CxHYS: Comparator Hysteresis Enable bit 1 = Comparator hysteresis enabled 0 = Comparator hysteresis disabled bit 0 CxSYNC: Comparator Output Synchronous Mode bit 1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source. Output updated on the falling edge of Timer1 clock source. 0 = Comparator output to Timer1 and I/O pin is asynchronous.
- 184. PIC16(L)F1934/6/7 DS41364E-page 184 2008-2011 Microchip Technology Inc. REGISTER 18-2: CMxCON1: COMPARATOR CX CONTROL REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 CxINTP CxINTN CxPCH<1:0> — — CxNCH<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxINTP: Comparator Interrupt on Positive Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit 0 = No interrupt flag will be set on a positive going edge of the CxOUT bit bit 6 CxINTN: Comparator Interrupt on Negative Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit 0 = No interrupt flag will be set on a negative going edge of the CxOUT bit bit 5-4 CxPCH<1:0>: Comparator Positive Input Channel Select bits 00 = CxVP connects to CxIN+ pin 01 = CxVP connects to DAC Voltage Reference 10 = CxVP connects to FVR Voltage Reference 11 = CxVP connects to VSS bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 CxNCH<1:0>: Comparator Negative Input Channel Select bits 00 = CxVN connects to C12IN0- pin 01 = CxVN connects to C12IN1- pin 10 = CxVN connects to C12IN2- pin 11 = CxVN connects to C12IN3- pin REGISTER 18-3: CMOUT: COMPARATOR OUTPUT REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R-0/0 R-0/0 — — — — — — MC2OUT MC1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1 MC2OUT: Mirror Copy of C2OUT bit bit 0 MC1OUT: Mirror Copy of C1OUT bit
- 185. 2008-2011 Microchip Technology Inc. DS41364E-page 185 PIC16(L)F1934/6/7 TABLE 18-2: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page CM1CON0 C1ON C1OUT C1OE C1POL --- C1SP C1HYS C1SYNC 183 CM2CON0 C2ON C2OUT C2OE C2POL — C2SP C2HYS C2SYNC 183 CM1CON1 C1NTP C1INTN C1PCH<1:0> — — C1NCH<1:0> 184 CM2CON1 C2NTP C2INTN C2PCH<1:0> — — C2NCH<1:0> 184 CMOUT — — — — — — MC2OUT MC1OUT 184 FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 156 DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — DACNSS 176 DACCON1 — — — DACR<4:0> 176 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 100 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 103 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 138 ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 134 ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 139 Legend: — = unimplemented location, read as ‘0’. Shaded cells are unused by the comparator module.
- 186. PIC16(L)F1934/6/7 DS41364E-page 186 2008-2011 Microchip Technology Inc. NOTES:
- 187. 2008-2011 Microchip Technology Inc. DS41364E-page 187 PIC16(L)F1934/6/7 19.0 SR LATCH The module consists of a single SR Latch with multiple Set and Reset inputs as well as separate latch outputs. The SR Latch module includes the following features: • Programmable input selection • SR Latch output is available externally • Separate Q and Q outputs • Firmware Set and Reset The SR Latch can be used in a variety of analog appli- cations, including oscillator circuits, one-shot circuit, hysteretic controllers, and analog timing applications. 19.1 Latch Operation The latch is a Set-Reset Latch that does not depend on a clock source. Each of the Set and Reset inputs are active-high. The latch can be set or reset by: • Software control (SRPS and SRPR bits) • Comparator C1 output (SYNCC1OUT) • Comparator C2 output (SYNCC2OUT) • SRI pin • Programmable clock (SRCLK) The SRPS and the SRPR bits of the SRCON0 register may be used to set or reset the SR Latch, respectively. The latch is Reset-dominant. Therefore, if both Set and Reset inputs are high, the latch will go to the Reset state. Both the SRPS and SRPR bits are self resetting which means that a single write to either of the bits is all that is necessary to complete a latch Set or Reset oper- ation. The output from Comparator C1 or C2 can be used as the Set or Reset inputs of the SR Latch. The output of either Comparator can be synchronized to the Timer1 clock source. See Section 18.0 “Comparator Mod- ule” and Section 21.0 “Timer1 Module with Gate Control” for more information. An external source on the SRI pin can be used as the Set or Reset inputs of the SR Latch. An internal clock source is available that can periodically set or reset the SR Latch. The SRCLK<2:0> bits in the SRCON0 register are used to select the clock source period. The SRSCKE and SRRCKE bits of the SRCON1 register enable the clock source to set or reset the SR Latch, respectively. 19.2 Latch Output The SRQEN and SRNQEN bits of the SRCON0 regis- ter control the Q and Q latch outputs. Both of the SR Latch outputs may be directly output to an I/O pin at the same time. The Q latch output pin function can be moved to an alternate pin using the SRNQSEL bit of the APFCON register. The applicable TRIS bit of the corresponding port must be cleared to enable the port pin output driver. 19.3 Effects of a Reset Upon any device Reset, the SR Latch output is not ini- tialized to a known state. The user’s firmware is responsible for initializing the latch output before enabling the output pins. Note: Enabling both the Set and Reset inputs from any one source at the same time may result in indeterminate operation, as the Reset dominance cannot be assured.
- 188. PIC16(L)F1934/6/7 DS41364E-page 188 2008-2011 Microchip Technology Inc. FIGURE 19-1: SR LATCH SIMPLIFIED BLOCK DIAGRAM SRPS S R Q Q Note 1: If R = 1 and S = 1 simultaneously, Q = 0, Q = 1 2: Pulse generator causes a 1 Q-state pulse width. 3: Name denotes the connection point at the comparator output. Pulse Gen(2) SR Latch(1) SRQEN SRSPE SRSC2E SRSCKE SRCLK SYNCC2OUT(3) SRSC1E SYNCC1OUT(3) SRPR Pulse Gen(2) SRRPE SRRC2E SRRCKE SRCLK SYNCC2OUT(3) SRRC1E SYNCC1OUT(3) SRLEN SRNQEN SRLEN SRQ SRNQ SRI SRI
- 189. 2008-2011 Microchip Technology Inc. DS41364E-page 189 PIC16(L)F1934/6/7 TABLE 19-1: SRCLK FREQUENCY TABLE SRCLK Divider FOSC = 32 MHz FOSC = 20 MHz FOSC = 16 MHz FOSC = 4 MHz FOSC = 1 MHz 111 512 62.5 kHz 39.0 kHz 31.3 kHz 7.81 kHz 1.95 kHz 110 256 125 kHz 78.1 kHz 62.5 kHz 15.6 kHz 3.90 kHz 101 128 250 kHz 156 kHz 125 kHz 31.25 kHz 7.81 kHz 100 64 500 kHz 313 kHz 250 kHz 62.5 kHz 15.6 kHz 011 32 1 MHz 625 kHz 500 kHz 125 kHz 31.3 kHz 010 16 2 MHz 1.25 MHz 1 MHz 250 kHz 62.5 kHz 001 8 4 MHz 2.5 MHz 2 MHz 500 kHz 125 kHz 000 4 8 MHz 5 MHz 4 MHz 1 MHz 250 kHz REGISTER 19-1: SRCON0: SR LATCH CONTROL 0 REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/S-0/0 R/S-0/0 SRLEN SRCLK<2:0> SRQEN SRNQEN SRPS SRPR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared S = Bit is set only bit 7 SRLEN: SR Latch Enable bit 1 = SR Latch is enabled 0 = SR Latch is disabled bit 6-4 SRCLK<2:0>: SR Latch Clock Divider bits 000 = Generates a 1 FOSC wide pulse every 4th FOSC cycle clock 001 = Generates a 1 FOSC wide pulse every 8th FOSC cycle clock 010 = Generates a 1 FOSC wide pulse every 16th FOSC cycle clock 011 = Generates a 1 FOSC wide pulse every 32nd FOSC cycle clock 100 = Generates a 1 FOSC wide pulse every 64th FOSC cycle clock 101 = Generates a 1 FOSC wide pulse every 128th FOSC cycle clock 110 = Generates a 1 FOSC wide pulse every 256th FOSC cycle clock 111 = Generates a 1 FOSC wide pulse every 512th FOSC cycle clock bit 3 SRQEN: SR Latch Q Output Enable bit If SRLEN = 1: 1 = Q is present on the SRQ pin 0 = External Q output is disabled If SRLEN = 0: SR Latch is disabled bit 2 SRNQEN: SR Latch Q Output Enable bit If SRLEN = 1: 1 = Q is present on the SRnQ pin 0 = External Q output is disabled If SRLEN = 0: SR Latch is disabled bit 1 SRPS: Pulse Set Input of the SR Latch bit(1) 1 = Pulse set input for 1 Q-clock period 0 = No effect on set input. bit 0 SRPR: Pulse Reset Input of the SR Latch bit(1) 1 = Pulse Reset input for 1 Q-clock period 0 = No effect on Reset input. Note 1: Set only, always reads back ‘0’.
- 190. PIC16(L)F1934/6/7 DS41364E-page 190 2008-2011 Microchip Technology Inc. TABLE 19-2: SUMMARY OF REGISTERS ASSOCIATED WITH SR LATCH MODULE REGISTER 19-2: SRCON1: SR LATCH CONTROL 1 REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SRSPE: SR Latch Peripheral Set Enable bit 1 = SR Latch is set when the SRI pin is high. 0 = SRI pin has no effect on the set input of the SR Latch bit 6 SRSCKE: SR Latch Set Clock Enable bit 1 = Set input of SR Latch is pulsed with SRCLK 0 = SRCLK has no effect on the set input of the SR Latch bit 5 SRSC2E: SR Latch C2 Set Enable bit 1 = SR Latch is set when the C2 Comparator output is high 0 = C2 Comparator output has no effect on the set input of the SR Latch bit 4 SRSC1E: SR Latch C1 Set Enable bit 1 = SR Latch is set when the C1 Comparator output is high 0 = C1 Comparator output has no effect on the set input of the SR Latch bit 3 SRRPE: SR Latch Peripheral Reset Enable bit 1 = SR Latch is reset when the SRI pin is high. 0 = SRI pin has no effect on the reset input of the SR Latch bit 2 SRRCKE: SR Latch Reset Clock Enable bit 1 = Reset input of SR Latch is pulsed with SRCLK 0 = SRCLK has no effect on the reset input of the SR Latch bit 1 SRRC2E: SR Latch C2 Reset Enable bit 1 = SR Latch is reset when the C2 Comparator output is high 0 = C2 Comparator output has no effect on the reset input of the SR Latch bit 0 SRRC1E: SR Latch C1 Reset Enable bit 1 = SR Latch is reset when the C1 Comparator output is high 0 = C1 Comparator output has no effect on the reset input of the SR Latch Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 134 SRCON0 SRLEN SRCLK<2:0> SRQEN SRNQEN SRPS SRPR 189 SRCON1 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E 190 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 Legend: — = unimplemented location, read as ‘0’. Shaded cells are unused by the SR Latch module.
- 191. 2008-2011 Microchip Technology Inc. DS41364E-page 191 PIC16(L)F1934/6/7 20.0 TIMER0 MODULE The Timer0 module is an 8-bit timer/counter with the following features: • 8-bit timer/counter register (TMR0) • 8-bit prescaler (independent of Watchdog Timer) • Programmable internal or external clock source • Programmable external clock edge selection • Interrupt on overflow • TMR0 can be used to gate Timer1 Figure 20-1 is a block diagram of the Timer0 module. 20.1 Timer0 Operation The Timer0 module can be used as either an 8-bit timer or an 8-bit counter. 20.1.1 8-BIT TIMER MODE The Timer0 module will increment every instruction cycle, if used without a prescaler. 8-it Timer mode is selected by clearing the TMR0CS bit of the OPTION_REG register. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. 20.1.2 8-BIT COUNTER MODE In 8-Bit Counter mode, the Timer0 module will increment on every rising or falling edge of the T0CKI pin or the Capacitive Sensing Oscillator (CPSCLK) signal. 8-Bit Counter mode using the T0CKI pin is selected by setting the TMR0CS bit in the OPTION_REG register to ‘1’ and resetting the T0XCS bit in the CPSCON0 register to ‘0’. 8-Bit Counter mode using the Capacitive Sensing Oscillator (CPSCLK) signal is selected by setting the TMR0CS bit in the OPTION_REG register to ‘1’ and setting the T0XCS bit in the CPSCON0 register to ‘1’. The rising or falling transition of the incrementing edge for either input source is determined by the TMR0SE bit in the OPTION_REG register. FIGURE 20-1: BLOCK DIAGRAM OF THE TIMER0 Note: The value written to the TMR0 register can be adjusted, in order to account for the two instruction cycle delay when TMR0 is written. T0CKI TMR0SE TMR0 PS<2:0> Data Bus Set Flag bit TMR0IF on Overflow TMR0CS 0 1 0 1 8 8 8-bit Prescaler FOSC/4 PSA Sync 2 TCY Overflow to Timer1 1 0 From CPSCLK T0XCS
- 192. PIC16(L)F1934/6/7 DS41364E-page 192 2008-2011 Microchip Technology Inc. 20.1.3 SOFTWARE PROGRAMMABLE PRESCALER A software programmable prescaler is available for exclusive use with Timer0. The prescaler is enabled by clearing the PSA bit of the OPTION_REG register. There are 8 prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION_REG register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be disabled by set- ting the PSA bit of the OPTION_REG register. The prescaler is not readable or writable. All instructions writing to the TMR0 register will clear the prescaler. 20.1.4 TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The TMR0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The TMR0IF bit can only be cleared in software. The Timer0 interrupt enable is the TMR0IE bit of the INTCON register. 20.1.5 8-BIT COUNTER MODE SYNCHRONIZATION When in 8-Bit Counter mode, the incrementing edge on the T0CKI pin must be synchronized to the instruction clock. Synchronization can be accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the instruction clock. The high and low periods of the external clocking source must meet the timing requirements as shown in the applicable Electrical Specifications Chapter. 20.1.6 OPERATION DURING SLEEP Timer0 cannot operate while the processor is in Sleep mode. The contents of the TMR0 register will remain unchanged while the processor is in Sleep mode. Note: The Watchdog Timer (WDT) uses its own independent prescaler. Note: The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep.
- 193. 2008-2011 Microchip Technology Inc. DS41364E-page 193 PIC16(L)F1934/6/7 20.2 Option and Timer0 Control Register TABLE 20-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 REGISTER 20-1: OPTION_REG: OPTION REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 WPUEN: Weak Pull-up Enable bit 1 = All weak pull-ups are disabled (except MCLR, if it is enabled) 0 = Weak pull-ups are enabled by individual WPUx latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 TMR0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 TMR0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is not assigned to the Timer0 module 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page CPSCON0 CPSON — — — CPSRNG<1:0> CPSOUT T0XCS 323 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 193 TMR0 Timer0 Module Register 191* TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the Timer0 module. * Page provides register information. 000 001 010 011 100 101 110 111 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 Bit Value Timer0 Rate
- 194. PIC16(L)F1934/6/7 DS41364E-page 194 2008-2011 Microchip Technology Inc. NOTES:
- 195. 2008-2011 Microchip Technology Inc. DS41364E-page 195 PIC16(L)F1934/6/7 21.0 TIMER1 MODULE WITH GATE CONTROL The Timer1 module is a 16-bit timer/counter with the following features: • 16-bit timer/counter register pair (TMR1H:TMR1L) • Programmable internal or external clock source • 2-bit prescaler • Dedicated 32 kHz oscillator circuit • Optionally synchronized comparator out • Multiple Timer1 gate (count enable) sources • Interrupt on overflow • Wake-up on overflow (external clock, Asynchronous mode only) • Time base for the Capture/Compare function • Special Event Trigger (with CCP/ECCP) • Selectable Gate Source Polarity • Gate Toggle Mode • Gate Single-pulse Mode • Gate Value Status • Gate Event Interrupt Figure 21-1 is a block diagram of the Timer1 module. FIGURE 21-1: TIMER1 BLOCK DIAGRAM TMR1H TMR1L T1SYNC T1CKPS<1:0> Prescaler 1, 2, 4, 8 0 1 Synchronized clock input 2 Set flag bit TMR1IF on Overflow TMR1(2) TMR1ON Note 1: ST Buffer is high speed type when using T1CKI. 2: Timer1 register increments on rising edge. 3: Synchronize does not operate while in Sleep. T1G T1OSC FOSC/4 Internal Clock T1OSO T1OSI T1OSCEN 1 0 T1CKI TMR1CS<1:0> (1) Synchronize(3) det Sleep input TMR1GE 0 1 00 01 10 11 T1GPOL D Q CK Q 0 1 T1GVAL T1GTM Single Pulse Acq. Control T1GSPM T1GGO/DONE T1GSS<1:0> EN OUT 10 11 00 01 FOSC Internal Clock Cap. Sensing R D EN Q Q1 RD T1GCON Data Bus det Interrupt TMR1GIF Set T1CLK FOSC/2 Internal Clock D EN Q T1G_IN TMR1ON Oscillator From Timer0 Comparator 1 Overflow Comparator 2 SYNCC2OUT SYNCC1OUT To Comparator Module To LCD and Clock Switching Modules
- 196. PIC16(L)F1934/6/7 DS41364E-page 196 2008-2011 Microchip Technology Inc. 21.1 Timer1 Operation The Timer1 module is a 16-bit incrementing counter which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. When used with an internal clock source, the module is a timer and increments on every instruction cycle. When used with an external clock source, the module can be used as either a timer or counter and incre- ments on every selected edge of the external source. Timer1 is enabled by configuring the TMR1ON and TMR1GE bits in the T1CON and T1GCON registers, respectively. Table 21-1 displays the Timer1 enable selections. 21.2 Clock Source Selection The TMR1CS<1:0> and T1OSCEN bits of the T1CON register are used to select the clock source for Timer1. Table 21-2 displays the clock source selections. 21.2.1 INTERNAL CLOCK SOURCE When the internal clock source is selected the TMR1H:TMR1L register pair will increment on multiples of FOSC as determined by the Timer1 prescaler. When the FOSC internal clock source is selected, the Timer1 register value will increment by four counts every instruction clock cycle. Due to this condition, a 2 LSB error in resolution will occur when reading the Timer1 value. To utilize the full resolution of Timer1, an asynchronous input signal must be used to gate the Timer1 clock input. The following asynchronous sources may be used: • Asynchronous event on the T1G pin to Timer1 gate • C1 or C2 comparator input to Timer1 gate 21.2.2 EXTERNAL CLOCK SOURCE When the external clock source is selected, the Timer1 module may work as a timer or a counter. When enabled to count, Timer1 is incremented on the rising edge of the external clock input T1CKI or the capacitive sensing oscillator signal. Either of these external clock sources can be synchronized to the microcontroller system clock or they can run asynchronously. When used as a timer with a clock oscillator, an external 32.768 kHz crystal can be used in conjunction with the dedicated internal oscillator circuit. TABLE 21-1: TIMER1 ENABLE SELECTIONS TMR1ON TMR1GE Timer1 Operation 0 0 Off 0 1 Off 1 0 Always On 1 1 Count Enabled Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge after any one or more of the following conditions: • Timer1 enabled after POR • Write to TMR1H or TMR1L • Timer1 is disabled • Timer1 is disabled (TMR1ON = 0) when T1CKI is high then Timer1 is enabled (TMR1ON=1) when T1CKI is low. TABLE 21-2: CLOCK SOURCE SELECTIONS TMR1CS1 TMR1CS0 T1OSCEN Clock Source 0 0 x Instruction Clock (FOSC/4) 0 1 x System Clock (FOSC) 1 0 0 External Clocking on T1CKI Pin 1 0 0 External Clocking on T1CKI Pin 1 1 x Capacitive Sensing Oscillator
- 197. 2008-2011 Microchip Technology Inc. DS41364E-page 197 PIC16(L)F1934/6/7 21.3 Timer1 Prescaler Timer1 has four prescaler options allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. 21.4 Timer1 Oscillator A dedicated low-power 32.768 kHz oscillator circuit is built-in between pins T1OSI (input) and T1OSO (amplifier output). This internal circuit is to be used in conjunction with an external 32.768 kHz crystal. The oscillator circuit is enabled by setting the T1OSCEN bit of the T1CON register. The oscillator will continue to run during Sleep. 21.5 Timer1 Operation in Asynchronous Counter Mode If control bit T1SYNC of the T1CON register is set, the external clock input is not synchronized. The timer increments asynchronously to the internal phase clocks. If the external clock source is selected then the timer will continue to run during Sleep and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (see Section 21.5.1 “Reading and Writing Timer1 in Asynchronous Counter Mode”). 21.5.1 READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L while the timer is running from an external asynchronous clock will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the timer may overflow between the reads. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the TMR1H:TMR1L register pair. 21.6 Timer1 Gate Timer1 can be configured to count freely or the count can be enabled and disabled using Timer1 gate circuitry. This is also referred to as Timer1 Gate Enable. Timer1 gate can also be driven by multiple selectable sources. 21.6.1 TIMER1 GATE ENABLE The Timer1 Gate Enable mode is enabled by setting the TMR1GE bit of the T1GCON register. The polarity of the Timer1 Gate Enable mode is configured using the T1GPOL bit of the T1GCON register. When Timer1 Gate Enable mode is enabled, Timer1 will increment on the rising edge of the Timer1 clock source. When Timer1 Gate Enable mode is disabled, no incrementing will occur and Timer1 will hold the current count. See Figure 21-3 for timing details. Note: The oscillator requires a start-up and stabilization time before use. Thus, T1OSCEN should be set and a suitable delay observed prior to using Timer1. A suitable delay similar to the OST delay can be implemented in software by clearing the TMR1IF bit then presetting the TMR1H:TMR1L register pair to FC00h. The TMR1IF flag will be set when 1024 clock cycles have elapsed, thereby indicating that the oscillator is running and reasonably stable. Note: When switching from synchronous to asynchronous operation, it is possible to skip an increment. When switching from asynchronous to synchronous operation, it is possible to produce an additional increment. TABLE 21-3: TIMER1 GATE ENABLE SELECTIONS T1CLK T1GPOL T1G Timer1 Operation 0 0 Counts 0 1 Holds Count 1 0 Holds Count 1 1 Counts
- 198. PIC16(L)F1934/6/7 DS41364E-page 198 2008-2011 Microchip Technology Inc. 21.6.2 TIMER1 GATE SOURCE SELECTION The Timer1 gate source can be selected from one of four different sources. Source selection is controlled by the T1GSS bits of the T1GCON register. The polarity for each available source is also selectable. Polarity selection is controlled by the T1GPOL bit of the T1GCON register. TABLE 21-4: TIMER1 GATE SOURCES 21.6.2.1 T1G Pin Gate Operation The T1G pin is one source for Timer1 gate control. It can be used to supply an external source to the Timer1 gate circuitry. 21.6.2.2 Timer0 Overflow Gate Operation When Timer0 increments from FFh to 00h, a low-to-high pulse will automatically be generated and internally supplied to the Timer1 gate circuitry. 21.6.2.3 Comparator C1 Gate Operation The output resulting from a Comparator 1 operation can be selected as a source for Timer1 gate control. The Comparator 1 output (SYNCC1OUT) can be synchronized to the Timer1 clock or left asynchronous. For more information see Section 18.4.1 “Comparator Output Synchronization”. 21.6.2.4 Comparator C2 Gate Operation The output resulting from a Comparator 2 operation can be selected as a source for Timer1 gate control. The Comparator 2 output (SYNCC2OUT) can be synchronized to the Timer1 clock or left asynchronous. For more information see Section 18.4.1 “Comparator Output Synchronization”. 21.6.3 TIMER1 GATE TOGGLE MODE When Timer1 Gate Toggle mode is enabled, it is possi- ble to measure the full-cycle length of a Timer1 gate signal, as opposed to the duration of a single level pulse. The Timer1 gate source is routed through a flip-flop that changes state on every incrementing edge of the sig- nal. See Figure 21-4 for timing details. Timer1 Gate Toggle mode is enabled by setting the T1GTM bit of the T1GCON register. When the T1GTM bit is cleared, the flip-flop is cleared and held clear. This is necessary in order to control which edge is measured. 21.6.4 TIMER1 GATE SINGLE-PULSE MODE When Timer1 Gate Single-Pulse mode is enabled, it is possible to capture a single pulse gate event. Timer1 Gate Single-Pulse mode is first enabled by setting the T1GSPM bit in the T1GCON register. Next, the T1GGO/DONE bit in the T1GCON register must be set. The Timer1 will be fully enabled on the next incrementing edge. On the next trailing edge of the pulse, the T1GGO/DONE bit will automatically be cleared. No other gate events will be allowed to increment Timer1 until the T1GGO/DONE bit is once again set in software. See Figure 21-5 for timing details. If the Single Pulse Gate mode is disabled by clearing the T1GSPM bit in the T1GCON register, the T1GGO/DONE bit should also be cleared. Enabling the Toggle mode and the Single-Pulse mode simultaneously will permit both sections to work together. This allows the cycle times on the Timer1 gate source to be measured. See Figure 21-6 for timing details. 21.6.5 TIMER1 GATE VALUE STATUS When Timer1 Gate Value Status is utilized, it is possible to read the most current level of the gate control value. The value is stored in the T1GVAL bit in the T1GCON register. The T1GVAL bit is valid even when the Timer1 gate is not enabled (TMR1GE bit is cleared). 21.6.6 TIMER1 GATE EVENT INTERRUPT When Timer1 Gate Event Interrupt is enabled, it is pos- sible to generate an interrupt upon the completion of a gate event. When the falling edge of T1GVAL occurs, the TMR1GIF flag bit in the PIR1 register will be set. If the TMR1GIE bit in the PIE1 register is set, then an interrupt will be recognized. The TMR1GIF flag bit operates even when the Timer1 gate is not enabled (TMR1GE bit is cleared). T1GSS Timer1 Gate Source 00 Timer1 Gate Pin 01 Overflow of Timer0 (TMR0 increments from FFh to 00h) 10 Comparator 1 Output SYNCC1OUT (optionally Timer1 synchronized output) 11 Comparator 2 Output SYNCC2OUT (optionally Timer1 synchronized output) Note: Enabling Toggle mode at the same time as changing the gate polarity may result in indeterminate operation.
- 199. 2008-2011 Microchip Technology Inc. DS41364E-page 199 PIC16(L)F1934/6/7 21.7 Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: • TMR1ON bit of the T1CON register • TMR1IE bit of the PIE1 register • PEIE bit of the INTCON register • GIE bit of the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. 21.8 Timer1 Operation During Sleep Timer1 can only operate during Sleep when setup in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To set up the timer to wake the device: • TMR1ON bit of the T1CON register must be set • TMR1IE bit of the PIE1 register must be set • PEIE bit of the INTCON register must be set • T1SYNC bit of the T1CON register must be set • TMR1CS bits of the T1CON register must be configured • T1OSCEN bit of the T1CON register must be configured The device will wake-up on an overflow and execute the next instructions. If the GIE bit of the INTCON register is set, the device will call the Interrupt Service Routine. Timer1 oscillator will continue to operate in Sleep regardless of the T1SYNC bit setting. 21.9 ECCP/CCP Capture/Compare Time Base The CCP modules use the TMR1H:TMR1L register pair as the time base when operating in Capture or Compare mode. In Capture mode, the value in the TMR1H:TMR1L register pair is copied into the CCPR1H:CCPR1L register pair on a configured event. In Compare mode, an event is triggered when the value CCPR1H:CCPR1L register pair matches the value in the TMR1H:TMR1L register pair. This event can be a Special Event Trigger. For more information, see Section 12.0 “I/O Ports”. 21.10 ECCP/CCP Special Event Trigger When any of the CCP’s are configured to trigger a spe- cial event, the trigger will clear the TMR1H:TMR1L reg- ister pair. This special event does not cause a Timer1 interrupt. The CCP module may still be configured to generate a CCP interrupt. In this mode of operation, the CCPR1H:CCPR1L register pair becomes the period register for Timer1. Timer1 should be synchronized and FOSC/4 should be selected as the clock source in order to utilize the Spe- cial Event Trigger. Asynchronous operation of Timer1 can cause a Special Event Trigger to be missed. In the event that a write to TMR1H or TMR1L coincides with a Special Event Trigger from the CCP, the write will take precedence. For more information, see Section 15.2.5 “Special Event Trigger”. FIGURE 21-2: TIMER1 INCREMENTING EDGE Note: The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: Arrows indicate counter increments. 2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock.
- 200. PIC16(L)F1934/6/7 DS41364E-page 200 2008-2011 Microchip Technology Inc. FIGURE 21-3: TIMER1 GATE ENABLE MODE FIGURE 21-4: TIMER1 GATE TOGGLE MODE TMR1GE T1GPOL T1G_IN T1CKI T1GVAL TIMER1 N N + 1 N + 2 N + 3 N + 4 TMR1GE T1GPOL T1GTM T1G_IN T1CKI T1GVAL TIMER1 N N + 1 N + 2 N + 3 N + 4 N + 5 N + 6 N + 7 N + 8
- 201. 2008-2011 Microchip Technology Inc. DS41364E-page 201 PIC16(L)F1934/6/7 FIGURE 21-5: TIMER1 GATE SINGLE-PULSE MODE TMR1GE T1GPOL T1G_IN T1CKI T1GVAL TIMER1 N N + 1 N + 2 T1GSPM T1GGO/ DONE Set by software Cleared by hardware on falling edge of T1GVAL Set by hardware on falling edge of T1GVAL Cleared by software Cleared by software TMR1GIF Counting enabled on rising edge of T1G
- 202. PIC16(L)F1934/6/7 DS41364E-page 202 2008-2011 Microchip Technology Inc. FIGURE 21-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE TMR1GE T1GPOL T1G_IN T1CKI T1GVAL TIMER1 N N + 1 N + 2 T1GSPM T1GGO/ DONE Set by software Cleared by hardware on falling edge of T1GVAL Set by hardware on falling edge of T1GVAL Cleared by software Cleared by software TMR1GIF T1GTM Counting enabled on rising edge of T1G N + 4 N + 3
- 203. 2008-2011 Microchip Technology Inc. DS41364E-page 203 PIC16(L)F1934/6/7 21.11 Timer1 Control Register The Timer1 Control register (T1CON), shown in Register 21-1, is used to control Timer1 and select the various features of the Timer1 module. REGISTER 21-1: T1CON: TIMER1 CONTROL REGISTER R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W-0/u U-0 R/W-0/u TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 TMR1CS<1:0>: Timer1 Clock Source Select bits 11 =Timer1 clock source is Capacitive Sensing Oscillator (CAPOSC) 10 =Timer1 clock source is pin or oscillator: If T1OSCEN = 0: External clock from T1CKI pin (on the rising edge) If T1OSCEN = 1: Crystal oscillator on T1OSI/T1OSO pins 01 =Timer1 clock source is system clock (FOSC) 00 =Timer1 clock source is instruction clock (FOSC/4) bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3 T1OSCEN: LP Oscillator Enable Control bit 1 = Dedicated Timer1 oscillator circuit enabled 0 = Dedicated Timer1 oscillator circuit disabled bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit TMR1CS<1:0> = 1X 1 = Do not synchronize external clock input 0 = Synchronize external clock input with system clock (FOSC) TMR1CS<1:0> = 0X This bit is ignored. Timer1 uses the internal clock when TMR1CS<1:0> = 1X. bit 1 Unimplemented: Read as ‘0’ bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 Clears Timer1 gate flip-flop
- 204. PIC16(L)F1934/6/7 DS41364E-page 204 2008-2011 Microchip Technology Inc. 21.12 Timer1 Gate Control Register The Timer1 Gate Control register (T1GCON), shown in Register 21-2, is used to control Timer1 gate. REGISTER 21-2: T1GCON: TIMER1 GATE CONTROL REGISTER R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W/HC-0/u R-x/x R/W-0/u R/W-0/u TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ DONE T1GVAL T1GSS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 counting is controlled by the Timer1 gate function 0 = Timer1 counts regardless of Timer1 gate function bit 6 T1GPOL: Timer1 Gate Polarity bit 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 5 T1GTM: Timer1 Gate Toggle Mode bit 1 = Timer1 Gate Toggle mode is enabled 0 = Timer1 Gate Toggle mode is disabled and toggle flip flop is cleared Timer1 gate flip-flop toggles on every rising edge. bit 4 T1GSPM: Timer1 Gate Single-Pulse Mode bit 1 = Timer1 gate Single-Pulse mode is enabled and is controlling Timer1 gate 0 = Timer1 gate Single-Pulse mode is disabled bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit 1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge 0 = Timer1 gate single-pulse acquisition has completed or has not been started bit 2 T1GVAL: Timer1 Gate Current State bit Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L. Unaffected by Timer1 Gate Enable (TMR1GE). bit 1-0 T1GSS<1:0>: Timer1 Gate Source Select bits 00 = Timer1 gate pin 01 = Timer0 overflow output 10 = Comparator 1 optionally synchronized output (SYNCC1OUT) 11 = Comparator 2 optionally synchronized output (SYNCC2OUT)
- 205. 2008-2011 Microchip Technology Inc. DS41364E-page 205 PIC16(L)F1934/6/7 TABLE 21-5: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 139 CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 234 CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0> 234 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 199* TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 199* TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 138 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 203 T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ DONE T1GVAL T1GSS<1:0> 204 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the Timer1 module. * Page provides register information.
- 206. PIC16(L)F1934/6/7 DS41364E-page 206 2008-2011 Microchip Technology Inc. NOTES:
- 207. 2008-2011 Microchip Technology Inc. DS41364E-page 207 PIC16(L)F1934/6/7 22.0 TIMER2/4/6 MODULES There are up to three identical Timer2-type modules available. To maintain pre-existing naming conventions, the Timers are called Timer2, Timer4 and Timer6 (also Timer2/4/6). The Timer2/4/6 modules incorporate the following features: • 8-bit Timer and Period registers (TMRx and PRx, respectively) • Readable and writable (both registers) • Software programmable prescaler (1:1, 1:4, 1:16, and 1:64) • Software programmable postscaler (1:1 to 1:16) • Interrupt on TMRx match with PRx, respectively • Optional use as the shift clock for the MSSP modules (Timer2 only) See Figure 22-1 for a block diagram of Timer2/4/6. FIGURE 22-1: TIMER2/4/6 BLOCK DIAGRAM Note: The ‘x’ variable used in this section is used to designate Timer2, Timer4, or Timer6. For example, TxCON references T2CON, T4CON, or T6CON. PRx refer- ences PR2, PR4, or PR6. Comparator TMRx Sets Flag TMRx Output Reset Postscaler Prescaler PRx 2 FOSC/4 1:1 to 1:16 1:1, 1:4, 1:16, 1:64 EQ 4 bit TMRxIF TxOUTPS<3:0> TxCKPS<1:0>
- 208. PIC16(L)F1934/6/7 DS41364E-page 208 2008-2011 Microchip Technology Inc. 22.1 Timer2/4/6 Operation The clock input to the Timer2/4/6 modules is the system instruction clock (FOSC/4). TMRx increments from 00h on each clock edge. A 4-bit counter/prescaler on the clock input allows direct input, divide-by-4 and divide-by-16 prescale options. These options are selected by the prescaler control bits, TxCKPS<1:0> of the TxCON register. The value of TMRx is compared to that of the Period register, PRx, on each clock cycle. When the two values match, the comparator generates a match signal as the timer output. This signal also resets the value of TMRx to 00h on the next cycle and drives the output counter/postscaler (see Section 22.2 “Timer2/4/6 Interrupt”). The TMRx and PRx registers are both directly readable and writable. The TMRx register is cleared on any device Reset, whereas the PRx register initializes to FFh. Both the prescaler and postscaler counters are cleared on the following events: • a write to the TMRx register • a write to the TxCON register • Power-on Reset (POR) • Brown-out Reset (BOR) • MCLR Reset • Watchdog Timer (WDT) Reset • Stack Overflow Reset • Stack Underflow Reset • RESET Instruction 22.2 Timer2/4/6 Interrupt Timer2/4/6 can also generate an optional device interrupt. The Timer2/4/6 output signal (TMRx-to-PRx match) provides the input for the 4-bit counter/postscaler. This counter generates the TMRx match interrupt flag which is latched in TMRxIF of the PIRx register. The interrupt is enabled by setting the TMRx Match Interrupt Enable bit, TMRxIE, of the PIEx register. A range of 16 postscale options (from 1:1 through 1:16 inclusive) can be selected with the postscaler control bits, TxOUTPS<3:0>, of the TxCON register. 22.3 Timer2/4/6 Output The unscaled output of TMRx is available primarily to the CCP modules, where it is used as a time base for operations in PWM mode. Timer2 can be optionally used as the shift clock source for the MSSP module operating in SPI mode. Additional information is provided in Section 24.0 “Master Synchronous Serial Port Module” 22.4 Timer2/4/6 Operation During Sleep The Timer2/4/6 timers cannot be operated while the processor is in Sleep mode. The contents of the TMRx and PRx registers will remain unchanged while the processor is in Sleep mode. Note: TMRx is not cleared when TxCON is written.
- 209. 2008-2011 Microchip Technology Inc. DS41364E-page 209 PIC16(L)F1934/6/7 22.5 Timer2/4/6 Control Register REGISTER 22-1: TXCON: TIMER2/TIMER4/TIMER6 CONTROL REGISTER U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — TOUTPS<3:0> TMRxON TxCKPS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-3 TOUTPS<3:0>: Timer Output Postscaler Select bits 0000 = 1:1 Postscaler 0001 = 1:2 Postscaler 0010 = 1:3 Postscaler 0011 = 1:4 Postscaler 0100 = 1:5 Postscaler 0101 = 1:6 Postscaler 0110 = 1:7 Postscaler 0111 = 1:8 Postscaler 1000 = 1:9 Postscaler 1001 = 1:10 Postscaler 1010 = 1:11 Postscaler 1011 = 1:12 Postscaler 1100 = 1:13 Postscaler 1101 = 1:14 Postscaler 1110 = 1:15 Postscaler 1111 = 1:16 Postscaler bit 2 TMRxON: Timerx On bit 1 = Timerx is on 0 = Timerx is off bit 1-0 TxCKPS<1:0>: Timer2-type Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 10 = Prescaler is 16 11 = Prescaler is 64
- 210. PIC16(L)F1934/6/7 DS41364E-page 210 2008-2011 Microchip Technology Inc. TABLE 22-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2/4/6 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0> 234 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 101 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 104 PR2 Timer2 Module Period Register 207* PR4 Timer4 Module Period Register 207* PR6 Timer6 Module Period Register 207* T2CON — TOUTPS<3:0> TMR2ON T2CKPS<1:0> 209 T4CON — TOUTPS<3:0> TMR4ON T4CKPS<1:0> 209 T6CON — TOUTPS<3:0> TMR2ON T6CKPS<1:0> 209 TMR2 Holding Register for the 8-bit TMR2 Register 207* TMR4 Holding Register for the 8-bit TMR4 Register(1) 207* TMR6 Holding Register for the 8-bit TMR6 Register(1) 207* Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Timer2 module. * Page provides register information.
- 211. 2008-2011 Microchip Technology Inc. DS41364E-page 211 PIC16(L)F1934/6/7 23.0 CAPTURE/COMPARE/PWM MODULES The Capture/Compare/PWM module is a peripheral which allows the user to time and control different events, and to generate Pulse-Width Modulation (PWM) signals. In Capture mode, the peripheral allows the timing of the duration of an event. The Compare mode allows the user to trigger an external event when a predetermined amount of time has expired. The PWM mode can generate Pulse-Width Modulated signals of varying frequency and duty cycle. This family of devices contains three Enhanced Capture/Compare/PWM modules (ECCP1, ECCP2, and ECCP3) and two standard Capture/Compare/PWM modules (CCP4 and CCP5). The Capture and Compare functions are identical for all five CCP modules (ECCP1, ECCP2, ECCP3, CCP4, and CCP5). The only differences between CCP modules are in the Pulse-Width Modulation (PWM) function. The standard PWM function is identical in modules, CCP4 and CCP5. In CCP modules ECCP1, ECCP2, and ECCP3, the Enhanced PWM function has slight variations from one another. Full-Bridge ECCP modules have four available I/O pins while Half-Bridge ECCP modules only have two available I/O pins. See Table 23-1 for more information. Note 1: In devices with more than one CCP module, it is very important to pay close attention to the register names used. A number placed after the module acronym is used to distinguish between separate modules. For example, the CCP1CON and CCP2CON control the same operational aspects of two completely different CCP modules. 2: Throughout this section, generic references to a CCP module in any of its operating modes may be interpreted as being equally applicable to ECCP1, ECCP2, ECCP3, CCP4 and CCP5. Register names, module signals, I/O pins, and bit names may use the generic designator ‘x’ to indicate the use of a numeral to distinguish a particular module, when required. TABLE 23-1: PWM RESOURCES Device Name ECCP1 ECCP2 ECCP3 CCP4 CCP5 PIC16(L)F1936 Enhanced PWM Full-Bridge Enhanced PWM Half-Bridge Enhanced PWM Half-Bridge Standard PWM Standard PWM PIC16(L)F1934/7 Enhanced PWM Full-Bridge Enhanced PWM Full-Bridge Enhanced PWM Half-Bridge Standard PWM Standard PWM
- 212. PIC16(L)F1934/6/7 DS41364E-page 212 2008-2011 Microchip Technology Inc. 23.1 Capture Mode The Capture mode function described in this section is available and identical for CCP modules ECCP1, ECCP2, ECCP3, CCP4 and CCP5. Capture mode makes use of the 16-bit Timer1 resource. When an event occurs on the CCPx pin, the 16-bit CCPRxH:CCPRxL register pair captures and stores the 16-bit value of the TMR1H:TMR1L register pair, respectively. An event is defined as one of the following and is configured by the CCPxM<3:0> bits of the CCPxCON register: • Every falling edge • Every rising edge • Every 4th rising edge • Every 16th rising edge When a capture is made, the Interrupt Request Flag bit CCPxIF of the PIRx register is set. The interrupt flag must be cleared in software. If another capture occurs before the value in the CCPRxH, CCPRxL register pair is read, the old captured value is overwritten by the new captured value. Figure 23-1 shows a simplified diagram of the Capture operation. 23.1.1 CCP PIN CONFIGURATION In Capture mode, the CCPx pin should be configured as an input by setting the associated TRIS control bit. Also, the CCPx pin function can be moved to alternative pins using the APFCON register. Refer to Section 12.1 “Alternate Pin Function” for more details. FIGURE 23-1: CAPTURE MODE OPERATION BLOCK DIAGRAM 23.1.2 TIMER1 MODE RESOURCE Timer1 must be running in Timer mode or Synchronized Counter mode for the CCP module to use the capture feature. In Asynchronous Counter mode, the capture operation may not work. See Section 21.0 “Timer1 Module with Gate Control” for more information on configuring Timer1. 23.1.3 SOFTWARE INTERRUPT MODE When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCPxIE interrupt enable bit of the PIEx register clear to avoid false interrupts. Additionally, the user should clear the CCPxIF interrupt flag bit of the PIRx register following any change in Operating mode. 23.1.4 CCP PRESCALER There are four prescaler settings specified by the CCPxM<3:0> bits of the CCPxCON register. Whenever the CCP module is turned off, or the CCP module is not in Capture mode, the prescaler counter is cleared. Any Reset will clear the prescaler counter. Switching from one capture prescaler to another does not clear the prescaler and may generate a false interrupt. To avoid this unexpected operation, turn the module off by clearing the CCPxCON register before changing the prescaler. Example 23-1 demonstrates the code to perform this function. EXAMPLE 23-1: CHANGING BETWEEN CAPTURE PRESCALERS 23.1.5 CAPTURE DURING SLEEP Capture mode depends upon the Timer1 module for proper operation. There are two options for driving the Timer1 module in Capture mode. It can be driven by the instruction clock (FOSC/4), or by an external clock source. When Timer1 is clocked by FOSC/4, Timer1 will not increment during Sleep. When the device wakes from Sleep, Timer1 will continue from its previous state. Capture mode will operate during Sleep when Timer1 is clocked by an external clock source. Note: If the CCPx pin is configured as an output, a write to the port can cause a capture condition. CCPRxH CCPRxL TMR1H TMR1L Set Flag bit CCPxIF (PIRx register) Capture Enable CCPxM<3:0> Prescaler 1, 4, 16 and Edge Detect pin CCPx System Clock (FOSC) Note: Clocking Timer1 from the system clock (FOSC) should not be used in Capture mode. In order for Capture mode to recognize the trigger event on the CCPx pin, Timer1 must be clocked from the instruction clock (FOSC/4) or from an external clock source. BANKSEL CCPxCON ;Set Bank bits to point ;to CCPxCON CLRF CCPxCON ;Turn CCP module off MOVLW NEW_CAPT_PS ;Load the W reg with ;the new prescaler ;move value and CCP ON MOVWF CCPxCON ;Load CCPxCON with this ;value
- 213. 2008-2011 Microchip Technology Inc. DS41364E-page 213 PIC16(L)F1934/6/7 23.1.6 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 12.1 “Alternate Pin Function” for more information. TABLE 23-2: SUMMARY OF REGISTERS ASSOCIATED WITH CAPTURE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page APFCON — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL 131 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 234 CCPRxL Capture/Compare/PWM Register x Low Byte (LSB) 212 CCPRxH Capture/Compare/PWM Register x High Byte (MSB) 212 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 100 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 101 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 103 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 104 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 203 T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/DONE T1GVAL T1GSS<1:0> 204 TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 199 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 199 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 138 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 TRISD(2) TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 145 TRISE — — — — —(3) TRISE2(2) TRISE1(2) TRISE0(2) 148 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by Capture mode. Note 1: Applies to ECCP modules only. 2: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 3: Unimplemented, read as ‘1’.
- 214. PIC16(L)F1934/6/7 DS41364E-page 214 2008-2011 Microchip Technology Inc. 23.2 Compare Mode The Compare mode function described in this section is available and identical for CCP modules ECCP1, ECCP2, ECCP3, CCP4 and CCP5. Compare mode makes use of the 16-bit Timer1 resource. The 16-bit value of the CCPRxH:CCPRxL register pair is constantly compared against the 16-bit value of the TMR1H:TMR1L register pair. When a match occurs, one of the following events can occur: • Toggle the CCPx output • Set the CCPx output • Clear the CCPx output • Generate a Special Event Trigger • Generate a Software Interrupt The action on the pin is based on the value of the CCPxM<3:0> control bits of the CCPxCON register. At the same time, the interrupt flag CCPxIF bit is set. All Compare modes can generate an interrupt. Figure 23-2 shows a simplified diagram of the Compare operation. FIGURE 23-2: COMPARE MODE OPERATION BLOCK DIAGRAM 23.2.1 CCP PIN CONFIGURATION The user must configure the CCPx pin as an output by clearing the associated TRIS bit. Also, the CCPx pin function can be moved to alternative pins using the APFCON register. Refer to Section 12.1 “Alternate Pin Function” for more details. 23.2.2 TIMER1 MODE RESOURCE In Compare mode, Timer1 must be running in either Timer mode or Synchronized Counter mode. The compare operation may not work in Asynchronous Counter mode. See Section 21.0 “Timer1 Module with Gate Control” for more information on configuring Timer1. 23.2.3 SOFTWARE INTERRUPT MODE When Generate Software Interrupt mode is chosen (CCPxM<3:0> = 1010), the CCPx module does not assert control of the CCPx pin (see the CCPxCON register). 23.2.4 SPECIAL EVENT TRIGGER When Special Event Trigger mode is chosen (CCPxM<3:0> = 1011), the CCPx module does the following: • Resets Timer1 • Starts an ADC conversion if ADC is enabled The CCPx module does not assert control of the CCPx pin in this mode. The Special Event Trigger output of the CCP occurs immediately upon a match between the TMR1H, TMR1L register pair and the CCPRxH, CCPRxL regis- ter pair. The TMR1H, TMR1L register pair is not reset until the next rising edge of the Timer1 clock. The Special Event Trigger output starts an A/D conversion (if the A/D module is enabled). This allows the CCPRxH, CCPRxL register pair to effectively provide a 16-bit programmable period register for Timer1. Refer to Section 15.2.5 “Special Event Trigger”for more information. Note: Clearing the CCPxCON register will force the CCPx compare output latch to the default low level. This is not the PORT I/O data latch. CCPRxH CCPRxL TMR1H TMR1L Comparator Q S R Output Logic Special Event Trigger Set CCPxIF Interrupt Flag (PIRx) Match TRIS CCPxM<3:0> Mode Select Output Enable Pin CCPx 4 Note: Clocking Timer1 from the system clock (FOSC) should not be used in Compare mode. In order for Compare mode to recognize the trigger event on the CCPx pin, TImer1 must be clocked from the instruction clock (FOSC/4) or from an external clock source. TABLE 23-3: SPECIAL EVENT TRIGGER Device CCPx/ECCPx PIC16(L)F1934/6/7 CCP5 Note 1: The Special Event Trigger from the CCP module does not set interrupt flag bit TMR1IF of the PIR1 register. 2: Removing the match condition by changing the contents of the CCPRxH and CCPRxL register pair, between the clock edge that generates the Special Event Trigger and the clock edge that generates the Timer1 Reset, will preclude the Reset from occurring.
- 215. 2008-2011 Microchip Technology Inc. DS41364E-page 215 PIC16(L)F1934/6/7 23.2.5 COMPARE DURING SLEEP The Compare mode is dependent upon the system clock (FOSC) for proper operation. Since FOSC is shut down during Sleep mode, the Compare mode will not function properly during Sleep. 23.2.6 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 12.1 “Alternate Pin Function” for more information. TABLE 23-4: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page APFCON — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL 131 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 234 CCPRxL Capture/Compare/PWM Register x Low Byte (LSB) 212 CCPRxH Capture/Compare/PWM Register x High Byte (MSB) 212 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 100 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 101 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 103 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 104 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 203 T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/DONE T1GVAL T1GSS<1:0> 204 TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 199 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 199 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 138 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 TRISD(2) TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 145 TRISE — — — — —(3) TRISE2(2) TRISE1(2) TRISE0(2) 148 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by Compare mode. Note 1: Applies to ECCP modules only. 2: These bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 3: Unimplemented, read as ‘1’.
- 216. PIC16(L)F1934/6/7 DS41364E-page 216 2008-2011 Microchip Technology Inc. 23.3 PWM Overview Pulse-Width Modulation (PWM) is a scheme that provides power to a load by switching quickly between fully on and fully off states. The PWM signal resembles a square wave where the high portion of the signal is considered the on state and the low portion of the signal is considered the off state. The high portion, also known as the pulse width, can vary in time and is defined in steps. A larger number of steps applied, which lengthens the pulse width, also supplies more power to the load. Lowering the number of steps applied, which shortens the pulse width, supplies less power. The PWM period is defined as the duration of one complete cycle or the total amount of on and off time combined. PWM resolution defines the maximum number of steps that can be present in a single PWM period. A higher resolution allows for more precise control of the pulse width time and in turn the power that is applied to the load. The term duty cycle describes the proportion of the on time to the off time and is expressed in percentages, where 0% is fully off and 100% is fully on. A lower duty cycle corresponds to less power applied and a higher duty cycle corresponds to more power applied. Figure 23-3 shows a typical waveform of the PWM signal. 23.3.1 STANDARD PWM OPERATION The standard PWM function described in this section is available and identical for CCP modules ECCP1, ECCP2, ECCP3, CCP4 and CCP5. The standard PWM mode generates a Pulse-Width modulation (PWM) signal on the CCPx pin with up to 10 bits of resolution. The period, duty cycle, and resolution are controlled by the following registers: • PRx registers • TxCON registers • CCPRxL registers • CCPxCON registers Figure 23-4 shows a simplified block diagram of PWM operation. FIGURE 23-3: CCP PWM OUTPUT SIGNAL FIGURE 23-4: SIMPLIFIED PWM BLOCK DIAGRAM Note 1: The corresponding TRIS bit must be cleared to enable the PWM output on the CCPx pin. 2: Clearing the CCPxCON register will relinquish control of the CCPx pin. Period Pulse Width TMRx = 0 TMRx = CCPRxH:CCPxCON<5:4> TMRx = PRx CCPRxL CCPRxH(2) (Slave) Comparator TMRx PRx (1) R Q S Duty Cycle Registers CCPxCON<5:4> Clear Timer, toggle CCPx pin and latch duty cycle Note 1: The 8-bit timer TMRx register is concatenated with the 2-bit internal system clock (FOSC), or 2 bits of the prescaler, to create the 10-bit time base. 2: In PWM mode, CCPRxH is a read-only register. TRIS CCPx Comparator
- 217. 2008-2011 Microchip Technology Inc. DS41364E-page 217 PIC16(L)F1934/6/7 23.3.2 SETUP FOR PWM OPERATION The following steps should be taken when configuring the CCP module for standard PWM operation: 1. Disable the CCPx pin output driver by setting the associated TRIS bit. 2. Load the PRx register with the PWM period value. 3. Configure the CCP module for the PWM mode by loading the CCPxCON register with the appropriate values. 4. Load the CCPRxL register and the DCxBx bits of the CCPxCON register, with the PWM duty cycle value. 5. Configure and start Timer2/4/6: • Select the Timer2/4/6 resource to be used for PWM generation by setting the CxTSEL<1:0> bits in the CCPTMRSx register. • Clear the TMRxIF interrupt flag bit of the PIRx register. See Note below. • Configure the TxCKPS bits of the TxCON register with the Timer prescale value. • Enable the Timer by setting the TMRxON bit of the TxCON register. 6. Enable PWM output pin: • Wait until the Timer overflows and the TMRxIF bit of the PIRx register is set. See Note below. • Enable the CCPx pin output driver by clear- ing the associated TRIS bit. 23.3.3 TIMER2/4/6 TIMER RESOURCE The PWM standard mode makes use of one of the 8-bit Timer2/4/6 timer resources to specify the PWM period. Configuring the CxTSEL<1:0> bits in the CCPTMRSx register selects which Timer2/4/6 timer is used. 23.3.4 PWM PERIOD The PWM period is specified by the PRx register of Timer2/4/6. The PWM period can be calculated using the formula of Equation 23-1. EQUATION 23-1: PWM PERIOD When TMRx is equal to PRx, the following three events occur on the next increment cycle: • TMRx is cleared • The CCPx pin is set. (Exception: If the PWM duty cycle = 0%, the pin will not be set.) • The PWM duty cycle is latched from CCPRxL into CCPRxH. 23.3.5 PWM DUTY CYCLE The PWM duty cycle is specified by writing a 10-bit value to multiple registers: CCPRxL register and DCxB<1:0> bits of the CCPxCON register. The CCPRxL contains the eight MSbs and the DCxB<1:0> bits of the CCPxCON register contain the two LSbs. CCPRxL and DCxB<1:0> bits of the CCPxCON register can be written to at any time. The duty cycle value is not latched into CCPRxH until after the period completes (i.e., a match between PRx and TMRx registers occurs). While using the PWM, the CCPRxH register is read-only. Equation 23-2 is used to calculate the PWM pulse width. Equation 23-3 is used to calculate the PWM duty cycle ratio. EQUATION 23-2: PULSE WIDTH EQUATION 23-3: DUTY CYCLE RATIO The CCPRxH register and a 2-bit internal latch are used to double buffer the PWM duty cycle. This double buffering is essential for glitchless PWM operation. The 8-bit timer TMRx register is concatenated with either the 2-bit internal system clock (FOSC), or 2 bits of the prescaler, to create the 10-bit time base. The system clock is used if the Timer2/4/6 prescaler is set to 1:1. When the 10-bit time base matches the CCPRxH and 2-bit latch, then the CCPx pin is cleared (see Figure 23-4). Note: In order to send a complete duty cycle and period on the first PWM output, the above steps must be included in the setup sequence. If it is not critical to start with a complete PWM signal on the first output, then step 6 may be ignored. PWM Period PRx 1 + 4 TOSC = (TMRx Prescale Value) Note 1: TOSC = 1/FOSC Note: The Timer postscaler (see Section 22.1 “Timer2/4/6 Operation”) is not used in the determination of the PWM frequency. Pulse Width CCPRxL:CCPxCON<5:4> = TOSC (TMRx Prescale Value) Duty Cycle Ratio CCPRxL:CCPxCON<5:4> 4 PRx 1 + ---------------------------------------------------------------------- - =
- 218. PIC16(L)F1934/6/7 DS41364E-page 218 2008-2011 Microchip Technology Inc. 23.3.6 PWM RESOLUTION The resolution determines the number of available duty cycles for a given period. For example, a 10-bit resolution will result in 1024 discrete duty cycles, whereas an 8-bit resolution will result in 256 discrete duty cycles. The maximum PWM resolution is 10 bits when PRx is 255. The resolution is a function of the PRx register value as shown by Equation 23-4. EQUATION 23-4: PWM RESOLUTION TABLE 23-5: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 32 MHz) TABLE 23-6: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz) TABLE 23-7: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz) Note: If the pulse width value is greater than the period the assigned PWM pin(s) will remain unchanged. Resolution 4 PRx 1 + log 2 log ----------------------------------------- - bits = PWM Frequency 1.95 kHz 7.81 kHz 31.25 kHz 125 kHz 250 kHz 333.3 kHz Timer Prescale (1, 4, 16) 16 4 1 1 1 1 PRx Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 Maximum Resolution (bits) 10 10 10 8 7 6.6 PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz Timer Prescale (1, 4, 16) 16 4 1 1 1 1 PRx Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 Maximum Resolution (bits) 10 10 10 8 7 6.6 PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz Timer Prescale (1, 4, 16) 16 4 1 1 1 1 PRx Value 0x65 0x65 0x65 0x19 0x0C 0x09 Maximum Resolution (bits) 8 8 8 6 5 5
- 219. 2008-2011 Microchip Technology Inc. DS41364E-page 219 PIC16(L)F1934/6/7 23.3.7 OPERATION IN SLEEP MODE In Sleep mode, the TMRx register will not increment and the state of the module will not change. If the CCPx pin is driving a value, it will continue to drive that value. When the device wakes up, TMRx will continue from its previous state. 23.3.8 CHANGES IN SYSTEM CLOCK FREQUENCY The PWM frequency is derived from the system clock frequency. Any changes in the system clock frequency will result in changes to the PWM frequency. See Section 5.0 “Oscillator Module (With Fail-Safe Clock Monitor)” for additional details. 23.3.9 EFFECTS OF RESET Any Reset will force all ports to Input mode and the CCP registers to their Reset states. 23.3.10 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 12.1 “Alternate Pin Function” for more information. TABLE 23-8: SUMMARY OF REGISTERS ASSOCIATED WITH STANDARD PWM Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page APFCON — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL 131 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 234 CCPTMRS0 C4TSEL<1:0> C3TSEL<1:0> C2TSEL<1:0> C1TSEL<1:0> 235 CCPTMRS1 — — — — — — C5TSEL<1:0> 235 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 100 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 101 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 103 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 104 PRx Timer2/4/6 Period Register 207* TxCON — TxOUTPS<3:0> TMRxON TxCKPS<:0>1 209 TMRx Timer2/4/6 Module Register 207 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 138 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 TRISD(2) TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 145 TRISE — — — — —(3) TRISE2(2) TRISE1(2) TRISE0(2) 148 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the PWM. Note 1: Applies to ECCP modules only. 2: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 3: Unimplemented, read as ‘1’. * Page provides register information.
- 220. PIC16(L)F1934/6/7 DS41364E-page 220 2008-2011 Microchip Technology Inc. 23.4 PWM (Enhanced Mode) The enhanced PWM function described in this section is available for CCP modules ECCP1, ECCP2 and ECCP3, with any differences between modules noted. The enhanced PWM mode generates a Pulse-Width Modulation (PWM) signal on up to four different output pins with up to 10 bits of resolution. The period, duty cycle, and resolution are controlled by the following registers: • PRx registers • TxCON registers • CCPRxL registers • CCPxCON registers The ECCP modules have the following additional PWM registers which control Auto-shutdown, Auto-restart, Dead-band Delay and PWM Steering modes: • CCPxAS registers • PSTRxCON registers • PWMxCON registers The enhanced PWM module can generate the following five PWM Output modes: • Single PWM • Half-Bridge PWM • Full-Bridge PWM, Forward Mode • Full-Bridge PWM, Reverse Mode • Single PWM with PWM Steering Mode To select an Enhanced PWM Output mode, the PxM bits of the CCPxCON register must be configured appropriately. The PWM outputs are multiplexed with I/O pins and are designated PxA, PxB, PxC and PxD. The polarity of the PWM pins is configurable and is selected by setting the CCPxM bits in the CCPxCON register appropriately. Figure 23-5 shows an example of a simplified block diagram of the Enhanced PWM module. Table 23-9 shows the pin assignments for various Enhanced PWM modes. FIGURE 23-5: EXAMPLE SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODE Note 1: The corresponding TRIS bit must be cleared to enable the PWM output on the CCPx pin. 2: Clearing the CCPxCON register will relinquish control of the CCPx pin. 3: Any pin not used in the enhanced PWM mode is available for alternate pin functions, if applicable. 4: To prevent the generation of an incomplete waveform when the PWM is first enabled, the ECCP module waits until the start of a new PWM period before generating a PWM signal. CCPRxL CCPRxH (Slave) Comparator TMRx Comparator PRx (1) R Q S Duty Cycle Registers DCxB<1:0> Clear Timer, toggle PWM pin and latch duty cycle Note 1: The 8-bit timer TMRx register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the 10-bit time base. TRISx CCPx/PxA TRISx PxB TRISx PxC TRISx PxD Output Controller PxM<1:0> 2 CCPxM<3:0> 4 PWMxCON CCPx/PxA PxB PxC PxD
- 221. 2008-2011 Microchip Technology Inc. DS41364E-page 221 PIC16(L)F1934/6/7 TABLE 23-9: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES FIGURE 23-6: EXAMPLE PWM (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE) ECCP Mode PxM<1:0> CCPx/PxA PxB PxC PxD Single 00 Yes(1) Yes(1) Yes(1) Yes(1) Half-Bridge 10 Yes Yes No No Full-Bridge, Forward 01 Yes Yes Yes Yes Full-Bridge, Reverse 11 Yes Yes Yes Yes Note 1: PWM Steering enables outputs in Single mode. 0 Period 00 10 01 11 Signal PRX+1 PxM<1:0> PxA Modulated PxA Modulated PxB Modulated PxA Active PxB Inactive PxC Inactive PxD Modulated PxA Inactive PxB Modulated PxC Active PxD Inactive Pulse Width (Single Output) (Half-Bridge) (Full-Bridge, Forward) (Full-Bridge, Reverse) Delay Delay Relationships: • Period = 4 * TOSC * (PRx + 1) * (TMRx Prescale Value) • Pulse Width = TOSC * (CCPRxL<7:0>:CCPxCON<5:4>) * (TMRx Prescale Value) • Delay = 4 * TOSC * (PWMxCON<6:0>)
- 222. PIC16(L)F1934/6/7 DS41364E-page 222 2008-2011 Microchip Technology Inc. FIGURE 23-7: EXAMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE) 0 Period 00 10 01 11 Signal PRx+1 PxM<1:0> PxA Modulated PxA Modulated PxB Modulated PxA Active PxB Inactive PxC Inactive PxD Modulated PxA Inactive PxB Modulated PxC Active PxD Inactive Pulse Width (Single Output) (Half-Bridge) (Full-Bridge, Forward) (Full-Bridge, Reverse) Delay Delay Relationships: • Period = 4 * TOSC * (PRx + 1) * (TMRx Prescale Value) • Pulse Width = TOSC * (CCPRxL<7:0>:CCPxCON<5:4>) * (TMRx Prescale Value) • Delay = 4 * TOSC * (PWMxCON<6:0>)
- 223. 2008-2011 Microchip Technology Inc. DS41364E-page 223 PIC16(L)F1934/6/7 23.4.1 HALF-BRIDGE MODE In Half-Bridge mode, two pins are used as outputs to drive push-pull loads. The PWM output signal is output on the CCPx/PxA pin, while the complementary PWM output signal is output on the PxB pin (see Figure 23-9). This mode can be used for Half-Bridge applications, as shown in Figure 23-9, or for Full-Bridge applications, where four power switches are being modulated with two PWM signals. In Half-Bridge mode, the programmable dead-band delay can be used to prevent shoot-through current in Half-Bridge power devices. The value of the PDC<6:0> bits of the PWMxCON register sets the number of instruction cycles before the output is driven active. If the value is greater than the duty cycle, the corresponding output remains inactive during the entire cycle. See Section 23.4.5 “Programmable Dead-Band Delay Mode” for more details of the dead-band delay operations. Since the PxA and PxB outputs are multiplexed with the PORT data latches, the associated TRIS bits must be cleared to configure PxA and PxB as outputs. FIGURE 23-8: EXAMPLE OF HALF-BRIDGE PWM OUTPUT FIGURE 23-9: EXAMPLE OF HALF-BRIDGE APPLICATIONS Period Pulse Width td td (1) PxA(2) PxB(2) td = Dead-Band Delay Period (1) (1) Note 1: At this time, the TMRx register is equal to the PRx register. 2: Output signals are shown as active-high. PxA PxB FET Driver FET Driver Load + - + - FET Driver FET Driver V+ Load FET Driver FET Driver PxA PxB Standard Half-Bridge Circuit (“Push-Pull”) Half-Bridge Output Driving a Full-Bridge Circuit
- 224. PIC16(L)F1934/6/7 DS41364E-page 224 2008-2011 Microchip Technology Inc. 23.4.2 FULL-BRIDGE MODE In Full-Bridge mode, all four pins are used as outputs. An example of Full-Bridge application is shown in Figure 23-10. In the Forward mode, pin CCPx/PxA is driven to its active state, pin PxD is modulated, while PxB and PxC will be driven to their inactive state as shown in Figure 23-11. In the Reverse mode, PxC is driven to its active state, pin PxB is modulated, while PxA and PxD will be driven to their inactive state as shown Figure 23-11. PxA, PxB, PxC and PxD outputs are multiplexed with the PORT data latches. The associated TRIS bits must be cleared to configure the PxA, PxB, PxC and PxD pins as outputs. FIGURE 23-10: EXAMPLE OF FULL-BRIDGE APPLICATION PxA PxC FET Driver FET Driver V+ V- Load FET Driver FET Driver PxB PxD QA QB QD QC
- 225. 2008-2011 Microchip Technology Inc. DS41364E-page 225 PIC16(L)F1934/6/7 FIGURE 23-11: EXAMPLE OF FULL-BRIDGE PWM OUTPUT Period Pulse Width PxA(2) PxB(2) PxC(2) PxD(2) Forward Mode (1) Period Pulse Width PxA(2) PxC(2) PxD(2) PxB(2) Reverse Mode (1) (1) (1) Note 1: At this time, the TMRx register is equal to the PRx register. 2: Output signal is shown as active-high.
- 226. PIC16(L)F1934/6/7 DS41364E-page 226 2008-2011 Microchip Technology Inc. 23.4.2.1 Direction Change in Full-Bridge Mode In the Full-Bridge mode, the PxM1 bit in the CCPxCON register allows users to control the forward/reverse direction. When the application firmware changes this direction control bit, the module will change to the new direction on the next PWM cycle. A direction change is initiated in software by changing the PxM1 bit of the CCPxCON register. The following sequence occurs four Timer cycles prior to the end of the current PWM period: • The modulated outputs (PxB and PxD) are placed in their inactive state. • The associated unmodulated outputs (PxA and PxC) are switched to drive in the opposite direction. • PWM modulation resumes at the beginning of the next period. See Figure 23-12 for an illustration of this sequence. The Full-Bridge mode does not provide dead-band delay. As one output is modulated at a time, dead-band delay is generally not required. There is a situation where dead-band delay is required. This situation occurs when both of the following conditions are true: 1. The direction of the PWM output changes when the duty cycle of the output is at or near 100%. 2. The turn off time of the power switch, including the power device and driver circuit, is greater than the turn on time. Figure 23-13 shows an example of the PWM direction changing from forward to reverse, at a near 100% duty cycle. In this example, at time t1, the output PxA and PxD become inactive, while output PxC becomes active. Since the turn off time of the power devices is longer than the turn on time, a shoot-through current will flow through power devices QC and QD (see Figure 23-10) for the duration of ‘t’. The same phenomenon will occur to power devices QA and QB for PWM direction change from reverse to forward. If changing PWM direction at high duty cycle is required for an application, two possible solutions for eliminating the shoot-through current are: 1. Reduce PWM duty cycle for one PWM period before changing directions. 2. Use switch drivers that can drive the switches off faster than they can drive them on. Other options to prevent shoot-through current may exist. FIGURE 23-12: EXAMPLE OF PWM DIRECTION CHANGE Pulse Width Period(1) Signal Note 1: The direction bit PxM1 of the CCPxCON register is written any time during the PWM cycle. 2: When changing directions, the PxA and PxC signals switch before the end of the current PWM cycle. The modulated PxB and PxD signals are inactive at this time. The length of this time is four Timer counts. Period (2) PxA (Active-High) PxB (Active-High) PxC (Active-High) PxD (Active-High) Pulse Width
- 227. 2008-2011 Microchip Technology Inc. DS41364E-page 227 PIC16(L)F1934/6/7 FIGURE 23-13: EXAMPLE OF PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE Forward Period Reverse Period PxA TON TOFF T = TOFF – TON PxB PxC PxD External Switch D Potential Shoot-Through Current Note 1: All signals are shown as active-high. 2: TON is the turn on delay of power switch QC and its driver. 3: TOFF is the turn off delay of power switch QD and its driver. External Switch C t1 PW PW
- 228. PIC16(L)F1934/6/7 DS41364E-page 228 2008-2011 Microchip Technology Inc. 23.4.3 ENHANCED PWM AUTO-SHUTDOWN MODE The PWM mode supports an Auto-Shutdown mode that will disable the PWM outputs when an external shutdown event occurs. Auto-Shutdown mode places the PWM output pins into a predetermined state. This mode is used to help prevent the PWM from damaging the application. The auto-shutdown sources are selected using the CCPxAS<2:0> bits of the CCPxAS register. A shutdown event may be generated by: • A logic ‘0’ on the INT pin • A logic ‘1’ on a Comparator (Cx) output A shutdown condition is indicated by the CCPxASE (Auto-Shutdown Event Status) bit of the CCPxAS register. If the bit is a ‘0’, the PWM pins are operating normally. If the bit is a ‘1’, the PWM outputs are in the shutdown state. When a shutdown event occurs, two things happen: The CCPxASE bit is set to ‘1’. The CCPxASE will remain set until cleared in firmware or an auto-restart occurs (see Section 23.4.4 “Auto-Restart Mode”). The enabled PWM pins are asynchronously placed in their shutdown states. The PWM output pins are grouped into pairs [PxA/PxC] and [PxB/PxD]. The state of each pin pair is determined by the PSSxAC and PSSxBD bits of the CCPxAS register. Each pin pair may be placed into one of three states: • Drive logic ‘1’ • Drive logic ‘0’ • Tri-state (high-impedance) FIGURE 23-14: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PXRSEN = 0) Note 1: The auto-shutdown condition is a level-based signal, not an edge-based signal. As long as the level is present, the auto-shutdown will persist. 2: Writing to the CCPxASE bit is disabled while an auto-shutdown condition persists. 3: Once the auto-shutdown condition has been removed and the PWM restarted (either through firmware or auto-restart) the PWM signal will always restart at the beginning of the next PWM period. 4: Prior to an auto-shutdown event caused by a comparator output or INT pin event, a software shutdown can be triggered in firmware by setting the CCPxASE bit of the CCPxAS register to ‘1’. The Auto-Restart feature tracks the active sta- tus of a shutdown caused by a compara- tor output or INT pin event only. If it is enabled at this time, it will immediately clear this bit and restart the ECCP mod- ule at the beginning of the next PWM period. Shutdown PWM CCPxASE bit Activity Event Shutdown Event Occurs Shutdown Event Clears PWM Resumes PWM Period Start of PWM Period CCPxASE Cleared by Firmware Timer Overflow Timer Overflow Timer Overflow Timer Overflow Missing Pulse (Auto-Shutdown) Missing Pulse (CCPxASE not clear) Timer Overflow
- 229. 2008-2011 Microchip Technology Inc. DS41364E-page 229 PIC16(L)F1934/6/7 23.4.4 AUTO-RESTART MODE The Enhanced PWM can be configured to automati- cally restart the PWM signal once the auto-shutdown condition has been removed. Auto-restart is enabled by setting the PxRSEN bit in the PWMxCON register. If auto-restart is enabled, the CCPxASE bit will remain set as long as the auto-shutdown condition is active. When the auto-shutdown condition is removed, the CCPxASE bit will be cleared via hardware and normal operation will resume. FIGURE 23-15: PWM AUTO-SHUTDOWN WITH AUTO-RESTART (PXRSEN = 1) Shutdown PWM CCPxASE bit Activity Event Shutdown Event Occurs Shutdown Event Clears PWM Period Start of PWM Period CCPxASE Cleared by Hardware Timer Overflow Timer Overflow Timer Overflow Timer Overflow Missing Pulse (Auto-Shutdown) Missing Pulse (CCPxASE not clear) Timer Overflow PWM Resumes
- 230. PIC16(L)F1934/6/7 DS41364E-page 230 2008-2011 Microchip Technology Inc. 23.4.5 PROGRAMMABLE DEAD-BAND DELAY MODE In Half-Bridge applications where all power switches are modulated at the PWM frequency, the power switches normally require more time to turn off than to turn on. If both the upper and lower power switches are switched at the same time (one turned on, and the other turned off), both switches may be on for a short period of time until one switch completely turns off. During this brief interval, a very high current (shoot-through current) will flow through both power switches, shorting the bridge supply. To avoid this potentially destructive shoot-through current from flowing during switching, turning on either of the power switches is normally delayed to allow the other switch to completely turn off. In Half-Bridge mode, a digitally programmable dead-band delay is available to avoid shoot-through current from destroying the bridge power switches. The delay occurs at the signal transition from the non-active state to the active state. See Figure 23-16 for illustration. The lower seven bits of the associated PWMxCON register (Register 23-5) sets the delay period in terms of microcontroller instruction cycles (TCY or 4 TOSC). FIGURE 23-16: EXAMPLE OF HALF-BRIDGE PWM OUTPUT FIGURE 23-17: EXAMPLE OF HALF-BRIDGE APPLICATIONS Period Pulse Width td td (1) PxA(2) PxB(2) td = Dead-Band Delay Period (1) (1) Note 1: At this time, the TMRx register is equal to the PRx register. 2: Output signals are shown as active-high. PxA PxB FET Driver FET Driver V+ V- Load + V - + V - Standard Half-Bridge Circuit (“Push-Pull”)
- 231. 2008-2011 Microchip Technology Inc. DS41364E-page 231 PIC16(L)F1934/6/7 23.4.6 PWM STEERING MODE In Single Output mode, PWM steering allows any of the PWM pins to be the modulated signal. Additionally, the same PWM signal can be simultaneously available on multiple pins. Once the Single Output mode is selected (CCPxM<3:2> = 11 and PxM<1:0> = 00 of the CCPxCON register), the user firmware can bring out the same PWM signal to one, two, three or four output pins by setting the appropriate STRx<D:A> bits of the PSTRxCON register, as shown in Table 23-9. While the PWM Steering mode is active, CCPxM<1:0> bits of the CCPxCON register select the PWM output polarity for the Px<D:A> pins. The PWM auto-shutdown operation also applies to PWM Steering mode as described in Section 23.4.3 “Enhanced PWM Auto-shutdown mode”. An auto-shutdown event will only affect pins that have PWM outputs enabled. FIGURE 23-18: SIMPLIFIED STEERING BLOCK DIAGRAM Note: The associated TRIS bits must be set to output (‘0’) to enable the pin output driver in order to see the PWM signal on the pin. 1 0 TRIS PxA pin PORT Data PxA Signal STRxA 1 0 TRIS PxB pin PORT Data STRxB 1 0 TRIS PxC pin PORT Data STRxC 1 0 TRIS PxD pin PORT Data STRxD Note 1: Port outputs are configured as shown when the CCPxCON register bits PxM<1:0> = 00 and CCPxM<3:2> = 11. 2: Single PWM output requires setting at least one of the STRx bits. CCPxM1 CCPxM0 CCPxM1 CCPxM0
- 232. PIC16(L)F1934/6/7 DS41364E-page 232 2008-2011 Microchip Technology Inc. 23.4.6.1 Steering Synchronization The STRxSYNC bit of the PSTRxCON register gives the user two selections of when the steering event will happen. When the STRxSYNC bit is ‘0’, the steering event will happen at the end of the instruction that writes to the PSTRxCON register. In this case, the output signal at the Px<D:A> pins may be an incomplete PWM waveform. This operation is useful when the user firmware needs to immediately remove a PWM signal from the pin. When the STRxSYNC bit is ‘1’, the effective steering update will happen at the beginning of the next PWM period. In this case, steering on/off the PWM output will always produce a complete PWM waveform. Figures 23-19 and 23-20 illustrate the timing diagrams of the PWM steering depending on the STRxSYNC setting. 23.4.7 START-UP CONSIDERATIONS When any PWM mode is used, the application hardware must use the proper external pull-up and/or pull-down resistors on the PWM output pins. The CCPxM<1:0> bits of the CCPxCON register allow the user to choose whether the PWM output signals are active-high or active-low for each pair of PWM output pins (PxA/PxC and PxB/PxD). The PWM output polarities must be selected before the PWM pin output drivers are enabled. Changing the polarity configuration while the PWM pin output drivers are enable is not recommended since it may result in damage to the application circuits. The PxA, PxB, PxC and PxD output latches may not be in the proper states when the PWM module is initialized. Enabling the PWM pin output drivers at the same time as the Enhanced PWM modes may cause damage to the application circuit. The Enhanced PWM modes must be enabled in the proper Output mode and complete a full PWM cycle before enabling the PWM pin output drivers. The completion of a full PWM cycle is indicated by the TMRxIF bit of the PIRx register being set as the second PWM period begins. FIGURE 23-19: EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STRxSYNC = 0) FIGURE 23-20: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION (STRxSYNC = 1) Note: When the microcontroller is released from Reset, all of the I/O pins are in the high-impedance state. The external cir- cuits must keep the power switch devices in the Off state until the microcontroller drives the I/O pins with the proper signal levels or activates the PWM output(s). PWM P1n = PWM STRx P1<D:A> PORT Data PWM Period PORT Data PWM PORT Data P1n = PWM STRx P1<D:A> PORT Data
- 233. 2008-2011 Microchip Technology Inc. DS41364E-page 233 PIC16(L)F1934/6/7 TABLE 23-10: SUMMARY OF REGISTERS ASSOCIATED WITH ENHANCED PWM Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 234 CCPxAS CCPxASE CCPxAS<2:0> PSSxAC<1:0> PSSxBD<1:0> 236 CCPTMRS0 C4TSEL<1:0> C3TSEL<1:0> C2TSEL<1:0> C1TSEL<1:0> 235 CCPTMRS1 — — — — — — C5TSEL<1:0> 235 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 100 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 101 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 103 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 104 PRx Timer2/4/6 Period Register 207* PSTRxCON — — — STRxSYNC STRxD STRxC STRxB STRxA 238 PWMxCON PxRSEN PxDC<6:0> 237 TxCON — TxOUTPS<3:0> TMRxON TxCKPS<:0>1 209 TMRx Timer2/4/6 Module Register 207 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 138 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 TRISD(2) TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 145 TRISE — — — — —(3) TRISE2(2) TRISE1(2) TRISE0(2) 148 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the PWM. Note 1: Applies to ECCP modules only. 2: These registers/bits are not implemented on PIC16(L)F1936 devices, read as ‘0’. 3: Unimplemented, read as ‘1’. * Page provides register information.
- 234. PIC16(L)F1934/6/7 DS41364E-page 234 2008-2011 Microchip Technology Inc. 23.5 CCP Control Register REGISTER 23-1: CCPxCON: CCPx CONTROL REGISTER R/W-00 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 PxM<1:0>: Enhanced PWM Output Configuration bits(1) Capture mode: Unused Compare mode: Unused If CCPxM<3:2> = 00, 01, 10: xx = PxA assigned as Capture/Compare input; PxB, PxC, PxD assigned as port pins If CCPxM<3:2> = 11: 00 = Single output; PxA modulated; PxB, PxC, PxD assigned as port pins 01 = Full-Bridge output forward; PxD modulated; PxA active; PxB, PxC inactive 10 = Half-Bridge output; PxA, PxB modulated with dead-band control; PxC, PxD assigned as port pins 11 = Full-Bridge output reverse; PxB modulated; PxC active; PxA, PxD inactive bit 5-4 DCxB<1:0>: PWM Duty Cycle Least Significant bits Capture mode: Unused Compare mode: Unused PWM mode: These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPRxL. bit 3-0 CCPxM<3:0>: ECCPx Mode Select bits 0000 = Capture/Compare/PWM off (resets ECCPx module) 0001 = Reserved 0010 = Compare mode: toggle output on match 0011 = Reserved 0100 = Capture mode: every falling edge 0101 = Capture mode: every rising edge 0110 = Capture mode: every 4th rising edge 0111 = Capture mode: every 16th rising edge 1000 = Compare mode: initialize ECCPx pin low; set output on compare match (set CCPxIF) 1001 = Compare mode: initialize ECCPx pin high; clear output on compare match (set CCPxIF) 1010 = Compare mode: generate software interrupt only; ECCPx pin reverts to I/O state 1011 = Compare mode: Special Event Trigger (ECCPx resets Timer, sets CCPxIF bit starts A/D conversion if A/D module is enabled)(1) CCP4/CCP5 only: 11xx = PWM mode ECCP1/ECCP2/ECCP3 only: 1100 = PWM mode: PxA, PxC active-high; PxB, PxD active-high 1101 = PWM mode: PxA, PxC active-high; PxB, PxD active-low 1110 = PWM mode: PxA, PxC active-low; PxB, PxD active-high 1111 = PWM mode: PxA, PxC active-low; PxB, PxD active-low Note 1: These bits are not implemented on CCP4 and CCP5.
- 235. 2008-2011 Microchip Technology Inc. DS41364E-page 235 PIC16(L)F1934/6/7 REGISTER 23-2: CCPTMRS0: PWM TIMER SELECTION CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 C4TSEL<1:0> C3TSEL<1:0> C2TSEL<1:0> C1TSEL<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 C4TSEL<1:0>: CCP4 Timer Selection bits 00 = CCP4 is based off Timer2 in PWM mode 01 = CCP4 is based off Timer4 in PWM mode 10 = CCP4 is based off Timer6 in PWM mode 11 = Reserved bit 5-4 C3TSEL<1:0>: CCP3 Timer Selection bits 00 = CCP3 is based off Timer2 in PWM mode 01 = CCP3 is based off Timer4 in PWM mode 10 = CCP3 is based off Timer6 in PWM mode 11 = Reserved bit 3-2 C2TSEL<1:0>: CCP2 Timer Selection bits 00 = CCP2 is based off Timer2 in PWM mode 01 = CCP2 is based off Timer4 in PWM mode 10 = CCP2 is based off Timer6 in PWM mode 11 = Reserved bit 1-0 C1TSEL<1:0>: CCP1 Timer Selection bits 00 = CCP1 is based off Timer2 in PWM mode 01 = CCP1 is based off Timer4 in PWM mode 10 = CCP1 is based off Timer6 in PWM mode 11 = Reserved REGISTER 23-3: CCPTMRS1: PWM TIMER SELECTION CONTROL REGISTER 1 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 — — — — — — C5TSEL<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1-0 C5TSEL<1:0>: CCP5 Timer Selection bits 00 = CCP5 is based off Timer2 in PWM mode 01 = CCP5 is based off Timer4 in PWM mode 10 = CCP5 is based off Timer6 in PWM mode 11 = Reserved
- 236. PIC16(L)F1934/6/7 DS41364E-page 236 2008-2011 Microchip Technology Inc. REGISTER 23-4: CCPxAS: CCPX AUTO-SHUTDOWN CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 CCPxASE CCPxAS<2:0> PSSxAC<1:0> PSSxBD<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CCPxASE: CCPx Auto-Shutdown Event Status bit 1 = A shutdown event has occurred; CCPx outputs are in shutdown state 0 = CCPx outputs are operating bit 6-4 CCPxAS<2:0>: CCPx Auto-Shutdown Source Select bits 000 = Auto-shutdown is disabled 001 = Comparator C1 output high(1) 010 = Comparator C2 output high(1) 011 = Either Comparator C1 or C2 high(1) 100 = VIL on INT pin 101 = VIL on INT pin or Comparator C1 high(1) 110 = VIL on INT pin or Comparator C2 high(1) 111 = VIL on INT pin or Comparator C1 or Comparator C2 high(1) bit 3-2 PSSxAC<1:0>: Pins PxA and PxC Shutdown State Control bits 00 = Drive pins PxA and PxC to ‘0’ 01 = Drive pins PxA and PxC to ‘1’ 1x = Pins PxA and PxC tri-state bit 1-0 PSSxBD<1:0>: Pins PxB and PxD Shutdown State Control bits 00 = Drive pins PxB and PxD to ‘0’ 01 = Drive pins PxB and PxD to ‘1’ 1x = Pins PxB and PxD tri-state Note 1: If CxSYNC is enabled, the shutdown will be delayed by Timer1.
- 237. 2008-2011 Microchip Technology Inc. DS41364E-page 237 PIC16(L)F1934/6/7 REGISTER 23-5: PWMxCON: ENHANCED PWM CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PxRSEN PxDC<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 PxRSEN: PWM Restart Enable bit 1 = Upon auto-shutdown, the CCPxASE bit clears automatically once the shutdown event goes away; the PWM restarts automatically 0 = Upon auto-shutdown, CCPxASE must be cleared in software to restart the PWM bit 6-0 PxDC<6:0>: PWM Delay Count bits PxDCx = Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal should transition active and the actual time it transitions active Note 1: Bit resets to ‘0’ with Two-Speed Start-up and LP, XT or HS selected as the Oscillator mode or Fail-Safe mode is enabled.
- 238. PIC16(L)F1934/6/7 DS41364E-page 238 2008-2011 Microchip Technology Inc. REGISTER 23-6: PSTRxCON: PWM STEERING CONTROL REGISTER(1) U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1 — — — STRxSYNC STRxD STRxC STRxB STRxA bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4 STRxSYNC: Steering Sync bit 1 = Output steering update occurs on next PWM period 0 = Output steering update occurs at the beginning of the instruction cycle boundary bit 3 STRxD: Steering Enable bit D 1 = PxD pin has the PWM waveform with polarity control from CCPxM<1:0> 0 = PxD pin is assigned to port pin bit 2 STRxC: Steering Enable bit C 1 = PxC pin has the PWM waveform with polarity control from CCPxM<1:0> 0 = PxC pin is assigned to port pin bit 1 STRxB: Steering Enable bit B 1 = PxB pin has the PWM waveform with polarity control from CCPxM<1:0> 0 = PxB pin is assigned to port pin bit 0 STRxA: Steering Enable bit A 1 = PxA pin has the PWM waveform with polarity control from CCPxM<1:0> 0 = PxA pin is assigned to port pin Note 1: The PWM Steering mode is available only when the CCPxCON register bits CCPxM<3:2> = 11 and PxM<1:0> = 00.
- 239. 2008-2011 Microchip Technology Inc. DS41364E-page 239 PIC16(L)F1934/6/7 24.0 MASTER SYNCHRONOUS SERIAL PORT MODULE 24.1 Master SSP (MSSP) Module Overview The Master Synchronous Serial Port (MSSP) module is a serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, shift registers, dis- play drivers, A/D converters, etc. The MSSP module can operate in one of two modes: • Serial Peripheral Interface (SPI) • Inter-Integrated Circuit (I2 C™) The SPI interface supports the following modes and features: • Master mode • Slave mode • Clock Parity • Slave Select Synchronization (Slave mode only) • Daisy-chain connection of slave devices Figure 24-1 is a block diagram of the SPI interface module. FIGURE 24-1: MSSP BLOCK DIAGRAM (SPI MODE) ( ) Read Write Data Bus SSPSR Reg SSPM<3:0> bit 0 Shift Clock SS Control Enable Edge Select Clock Select TMR2 Output TOSC Prescaler 4, 16, 64 2 Edge Select 2 (CKP, CKE) 4 TRIS bit SDO SSPBUF Reg SDI SS SCK Baud rate generator (SSPADD)
- 240. PIC16(L)F1934/6/7 DS41364E-page 240 2008-2011 Microchip Technology Inc. The I2 C interface supports the following modes and features: • Master mode • Slave mode • Byte NACKing (Slave mode) • Limited Multi-master support • 7-bit and 10-bit addressing • Start and Stop interrupts • Interrupt masking • Clock stretching • Bus collision detection • General call address matching • Address masking • Address Hold and Data Hold modes • Selectable SDA hold times Figure 24-2 is a block diagram of the I2 C interface mod- ule in Master mode. Figure 24-3 is a diagram of the I2 C interface module in Slave mode. FIGURE 24-2: MSSP BLOCK DIAGRAM (I2C™ MASTER MODE) Read Write SSPSR Start bit, Stop bit, Start bit detect, SSPBUF Internal data bus Set/Reset: S, P, SSPSTAT, WCOL, SSPOV Shift Clock MSb LSb SDA Acknowledge Generate (SSPCON2) Stop bit detect Write collision detect Clock arbitration State counter for end of XMIT/RCV SCL SCL in Bus Collision SDA in Receive Enable (RCEN) Clock Cntl Clock arbitrate/BCOL detect (Hold off clock source) [SSPM 3:0] Baud Rate Reset SEN, PEN (SSPCON2) Generator (SSPADD) Address Match detect Set SSPIF, BCLIF
- 241. 2008-2011 Microchip Technology Inc. DS41364E-page 241 PIC16(L)F1934/6/7 FIGURE 24-3: MSSP BLOCK DIAGRAM (I2C™ SLAVE MODE) Read Write SSPSR Reg Match Detect SSPADD Reg Start and Stop bit Detect SSPBUF Reg Internal Data Bus Addr Match Set, Reset S, P bits (SSPSTAT Reg) SCL SDA Shift Clock MSb LSb SSPMSK Reg
- 242. PIC16(L)F1934/6/7 DS41364E-page 242 2008-2011 Microchip Technology Inc. 24.2 SPI Mode Overview The Serial Peripheral Interface (SPI) bus is a synchronous serial data communication bus that operates in Full-Duplex mode. Devices communicate in a master/slave environment where the master device initiates the communication. A slave device is controlled through a Chip Select known as Slave Select. The SPI bus specifies four signal connections: • Serial Clock (SCK) • Serial Data Out (SDO) • Serial Data In (SDI) • Slave Select (SS) Figure 24-1 shows the block diagram of the MSSP module when operating in SPI Mode. The SPI bus operates with a single master device and one or more slave devices. When multiple slave devices are used, an independent Slave Select con- nection is required from the master device to each slave device. Figure 24-4 shows a typical connection between a master device and multiple slave devices. The master selects only one slave at a time. Most slave devices have tri-state outputs so their output signal appears disconnected from the bus when they are not selected. Transmissions involve two shift registers, eight bits in size, one in the master and one in the slave. With either the master or the slave device, data is always shifted out one bit at a time, with the Most Significant bit (MSb) shifted out first. At the same time, a new Least Significant bit (LSb) is shifted into the same register. Figure 24-5 shows a typical connection between two processors configured as master and slave devices. Data is shifted out of both shift registers on the pro- grammed clock edge and latched on the opposite edge of the clock. The master device transmits information out on its SDO output pin which is connected to, and received by, the slave’s SDI input pin. The slave device transmits infor- mation out on its SDO output pin, which is connected to, and received by, the master’s SDI input pin. To begin communication, the master device first sends out the clock signal. Both the master and the slave devices should be configured for the same clock polar- ity. The master device starts a transmission by sending out the MSb from its shift register. The slave device reads this bit from that same line and saves it into the LSb position of its shift register. During each SPI clock cycle, a full-duplex data transmission occurs. This means that while the master device is sending out the MSb from its shift register (on its SDO pin) and the slave device is reading this bit and saving it as the LSb of its shift register, that the slave device is also sending out the MSb from its shift register (on its SDO pin) and the master device is reading this bit and saving it as the LSb of its shift register. After 8 bits have been shifted out, the master and slave have exchanged register values. If there is more data to exchange, the shift registers are loaded with new data and the process repeats itself. Whether the data is meaningful or not (dummy data), depends on the application software. This leads to three scenarios for data transmission: • Master sends useful data and slave sends dummy data. • Master sends useful data and slave sends useful data. • Master sends dummy data and slave sends useful data. Transmissions may involve any number of clock cycles. When there is no more data to be transmitted, the master stops sending the clock signal and it dese- lects the slave. Every slave device connected to the bus that has not been selected through its slave select line must disre- gard the clock and transmission signals and must not transmit out any data of its own.
- 243. 2008-2011 Microchip Technology Inc. DS41364E-page 243 PIC16(L)F1934/6/7 FIGURE 24-4: SPI MASTER AND MULTIPLE SLAVE CONNECTION 24.2.1 SPI MODE REGISTERS The MSSP module has five registers for SPI mode operation. These are: • MSSP STATUS register (SSPSTAT) • MSSP Control Register 1 (SSPCON1) • MSSP Control Register 3 (SSPCON3) • MSSP Data Buffer register (SSPBUF) • MSSP Address register (SSPADD) • MSSP Shift register (SSPSR) (Not directly accessible) SSPCON1 and SSPSTAT are the control and STATUS registers in SPI mode operation. The SSPCON1 regis- ter is readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. In one SPI master mode, SSPADD can be loaded with a value used in the Baud Rate Generator. More infor- mation on the Baud Rate Generator is available in Section 24.7 “Baud Rate Generator”. SSPSR is the shift register used for shifting data in and out. SSPBUF provides indirect access to the SSPSR register. SSPBUF is the buffer register to which data bytes are written, and from which data bytes are read. In receive operations, SSPSR and SSPBUF together create a buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not buffered. A write to SSPBUF will write to both SSPBUF and SSPSR. SPI Master SCK SDO SDI General I/O General I/O General I/O SCK SDI SDO SS SPI Slave #1 SCK SDI SDO SS SPI Slave #2 SCK SDI SDO SS SPI Slave #3
- 244. PIC16(L)F1934/6/7 DS41364E-page 244 2008-2011 Microchip Technology Inc. 24.2.2 SPI MODE OPERATION When initializing the SPI, several options need to be specified. This is done by programming the appropriate control bits (SSPCON1<5:0> and SSPSTAT<7:6>). These control bits allow the following to be specified: • Master mode (SCK is the clock output) • Slave mode (SCK is the clock input) • Clock Polarity (Idle state of SCK) • Data Input Sample Phase (middle or end of data output time) • Clock Edge (output data on rising/falling edge of SCK) • Clock Rate (Master mode only) • Slave Select mode (Slave mode only) To enable the serial port, SSP Enable bit, SSPEN of the SSPCON1 register, must be set. To reset or reconfig- ure SPI mode, clear the SSPEN bit, re-initialize the SSPCONx registers and then set the SSPEN bit. This configures the SDI, SDO, SCK and SS pins as serial port pins. For the pins to behave as the serial port func- tion, some must have their data direction bits (in the TRIS register) appropriately programmed as follows: • SDI must have corresponding TRIS bit set • SDO must have corresponding TRIS bit cleared • SCK (Master mode) must have corresponding TRIS bit cleared • SCK (Slave mode) must have corresponding TRIS bit set • SS must have corresponding TRIS bit set Any serial port function that is not desired may be overridden by programming the corresponding data direction (TRIS) register to the opposite value. The MSSP consists of a transmit/receive shift register (SSPSR) and a buffer register (SSPBUF). The SSPSR shifts the data in and out of the device, MSb first. The SSPBUF holds the data that was written to the SSPSR until the received data is ready. Once the 8 bits of data have been received, that byte is moved to the SSPBUF register. Then, the Buffer Full Detect bit, BF of the SSPSTAT register, and the interrupt flag bit, SSPIF, are set. This double-buffering of the received data (SSPBUF) allows the next byte to start reception before reading the data that was just received. Any write to the SSPBUF register during transmission/reception of data will be ignored and the write collision detect bit WCOL of the SSPCON1 register, will be set. User software must clear the WCOL bit to allow the following write(s) to the SSPBUF register to complete successfully. When the application software is expecting to receive valid data, the SSPBUF should be read before the next byte of data to transfer is written to the SSPBUF. The Buffer Full bit, BF of the SSPSTAT register, indicates when SSPBUF has been loaded with the received data (transmission is complete). When the SSPBUF is read, the BF bit is cleared. This data may be irrelevant if the SPI is only a transmitter. Generally, the MSSP interrupt is used to determine when the transmission/reception has completed. If the interrupt method is not going to be used, then software polling can be done to ensure that a write collision does not occur. The SSPSR is not directly readable or writable and can only be accessed by addressing the SSPBUF register. Additionally, the SSPSTAT register indicates the various status conditions. FIGURE 24-5: SPI MASTER/SLAVE CONNECTION Serial Input Buffer (BUF) Shift Register (SSPSR) MSb LSb SDO SDI Processor 1 SCK SPI Master SSPM<3:0> = 00xx Serial Input Buffer (SSPBUF) Shift Register (SSPSR) LSb MSb SDI SDO Processor 2 SCK SPI Slave SSPM<3:0> = 010x Serial Clock SS Slave Select General I/O (optional) = 1010
- 245. 2008-2011 Microchip Technology Inc. DS41364E-page 245 PIC16(L)F1934/6/7 24.2.3 SPI MASTER MODE The master can initiate the data transfer at any time because it controls the SCK line. The master determines when the slave (Processor 2, Figure 24-5) is to broadcast data by the software protocol. In Master mode, the data is transmitted/received as soon as the SSPBUF register is written to. If the SPI is only going to receive, the SDO output could be dis- abled (programmed as an input). The SSPSR register will continue to shift in the signal present on the SDI pin at the programmed clock rate. As each byte is received, it will be loaded into the SSPBUF register as if a normal received byte (interrupts and Status bits appropriately set). The clock polarity is selected by appropriately programming the CKP bit of the SSPCON1 register and the CKE bit of the SSPSTAT register. This then, would give waveforms for SPI communication as shown in Figure 24-6, Figure 24-8 and Figure 24-9, where the MSB is transmitted first. In Master mode, the SPI clock rate (bit rate) is user programmable to be one of the following: • FOSC/4 (or TCY) • FOSC/16 (or 4 * TCY) • FOSC/64 (or 16 * TCY) • Timer2 output/2 • Fosc/(4 * (SSPADD + 1)) Figure 24-6 shows the waveforms for Master mode. When the CKE bit is set, the SDO data is valid before there is a clock edge on SCK. The change of the input sample is shown based on the state of the SMP bit. The time when the SSPBUF is loaded with the received data is shown. FIGURE 24-6: SPI MODE WAVEFORM (MASTER MODE) SCK (CKP = 0 SCK (CKP = 1 SCK (CKP = 0 SCK (CKP = 1 4 Clock Modes Input Sample Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 bit 7 SDI SSPIF (SMP = 1) (SMP = 0) (SMP = 1) CKE = 1) CKE = 0) CKE = 1) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (CKE = 0) (CKE = 1) bit 0
- 246. PIC16(L)F1934/6/7 DS41364E-page 246 2008-2011 Microchip Technology Inc. 24.2.4 SPI SLAVE MODE In Slave mode, the data is transmitted and received as external clock pulses appear on SCK. When the last bit is latched, the SSPIF interrupt flag bit is set. Before enabling the module in SPI Slave mode, the clock line must match the proper Idle state. The clock line can be observed by reading the SCK pin. The Idle state is determined by the CKP bit of the SSPCON1 register. While in Slave mode, the external clock is supplied by the external clock source on the SCK pin. This external clock must meet the minimum high and low times as specified in the electrical specifications. While in Sleep mode, the slave can transmit/receive data. The shift register is clocked from the SCK pin input and when a byte is received, the device will gen- erate an interrupt. If enabled, the device will wake-up from Sleep. 24.2.4.1 Daisy-Chain Configuration The SPI bus can sometimes be connected in a daisy-chain configuration. The first slave output is connected to the second slave input, the second slave output is connected to the third slave input, and so on. The final slave output is connected to the master input. Each slave sends out, during a second group of clock pulses, an exact copy of what was received during the first group of clock pulses. The whole chain acts as one large communication shift register. The daisy-chain feature only requires a single Slave Select line from the master device. Figure 24-7 shows the block diagram of a typical daisy-chain connection when operating in SPI Mode. In a daisy-chain configuration, only the most recent byte on the bus is required by the slave. Setting the BOEN bit of the SSPCON3 register will enable writes to the SSPBUF register, even if the previous byte has not been read. This allows the software to ignore data that may not apply to it. 24.2.5 SLAVE SELECT SYNCHRONIZATION The Slave Select can also be used to synchronize com- munication. The Slave Select line is held high until the master device is ready to communicate. When the Slave Select line is pulled low, the slave knows that a new transmission is starting. If the slave fails to receive the communication properly, it will be reset at the end of the transmission, when the Slave Select line returns to a high state. The slave is then ready to receive a new transmission when the Slave Select line is pulled low again. If the Slave Select line is not used, there is a risk that the slave will even- tually become out of sync with the master. If the slave misses a bit, it will always be one bit off in future trans- missions. Use of the Slave Select line allows the slave and master to align themselves at the beginning of each transmission. The SS pin allows a Synchronous Slave mode. The SPI must be in Slave mode with SS pin control enabled (SSPCON1<3:0> = 0100). When the SS pin is low, transmission and reception are enabled and the SDO pin is driven. When the SS pin goes high, the SDO pin is no longer driven, even if in the middle of a transmitted byte and becomes a floating output. External pull-up/pull-down resistors may be desirable depending on the applica- tion. When the SPI module resets, the bit counter is forced to ‘0’. This can be done by either forcing the SS pin to a high level or clearing the SSPEN bit. Note 1: When the SPI is in Slave mode with SS pin control enabled (SSPCON1<3:0> = 0100), the SPI module will reset if the SS pin is set to VDD. 2: When the SPI is used in Slave mode with CKE set; the user must enable SS pin control. 3: While operated in SPI Slave mode the SMP bit of the SSPSTAT register must remain clear.
- 247. 2008-2011 Microchip Technology Inc. DS41364E-page 247 PIC16(L)F1934/6/7 FIGURE 24-7: SPI DAISY-CHAIN CONNECTION FIGURE 24-8: SLAVE SELECT SYNCHRONOUS WAVEFORM SPI Master SCK SDO SDI General I/O SCK SDI SDO SS SPI Slave #1 SCK SDI SDO SS SPI Slave #2 SCK SDI SDO SS SPI Slave #3 SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 SDO bit 7 bit 6 bit 7 SSPIF Interrupt CKE = 0) CKE = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag bit 0 bit 7 bit 0 bit 6 SSPBUF to SSPSR Shift register SSPSR and bit count are reset
- 248. PIC16(L)F1934/6/7 DS41364E-page 248 2008-2011 Microchip Technology Inc. FIGURE 24-9: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0) FIGURE 24-10: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SSPIF Interrupt CKE = 0) CKE = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag Optional bit 0 detection active Write Collision Valid SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SSPIF Interrupt CKE = 1) CKE = 1) Write to SSPBUF SSPSR to SSPBUF SS Flag Not Optional Write Collision detection active Valid
- 249. 2008-2011 Microchip Technology Inc. DS41364E-page 249 PIC16(L)F1934/6/7 24.2.6 SPI OPERATION IN SLEEP MODE In SPI Master mode, module clocks may be operating at a different speed than when in Full Power mode; in the case of the Sleep mode, all clocks are halted. Special care must be taken by the user when the MSSP clock is much faster than the system clock. In Slave mode, when MSSP interrupts are enabled, after the master completes sending data, an MSSP interrupt will wake the controller from Sleep. If an exit from Sleep mode is not desired, MSSP interrupts should be disabled. In SPI Master mode, when the Sleep mode is selected, all module clocks are halted and the transmis- sion/reception will remain in that state until the device wakes. After the device returns to Run mode, the mod- ule will resume transmitting and receiving data. In SPI Slave mode, the SPI Transmit/Receive Shift register operates asynchronously to the device. This allows the device to be placed in Sleep mode and data to be shifted into the SPI Transmit/Receive Shift register. When all 8 bits have been received, the MSSP interrupt flag bit will be set and if enabled, will wake the device. TABLE 24-1: SUMMARY OF REGISTERS ASSOCIATED WITH SPI OPERATION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 134 APFCON — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL 131 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 99 PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 102 SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register 243* SSPCON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 287 SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 289 SSPSTAT SMP CKE D/A P S R/W UA BF 286 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISB2 TRISC1 TRISC0 142 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP in SPI mode. * Page provides register information.
- 250. PIC16(L)F1934/6/7 DS41364E-page 250 2008-2011 Microchip Technology Inc. 24.3 I2 C Mode Overview The Inter-Integrated Circuit Bus (I2 C) is a multi-master serial data communication bus. Devices communicate in a master/slave environment where the master devices initiate the communication. A Slave device is controlled through addressing. The I2 C bus specifies two signal connections: • Serial Clock (SCL) • Serial Data (SDA) Figure 24-11 shows the block diagram of the MSSP module when operating in I2 C Mode. Both the SCL and SDA connections are bidirectional open-drain lines, each requiring pull-up resistors for the supply voltage. Pulling the line to ground is considered a logical zero and letting the line float is considered a logical one. Figure 24-11 shows a typical connection between two processors configured as master and slave devices. The I2 C bus can operate with one or more master devices and one or more slave devices. There are four potential modes of operation for a given device: • Master Transmit mode (master is transmitting data to a slave) • Master Receive mode (master is receiving data from a slave) • Slave Transmit mode (slave is transmitting data to a master) • Slave Receive mode (slave is receiving data from the master) To begin communication, a master device starts out in Master Transmit mode. The master device sends out a Start bit followed by the address byte of the slave it intends to communicate with. This is followed by a sin- gle Read/Write bit, which determines whether the mas- ter intends to transmit to or receive data from the slave device. If the requested slave exists on the bus, it will respond with an Acknowledge bit, otherwise known as an ACK. The master then continues in either Transmit mode or Receive mode and the slave continues in the comple- ment, either in Receive mode or Transmit mode, respectively. A Start bit is indicated by a high-to-low transition of the SDA line while the SCL line is held high. Address and data bytes are sent out, Most Significant bit (MSb) first. The Read/Write bit is sent out as a logical one when the master intends to read data from the slave, and is sent out as a logical zero when it intends to write data to the slave. FIGURE 24-11: I2C MASTER/ SLAVE CONNECTION The Acknowledge bit (ACK) is an active-low signal, which holds the SDA line low to indicate to the transmit- ter that the slave device has received the transmitted data and is ready to receive more. The transition of a data bit is always performed while the SCL line is held low. Transitions that occur while the SCL line is held high are used to indicate Start and Stop bits. If the master intends to write to the slave, then it repeat- edly sends out a byte of data, with the slave responding after each byte with an ACK bit. In this example, the master device is in Master Transmit mode and the slave is in Slave Receive mode. If the master intends to read from the slave, then it repeatedly receives a byte of data from the slave, and responds after each byte with an ACK bit. In this exam- ple, the master device is in Master Receive mode and the slave is Slave Transmit mode. On the last byte of data communicated, the master device may end the transmission by sending a Stop bit. If the master device is in Receive mode, it sends the Stop bit in place of the last ACK bit. A Stop bit is indi- cated by a low-to-high transition of the SDA line while the SCL line is held high. In some cases, the master may want to maintain con- trol of the bus and re-initiate another transmission. If so, the master device may send another Start bit in place of the Stop bit or last ACK bit when it is in receive mode. The I2 C bus specifies three message protocols; • Single message where a master writes data to a slave. • Single message where a master reads data from a slave. • Combined message where a master initiates a minimum of two writes, or two reads, or a combination of writes and reads, to one or more slaves. Master SCL SDA SCL SDA Slave VDD VDD
- 251. 2008-2011 Microchip Technology Inc. DS41364E-page 251 PIC16(L)F1934/6/7 When one device is transmitting a logical one, or letting the line float, and a second device is transmitting a log- ical zero, or holding the line low, the first device can detect that the line is not a logical one. This detection, when used on the SCL line, is called clock stretching. Clock stretching gives slave devices a mechanism to control the flow of data. When this detection is used on the SDA line, it is called arbitration. Arbitration ensures that there is only one master device communicating at any single time. 24.3.1 CLOCK STRETCHING When a slave device has not completed processing data, it can delay the transfer of more data through the process of clock stretching. An addressed slave device may hold the SCL clock line low after receiving or send- ing a bit, indicating that it is not yet ready to continue. The master that is communicating with the slave will attempt to raise the SCL line in order to transfer the next bit, but will detect that the clock line has not yet been released. Because the SCL connection is open-drain, the slave has the ability to hold that line low until it is ready to continue communicating. Clock stretching allows receivers that cannot keep up with a transmitter to control the flow of incoming data. 24.3.2 ARBITRATION Each master device must monitor the bus for Start and Stop bits. If the device detects that the bus is busy, it cannot begin a new message until the bus returns to an Idle state. However, two master devices may try to initiate a trans- mission on or about the same time. When this occurs, the process of arbitration begins. Each transmitter checks the level of the SDA data line and compares it to the level that it expects to find. The first transmitter to observe that the two levels do not match, loses arbitra- tion, and must stop transmitting on the SDA line. For example, if one transmitter holds the SDA line to a logical one (lets it float) and a second transmitter holds it to a logical zero (pulls it low), the result is that the SDA line will be low. The first transmitter then observes that the level of the line is different than expected and concludes that another transmitter is communicating. The first transmitter to notice this difference is the one that loses arbitration and must stop driving the SDA line. If this transmitter is also a master device, it also must stop driving the SCL line. It then can monitor the lines for a Stop condition before trying to reissue its transmission. In the meantime, the other device that has not noticed any difference between the expected and actual levels on the SDA line continues with its original transmission. It can do so without any compli- cations, because so far, the transmission appears exactly as expected with no other transmitter disturbing the message. Slave Transmit mode can also be arbitrated, when a master addresses multiple slaves, but this is less com- mon. If two master devices are sending a message to two dif- ferent slave devices at the address stage, the master sending the lower slave address always wins arbitra- tion. When two master devices send messages to the same slave address, and addresses can sometimes refer to multiple slaves, the arbitration process must continue into the data stage. Arbitration usually occurs very rarely, but it is a neces- sary process for proper multi-master support. 24.4 I2 C™ Mode Operation All MSSP I2 C communication is byte oriented and shifted out MSb first. Six SFR registers and 2 interrupt flags interface the module with the PIC® microcon- troller and user software. Two pins, SDA and SCL, are exercised by the module to communicate with other external I2 C devices. 24.4.1 BYTE FORMAT All communication in I2 C is done in 9-bit segments. A byte is sent from a Master to a Slave or vice-versa, fol- lowed by an Acknowledge bit sent back. After the 8th falling edge of the SCL line, the device outputting data on the SDA changes that pin to an input and reads in an Acknowledge value on the next clock pulse. The clock signal, SCL, is provided by the master. Data is valid to change while the SCL signal is low, and sampled on the rising edge of the clock. Changes on the SDA line while the SCL line is high define special conditions on the bus, explained below. 24.4.2 DEFINITION OF I2 C TERMINOLOGY There is language and terminology in the description of I2 C communication that have definitions specific to I2 C. That word usage is defined below and may be used in the rest of this document without explana- tion. This table was adapted from the Philips I2 C specification. 24.4.3 SDA AND SCL PINS Selection of any I2 C mode with the SSPEN bit set, forces the SCL and SDA pins to be open-drain. These pins should be set by the user to inputs by setting the appropriate TRIS bits. 24.4.4 SDA HOLD TIME The hold time of the SDA pin is selected by the SDAHT bit of the SSPCON3 register. Hold time is the time SDA is held valid after the falling edge of SCL. Setting the SDAHT bit selects a longer 300 ns minimum hold time and may help on buses with large capacitance. Note: Data is tied to output zero when an I2 C mode is enabled.
- 252. PIC16(L)F1934/6/7 DS41364E-page 252 2008-2011 Microchip Technology Inc. TABLE 24-2: I2C BUS TERMS 24.4.5 START CONDITION The I2 C specification defines a Start condition as a transition of SDA from a high to a low state while SCL line is high. A Start condition is always generated by the master and signifies the transition of the bus from an Idle to an Active state. Figure 24-10 shows wave forms for Start and Stop conditions. A bus collision can occur on a Start condition if the module samples the SDA line low before asserting it low. This does not conform to the I2 C specification that states no bus collision can occur on a Start. 24.4.6 STOP CONDITION A Stop condition is a transition of the SDA line from low-to-high state while the SCL line is high. 24.4.7 RESTART CONDITION A Restart is valid any time that a Stop would be valid. A master can issue a Restart if it wishes to hold the bus after terminating the current transfer. A Restart has the same effect on the slave that a Start would, resetting all slave logic and preparing it to clock in an address. The master may want to address the same or another slave. In 10-bit Addressing Slave mode a Restart is required for the master to clock data out of the addressed slave. Once a slave has been fully addressed, match- ing both high and low address bytes, the master can issue a Restart and the high address byte with the R/W bit set. The slave logic will then hold the clock and prepare to clock out data. After a full match with R/W clear in 10-bit mode, a prior match flag is set and maintained. Until a Stop condi- tion, a high address with R/W clear, or high address match fails. 24.4.8 START/STOP CONDITION INTERRUPT MASKING The SCIE and PCIE bits of the SSPCON3 register can enable the generation of an interrupt in Slave modes that do not typically support this function. Slave modes where interrupt on Start and Stop detect are already enabled, these bits will have no effect. TERM Description Transmitter The device which shifts data out onto the bus. Receiver The device which shifts data in from the bus. Master The device that initiates a transfer, generates clock signals and termi- nates a transfer. Slave The device addressed by the mas- ter. Multi-master A bus with more than one device that can initiate data transfers. Arbitration Procedure to ensure that only one master at a time controls the bus. Winning arbitration ensures that the message is not corrupted. Synchronization Procedure to synchronize the clocks of two or more devices on the bus. Idle No master is controlling the bus, and both SDA and SCL lines are high. Active Any time one or more master devices are controlling the bus. Addressed Slave Slave device that has received a matching address and is actively being clocked by a master. Matching Address Address byte that is clocked into a slave that matches the value stored in SSPADD. Write Request Slave receives a matching address with R/W bit clear, and is ready to clock in data. Read Request Master sends an address byte with the R/W bit set, indicating that it wishes to clock data out of the Slave. This data is the next and all following bytes until a Restart or Stop. Clock Stretching When a device on the bus hold SCL low to stall communication. Bus Collision Any time the SDA line is sampled low by the module while it is out- putting and expected high state. Note: At least one SCL low time must appear before a Stop is valid, therefore, if the SDA line goes low then high again while the SCL line stays high, only the Start condition is detected.
- 253. 2008-2011 Microchip Technology Inc. DS41364E-page 253 PIC16(L)F1934/6/7 FIGURE 24-12: I2C START AND STOP CONDITIONS FIGURE 24-13: I2 C RESTART CONDITION SDA SCL P Stop Condition S Start Condition Change of Data Allowed Change of Data Allowed Restart Condition Sr Change of Data Allowed Change of Data Allowed
- 254. PIC16(L)F1934/6/7 DS41364E-page 254 2008-2011 Microchip Technology Inc. 24.4.9 ACKNOWLEDGE SEQUENCE The 9th SCL pulse for any transferred byte in I2 C is dedicated as an Acknowledge. It allows receiving devices to respond back to the transmitter by pulling the SDA line low. The transmitter must release control of the line during this time to shift in the response. The Acknowledge (ACK) is an active-low signal, pulling the SDA line low indicated to the transmitter that the device has received the transmitted data and is ready to receive more. The result of an ACK is placed in the ACKSTAT bit of the SSPCON2 register. Slave software, when the AHEN and DHEN bits are set, allow the user to set the ACK value sent back to the transmitter. The ACKDT bit of the SSPCON2 regis- ter is set/cleared to determine the response. Slave hardware will generate an ACK response if the AHEN and DHEN bits of the SSPCON3 register are clear. There are certain conditions where an ACK will not be sent by the slave. If the BF bit of the SSPSTAT register or the SSPOV bit of the SSPCON1 register are set when a byte is received. When the module is addressed, after the 8th falling edge of SCL on the bus, the ACKTIM bit of the SSPCON3 register is set. The ACKTIM bit indicates the acknowledge time of the active bus. The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is enabled. 24.5 I2 C Slave Mode Operation The MSSP Slave mode operates in one of four modes selected in the SSPM bits of SSPCON1 register. The modes can be divided into 7-bit and 10-bit Addressing mode. 10-bit Addressing modes operate the same as 7-bit with some additional overhead for handling the larger addresses. Modes with Start and Stop bit interrupts operated the same as the other modes with SSPIF additionally get- ting set upon detection of a Start, Restart, or Stop condition. 24.5.1 SLAVE MODE ADDRESSES The SSPADD register (Register 24-6) contains the Slave mode address. The first byte received after a Start or Restart condition is compared against the value stored in this register. If the byte matches, the value is loaded into the SSPBUF register and an inter- rupt is generated. If the value does not match, the module goes Idle and no indication is given to the soft- ware that anything happened. The SSP Mask register (Register 24-5) affects the address matching process. See Section 24.5.9 “SSP Mask Register” for more information. 24.5.1.1 I2 C Slave 7-bit Addressing Mode In 7-bit Addressing mode, the LSb of the received data byte is ignored when determining if there is an address match. 24.5.1.2 I2C Slave 10-bit Addressing Mode In 10-bit Addressing mode, the first received byte is compared to the binary value of ‘1 1 1 1 0 A9 A8 0’. A9 and A8 are the two MSb of the 10-bit address and stored in bits 2 and 1 of the SSPADD register. After the acknowledge of the high byte the UA bit is set and SCL is held low until the user updates SSPADD with the low address. The low address byte is clocked in and all 8 bits are compared to the low address value in SSPADD. Even if there is not an address match; SSPIF and UA are set, and SCL is held low until SSPADD is updated to receive a high byte again. When SSPADD is updated the UA bit is cleared. This ensures the module is ready to receive the high address byte on the next communication. A high and low address match as a write request is required at the start of all 10-bit addressing communi- cation. A transmission can be initiated by issuing a Restart once the slave is addressed, and clocking in the high address with the R/W bit set. The slave hard- ware will then acknowledge the read request and pre- pare to clock out data. This is only valid for a slave after it has received a complete high and low address byte match.
- 255. 2008-2011 Microchip Technology Inc. DS41364E-page 255 PIC16(L)F1934/6/7 24.5.2 SLAVE RECEPTION When the R/W bit of a matching received address byte is clear, the R/W bit of the SSPSTAT register is cleared. The received address is loaded into the SSPBUF reg- ister and acknowledged. When the overflow condition exists for a received address, then not Acknowledge is given. An overflow condition is defined as either bit BF bit of the SSPSTAT register is set, or bit SSPOV bit of the SSPCON1 reg- ister is set. The BOEN bit of the SSPCON3 register modifies this operation. For more information see Register 24-4. An MSSP interrupt is generated for each transferred data byte. Flag bit, SSPIF, must be cleared by software. When the SEN bit of the SSPCON2 register is set, SCL will be held low (clock stretch) following each received byte. The clock must be released by setting the CKP bit of the SSPCON1 register, except sometimes in 10-bit mode. See Section 24.2.3 “SPI Master Mode” for more detail. 24.5.2.1 7-bit Addressing Reception This section describes a standard sequence of events for the MSSP module configured as an I2 C Slave in 7-bit Addressing mode. All decisions made by hard- ware or software and their effect on reception. Figure 24-13 and Figure 24-14 is used as a visual reference for this description. This is a step by step process of what typically must be done to accomplish I2 C communication. 1. Start bit detected. 2. S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 3. Matching address with R/W bit clear is received. 4. The slave pulls SDA low sending an ACK to the master, and sets SSPIF bit. 5. Software clears the SSPIF bit. 6. Software reads received address from SSPBUF clearing the BF flag. 7. If SEN = 1; Slave software sets CKP bit to release the SCL line. 8. The master clocks out a data byte. 9. Slave drives SDA low sending an ACK to the master, and sets SSPIF bit. 10. Software clears SSPIF. 11. Software reads the received byte from SSPBUF clearing BF. 12. Steps 8-12 are repeated for all received bytes from the Master. 13. Master sends Stop condition, setting P bit of SSPSTAT, and the bus goes Idle. 24.5.2.2 7-bit Reception with AHEN and DHEN Slave device reception with AHEN and DHEN set operate the same as without these options with extra interrupts and clock stretching added after the 8th fall- ing edge of SCL. These additional interrupts allow the slave software to decide whether it wants to ACK the receive address or data byte, rather than the hard- ware. This functionality adds support for PMBus™ that was not present on previous versions of this module. This list describes the steps that need to be taken by slave software to use these options for I2 C communi- cation. Figure 24-15 displays a module using both address and data holding. Figure 24-16 includes the operation with the SEN bit of the SSPCON2 register set. 1. S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 2. Matching address with R/W bit clear is clocked in. SSPIF is set and CKP cleared after the 8th falling edge of SCL. 3. Slave clears the SSPIF. 4. Slave can look at the ACKTIM bit of the SSPCON3 register to determine if the SSPIF was after or before the ACK. 5. Slave reads the address value from SSPBUF, clearing the BF flag. 6. Slave sets ACK value clocked out to the master by setting ACKDT. 7. Slave releases the clock by setting CKP. 8. SSPIF is set after an ACK, not after a NACK. 9. If SEN = 1 the slave hardware will stretch the clock after the ACK. 10. Slave clears SSPIF. 11. SSPIF set and CKP cleared after 8th falling edge of SCL for a received data byte. 12. Slave looks at ACKTIM bit of SSPCON3 to determine the source of the interrupt. 13. Slave reads the received data from SSPBUF clearing BF. 14. Steps 7-14 are the same for each received data byte. 15. Communication is ended by either the slave sending an ACK = 1, or the master sending a Stop condition. If a Stop is sent and Interrupt on Stop Detect is disabled, the slave will only know by polling the P bit of the SSTSTAT register. Note: SSPIF is still set after the 9th falling edge of SCL even if there is no clock stretching and BF has been cleared. Only if NACK is sent to Master is SSPIF not set
- 256. PIC16(L)F1934/6/7 DS41364E-page 256 2008-2011 Microchip Technology Inc. FIGURE 24-14: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0) Receiving Address ACK Receiving Data ACK Receiving Data ACK = 1 A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 SDA SCL SSPIF BF SSPOV 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 9 9 ACK is not sent. SSPOV set because SSPBUF is still full. Cleared by software First byte of data is available in SSPBUF SSPBUF is read SSPIF set on 9th falling edge of SCL Cleared by software P Bus Master sends Stop condition S From Slave to Master
- 257. 2008-2011 Microchip Technology Inc. DS41364E-page 257 PIC16(L)F1934/6/7 FIGURE 24-15: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0) SEN SEN A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 SDA SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P SSPIF set on 9th SCL is not held CKP is written to 1 in software, CKP is written to ‘1’ in software, ACK low because falling edge of SCL releasing SCL ACK is not sent. Bus Master sends CKP SSPOV BF SSPIF SSPOV set because SSPBUF is still full. Cleared by software First byte of data is available in SSPBUF ACK= 1 Cleared by software SSPBUF is read Clock is held low until CKP is set to ‘1’ releasing SCL Stop condition S ACK ACK Receive Address Receive Data Receive Data R/W=0
- 258. PIC16(L)F1934/6/7 DS41364E-page 258 2008-2011 Microchip Technology Inc. FIGURE 24-16: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1) Receiving Address Receiving Data Received Data P A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 SDA SCL BF CKP S P 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 Master sends Stop condition S Data is read from SSPBUF Cleared by software SSPIF is set on 9th falling edge of SCL, after ACK CKP set by software, SCL is released Slave software 9 ACKTIM cleared by hardware in 9th rising edge of SCL sets ACKDT to not ACK When DHEN=1: CKP is cleared by hardware on 8th falling edge of SCL Slave software clears ACKDT to ACK the received byte ACKTIM set by hardware on 8th falling edge of SCL When AHEN=1: CKP is cleared by hardware and SCL is stretched Address is read from SSBUF ACKTIM set by hardware on 8th falling edge of SCL ACK Master Releases SDA to slave for ACK sequence No interrupt after not ACK from Slave ACK=1 ACK ACKDT ACKTIM SSPIF If AHEN = 1: SSPIF is set
- 259. 2008-2011 Microchip Technology Inc. DS41364E-page 259 PIC16(L)F1934/6/7 FIGURE 24-17: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1) Receiving Address Receive Data Receive Data A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 SDA SCL SSPIF BF ACKDT CKP S P ACK S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 ACK ACK Cleared by software ACKTIM is cleared by hardware SSPBUF can be Set by software, read any time before next byte is loaded release SCL on 9th rising edge of SCL Received address is loaded into SSPBUF Slave software clears ACKDT to ACK R/W = 0 Master releases SDA to slave for ACK sequence the received byte When AHEN = 1; on the 8th falling edge of SCL of an address byte, CKP is cleared ACKTIM is set by hardware on 8th falling edge of SCL When DHEN = 1; on the 8th falling edge of SCL of a received data byte, CKP is cleared Received data is available on SSPBUF Slave sends not ACK CKP is not cleared if not ACK P Master sends Stop condition No interrupt after if not ACK from Slave ACKTIM
- 260. PIC16(L)F1934/6/7 DS41364E-page 260 2008-2011 Microchip Technology Inc. 24.5.3 SLAVE TRANSMISSION When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit of the SSPSTAT register is set. The received address is loaded into the SSPBUF register, and an ACK pulse is sent by the slave on the ninth bit. Following the ACK, slave hardware clears the CKP bit and the SCL pin is held low (see Section 24.5.6 “Clock Stretching” for more detail). By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. The transmit data must be loaded into the SSPBUF register which also loads the SSPSR register. Then the SCL pin should be released by setting the CKP bit of the SSPCON1 register. The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time. The ACK pulse from the master-receiver is latched on the rising edge of the ninth SCL input pulse. This ACK value is copied to the ACKSTAT bit of the SSPCON2 register. If ACKSTAT is set (not ACK), then the data transfer is complete. In this case, when the not ACK is latched by the slave, the slave goes Idle and waits for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, the SCL pin must be released by setting bit CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared by software and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the ninth clock pulse. 24.5.3.1 Slave Mode Bus Collision A slave receives a Read request and begins shifting data out on the SDA line. If a bus collision is detected and the SBCDE bit of the SSPCON3 register is set, the BCLIF bit of the PIR register is set. Once a bus collision is detected, the slave goes Idle and waits to be addressed again. User software can use the BCLIF bit to handle a slave bus collision. 24.5.3.2 7-bit Transmission A master device can transmit a read request to a slave, and then clock data out of the slave. The list below outlines what software for a slave will need to do to accomplish a standard transmission. Figure 24-17 can be used as a reference to this list. 1. Master sends a Start condition on SDA and SCL. 2. S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 3. Matching address with R/W bit set is received by the Slave setting SSPIF bit. 4. Slave hardware generates an ACK and sets SSPIF. 5. SSPIF bit is cleared by user. 6. Software reads the received address from SSPBUF, clearing BF. 7. R/W is set so CKP was automatically cleared after the ACK. 8. The slave software loads the transmit data into SSPBUF. 9. CKP bit is set releasing SCL, allowing the master to clock the data out of the slave. 10. SSPIF is set after the ACK response from the master is loaded into the ACKSTAT register. 11. SSPIF bit is cleared. 12. The slave software checks the ACKSTAT bit to see if the master wants to clock out more data. 13. Steps 9-13 are repeated for each transmitted byte. 14. If the master sends a not ACK; the clock is not held, but SSPIF is still set. 15. The master sends a Restart condition or a Stop. 16. The slave is no longer addressed. Note 1: If the master ACKs the clock will be stretched. 2: ACKSTAT is the only bit updated on the rising edge of SCL (9th) rather than the falling.
- 261. 2008-2011 Microchip Technology Inc. DS41364E-page 261 PIC16(L)F1934/6/7 FIGURE 24-18: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0) Receiving Address Automatic Transmitting Data Automatic Transmitting Data A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 SDA SCL SSPIF BF CKP ACKSTAT R/W D/A S P Received address When R/W is set R/W is copied from the Indicates an address is read from SSPBUF SCL is always held low after 9th SCL falling edge matching address byte has been received Masters not ACK is copied to ACKSTAT CKP is not held for not ACK BF is automatically cleared after 8th falling edge of SCL Data to transmit is loaded into SSPBUF Set by software Cleared by software ACK ACK ACK R/W = 1 S P Master sends Stop condition
- 262. PIC16(L)F1934/6/7 DS41364E-page 262 2008-2011 Microchip Technology Inc. 24.5.3.3 7-bit Transmission with Address Hold Enabled Setting the AHEN bit of the SSPCON3 register enables additional clock stretching and interrupt generation after the 8th falling edge of a received matching address. Once a matching address has been clocked in, CKP is cleared and the SSPIF interrupt is set. Figure 24-18 displays a standard waveform of a 7-bit Address Slave Transmission with AHEN enabled. 1. Bus starts Idle. 2. Master sends Start condition; the S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 3. Master sends matching address with R/W bit set. After the 8th falling edge of the SCL line the CKP bit is cleared and SSPIF interrupt is gener- ated. 4. Slave software clears SSPIF. 5. Slave software reads ACKTIM bit of SSPCON3 register, and R/W and D/A of the SSPSTAT reg- ister to determine the source of the interrupt. 6. Slave reads the address value from the SSPBUF register clearing the BF bit. 7. Slave software decides from this information if it wishes to ACK or not ACK and sets ACKDT bit of the SSPCON2 register accordingly. 8. Slave sets the CKP bit releasing SCL. 9. Master clocks in the ACK value from the slave. 10. Slave hardware automatically clears the CKP bit and sets SSPIF after the ACK if the R/W bit is set. 11. Slave software clears SSPIF. 12. Slave loads value to transmit to the master into SSPBUF setting the BF bit. 13. Slave sets CKP bit releasing the clock. 14. Master clocks out the data from the slave and sends an ACK value on the 9th SCL pulse. 15. Slave hardware copies the ACK value into the ACKSTAT bit of the SSPCON2 register. 16. Steps 10-15 are repeated for each byte transmit- ted to the master from the slave. 17. If the master sends a not ACK the slave releases the bus allowing the master to send a Stop and end the communication. Note: SSPBUF cannot be loaded until after the ACK. Note: Master must send a not ACK on the last byte to ensure that the slave releases the SCL line to receive a Stop.
- 263. 2008-2011 Microchip Technology Inc. DS41364E-page 263 PIC16(L)F1934/6/7 FIGURE 24-19: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1) Receiving Address Automatic Transmitting Data Automatic Transmitting Data A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 SDA SCL SSPIF BF ACKDT ACKSTAT CKP R/W D/A Received address is read from SSPBUF BF is automatically cleared after 8th falling edge of SCL Data to transmit is loaded into SSPBUF Cleared by software Slave clears ACKDT to ACK address Master’s ACK response is copied to SSPSTAT CKP not cleared after not ACK Set by software, releases SCL ACKTIM is cleared on 9th rising edge of SCL ACKTIM is set on 8th falling edge of SCL When AHEN = 1; CKP is cleared by hardware after receiving matching address. When R/W = 1; CKP is always cleared after ACK S P Master sends Stop condition ACK R/W = 1 Master releases SDA to slave for ACK sequence ACK ACK ACKTIM
- 264. PIC16(L)F1934/6/7 DS41364E-page 264 2008-2011 Microchip Technology Inc. 24.5.4 SLAVE MODE 10-BIT ADDRESS RECEPTION This section describes a standard sequence of events for the MSSP module configured as an I2 C Slave in 10-bit Addressing mode. Figure 24-19 is used as a visual reference for this description. This is a step by step process of what must be done by slave software to accomplish I2 C communication. 1. Bus starts Idle. 2. Master sends Start condition; S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 3. Master sends matching high address with R/W bit clear; UA bit of the SSPSTAT register is set. 4. Slave sends ACK and SSPIF is set. 5. Software clears the SSPIF bit. 6. Software reads received address from SSPBUF clearing the BF flag. 7. Slave loads low address into SSPADD, releasing SCL. 8. Master sends matching low address byte to the Slave; UA bit is set. 9. Slave sends ACK and SSPIF is set. 10. Slave clears SSPIF. 11. Slave reads the received matching address from SSPBUF clearing BF. 12. Slave loads high address into SSPADD. 13. Master clocks a data byte to the slave and clocks out the slaves ACK on the 9th SCL pulse; SSPIF is set. 14. If SEN bit of SSPCON2 is set, CKP is cleared by hardware and the clock is stretched. 15. Slave clears SSPIF. 16. Slave reads the received byte from SSPBUF clearing BF. 17. If SEN is set the slave sets CKP to release the SCL. 18. Steps 13-17 repeat for each received byte. 19. Master sends Stop to end the transmission. 24.5.5 10-BIT ADDRESSING WITH ADDRESS OR DATA HOLD Reception using 10-bit addressing with AHEN or DHEN set is the same as with 7-bit modes. The only difference is the need to update the SSPADD register using the UA bit. All functionality, specifically when the CKP bit is cleared and SCL line is held low are the same. Figure 24-20 can be used as a reference of a slave in 10-bit addressing with AHEN set. Figure 24-21 shows a standard waveform for a slave transmitter in 10-bit Addressing mode. Note: Updates to the SSPADD register are not allowed until after the ACK sequence. Note: If the low address does not match, SSPIF and UA are still set so that the slave soft- ware can set SSPADD back to the high address. BF is not set because there is no match. CKP is unaffected.
- 265. 2008-2011 Microchip Technology Inc. DS41364E-page 265 PIC16(L)F1934/6/7 FIGURE 24-20: I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0) SSPIF Receive First Address Byte ACK Receive Second Address Byte ACK Receive Data ACK Receive Data ACK 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 SDA SCL UA CKP 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P Master sends Stop condition Cleared by software Receive address is Software updates SSPADD Data is read SCL is held low Set by software, while CKP = 0 from SSPBUF releasing SCL When SEN = 1 ; CKP is cleared after 9th falling edge of received byte read from SSPBUF and releases SCL When UA = 1 ; If address matches Set by hardware on 9th falling edge SSPADD it is loaded into SSPBUF SCL is held low S BF
- 266. PIC16(L)F1934/6/7 DS41364E-page 266 2008-2011 Microchip Technology Inc. FIGURE 24-21: I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0) Receive First Address Byte UA Receive Second Address Byte UA Receive Data ACK Receive Data 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 SDA SCL SSPIF BF ACKDT UA CKP ACKTIM 1 2 3 4 5 6 7 8 9 S ACK ACK 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 SSPBUF is read from Received data SSPBUF can be read anytime before the next received byte Cleared by software falling edge of SCL not allowed until 9th Update to SSPADD is Set CKP with software releases SCL SCL clears UA and releases Update of SSPADD, Set by hardware on 9th falling edge Slave software clears ACKDT to ACK the received byte If when AHEN = 1; on the 8th falling edge of SCL of an address byte, CKP is cleared ACKTIM is set by hardware on 8th falling edge of SCL Cleared by software R/W = 0
- 267. 2008-2011 Microchip Technology Inc. DS41364E-page 267 PIC16(L)F1934/6/7 FIGURE 24-22: I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0) Receiving Address ACK Receiving Second Address Byte Sr Receive First Address Byte ACK Transmitting Data Byte 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 1 1 1 1 0 A9 A8 D7 D6 D5 D4 D3 D2 D1 D0 SDA SCL SSPIF BF UA CKP R/W D/A 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 ACK = 1 P Master sends Stop condition Master sends not ACK Master sends Restart event ACK R/W = 0 S Cleared by software After SSPADD is updated, UA is cleared and SCL is released High address is loaded Received address is Data to transmit is Set by software Indicates an address When R/W = 1; R/W is copied from the Set by hardware UA indicates SSPADD SSPBUF loaded with received address must be updated has been received loaded into SSPBUF releases SCL Masters not ACK is copied matching address byte CKP is cleared on 9th falling edge of SCL read from SSPBUF back into SSPADD ACKSTAT Set by hardware
- 268. PIC16(L)F1934/6/7 DS41364E-page 268 2008-2011 Microchip Technology Inc. 24.5.6 CLOCK STRETCHING Clock stretching occurs when a device on the bus holds the SCL line low, effectively pausing communi- cation. The slave may stretch the clock to allow more time to handle data or prepare a response for the mas- ter device. A master device is not concerned with stretching as anytime it is active on the bus and not transferring data it is stretching. Any stretching done by a slave is invisible to the master software and han- dled by the hardware that generates SCL. The CKP bit of the SSPCON1 register is used to con- trol stretching in software. Any time the CKP bit is cleared, the module will wait for the SCL line to go low and then hold it. Setting CKP will release SCL and allow more communication. 24.5.6.1 Normal Clock Stretching Following an ACK if the R/W bit of SSPSTAT is set, a read request, the slave hardware will clear CKP. This allows the slave time to update SSPBUF with data to transfer to the master. If the SEN bit of SSPCON2 is set, the slave hardware will always stretch the clock after the ACK sequence. Once the slave is ready, CKP is set by software and communication resumes. 24.5.6.2 10-bit Addressing Mode In 10-bit Addressing mode, when the UA bit is set, the clock is always stretched. This is the only time the SCL is stretched without CKP being cleared. SCL is released immediately after a write to SSPADD. 24.5.6.3 Byte NACKing When the AHEN bit of SSPCON3 is set; CKP is cleared by hardware after the 8th falling edge of SCL for a received matching address byte. When the DHEN bit of SSPCON3 is set; CKP is cleared after the 8th falling edge of SCL for received data. Stretching after the 8th falling edge of SCL allows the slave to look at the received address or data and decide if it wants to ACK the received data. 24.5.7 CLOCK SYNCHRONIZATION AND THE CKP BIT Any time the CKP bit is cleared, the module will wait for the SCL line to go low and then hold it. However, clearing the CKP bit will not assert the SCL output low until the SCL output is already sampled low. There- fore, the CKP bit will not assert the SCL line until an external I2 C master device has already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2 C bus have released SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (see Figure 24-22). FIGURE 24-23: CLOCK SYNCHRONIZATION TIMING Note 1: The BF bit has no effect on whether the clock will be stretched or not. This is differ- ent than previous versions of the module that would not stretch the clock, clear CKP, if SSPBUF was read before the 9th falling edge of SCL. 2: Previous versions of the module did not stretch the clock for a transmission if SSPBUF was loaded before the 9th falling edge of SCL. It is now always cleared for read requests. Note: Previous versions of the module did not stretch the clock if the second address byte did not match. SDA SCL DX ‚ – 1 DX WR Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SSPCON1 CKP Master device releases clock Master device asserts clock
- 269. 2008-2011 Microchip Technology Inc. DS41364E-page 269 PIC16(L)F1934/6/7 24.5.8 GENERAL CALL ADDRESS SUPPORT The addressing procedure for the I2 C bus is such that the first byte after the Start condition usually deter- mines which device will be the slave addressed by the master device. The exception is the general call address which can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledge. The general call address is a reserved address in the I2 C protocol, defined as address 0x00. When the GCEN bit of the SSPCON2 register is set, the slave module will automatically ACK the reception of this address regardless of the value stored in SSPADD. After the slave clocks in an address of all zeros with the R/W bit clear, an interrupt is generated and slave software can read SSPBUF and respond. Figure 24-23 shows a general call reception sequence. In 10-bit Address mode, the UA bit will not be set on the reception of the general call address. The slave will prepare to receive the second byte as data, just as it would in 7-bit mode. If the AHEN bit of the SSPCON3 register is set, just as with any other address reception, the slave hardware will stretch the clock after the 8th falling edge of SCL. The slave must then set its ACKDT value and release the clock with communication progressing as it would normally. FIGURE 24-24: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE 24.5.9 SSP MASK REGISTER An SSP Mask (SSPMSK) register (Register 24-5) is available in I2C Slave mode as a mask for the value held in the SSPSR register during an address comparison operation. A zero (‘0’) bit in the SSPMSK register has the effect of making the corresponding bit of the received address a “don’t care”. This register is reset to all ‘1’s upon any Reset condition and, therefore, has no effect on standard SSP operation until written with a mask value. The SSP Mask register is active during: • 7-bit Address mode: address compare of A<7:1>. • 10-bit Address mode: address compare of A<7:0> only. The SSP mask has no effect during the reception of the first (high) byte of the address. SDA SCL S SSPIF BF (SSPSTAT<0>) Cleared by software SSPBUF is read R/W = 0 ACK General Call Address Address is compared to General Call Address Receiving Data ACK 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 D7 D6 D5 D4 D3 D2 D1 D0 after ACK, set interrupt GCEN (SSPCON2<7>) ’1’
- 270. PIC16(L)F1934/6/7 DS41364E-page 270 2008-2011 Microchip Technology Inc. 24.6 I2 C Master Mode Master mode is enabled by setting and clearing the appropriate SSPM bits in the SSPCON1 register and by setting the SSPEN bit. In Master mode, the SDA and SCK pins must be configured as inputs. The MSSP peripheral hardware will override the output driver TRIS controls when necessary to drive the pins low. Master mode of operation is supported by interrupt generation on the detection of the Start and Stop con- ditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I2 C bus may be taken when the P bit is set, or the bus is Idle. In Firmware Controlled Master mode, user code conducts all I2 C bus operations based on Start and Stop bit condition detection. Start and Stop condition detection is the only active circuitry in this mode. All other communication is done by the user software directly manipulating the SDA and SCL lines. The following events will cause the SSP Interrupt Flag bit, SSPIF, to be set (SSP interrupt, if enabled): • Start condition detected • Stop condition detected • Data transfer byte transmitted/received • Acknowledge transmitted/received • Repeated Start generated 24.6.1 I2C MASTER MODE OPERATION The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2 C bus will not be released. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic ‘0’. Serial data is transmitted 8 bits at a time. After each byte is transmit- ted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted con- tains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address followed by a ‘1’ to indicate the receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an Acknowledge bit is transmit- ted. Start and Stop conditions indicate the beginning and end of transmission. A Baud Rate Generator is used to set the clock fre- quency output on SCL. See Section 24.7 “Baud Rate Generator” for more detail. Note 1: The MSSP module, when configured in I2 C Master mode, does not allow queue- ing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start con- dition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur 2: When in Master mode, Start/Stop detec- tion is masked and an interrupt is gener- ated when the SEN/PEN bit is cleared and the generation is complete.
- 271. 2008-2011 Microchip Technology Inc. DS41364E-page 271 PIC16(L)F1934/6/7 24.6.2 CLOCK ARBITRATION Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, releases the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Gen- erator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sam- pled high, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure 24-25). FIGURE 24-25: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION 24.6.3 WCOL STATUS FLAG If the user writes the SSPBUF when a Start, Restart, Stop, Receive or Transmit sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write does not occur). Any time the WCOL bit is set it indicates that an action on SSPBUF was attempted while the module was not Idle. SDA SCL SCL deasserted but slave holds DX ‚ – 1 DX BRG SCL is sampled high, reload takes place and BRG starts its count 03h 02h 01h 00h (hold off) 03h 02h Reload BRG Value SCL low (clock arbitration) SCL allowed to transition high BRG decrements on Q2 and Q4 cycles Note: Because queueing of events is not allowed, writing to the lower 5 bits of SSPCON2 is disabled until the Start condition is complete.
- 272. PIC16(L)F1934/6/7 DS41364E-page 272 2008-2011 Microchip Technology Inc. 24.6.4 I2C MASTER MODE START CONDITION TIMING To initiate a Start condition, the user sets the Start Enable bit, SEN bit of the SSPCON2 register. If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action of the SDA being driven low while SCL is high is the Start condition and causes the S bit of the SSPSTAT1 register to be set. Following this, the Baud Rate Gen- erator is reloaded with the contents of SSPADD<7:0> and resumes its count. When the Baud Rate Genera- tor times out (TBRG), the SEN bit of the SSPCON2 reg- ister will be automatically cleared by hardware; the Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. FIGURE 24-26: FIRST START BIT TIMING Note 1: If at the beginning of the Start condition, the SDA and SCL pins are already sam- pled low, or if during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs, the Bus Collision Interrupt Flag, BCLIF, is set, the Start condition is aborted and the I2 C module is reset into its Idle state. 2: The Philips I2 C specification states that a bus collision cannot occur on a Start. SDA SCL S TBRG 1st bit 2nd bit TBRG SDA = 1, At completion of Start bit, SCL = 1 Write to SSPBUF occurs here TBRG hardware clears SEN bit TBRG Write to SEN bit occurs here Set S bit (SSPSTAT<3>) and sets SSPIF bit
- 273. 2008-2011 Microchip Technology Inc. DS41364E-page 273 PIC16(L)F1934/6/7 24.6.5 I2C MASTER MODE REPEATED START CONDITION TIMING A Repeated Start condition occurs when the RSEN bit of the SSPCON2 register is programmed high and the Master state machine is no longer active. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. SCL is asserted low. Following this, the RSEN bit of the SSPCON2 register will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit of the SSPSTAT register will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out. FIGURE 24-27: REPEAT START CONDITION WAVEFORM Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. 2: A bus collision during the Repeated Start condition occurs if: • SDA is sampled low when SCL goes from low-to-high. • SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data ‘1’. SDA SCL Repeated Start Write to SSPCON2 Write to SSPBUF occurs here At completion of Start bit, hardware clears RSEN bit 1st bit S bit set by hardware TBRG TBRG SDA = 1, SDA = 1, SCL (no change) SCL = 1 occurs here TBRG TBRG TBRG and sets SSPIF Sr
- 274. PIC16(L)F1934/6/7 DS41364E-page 274 2008-2011 Microchip Technology Inc. 24.6.6 I2C MASTER MODE TRANSMISSION Transmission of a data byte, a 7-bit address or the other half of a 10-bit address is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full (BF) flag bit, and allow the Baud Rate Generator to begin counting and start the next trans- mission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted. SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high. When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the eighth bit is shifted out (the falling edge of the eighth clock), the BF flag is cleared and the master releases SDA. This allows the slave device being addressed to respond with an ACK bit during the ninth bit time if an address match occurred, or if data was received prop- erly. The status of ACK is written into the ACKSTAT bit on the rising edge of the ninth clock. If the master receives an Acknowledge, the Acknowledge Status bit, ACKSTAT, is cleared. If not, the bit is set. After the ninth clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 24-27). After the write to the SSPBUF, each bit of the address will be shifted out on the falling edge of SCL until all seven address bits and the R/W bit are completed. On the falling edge of the eighth clock, the master will release the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the ninth clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT Status bit of the SSPCON2 register. Following the falling edge of the ninth clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, hold- ing SCL low and allowing SDA to float. 24.6.6.1 BF Status Flag In Transmit mode, the BF bit of the SSPSTAT register is set when the CPU writes to SSPBUF and is cleared when all 8 bits are shifted out. 24.6.6.2 WCOL Status Flag If the user writes the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buf- fer are unchanged (the write does not occur). WCOL must be cleared by software before the next transmission. 24.6.6.3 ACKSTAT Status Flag In Transmit mode, the ACKSTAT bit of the SSPCON2 register is cleared when the slave has sent an Acknowl- edge (ACK = 0) and is set when the slave does not Acknowledge (ACK = 1). A slave sends an Acknowl- edge when it has recognized its address (including a general call), or when the slave has properly received its data. 24.6.6.4 Typical transmit sequence: 1. The user generates a Start condition by setting the SEN bit of the SSPCON2 register. 2. SSPIF is set by hardware on completion of the Start. 3. SSPIF is cleared by software. 4. The MSSP module will wait the required start time before any other operation takes place. 5. The user loads the SSPBUF with the slave address to transmit. 6. Address is shifted out the SDA pin until all 8 bits are transmitted. Transmission begins as soon as SSPBUF is written to. 7. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. 8. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 9. The user loads the SSPBUF with eight bits of data. 10. Data is shifted out the SDA pin until all 8 bits are transmitted. 11. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. 12. Steps 8-11 are repeated for all transmitted data bytes. 13. The user generates a Stop or Restart condition by setting the PEN or RSEN bits of the SSPCON2 register. Interrupt is generated once the Stop/Restart condition is complete.
- 275. 2008-2011 Microchip Technology Inc. DS41364E-page 275 PIC16(L)F1934/6/7 FIGURE 24-28: I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) P 9 8 7 6 5 D0 D1 D2 D3 D4 D5 D6 D7 S A7 A6 A5 A4 A3 A2 A1 SDA SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 Bus master terminates transfer ACK Receiving Data from Slave Receiving Data from Slave D0 D1 D2 D3 D4 D5 D6 D7 ACK R/W Transmit Address to Slave SSPIF BF ACK is not sent Write to SSPCON2<0> (SEN = 1), Write to SSPBUF occurs here, ACK from Slave Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) PEN bit = 1 written here Data shifted in on falling edge of CLK Cleared by software start XMIT SEN = 0 SSPOV SDA = 0, SCL = 1 while CPU (SSPSTAT<0>) ACK Cleared by software Cleared by software Set SSPIF interrupt at end of receive Set P bit (SSPSTAT<4>) and SSPIF Cleared in software ACK from Master Set SSPIF at end Set SSPIF interrupt at end of Acknowledge sequence Set SSPIF interrupt at end of Acknow- ledge sequence of receive Set ACKEN, start Acknowledge sequence SSPOV is set because SSPBUF is still full SDA = ACKDT = 1 RCEN cleared automatically RCEN = 1, start next receive Write to SSPCON2<4> to start Acknowledge sequence SDA = ACKDT (SSPCON2<5>) = 0 RCEN cleared automatically responds to SSPIF ACKEN begin Start condition Cleared by software SDA = ACKDT = 0 Last bit is shifted into SSPSR and contents are unloaded into SSPBUF RCEN Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) RCEN cleared automatically ACK from Master SDA = ACKDT = 0 RCEN cleared automatically
- 276. PIC16(L)F1934/6/7 DS41364E-page 276 2008-2011 Microchip Technology Inc. 24.6.7 I2C MASTER MODE RECEPTION Master mode reception is enabled by programming the Receive Enable bit, RCEN bit of the SSPCON2 register. The Baud Rate Generator begins counting and on each rollover, the state of the SCL pin changes (high-to-low/low-to-high) and data is shifted into the SSPSR. After the falling edge of the eighth clock, the receive enable flag is automatically cleared, the con- tents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in Idle state awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable, ACKEN bit of the SSPCON2 register. 24.6.7.1 BF Status Flag In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read. 24.6.7.2 SSPOV Status Flag In receive operation, the SSPOV bit is set when 8 bits are received into the SSPSR and the BF flag bit is already set from a previous reception. 24.6.7.3 WCOL Status Flag If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). 24.6.7.4 Typical Receive Sequence: 1. The user generates a Start condition by setting the SEN bit of the SSPCON2 register. 2. SSPIF is set by hardware on completion of the Start. 3. SSPIF is cleared by software. 4. User writes SSPBUF with the slave address to transmit and the R/W bit set. 5. Address is shifted out the SDA pin until all 8 bits are transmitted. Transmission begins as soon as SSPBUF is written to. 6. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. 7. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 8. User sets the RCEN bit of the SSPCON2 register and the Master clocks in a byte from the slave. 9. After the 8th falling edge of SCL, SSPIF and BF are set. 10. Master clears SSPIF and reads the received byte from SSPBUF, clears BF. 11. Master sets ACK value sent to slave in ACKDT bit of the SSPCON2 register and initiates the ACK by setting the ACKEN bit. 12. Masters ACK is clocked out to the Slave and SSPIF is set. 13. User clears SSPIF. 14. Steps 8-13 are repeated for each received byte from the slave. 15. Master sends a not ACK or Stop to end communication. Note: The MSSP module must be in an Idle state before the RCEN bit is set or the RCEN bit will be disregarded.
- 277. 2008-2011 Microchip Technology Inc. DS41364E-page 277 PIC16(L)F1934/6/7 FIGURE 24-29: I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) P 9 8 7 6 5 D0 D1 D2 D3 D4 D5 D6 D7 S A7 A6 A5 A4 A3 A2 A1 SDA SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 Bus master terminates transfer ACK Receiving Data from Slave Receiving Data from Slave D0 D1 D2 D3 D4 D5 D6 D7 ACK R/W Transmit Address to Slave SSPIF BF ACK is not sent Write to SSPCON2<0> (SEN = 1), Write to SSPBUF occurs here, ACK from Slave Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) PEN bit = 1 written here Data shifted in on falling edge of CLK Cleared by software start XMIT SEN = 0 SSPOV SDA = 0, SCL = 1 while CPU (SSPSTAT<0>) ACK Cleared by software Cleared by software Set SSPIF interrupt at end of receive Set P bit (SSPSTAT<4>) and SSPIF Cleared in software ACK from Master Set SSPIF at end Set SSPIF interrupt at end of Acknowledge sequence Set SSPIF interrupt at end of Acknow- ledge sequence of receive Set ACKEN, start Acknowledge sequence SSPOV is set because SSPBUF is still full SDA = ACKDT = 1 RCEN cleared automatically RCEN = 1, start next receive Write to SSPCON2<4> to start Acknowledge sequence SDA = ACKDT (SSPCON2<5>) = 0 RCEN cleared automatically responds to SSPIF ACKEN begin Start condition Cleared by software SDA = ACKDT = 0 Last bit is shifted into SSPSR and contents are unloaded into SSPBUF RCEN Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) RCEN cleared automatically ACK from Master SDA = ACKDT = 0 RCEN cleared automatically
- 278. PIC16(L)F1934/6/7 DS41364E-page 278 2008-2011 Microchip Technology Inc. 24.6.8 ACKNOWLEDGE SEQUENCE TIMING An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable bit, ACKEN bit of the SSPCON2 register. When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to gen- erate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off and the MSSP module then goes into Idle mode (Figure 24-29). 24.6.8.1 WCOL Status Flag If the user writes the SSPBUF when an Acknowledge sequence is in progress, then WCOL is set and the contents of the buffer are unchanged (the write does not occur). 24.6.9 STOP CONDITION TIMING A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN bit of the SSPCON2 register. At the end of a receive/transmit, the SCL line is held low after the falling edge of the ninth clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to ‘0’. When the Baud Rate Generator times out, the SCL pin will be brought high and one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit of the SSPSTAT register is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 24-30). 24.6.9.1 WCOL Status Flag If the user writes the SSPBUF when a Stop sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). FIGURE 24-30: ACKNOWLEDGE SEQUENCE WAVEFORM FIGURE 24-31: STOP CONDITION RECEIVE OR TRANSMIT MODE Note: TBRG = one Baud Rate Generator period. SDA SCL SSPIF set at Acknowledge sequence starts here, write to SSPCON2 ACKEN automatically cleared Cleared in TBRG TBRG the end of receive 8 ACKEN = 1, ACKDT = 0 D0 9 SSPIF software SSPIF set at the end of Acknowledge sequence Cleared in software ACK SCL SDA SDA asserted low before rising edge of clock Write to SSPCON2, set PEN Falling edge of SCL = 1 for TBRG, followed by SDA = 1 for TBRG 9th clock SCL brought high after TBRG Note: TBRG = one Baud Rate Generator period. TBRG TBRG after SDA sampled high. P bit (SSPSTAT<4>) is set. TBRG to setup Stop condition ACK P TBRG PEN bit (SSPCON2<2>) is cleared by hardware and the SSPIF bit is set
- 279. 2008-2011 Microchip Technology Inc. DS41364E-page 279 PIC16(L)F1934/6/7 24.6.10 SLEEP OPERATION While in Sleep mode, the I2 C slave module can receive addresses or data and when an address match or complete byte transfer occurs, wake the processor from Sleep (if the MSSP interrupt is enabled). 24.6.11 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 24.6.12 MULTI-MASTER MODE In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I2 C bus may be taken when the P bit of the SSPSTAT register is set, or the bus is Idle, with both the S and P bits clear. When the bus is busy, enabling the SSP interrupt will gener- ate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed by hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: • Address Transfer • Data Transfer • A Start Condition • A Repeated Start Condition • An Acknowledge Condition 24.6.13 MULTI -MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master mode support is achieved by bus arbitra- tion. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA, by letting SDA float high and another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin is ‘0’, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLIF, and reset the I2 C port to its Idle state (Figure 24-31). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine and if the I2 C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condi- tion was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deas- serted and the respective control bits in the SSPCON2 register are cleared. When the user services the bus col- lision Interrupt Service Routine and if the I2 C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the deter- mination of when the bus is free. Control of the I2 C bus can be taken when the P bit is set in the SSPSTAT register, or the bus is Idle and the S and P bits are cleared. FIGURE 24-32: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE SDA SCL BCLIF SDA released SDA line pulled low by another source Sample SDA. While SCL is high, data does not match what is driven Bus collision has occurred. Set bus collision interrupt (BCLIF) by the master. by master Data changes while SCL = 0
- 280. PIC16(L)F1934/6/7 DS41364E-page 280 2008-2011 Microchip Technology Inc. 24.6.13.1 Bus Collision During a Start Condition During a Start condition, a bus collision occurs if: a) SDA or SCL are sampled low at the beginning of the Start condition (Figure 24-32). b) SCL is sampled low before SDA is asserted low (Figure 24-33). During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is already low, or the SCL pin is already low, then all of the following occur: • the Start condition is aborted, • the BCLIF flag is set and • the MSSP module is reset to its Idle state (Figure 24-32). The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded and counts down. If the SCL pin is sampled low while SDA is high, a bus colli- sion occurs because it is assumed that another master is attempting to drive a data ‘1’ during the Start condition. If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 24-34). If, however, a ‘1’ is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to zero; if the SCL pin is sampled as ‘0’ during this time, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. FIGURE 24-33: BUS COLLISION DURING START CONDITION (SDA ONLY) Note: The reason that bus collision is not a fac- tor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address fol- lowing the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions. SDA SCL SEN SDA sampled low before SDA goes low before the SEN bit is set. S bit and SSPIF set because SSP module reset into Idle state. SEN cleared automatically because of bus collision. S bit and SSPIF set because Set SEN, enable Start condition if SDA = 1, SCL = 1 SDA = 0, SCL = 1. BCLIF S SSPIF SDA = 0, SCL = 1. SSPIF and BCLIF are cleared by software SSPIF and BCLIF are cleared by software Set BCLIF, Start condition. Set BCLIF.
- 281. 2008-2011 Microchip Technology Inc. DS41364E-page 281 PIC16(L)F1934/6/7 FIGURE 24-34: BUS COLLISION DURING START CONDITION (SCL = 0) FIGURE 24-35: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDA SCL SEN bus collision occurs. Set BCLIF. SCL = 0 before SDA = 0, Set SEN, enable Start sequence if SDA = 1, SCL = 1 TBRG TBRG SDA = 0, SCL = 1 BCLIF S SSPIF Interrupt cleared by software bus collision occurs. Set BCLIF. SCL = 0 before BRG time-out, ’0’ ’0’ ’0’ ’0’ SDA SCL SEN Set S Less than TBRG TBRG SDA = 0, SCL = 1 BCLIF S SSPIF S Interrupts cleared by software set SSPIF SDA = 0, SCL = 1, SCL pulled low after BRG time-out Set SSPIF ’0’ SDA pulled low by other master. Reset BRG and assert SDA. Set SEN, enable Start sequence if SDA = 1, SCL = 1
- 282. PIC16(L)F1934/6/7 DS41364E-page 282 2008-2011 Microchip Technology Inc. 24.6.13.2 Bus Collision During a Repeated Start Condition During a Repeated Start condition, a bus collision occurs if: a) A low level is sampled on SDA when SCL goes from low level to high level. b) SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data ‘1’. When the user releases SDA and the pin is allowed to float high, the BRG is loaded with SSPADD and counts down to zero. The SCL pin is then deasserted and when sampled high, the SDA pin is sampled. If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data ‘0’, Figure 24-35). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high-to-low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. If SCL goes from high-to-low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data ‘1’ during the Repeated Start condition, see Figure 24-36. If, at the end of the BRG time-out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete. FIGURE 24-36: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) FIGURE 24-37: BUS COLLISION DURING REPEATED START CONDITION (CASE 2) SDA SCL RSEN BCLIF S SSPIF Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. Cleared by software ’0’ ’0’ SDA SCL BCLIF RSEN S SSPIF Interrupt cleared by software SCL goes low before SDA, set BCLIF. Release SDA and SCL. TBRG TBRG ’0’
- 283. 2008-2011 Microchip Technology Inc. DS41364E-page 283 PIC16(L)F1934/6/7 24.6.13.3 Bus Collision During a Stop Condition Bus collision occurs during a Stop condition if: a) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. b) After the SCL pin is deasserted, SCL is sampled low before SDA goes high. The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD and counts down to 0. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data ‘0’ (Figure 24-37). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure 24-38). FIGURE 24-38: BUS COLLISION DURING A STOP CONDITION (CASE 1) FIGURE 24-39: BUS COLLISION DURING A STOP CONDITION (CASE 2) SDA SCL BCLIF PEN P SSPIF TBRG TBRG TBRG SDA asserted low SDA sampled low after TBRG, set BCLIF ’0’ ’0’ SDA SCL BCLIF PEN P SSPIF TBRG TBRG TBRG Assert SDA SCL goes low before SDA goes high, set BCLIF ’0’ ’0’
- 284. PIC16(L)F1934/6/7 DS41364E-page 284 2008-2011 Microchip Technology Inc. TABLE 24-3: SUMMARY OF REGISTERS ASSOCIATED WITH I2C™ OPERATION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page: INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIE2 OSFIE C2IE C1IE EEIE BCLIE — — CCP2IE(1) 100 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 PIR2 OSFIF C2IF C1IF EEIF BCLIF — — CCP2IF(1) 103 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 SSPADD ADD<7:0> 290 SSPBUF MSSP Receive Buffer/Transmit Register 243* SSPCON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 287 SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 288 SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 289 SSPMSK MSK<7:0> 290 SSPSTAT SMP CKE D/A P S R/W UA BF 286 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP module in I2 C™ mode. * Page provides register information. Note 1: PIC16F1934 only.
- 285. 2008-2011 Microchip Technology Inc. DS41364E-page 285 PIC16(L)F1934/6/7 24.7 Baud Rate Generator The MSSP module has a Baud Rate Generator avail- able for clock generation in both I2 C and SPI Master modes. The Baud Rate Generator (BRG) reload value is placed in the SSPADD register (Register 24-6). When a write occurs to SSPBUF, the Baud Rate Gen- erator will automatically begin counting down. Once the given operation is complete, the internal clock will automatically stop counting and the clock pin will remain in its last state. An internal signal “Reload” in Figure 24-39 triggers the value from SSPADD to be loaded into the BRG counter. This occurs twice for each oscillation of the module clock line. The logic dictating when the reload signal is asserted depends on the mode the MSSP is being operated in. Table 24-4 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. EQUATION 24-1: FIGURE 24-40: BAUD RATE GENERATOR BLOCK DIAGRAM TABLE 24-4: MSSP CLOCK RATE W/BRG FCLOCK FOSC SSPxADD 1 + 4 ------------------------------------------------- = Note: Values of 0x00, 0x01 and 0x02 are not valid for SSPADD when used as a Baud Rate Generator for I2C. This is an implementation limitation. FOSC FCY BRG Value FCLOCK (2 Rollovers of BRG) 32 MHz 8 MHz 13h 400 kHz(1) 32 MHz 8 MHz 19h 308 kHz 32 MHz 8 MHz 4Fh 100 kHz 16 MHz 4 MHz 09h 400 kHz(1) 16 MHz 4 MHz 0Ch 308 kHz 16 MHz 4 MHz 27h 100 kHz 4 MHz 1 MHz 09h 100 kHz Note 1: The I2 C interface does not conform to the 400 kHz I2 C specification (which applies to rates greater than 100 kHz) in all details, but may be used with care where higher rates are required by the application. SSPM<3:0> BRG Down Counter SSPCLK FOSC/2 SSPADD<7:0> SSPM<3:0> SCL Reload Control Reload
- 286. PIC16(L)F1934/6/7 DS41364E-page 286 2008-2011 Microchip Technology Inc. REGISTER 24-1: SSPSTAT: SSP STATUS REGISTER R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SMP: SPI Data Input Sample bit SPI Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Slave mode: SMP must be cleared when SPI is used in Slave mode In I2 C Master or Slave mode: 1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for high speed mode (400 kHz) bit 6 CKE: SPI Clock Edge Select bit (SPI mode only) In SPI Master or Slave mode: 1 = Transmit occurs on transition from active to Idle clock state 0 = Transmit occurs on transition from Idle to active clock state In I2 C™ mode only: 1 = Enable input logic so that thresholds are compliant with SMBus specification 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit (I2C mode only) 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit (I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset) 0 = Stop bit was not detected last bit 3 S: Start bit (I2 C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset) 0 = Start bit was not detected last bit 2 R/W: Read/Write bit information (I2 C mode only) This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit, or not ACK bit. In I2 C Slave mode: 1 = Read 0 = Write In I2 C Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode. bit 1 UA: Update Address bit (10-bit I2C mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit Receive (SPI and I2C modes): 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty Transmit (I2 C mode only): 1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full 0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty
- 287. 2008-2011 Microchip Technology Inc. DS41364E-page 287 PIC16(L)F1934/6/7 REGISTER 24-2: SSPCON1: SSP CONTROL REGISTER 1 R/C/HS-0/0 R/C/HS-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 WCOL SSPOV SSPEN CKP SSPM<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS = Bit is set by hardware C = User cleared bit 7 WCOL: Write Collision Detect bit Master mode: 1 = A write to the SSPBUF register was attempted while the I2 C conditions were not valid for a transmission to be started 0 = No collision Slave mode: 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit(1) In SPI mode: 1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. In Slave mode, the user must read the SSPBUF, even if only transmitting data, to avoid setting overflow. In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register (must be cleared in software). 0 = No overflow In I2 C mode: 1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a “don’t care” in Transmit mode (must be cleared in software). 0 = No overflow bit 5 SSPEN: Synchronous Serial Port Enable bit In both modes, when enabled, these pins must be properly configured as input or output In SPI mode: 1 = Enables serial port and configures SCK, SDO, SDI and SS as the source of the serial port pins(2) 0 = Disables serial port and configures these pins as I/O port pins In I2C mode: 1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port pins(3) 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: Clock Polarity Select bit In SPI mode: 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level In I2 C Slave mode: SCL release control 1 = Enable clock 0 = Holds clock low (clock stretch). (Used to ensure data setup time.) In I2 C Master mode: Unused in this mode bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits 0000 = SPI Master mode, clock = FOSC/4 0001 = SPI Master mode, clock = FOSC/16 0010 = SPI Master mode, clock = FOSC/64 0011 = SPI Master mode, clock = TMR2 output/2 0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled 0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin 0110 = I2 C Slave mode, 7-bit address 0111 = I2C Slave mode, 10-bit address 1000 = I2 C Master mode, clock = FOSC / (4 * (SSPADD+1))(4) 1001 = Reserved 1010 = SPI Master mode, clock = FOSC/(4 * (SSPADD+1))(5) 1011 = I2 C firmware controlled Master mode (Slave Idle) 1100 = Reserved 1101 = Reserved 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1111 = I2 C Slave mode, 10-bit address with Start and Stop bit interrupts enabled Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. 2: When enabled, these pins must be properly configured as input or output. 3: When enabled, the SDA and SCL pins must be configured as inputs. 4: SSPADD values of 0, 1 or 2 are not supported for I2 C Mode. 5: SSPADD value of ‘0’ is not supported. Use SSPM = 0000 instead.
- 288. PIC16(L)F1934/6/7 DS41364E-page 288 2008-2011 Microchip Technology Inc. REGISTER 24-3: SSPCON2: SSP CONTROL REGISTER 2 R/W-0/0 R-0/0 R/W-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/W/HS-0/0 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Cleared by hardware S = User set bit 7 GCEN: General Call Enable bit (in I2 C Slave mode only) 1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPSR 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit (in I2C mode only) 1 = Acknowledge was not received 0 = Acknowledge was received bit 5 ACKDT: Acknowledge Data bit (in I2 C mode only) In Receive mode: Value transmitted when the user initiates an Acknowledge sequence at the end of a receive 1 = Not Acknowledge 0 = Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2 C Master mode only) In Master Receive mode: 1 = Initiate Acknowledge sequence on SDA and SCL pins, and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence Idle bit 3 RCEN: Receive Enable bit (in I2 C Master mode only) 1 = Enables Receive mode for I2 C 0 = Receive Idle bit 2 PEN: Stop Condition Enable bit (in I2 C Master mode only) SCKMSSP Release Control: 1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Stop condition Idle bit 1 RSEN: Repeated Start Condition Enabled bit (in I2 C Master mode only) 1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Repeated Start condition Idle bit 0 SEN: Start Condition Enabled bit (in I2 C Master mode only) In Master mode: 1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Start condition Idle In Slave mode: 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is disabled Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2 C module is not in the Idle mode, this bit may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled).
- 289. 2008-2011 Microchip Technology Inc. DS41364E-page 289 PIC16(L)F1934/6/7 REGISTER 24-4: SSPCON3: SSP CONTROL REGISTER 3 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ACKTIM: Acknowledge Time Status bit (I2 C mode only)(3) 1 = Indicates the I2 C bus is in an Acknowledge sequence, set on 8TH falling edge of SCL clock 0 = Not an Acknowledge sequence, cleared on 9TH rising edge of SCL clock bit 6 PCIE: Stop Condition Interrupt Enable bit (I2 C mode only) 1 = Enable interrupt on detection of Stop condition 0 = Stop detection interrupts are disabled(2) bit 5 SCIE: Start Condition Interrupt Enable bit (I2 C mode only) 1 = Enable interrupt on detection of Start or Restart conditions 0 = Start detection interrupts are disabled(2) bit 4 BOEN: Buffer Overwrite Enable bit In SPI Slave mode:(1) 1 = SSPBUF updates every time that a new data byte is shifted in ignoring the BF bit 0 = If new byte is received with BF bit of the SSPSTAT register already set, SSPOV bit of the SSPCON1 register is set, and the buffer is not updated In I2 C Master and SPI Master mode: This bit is ignored. In I2 C Slave mode: 1 = SSPBUF is updated and ACK is generated for a received address/data byte, ignoring the state of the SSPOV bit only if the BF bit = 0. 0 = SSPBUF is only updated when SSPOV is clear bit 3 SDAHT: SDA Hold Time Selection bit (I2 C mode only) 1 = Minimum of 300 ns hold time on SDA after the falling edge of SCL 0 = Minimum of 100 ns hold time on SDA after the falling edge of SCL bit 2 SBCDE: Slave Mode Bus Collision Detect Enable bit (I2 C Slave mode only) If on the rising edge of SCL, SDA is sampled low when the module is outputting a high state, the BCLIF bit of the PIR2 register is set, and bus goes Idle 1 = Enable slave bus collision interrupts 0 = Slave bus collision interrupts are disabled bit 1 AHEN: Address Hold Enable bit (I2 C Slave mode only) 1 = Following the 8th falling edge of SCL for a matching received address byte; CKP bit of the SSPCON1 register will be cleared and the SCL will be held low. 0 = Address holding is disabled bit 0 DHEN: Data Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCL for a received data byte; slave hardware clears the CKP bit of the SSPCON1 register and SCL is held low. 0 = Data holding is disabled Note 1: For daisy-chained SPI operation; allows the user to ignore all but the last received byte. SSPOV is still set when a new byte is received and BF = 1, but hardware continues to write the most recent byte to SSPBUF. 2: This bit has no effect in Slave modes that Start and Stop condition detection is explicitly listed as enabled. 3: The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is set.
- 290. PIC16(L)F1934/6/7 DS41364E-page 290 2008-2011 Microchip Technology Inc. REGISTER 24-5: SSPMSK: SSP MASK REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 MSK<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 MSK<7:1>: Mask bits 1 = The received address bit n is compared to SSPADD<n> to detect I2 C address match 0 = The received address bit n is not used to detect I2 C address match bit 0 MSK<0>: Mask bit for I2 C Slave mode, 10-bit Address I2 C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111): 1 = The received address bit 0 is compared to SSPADD<0> to detect I2 C address match 0 = The received address bit 0 is not used to detect I2 C address match I2 C Slave mode, 7-bit address, the bit is ignored REGISTER 24-6: SSPADD: MSSP ADDRESS AND BAUD RATE REGISTER (I2 C MODE) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ADD<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared Master mode: bit 7-0 ADD<7:0>: Baud Rate Clock Divider bits SCL pin clock period = ((ADD<7:0> + 1) *4)/FOSC 10-Bit Slave mode — Most Significant Address byte: bit 7-3 Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit pat- tern sent by master is fixed by I2 C specification and must be equal to ‘11110’. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD<2:1>: Two Most Significant bits of 10-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. 10-Bit Slave mode — Least Significant Address byte: bit 7-0 ADD<7:0>: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD<7:1>: 7-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”.
- 291. 2008-2011 Microchip Technology Inc. DS41364E-page 291 PIC16(L)F1934/6/7 25.0 ENHANCED UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER TRANSMITTER (EUSART) The Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) module is a serial I/O communications peripheral. It contains all the clock generators, shift registers and data buffers necessary to perform an input or output serial data transfer independent of device program execution. The EUSART, also known as a Serial Communications Interface (SCI), can be configured as a full-duplex asynchronous system or half-duplex synchronous system. Full-Duplex mode is useful for communications with peripheral systems, such as CRT terminals and personal computers. Half-Duplex Synchronous mode is intended for communications with peripheral devices, such as A/D or D/A integrated circuits, serial EEPROMs or other microcontrollers. These devices typically do not have internal clocks for baud rate generation and require the external clock signal provided by a master synchronous device. The EUSART module includes the following capabilities: • Full-duplex asynchronous transmit and receive • Two-character input buffer • One-character output buffer • Programmable 8-bit or 9-bit character length • Address detection in 9-bit mode • Input buffer overrun error detection • Received character framing error detection • Half-duplex synchronous master • Half-duplex synchronous slave • Programmable clock polarity in synchronous modes • Sleep operation The EUSART module implements the following additional features, making it ideally suited for use in Local Interconnect Network (LIN) bus systems: • Automatic detection and calibration of the baud rate • Wake-up on Break reception • 13-bit Break character transmit Block diagrams of the EUSART transmitter and receiver are shown in Figure 25-1 and Figure 25-2. FIGURE 25-1: EUSART TRANSMIT BLOCK DIAGRAM TXIF TXIE Interrupt TXEN TX9D MSb LSb Data Bus TXREG Register Transmit Shift Register (TSR) (8) 0 TX9 TRMT SPEN TX/CK pin Pin Buffer and Control 8 SPBRGL SPBRGH BRG16 FOSC ÷ n n + 1 Multiplier x4 x16 x64 SYNC 1 X 0 0 0 BRGH X 1 1 0 0 BRG16 X 1 0 1 0 Baud Rate Generator • • •
- 292. PIC16(L)F1934/6/7 DS41364E-page 292 2008-2011 Microchip Technology Inc. FIGURE 25-2: EUSART RECEIVE BLOCK DIAGRAM The operation of the EUSART module is controlled through three registers: • Transmit Status and Control (TXSTA) • Receive Status and Control (RCSTA) • Baud Rate Control (BAUDCON) These registers are detailed in Register 25-1, Register 25-2 and Register 25-3, respectively. When the receiver or transmitter section is not enabled then the corresponding RX or TX pin may be used for general purpose input and output. RX/DT pin Pin Buffer and Control SPEN Data Recovery CREN OERR FERR RSR Register MSb LSb RX9D RCREG Register FIFO Interrupt RCIF RCIE Data Bus 8 Stop START (8) 7 1 0 RX9 • • • SPBRGL SPBRGH BRG16 RCIDL FOSC ÷ n n + 1 Multiplier x4 x16 x64 SYNC 1 X 0 0 0 BRGH X 1 1 0 0 BRG16 X 1 0 1 0 Baud Rate Generator
- 293. 2008-2011 Microchip Technology Inc. DS41364E-page 293 PIC16(L)F1934/6/7 25.1 EUSART Asynchronous Mode The EUSART transmits and receives data using the standard non-return-to-zero (NRZ) format. NRZ is implemented with two levels: a VOH mark state which represents a ‘1’ data bit, and a VOL space state which represents a ‘0’ data bit. NRZ refers to the fact that consecutively transmitted data bits of the same value stay at the output level of that bit without returning to a neutral level between each bit transmission. An NRZ transmission port idles in the mark state. Each character transmission consists of one Start bit followed by eight or nine data bits and is always terminated by one or more Stop bits. The Start bit is always a space and the Stop bits are always marks. The most common data format is 8 bits. Each transmitted bit persists for a period of 1/(Baud Rate). An on-chip dedicated 8-bit/16-bit Baud Rate Generator is used to derive standard baud rate frequencies from the system oscillator. See Table 25-5 for examples of baud rate configurations. The EUSART transmits and receives the LSb first. The EUSART’s transmitter and receiver are functionally independent, but share the same data format and baud rate. Parity is not supported by the hardware, but can be implemented in software and stored as the ninth data bit. 25.1.1 EUSART ASYNCHRONOUS TRANSMITTER The EUSART transmitter block diagram is shown in Figure 25-1. The heart of the transmitter is the serial Transmit Shift Register (TSR), which is not directly accessible by software. The TSR obtains its data from the transmit buffer, which is the TXREG register. 25.1.1.1 Enabling the Transmitter The EUSART transmitter is enabled for asynchronous operations by configuring the following three control bits: • TXEN = 1 • SYNC = 0 • SPEN = 1 All other EUSART control bits are assumed to be in their default state. Setting the TXEN bit of the TXSTA register enables the transmitter circuitry of the EUSART. Clearing the SYNC bit of the TXSTA register configures the EUSART for asynchronous operation. Setting the SPEN bit of the RCSTA register enables the EUSART and automatically configures the TX/CK I/O pin as an output. If the TX/CK pin is shared with an analog peripheral, the analog I/O function must be disabled by clearing the corresponding ANSEL bit. 25.1.1.2 Transmitting Data A transmission is initiated by writing a character to the TXREG register. If this is the first character, or the previous character has been completely flushed from the TSR, the data in the TXREG is immediately transferred to the TSR register. If the TSR still contains all or part of a previous character, the new character data is held in the TXREG until the Stop bit of the previous character has been transmitted. The pending character in the TXREG is then transferred to the TSR in one TCY immediately following the Stop bit transmission. The transmission of the Start bit, data bits and Stop bit sequence commences immediately following the transfer of the data to the TSR from the TXREG. 25.1.1.3 Transmit Data Polarity The polarity of the transmit data can be controlled with the SCKP bit of the BAUDCON register. The default state of this bit is ‘0’ which selects high true transmit Idle and data bits. Setting the SCKP bit to ‘1’ will invert the transmit data resulting in low true Idle and data bits. The SCKP bit controls transmit data polarity in Asynchronous mode only. In Synchronous mode, the SCKP bit has a different function. See Section 25.4.1.2 “Clock Polarity”. 25.1.1.4 Transmit Interrupt Flag The TXIF interrupt flag bit of the PIR1 register is set whenever the EUSART transmitter is enabled and no character is being held for transmission in the TXREG. In other words, the TXIF bit is only clear when the TSR is busy with a character and a new character has been queued for transmission in the TXREG. The TXIF flag bit is not cleared immediately upon writing TXREG. TXIF becomes valid in the second instruction cycle following the write execution. Polling TXIF immediately following the TXREG write will return invalid results. The TXIF bit is read-only, it cannot be set or cleared by software. The TXIF interrupt can be enabled by setting the TXIE interrupt enable bit of the PIE1 register. However, the TXIF flag bit will be set whenever the TXREG is empty, regardless of the state of TXIE enable bit. To use interrupts when transmitting data, set the TXIE bit only when there is more data to send. Clear the TXIE interrupt enable bit upon writing the last character of the transmission to the TXREG. Note 1: The TXIF Transmitter Interrupt flag is set when the TXEN enable bit is set.
- 294. PIC16(L)F1934/6/7 DS41364E-page 294 2008-2011 Microchip Technology Inc. 25.1.1.5 TSR Status The TRMT bit of the TXSTA register indicates the status of the TSR register. This is a read-only bit. The TRMT bit is set when the TSR register is empty and is cleared when a character is transferred to the TSR register from the TXREG. The TRMT bit remains clear until all bits have been shifted out of the TSR register. No interrupt logic is tied to this bit, so the user has to poll this bit to determine the TSR status. 25.1.1.6 Transmitting 9-Bit Characters The EUSART supports 9-bit character transmissions. When the TX9 bit of the TXSTA register is set, the EUSART will shift 9 bits out for each character transmit- ted. The TX9D bit of the TXSTA register is the ninth, and Most Significant, data bit. When transmitting 9-bit data, the TX9D data bit must be written before writing the 8 Least Significant bits into the TXREG. All nine bits of data will be transferred to the TSR shift register immediately after the TXREG is written. A special 9-bit Address mode is available for use with multiple receivers. See Section 25.1.2.7 “Address Detection” for more information on the address mode. 25.1.1.7 Asynchronous Transmission Set-up: 1. Initialize the SPBRGH, SPBRGL register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 25.3 “EUSART Baud Rate Generator (BRG)”). 2. Enable the asynchronous serial port by clearing the SYNC bit and setting the SPEN bit. 3. If 9-bit transmission is desired, set the TX9 con- trol bit. A set ninth data bit will indicate that the 8 Least Significant data bits are an address when the receiver is set for address detection. 4. Set SCKP bit if inverted transmit is desired. 5. Enable the transmission by setting the TXEN control bit. This will cause the TXIF interrupt bit to be set. 6. If interrupts are desired, set the TXIE interrupt enable bit of the PIE1 register. An interrupt will occur immediately provided that the GIE and PEIE bits of the INTCON register are also set. 7. If 9-bit transmission is selected, the ninth bit should be loaded into the TX9D data bit. 8. Load 8-bit data into the TXREG register. This will start the transmission. FIGURE 25-3: ASYNCHRONOUS TRANSMISSION FIGURE 25-4: ASYNCHRONOUS TRANSMISSION (BACK-TO-BACK) Note: The TSR register is not mapped in data memory, so it is not available to the user. Word 1 Stop bit Word 1 Transmit Shift Reg. Start bit bit 0 bit 1 bit 7/8 Write to TXREG Word 1 BRG Output (Shift Clock) TX/CK TXIF bit (Transmit Buffer Reg. Empty Flag) TRMT bit (Transmit Shift Reg. Empty Flag) 1 TCY pin Transmit Shift Reg. Write to TXREG BRG Output (Shift Clock) TX/CK TRMT bit (Transmit Shift Reg. Empty Flag) Word 1 Word 2 Word 1 Word 2 Start bit Stop bit Start bit Transmit Shift Reg. Word 1 Word 2 bit 0 bit 1 bit 7/8 bit 0 Note: This timing diagram shows two consecutive transmissions. 1 TCY 1 TCY pin TXIF bit (Transmit Buffer Reg. Empty Flag)
- 295. 2008-2011 Microchip Technology Inc. DS41364E-page 295 PIC16(L)F1934/6/7 TABLE 25-1: SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 302 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 301 SPBRGL BRG<7:0> 303* SPBRGH BRG<15:8> 303* TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 TXREG EUSART Transmit Data Register 293* TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 300 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Asynchronous Transmission. * Page provides register information.
- 296. PIC16(L)F1934/6/7 DS41364E-page 296 2008-2011 Microchip Technology Inc. 25.1.2 EUSART ASYNCHRONOUS RECEIVER The Asynchronous mode is typically used in RS-232 systems. The receiver block diagram is shown in Figure 25-2. The data is received on the RX/DT pin and drives the data recovery block. The data recovery block is actually a high-speed shifter operating at 16 times the baud rate, whereas the serial Receive Shift Register (RSR) operates at the bit rate. When all 8 or 9 bits of the character have been shifted in, they are immediately transferred to a two character First-In-First-Out (FIFO) memory. The FIFO buffering allows reception of two complete characters and the start of a third character before software must start servicing the EUSART receiver. The FIFO and RSR registers are not directly accessible by software. Access to the received data is via the RCREG register. 25.1.2.1 Enabling the Receiver The EUSART receiver is enabled for asynchronous operation by configuring the following three control bits: • CREN = 1 • SYNC = 0 • SPEN = 1 All other EUSART control bits are assumed to be in their default state. Setting the CREN bit of the RCSTA register enables the receiver circuitry of the EUSART. Clearing the SYNC bit of the TXSTA register configures the EUSART for asynchronous operation. Setting the SPEN bit of the RCSTA register enables the EUSART. The programmer must set the corresponding TRIS bit to configure the RX/DT I/O pin as an input. 25.1.2.2 Receiving Data The receiver data recovery circuit initiates character reception on the falling edge of the first bit. The first bit, also known as the Start bit, is always a zero. The data recovery circuit counts one-half bit time to the center of the Start bit and verifies that the bit is still a zero. If it is not a zero then the data recovery circuit aborts character reception, without generating an error, and resumes looking for the falling edge of the Start bit. If the Start bit zero verification succeeds then the data recovery circuit counts a full bit time to the center of the next bit. The bit is then sampled by a majority detect circuit and the resulting ‘0’ or ‘1’ is shifted into the RSR. This repeats until all data bits have been sampled and shifted into the RSR. One final bit time is measured and the level sampled. This is the Stop bit, which is always a ‘1’. If the data recovery circuit samples a ‘0’ in the Stop bit position then a framing error is set for this character, otherwise the framing error is cleared for this character. See Section 25.1.2.4 “Receive Framing Error” for more information on framing errors. Immediately after all data bits and the Stop bit have been received, the character in the RSR is transferred to the EUSART receive FIFO and the RCIF interrupt flag bit of the PIR1 register is set. The top character in the FIFO is transferred out of the FIFO by reading the RCREG register. 25.1.2.3 Receive Interrupts The RCIF interrupt flag bit of the PIR1 register is set whenever the EUSART receiver is enabled and there is an unread character in the receive FIFO. The RCIF interrupt flag bit is read-only, it cannot be set or cleared by software. RCIF interrupts are enabled by setting all of the following bits: • RCIE interrupt enable bit of the PIE1 register • PEIE, Peripheral Interrupt Enable bit of the INTCON register • GIE, Global Interrupt Enable bit of the INTCON register The RCIF interrupt flag bit will be set when there is an unread character in the FIFO, regardless of the state of interrupt enable bits. Note 1: If the RX/DT function is on an analog pin, the corresponding ANSEL bit must be cleared for the receiver to function. Note: If the receive FIFO is overrun, no additional characters will be received until the overrun condition is cleared. See Section 25.1.2.5 “Receive Overrun Error” for more information on overrun errors.
- 297. 2008-2011 Microchip Technology Inc. DS41364E-page 297 PIC16(L)F1934/6/7 25.1.2.4 Receive Framing Error Each character in the receive FIFO buffer has a corresponding framing error Status bit. A framing error indicates that a Stop bit was not seen at the expected time. The framing error status is accessed via the FERR bit of the RCSTA register. The FERR bit represents the status of the top unread character in the receive FIFO. Therefore, the FERR bit must be read before reading the RCREG. The FERR bit is read-only and only applies to the top unread character in the receive FIFO. A framing error (FERR = 1) does not preclude reception of additional characters. It is not necessary to clear the FERR bit. Reading the next character from the FIFO buffer will advance the FIFO to the next character and the next corresponding framing error. The FERR bit can be forced clear by clearing the SPEN bit of the RCSTA register which resets the EUSART. Clearing the CREN bit of the RCSTA register does not affect the FERR bit. A framing error by itself does not generate an interrupt. 25.1.2.5 Receive Overrun Error The receive FIFO buffer can hold two characters. An overrun error will be generated if a third character, in its entirety, is received before the FIFO is accessed. When this happens the OERR bit of the RCSTA register is set. The characters already in the FIFO buffer can be read but no additional characters will be received until the error is cleared. The error must be cleared by either clearing the CREN bit of the RCSTA register or by resetting the EUSART by clearing the SPEN bit of the RCSTA register. 25.1.2.6 Receiving 9-bit Characters The EUSART supports 9-bit character reception. When the RX9 bit of the RCSTA register is set the EUSART will shift 9 bits into the RSR for each character received. The RX9D bit of the RCSTA register is the ninth and Most Significant data bit of the top unread character in the receive FIFO. When reading 9-bit data from the receive FIFO buffer, the RX9D data bit must be read before reading the 8 Least Significant bits from the RCREG. 25.1.2.7 Address Detection A special Address Detection mode is available for use when multiple receivers share the same transmission line, such as in RS-485 systems. Address detection is enabled by setting the ADDEN bit of the RCSTA register. Address detection requires 9-bit character reception. When address detection is enabled, only characters with the ninth data bit set will be transferred to the receive FIFO buffer, thereby setting the RCIF interrupt bit. All other characters will be ignored. Upon receiving an address character, user software determines if the address matches its own. Upon address match, user software must disable address detection by clearing the ADDEN bit before the next Stop bit occurs. When user software detects the end of the message, determined by the message protocol used, software places the receiver back into the Address Detection mode by setting the ADDEN bit. Note: If all receive characters in the receive FIFO have framing errors, repeated reads of the RCREG will not clear the FERR bit.
- 298. PIC16(L)F1934/6/7 DS41364E-page 298 2008-2011 Microchip Technology Inc. 25.1.2.8 Asynchronous Reception Set-up: 1. Initialize the SPBRGH, SPBRGL register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 25.3 “EUSART Baud Rate Generator (BRG)”). 2. Clear the ANSEL bit for the RX pin (if applicable). 3. Enable the serial port by setting the SPEN bit. The SYNC bit must be clear for asynchronous operation. 4. If interrupts are desired, set the RCIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. 5. If 9-bit reception is desired, set the RX9 bit. 6. Enable reception by setting the CREN bit. 7. The RCIF interrupt flag bit will be set when a character is transferred from the RSR to the receive buffer. An interrupt will be generated if the RCIE interrupt enable bit was also set. 8. Read the RCSTA register to get the error flags and, if 9-bit data reception is enabled, the ninth data bit. 9. Get the received 8 Least Significant data bits from the receive buffer by reading the RCREG register. 10. If an overrun occurred, clear the OERR flag by clearing the CREN receiver enable bit. 25.1.2.9 9-bit Address Detection Mode Set-up This mode would typically be used in RS-485 systems. To set up an Asynchronous Reception with Address Detect Enable: 1. Initialize the SPBRGH, SPBRGL register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 25.3 “EUSART Baud Rate Generator (BRG)”). 2. Clear the ANSEL bit for the RX pin (if applicable). 3. Enable the serial port by setting the SPEN bit. The SYNC bit must be clear for asynchronous operation. 4. If interrupts are desired, set the RCIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. 5. Enable 9-bit reception by setting the RX9 bit. 6. Enable address detection by setting the ADDEN bit. 7. Enable reception by setting the CREN bit. 8. The RCIF interrupt flag bit will be set when a character with the ninth bit set is transferred from the RSR to the receive buffer. An interrupt will be generated if the RCIE interrupt enable bit was also set. 9. Read the RCSTA register to get the error flags. The ninth data bit will always be set. 10. Get the received 8 Least Significant data bits from the receive buffer by reading the RCREG register. Software determines if this is the device’s address. 11. If an overrun occurred, clear the OERR flag by clearing the CREN receiver enable bit. 12. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and generate interrupts. FIGURE 25-5: ASYNCHRONOUS RECEPTION Start bit bit 7/8 bit 1 bit 0 bit 7/8 bit 0 Stop bit Start bit Start bit bit 7/8 Stop bit RX/DT pin Reg Rcv Buffer Reg. Rcv Shift Read Rcv Buffer Reg. RCREG RCIF (Interrupt Flag) OERR bit CREN Word 1 RCREG Word 2 RCREG Stop bit Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word, causing the OERR (overrun) bit to be set. RCIDL
- 299. 2008-2011 Microchip Technology Inc. DS41364E-page 299 PIC16(L)F1934/6/7 TABLE 25-2: SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 302 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 RCREG EUSART Receive Data Register 296* RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 301 SPBRGL BRG<7:0> 303* SPBRGH BRG<15:8> 303* TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 300 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for asynchronous reception. * Page provides register information.
- 300. PIC16(L)F1934/6/7 DS41364E-page 300 2008-2011 Microchip Technology Inc. 25.2 Clock Accuracy with Asynchronous Operation The factory calibrates the internal oscillator block out- put (INTOSC). However, the INTOSC frequency may drift as VDD or temperature changes, and this directly affects the asynchronous baud rate. Two methods may be used to adjust the baud rate clock, but both require a reference clock source of some kind. The first (preferred) method uses the OSCTUNE register to adjust the INTOSC output. Adjusting the value in the OSCTUNE register allows for fine resolution changes to the system clock source. See Section 5.2.2 “Internal Clock Sources” for more information. The other method adjusts the value in the Baud Rate Generator. This can be done automatically with the Auto-Baud Detect feature (see Section 25.3.1 “Auto-Baud Detect”). There may not be fine enough resolution when adjusting the Baud Rate Generator to compensate for a gradual change in the peripheral clock frequency. REGISTER 25-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER R/W-/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-1/1 R/W-0/0 CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CSRC: Clock Source Select bit Asynchronous mode: Don’t care Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) bit 6 TX9: 9-bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission bit 5 TXEN: Transmit Enable bit(1) 1 = Transmit enabled 0 = Transmit disabled bit 4 SYNC: EUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode bit 3 SENDB: Send Break Character bit Asynchronous mode: 1 = Send Sync Break on next transmission (cleared by hardware upon completion) 0 = Sync Break transmission completed Synchronous mode: Don’t care bit 2 BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode bit 1 TRMT: Transmit Shift Register Status bit 1 = TSR empty 0 = TSR full bit 0 TX9D: Ninth bit of Transmit Data Can be address/data bit or a parity bit. Note 1: SREN/CREN overrides TXEN in Sync mode.
- 301. 2008-2011 Microchip Technology Inc. DS41364E-page 301 PIC16(L)F1934/6/7 REGISTER 25-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER(1) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-x/x SPEN RX9 SREN CREN ADDEN FERR OERR RX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SPEN: Serial Port Enable bit 1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins) 0 = Serial port disabled (held in Reset) bit 6 RX9: 9-bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception bit 5 SREN: Single Receive Enable bit Asynchronous mode: Don’t care Synchronous mode – Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode – Slave Don’t care bit 4 CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN) 0 = Disables continuous receive bit 3 ADDEN: Address Detect Enable bit Asynchronous mode 9-bit (RX9 = 1): 1 = Enables address detection, enable interrupt and load the receive buffer when RSR<8> is set 0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit Asynchronous mode 8-bit (RX9 = 0): Don’t care bit 2 FERR: Framing Error bit 1 = Framing error (can be updated by reading RCREG register and receive next valid byte) 0 = No framing error bit 1 OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit CREN) 0 = No overrun error bit 0 RX9D: Ninth bit of Received Data This can be address/data bit or a parity bit and must be calculated by user firmware.
- 302. PIC16(L)F1934/6/7 DS41364E-page 302 2008-2011 Microchip Technology Inc. REGISTER 25-3: BAUDCON: BAUD RATE CONTROL REGISTER R-0/0 R-1/1 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ABDOVF: Auto-Baud Detect Overflow bit Asynchronous mode: 1 = Auto-baud timer overflowed 0 = Auto-baud timer did not overflow Synchronous mode: Don’t care bit 6 RCIDL: Receive Idle Flag bit Asynchronous mode: 1 = Receiver is Idle 0 = Start bit has been received and the receiver is receiving Synchronous mode: Don’t care bit 5 Unimplemented: Read as ‘0’ bit 4 SCKP: Synchronous Clock Polarity Select bit Asynchronous mode: 1 = Transmit inverted data to the TX/CK pin 0 = Transmit non-inverted data to the TX/CK pin Synchronous mode: 1 = Data is clocked on rising edge of the clock 0 = Data is clocked on falling edge of the clock bit 3 BRG16: 16-bit Baud Rate Generator bit 1 = 16-bit Baud Rate Generator is used 0 = 8-bit Baud Rate Generator is used bit 2 Unimplemented: Read as ‘0’ bit 1 WUE: Wake-up Enable bit Asynchronous mode: 1 = Receiver is waiting for a falling edge. No character will be received, byte RCIF will be set. WUE will automatically clear after RCIF is set. 0 = Receiver is operating normally Synchronous mode: Don’t care bit 0 ABDEN: Auto-Baud Detect Enable bit Asynchronous mode: 1 = Auto-Baud Detect mode is enabled (clears when auto-baud is complete) 0 = Auto-Baud Detect mode is disabled Synchronous mode: Don’t care
- 303. 2008-2011 Microchip Technology Inc. DS41364E-page 303 PIC16(L)F1934/6/7 25.3 EUSART Baud Rate Generator (BRG) The Baud Rate Generator (BRG) is an 8-bit or 16-bit timer that is dedicated to the support of both the asynchronous and synchronous EUSART operation. By default, the BRG operates in 8-bit mode. Setting the BRG16 bit of the BAUDCON register selects 16-bit mode. The SPBRGH, SPBRGL register pair determines the period of the free running baud rate timer. In Asynchronous mode the multiplier of the baud rate period is determined by both the BRGH bit of the TXSTA register and the BRG16 bit of the BAUDCON register. In Synchronous mode, the BRGH bit is ignored. Table 25-3 contains the formulas for determining the baud rate. Example 25-1 provides a sample calculation for determining the baud rate and baud rate error. Typical baud rates and error values for various asynchronous modes have been computed for your convenience and are shown in Table 25-3. It may be advantageous to use the high baud rate (BRGH = 1), or the 16-bit BRG (BRG16 = 1) to reduce the baud rate error. The 16-bit BRG mode is used to achieve slow baud rates for fast oscillator frequencies. Writing a new value to the SPBRGH, SPBRGL register pair causes the BRG timer to be reset (or cleared). This ensures that the BRG does not wait for a timer overflow before outputting the new baud rate. If the system clock is changed during an active receive operation, a receive error or data loss may result. To avoid this problem, check the status of the RCIDL bit to make sure that the receive operation is Idle before changing the system clock. EXAMPLE 25-1: CALCULATING BAUD RATE ERROR For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG: Solving for SPBRGH:SPBRGL: X FOSC Desired Baud Rate -------------------------------------------- - 64 --------------------------------------------- 1 – = Desired Baud Rate FOSC 64 [SPBRGH:SPBRG] 1 + -------------------------------------------------------------------- - = 16000000 9600 ----------------------- - 64 ----------------------- - 1 – = 25.042 25 = = Calculated Baud Rate 16000000 64 25 1 + -------------------------- - = 9615 = Error Calc. Baud Rate Desired Baud Rate – Desired Baud Rate ------------------------------------------------------------------------------------------- - = 9615 9600 – 9600 ---------------------------------- 0.16% = =
- 304. PIC16(L)F1934/6/7 DS41364E-page 304 2008-2011 Microchip Technology Inc. TABLE 25-3: BAUD RATE FORMULAS TABLE 25-4: SUMMARY OF REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR Configuration Bits BRG/EUSART Mode Baud Rate Formula SYNC BRG16 BRGH 0 0 0 8-bit/Asynchronous FOSC/[64 (n+1)] 0 0 1 8-bit/Asynchronous FOSC/[16 (n+1)] 0 1 0 16-bit/Asynchronous 0 1 1 16-bit/Asynchronous FOSC/[4 (n+1)] 1 0 x 8-bit/Synchronous 1 1 x 16-bit/Synchronous Legend: x = Don’t care, n = value of SPBRGH, SPBRGL register pair Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 302 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 301 SPBRGL BRG<7:0> 303* SPBRGH BRG<15:8> 303* TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 300 Legend: — = unimplemented read as ‘0’. Shaded cells are not used for the Baud Rate Generator. * Page provides register information.
- 305. 2008-2011 Microchip Technology Inc. DS41364E-page 305 PIC16(L)F1934/6/7 TABLE 25-5: BAUD RATES FOR ASYNCHRONOUS MODES BAUD RATE SYNC = 0, BRGH = 0, BRG16 = 0 FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 — — — — — — — — — — — — 1200 — — — 1221 1.73 255 1200 0.00 239 1200 0.00 143 2400 2404 0.16 207 2404 0.16 129 2400 0.00 119 2400 0.00 71 9600 9615 0.16 51 9470 -1.36 32 9600 0.00 29 9600 0.00 17 10417 10417 0.00 47 10417 0.00 29 10286 -1.26 27 10165 -2.42 16 19.2k 19.23k 0.16 25 19.53k 1.73 15 19.20k 0.00 14 19.20k 0.00 8 57.6k 55.55k -3.55 3 — — — 57.60k 0.00 7 57.60k 0.00 2 115.2k — — — — — — — — — — — — BAUD RATE SYNC = 0, BRGH = 0, BRG16 = 0 FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 — — — 300 0.16 207 300 0.00 191 300 0.16 51 1200 1202 0.16 103 1202 0.16 51 1200 0.00 47 1202 0.16 12 2400 2404 0.16 51 2404 0.16 25 2400 0.00 23 — — — 9600 9615 0.16 12 — — — 9600 0.00 5 — — — 10417 10417 0.00 11 10417 0.00 5 — — — — — — 19.2k — — — — — — 19.20k 0.00 2 — — — 57.6k — — — — — — 57.60k 0.00 0 — — — 115.2k — — — — — — — — — — — — BAUD RATE SYNC = 0, BRGH = 1, BRG16 = 0 FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 — — — — — — — — — — — — 1200 — — — — — — — — — — — — 2400 — — — — — — — — — — — — 9600 9615 0.16 207 9615 0.16 129 9600 0.00 119 9600 0.00 71 10417 10417 0.00 191 10417 0.00 119 10378 -0.37 110 10473 0.53 65 19.2k 19.23k 0.16 103 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35 57.6k 57.14k -0.79 34 56.82k -1.36 21 57.60k 0.00 19 57.60k 0.00 11 115.2k 117.64k 2.12 16 113.64k -1.36 10 115.2k 0.00 9 115.2k 0.00 5
- 306. PIC16(L)F1934/6/7 DS41364E-page 306 2008-2011 Microchip Technology Inc. BAUD RATE SYNC = 0, BRGH = 1, BRG16 = 0 FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 — — — — — — — — — 300 0.16 207 1200 — — — 1202 0.16 207 1200 0.00 191 1202 0.16 51 2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25 9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — — 10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5 19.2k 19231 0.16 25 19.23k 0.16 12 19.2k 0.00 11 — — — 57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — — 115.2k — — — — — — 115.2k 0.00 1 — — — BAUD RATE SYNC = 0, BRGH = 0, BRG16 = 1 FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 300.0 0.00 6666 300.0 -0.01 4166 300.0 0.00 3839 300.0 0.00 2303 1200 1200 -0.02 3332 1200 -0.03 1041 1200 0.00 959 1200 0.00 575 2400 2401 -0.04 832 2399 -0.03 520 2400 0.00 479 2400 0.00 287 9600 9615 0.16 207 9615 0.16 129 9600 0.00 119 9600 0.00 71 10417 10417 0.00 191 10417 0.00 119 10378 -0.37 110 10473 0.53 65 19.2k 19.23k 0.16 103 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35 57.6k 57.14k -0.79 34 56.818 -1.36 21 57.60k 0.00 19 57.60k 0.00 11 115.2k 117.6k 2.12 16 113.636 -1.36 10 115.2k 0.00 9 115.2k 0.00 5 BAUD RATE SYNC = 0, BRGH = 0, BRG16 = 1 FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 299.9 -0.02 1666 300.1 0.04 832 300.0 0.00 767 300.5 0.16 207 1200 1199 -0.08 416 1202 0.16 207 1200 0.00 191 1202 0.16 51 2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25 9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — — 10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5 19.2k 19.23k 0.16 25 19.23k 0.16 12 19.20k 0.00 11 — — — 57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — — 115.2k — — — — — — 115.2k 0.00 1 — — — TABLE 25-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
- 307. 2008-2011 Microchip Technology Inc. DS41364E-page 307 PIC16(L)F1934/6/7 BAUD RATE SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 300.0 0.00 26666 300.0 0.00 16665 300.0 0.00 15359 300.0 0.00 9215 1200 1200 0.00 6666 1200 -0.01 4166 1200 0.00 3839 1200 0.00 2303 2400 2400 0.01 3332 2400 0.02 2082 2400 0.00 1919 2400 0.00 1151 9600 9604 0.04 832 9597 -0.03 520 9600 0.00 479 9600 0.00 287 10417 10417 0.00 767 10417 0.00 479 10425 0.08 441 10433 0.16 264 19.2k 19.18k -0.08 416 19.23k 0.16 259 19.20k 0.00 239 19.20k 0.00 143 57.6k 57.55k -0.08 138 57.47k -0.22 86 57.60k 0.00 79 57.60k 0.00 47 115.2k 115.9k 0.64 68 116.3k 0.94 42 115.2k 0.00 39 115.2k 0.00 23 BAUD RATE SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 300.0 0.00 6666 300.0 0.01 3332 300.0 0.00 3071 300.1 0.04 832 1200 1200 -0.02 1666 1200 0.04 832 1200 0.00 767 1202 0.16 207 2400 2401 0.04 832 2398 0.08 416 2400 0.00 383 2404 0.16 103 9600 9615 0.16 207 9615 0.16 103 9600 0.00 95 9615 0.16 25 10417 10417 0 191 10417 0.00 95 10473 0.53 87 10417 0.00 23 19.2k 19.23k 0.16 103 19.23k 0.16 51 19.20k 0.00 47 19.23k 0.16 12 57.6k 57.14k -0.79 34 58.82k 2.12 16 57.60k 0.00 15 — — — 115.2k 117.6k 2.12 16 111.1k -3.55 8 115.2k 0.00 7 — — — TABLE 25-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
- 308. PIC16(L)F1934/6/7 DS41364E-page 308 2008-2011 Microchip Technology Inc. 25.3.1 AUTO-BAUD DETECT The EUSART module supports automatic detection and calibration of the baud rate. In the Auto-Baud Detect (ABD) mode, the clock to the BRG is reversed. Rather than the BRG clocking the incoming RX signal, the RX signal is timing the BRG. The Baud Rate Generator is used to time the period of a received 55h (ASCII “U”) which is the Sync character for the LIN bus. The unique feature of this character is that it has five rising edges including the Stop bit edge. Setting the ABDEN bit of the BAUDCON register starts the auto-baud calibration sequence (Figure 25-6). While the ABD sequence takes place, the EUSART state machine is held in Idle. On the first rising edge of the receive line, after the Start bit, the SPBRG begins counting up using the BRG counter clock as shown in Table 25-6. The fifth rising edge will occur on the RX pin at the end of the eighth bit period. At that time, an accumulated value totaling the proper BRG period is left in the SPBRGH, SPBRGL register pair, the ABDEN bit is automatically cleared and the RCIF interrupt flag is set. The value in the RCREG needs to be read to clear the RCIF interrupt. RCREG content should be discarded. When calibrating for modes that do not use the SPBRGH register the user can verify that the SPBRGL register did not overflow by checking for 00h in the SPBRGH register. The BRG auto-baud clock is determined by the BRG16 and BRGH bits as shown in Table 25-6. During ABD, both the SPBRGH and SPBRGL registers are used as a 16-bit counter, independent of the BRG16 bit setting. While calibrating the baud rate period, the SPBRGH and SPBRGL registers are clocked at 1/8th the BRG base clock rate. The resulting byte measurement is the average bit time when clocked at full speed. TABLE 25-6: BRG COUNTER CLOCK RATES FIGURE 25-6: AUTOMATIC BAUD RATE CALIBRATION Note 1: If the WUE bit is set with the ABDEN bit, auto-baud detection will occur on the byte following the Break character (see Section 25.3.3 “Auto-Wake-up on Break”). 2: It is up to the user to determine that the incoming character baud rate is within the range of the selected BRG clock source. Some combinations of oscillator frequency and EUSART baud rates are not possible. 3: During the auto-baud process, the auto-baud counter starts counting at 1. Upon completion of the auto-baud sequence, to achieve maximum accuracy, subtract 1 from the SPBRGH:SPBRGL register pair. BRG16 BRGH BRG Base Clock BRG ABD Clock 0 0 FOSC/64 FOSC/512 0 1 FOSC/16 FOSC/128 1 0 FOSC/16 FOSC/128 1 1 FOSC/4 FOSC/32 Note: During the ABD sequence, SPBRGL and SPBRGH registers are both used as a 16-bit counter, independent of BRG16 setting. BRG Value RX pin ABDEN bit RCIF bit bit 0 bit 1 (Interrupt) Read RCREG BRG Clock Start Auto Cleared Set by User XXXXh 0000h Edge #1 bit 2 bit 3 Edge #2 bit 4 bit 5 Edge #3 bit 6 bit 7 Edge #4 Stop bit Edge #5 001Ch Note 1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode. SPBRGL XXh 1Ch SPBRGH XXh 00h RCIDL
- 309. 2008-2011 Microchip Technology Inc. DS41364E-page 309 PIC16(L)F1934/6/7 25.3.2 AUTO-BAUD OVERFLOW During the course of automatic baud detection, the ABDOVF bit of the BAUDCON register will be set if the baud rate counter overflows before the fifth rising edge is detected on the RX pin. The ABDOVF bit indicates that the counter has exceeded the maximum count that can fit in the 16 bits of the SPBRGH:SPBRGL register pair. After the ABDOVF has been set, the counter con- tinues to count until the fifth rising edge is detected on the RX pin. Upon detecting the fifth RX edge, the hard- ware will set the RCIF interrupt flag and clear the ABDEN bit of the BAUDCON register. The RCIF flag can be subsequently cleared by reading the RCREG register. The ABDOVF flag of the BAUDCON register can be cleared by software directly. To terminate the auto-baud process before the RCIF flag is set, clear the ABDEN bit then clear the ABDOVF bit of the BAUDCON register. The ABDOVF bit will remain set if the ABDEN bit is not cleared first. 25.3.3 AUTO-WAKE-UP ON BREAK During Sleep mode, all clocks to the EUSART are suspended. Because of this, the Baud Rate Generator is inactive and a proper character reception cannot be performed. The Auto-Wake-up feature allows the controller to wake-up due to activity on the RX/DT line. This feature is available only in Asynchronous mode. The Auto-Wake-up feature is enabled by setting the WUE bit of the BAUDCON register. Once set, the normal receive sequence on RX/DT is disabled, and the EUSART remains in an Idle state, monitoring for a wake-up event independent of the CPU mode. A wake-up event consists of a high-to-low transition on the RX/DT line. (This coincides with the start of a Sync Break or a wake-up signal character for the LIN protocol.) The EUSART module generates an RCIF interrupt coincident with the wake-up event. The interrupt is generated synchronously to the Q clocks in normal CPU operating modes (Figure 25-7), and asynchronously if the device is in Sleep mode (Figure 25-8). The interrupt condition is cleared by reading the RCREG register. The WUE bit is automatically cleared by the low-to-high transition on the RX line at the end of the Break. This signals to the user that the Break event is over. At this point, the EUSART module is in Idle mode waiting to receive the next character. 25.3.3.1 Special Considerations Break Character To avoid character errors or character fragments during a wake-up event, the wake-up character must be all zeros. When the wake-up is enabled the function works independent of the low time on the data stream. If the WUE bit is set and a valid non-zero character is received, the low time from the Start bit to the first rising edge will be interpreted as the wake-up event. The remaining bits in the character will be received as a fragmented character and subsequent characters can result in framing or overrun errors. Therefore, the initial character in the transmission must be all ‘0’s. This must be 10 or more bit times, 13-bit times recommended for LIN bus, or any number of bit times for standard RS-232 devices. Oscillator Start-up Time Oscillator start-up time must be considered, especially in applications using oscillators with longer start-up intervals (i.e., LP, XT or HS/PLL mode). The Sync Break (or wake-up signal) character must be of sufficient length, and be followed by a sufficient interval, to allow enough time for the selected oscillator to start and provide proper initialization of the EUSART. WUE Bit The wake-up event causes a receive interrupt by setting the RCIF bit. The WUE bit is cleared in hardware by a rising edge on RX/DT. The interrupt condition is then cleared in software by reading the RCREG register and discarding its contents. To ensure that no actual data is lost, check the RCIDL bit to verify that a receive operation is not in process before setting the WUE bit. If a receive operation is not occurring, the WUE bit may then be set just prior to entering the Sleep mode.
- 310. PIC16(L)F1934/6/7 DS41364E-page 310 2008-2011 Microchip Technology Inc. FIGURE 25-7: AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION FIGURE 25-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP Q1 Q2 Q3 Q4 Q1 Q2 Q3Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3Q4 OSC1 WUE bit RX/DT Line RCIF Bit set by user Auto Cleared Cleared due to User Read of RCREG Note 1: The EUSART remains in Idle while the WUE bit is set. Q1Q2Q3 Q4 Q1Q2 Q3Q4 Q1Q2Q3Q4 Q1 Q2 Q3Q4 Q1Q2Q3 Q4 Q1Q2Q3Q4 Q1Q2Q3 Q4 Q1Q2 Q3Q4 OSC1 WUE bit RX/DT Line RCIF Bit Set by User Auto Cleared Cleared due to User Read of RCREG Sleep Command Executed Note 1 Note 1: If the wake-up event requires long oscillator warm-up time, the automatic clearing of the WUE bit can occur while the stposc signal is still active. This sequence should not depend on the presence of Q clocks. 2: The EUSART remains in Idle while the WUE bit is set. Sleep Ends
- 311. 2008-2011 Microchip Technology Inc. DS41364E-page 311 PIC16(L)F1934/6/7 25.3.4 BREAK CHARACTER SEQUENCE The EUSART module has the capability of sending the special Break character sequences that are required by the LIN bus standard. A Break character consists of a Start bit, followed by 12 ‘0’ bits and a Stop bit. To send a Break character, set the SENDB and TXEN bits of the TXSTA register. The Break character trans- mission is then initiated by a write to the TXREG. The value of data written to TXREG will be ignored and all ‘0’s will be transmitted. The SENDB bit is automatically reset by hardware after the corresponding Stop bit is sent. This allows the user to preload the transmit FIFO with the next transmit byte following the Break character (typically, the Sync character in the LIN specification). The TRMT bit of the TXSTA register indicates when the transmit operation is active or Idle, just as it does during normal transmission. See Figure 25-9 for the timing of the Break character sequence. 25.3.4.1 Break and Sync Transmit Sequence The following sequence will start a message frame header made up of a Break, followed by an auto-baud Sync byte. This sequence is typical of a LIN bus master. 1. Configure the EUSART for the desired mode. 2. Set the TXEN and SENDB bits to enable the Break sequence. 3. Load the TXREG with a dummy character to initiate transmission (the value is ignored). 4. Write ‘55h’ to TXREG to load the Sync character into the transmit FIFO buffer. 5. After the Break has been sent, the SENDB bit is reset by hardware and the Sync character is then transmitted. When the TXREG becomes empty, as indicated by the TXIF, the next data byte can be written to TXREG. 25.3.5 RECEIVING A BREAK CHARACTER The Enhanced EUSART module can receive a Break character in two ways. The first method to detect a Break character uses the FERR bit of the RCSTA register and the Received data as indicated by RCREG. The Baud Rate Generator is assumed to have been initialized to the expected baud rate. A Break character has been received when; • RCIF bit is set • FERR bit is set • RCREG = 00h The second method uses the Auto-Wake-up feature described in Section 25.3.3 “Auto-Wake-up on Break”. By enabling this feature, the EUSART will sample the next two transitions on RX/DT, cause an RCIF interrupt, and receive the next data byte followed by another interrupt. Note that following a Break character, the user will typically want to enable the Auto-Baud Detect feature. For both methods, the user can set the ABDEN bit of the BAUDCON register before placing the EUSART in Sleep mode. FIGURE 25-9: SEND BREAK CHARACTER SEQUENCE Write to TXREG Dummy Write BRG Output (Shift Clock) Start bit bit 0 bit 1 bit 11 Stop bit Break TXIF bit (Transmit Interrupt Flag) TX (pin) TRMT bit (Transmit Shift Empty Flag) SENDB (send Break control bit) SENDB Sampled Here Auto Cleared
- 312. PIC16(L)F1934/6/7 DS41364E-page 312 2008-2011 Microchip Technology Inc. 25.4 EUSART Synchronous Mode Synchronous serial communications are typically used in systems with a single master and one or more slaves. The master device contains the necessary cir- cuitry for baud rate generation and supplies the clock for all devices in the system. Slave devices can take advantage of the master clock by eliminating the inter- nal clock generation circuitry. There are two signal lines in Synchronous mode: a bidi- rectional data line and a clock line. Slaves use the external clock supplied by the master to shift the serial data into and out of their respective receive and trans- mit shift registers. Since the data line is bidirectional, synchronous operation is half-duplex only. Half-duplex refers to the fact that master and slave devices can receive and transmit data but not both simultaneously. The EUSART can operate as either a master or slave device. Start and Stop bits are not used in synchronous trans- missions. 25.4.1 SYNCHRONOUS MASTER MODE The following bits are used to configure the EUSART for Synchronous Master operation: • SYNC = 1 • CSRC = 1 • SREN = 0 (for transmit); SREN = 1 (for receive) • CREN = 0 (for transmit); CREN = 1 (for receive) • SPEN = 1 Setting the SYNC bit of the TXSTA register configures the device for synchronous operation. Setting the CSRC bit of the TXSTA register configures the device as a master. Clearing the SREN and CREN bits of the RCSTA register ensures that the device is in the Transmit mode, otherwise the device will be configured to receive. Setting the SPEN bit of the RCSTA register enables the EUSART. 25.4.1.1 Master Clock Synchronous data transfers use a separate clock line, which is synchronous with the data. A device config- ured as a master transmits the clock on the TX/CK line. The TX/CK pin output driver is automatically enabled when the EUSART is configured for synchronous transmit or receive operation. Serial data bits change on the leading edge to ensure they are valid at the trail- ing edge of each clock. One clock cycle is generated for each data bit. Only as many clock cycles are gener- ated as there are data bits. 25.4.1.2 Clock Polarity A clock polarity option is provided for Microwire compatibility. Clock polarity is selected with the SCKP bit of the BAUDCON register. Setting the SCKP bit sets the clock Idle state as high. When the SCKP bit is set, the data changes on the falling edge of each clock. Clearing the SCKP bit sets the Idle state as low. When the SCKP bit is cleared, the data changes on the rising edge of each clock. 25.4.1.3 Synchronous Master Transmission Data is transferred out of the device on the RX/DT pin. The RX/DT and TX/CK pin output drivers are automat- ically enabled when the EUSART is configured for syn- chronous master transmit operation. A transmission is initiated by writing a character to the TXREG register. If the TSR still contains all or part of a previous character the new character data is held in the TXREG until the last bit of the previous character has been transmitted. If this is the first character, or the pre- vious character has been completely flushed from the TSR, the data in the TXREG is immediately transferred to the TSR. The transmission of the character com- mences immediately following the transfer of the data to the TSR from the TXREG. Each data bit changes on the leading edge of the mas- ter clock and remains valid until the subsequent leading clock edge. 25.4.1.4 Synchronous Master Transmission Set-up: 1. Initialize the SPBRGH, SPBRGL register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 25.3 “EUSART Baud Rate Generator (BRG)”). 2. Enable the synchronous master serial port by setting bits SYNC, SPEN and CSRC. 3. Disable Receive mode by clearing bits SREN and CREN. 4. Enable Transmit mode by setting the TXEN bit. 5. If 9-bit transmission is desired, set the TX9 bit. 6. If interrupts are desired, set the TXIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. 7. If 9-bit transmission is selected, the ninth bit should be loaded in the TX9D bit. 8. Start transmission by loading data to the TXREG register. Note: The TSR register is not mapped in data memory, so it is not available to the user.
- 313. 2008-2011 Microchip Technology Inc. DS41364E-page 313 PIC16(L)F1934/6/7 FIGURE 25-10: SYNCHRONOUS TRANSMISSION FIGURE 25-11: SYNCHRONOUS TRANSMISSION (THROUGH TXEN) TABLE 25-7: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 302 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 301 SPBRGL BRG<7:0> 303* SPBRGH BRG<15:8> 303* TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 TXREG EUSART Transmit Data Register 293* TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 300 Legend: — = unimplemented read as ‘0’. Shaded cells are not used for synchronous master transmission. * Page provides register information. bit 0 bit 1 bit 7 Word 1 bit 2 bit 0 bit 1 bit 7 RX/DT Write to TXREG Reg TXIF bit (Interrupt Flag) TXEN bit ‘1’ ‘1’ Word 2 TRMT bit Write Word 1 Write Word 2 Note: Sync Master mode, SPBRGL = 0, continuous transmission of two 8-bit words. pin TX/CK pin TX/CK pin (SCKP = 0) (SCKP = 1) RX/DT pin TX/CK pin Write to TXREG reg TXIF bit TRMT bit bit 0 bit 1 bit 2 bit 6 bit 7 TXEN bit
- 314. PIC16(L)F1934/6/7 DS41364E-page 314 2008-2011 Microchip Technology Inc. 25.4.1.5 Synchronous Master Reception Data is received at the RX/DT pin. The RX/DT pin output driver is automatically disabled when the EUSART is configured for synchronous master receive operation. In Synchronous mode, reception is enabled by setting either the Single Receive Enable bit (SREN of the RCSTA register) or the Continuous Receive Enable bit (CREN of the RCSTA register). When SREN is set and CREN is clear, only as many clock cycles are generated as there are data bits in a single character. The SREN bit is automatically cleared at the completion of one character. When CREN is set, clocks are continuously generated until CREN is cleared. If CREN is cleared in the middle of a character the CK clock stops immediately and the partial charac- ter is discarded. If SREN and CREN are both set, then SREN is cleared at the completion of the first character and CREN takes precedence. To initiate reception, set either SREN or CREN. Data is sampled at the RX/DT pin on the trailing edge of the TX/CK clock pin and is shifted into the Receive Shift Register (RSR). When a complete character is received into the RSR, the RCIF bit is set and the char- acter is automatically transferred to the two character receive FIFO. The Least Significant eight bits of the top character in the receive FIFO are available in RCREG. The RCIF bit remains set as long as there are unread characters in the receive FIFO. 25.4.1.6 Slave Clock Synchronous data transfers use a separate clock line, which is synchronous with the data. A device configured as a slave receives the clock on the TX/CK line. The TX/CK pin output driver is automatically disabled when the device is configured for synchronous slave transmit or receive operation. Serial data bits change on the leading edge to ensure they are valid at the trailing edge of each clock. One data bit is transferred for each clock cycle. Only as many clock cycles should be received as there are data bits. 25.4.1.7 Receive Overrun Error The receive FIFO buffer can hold two characters. An overrun error will be generated if a third character, in its entirety, is received before RCREG is read to access the FIFO. When this happens the OERR bit of the RCSTA register is set. Previous data in the FIFO will not be overwritten. The two characters in the FIFO buffer can be read, however, no additional characters will be received until the error is cleared. The OERR bit can only be cleared by clearing the overrun condition. If the overrun error occurred when the SREN bit is set and CREN is clear then the error is cleared by reading RCREG. If the overrun occurred when the CREN bit is set then the error condition is cleared by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART. 25.4.1.8 Receiving 9-bit Characters The EUSART supports 9-bit character reception. When the RX9 bit of the RCSTA register is set the EUSART will shift 9-bits into the RSR for each character received. The RX9D bit of the RCSTA register is the ninth, and Most Significant, data bit of the top unread character in the receive FIFO. When reading 9-bit data from the receive FIFO buffer, the RX9D data bit must be read before reading the 8 Least Significant bits from the RCREG. 25.4.1.9 Synchronous Master Reception Set-up: 1. Initialize the SPBRGH, SPBRGL register pair for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Clear the ANSEL bit for the RX pin (if applicable). 3. Enable the synchronous master serial port by setting bits SYNC, SPEN and CSRC. 4. Ensure bits CREN and SREN are clear. 5. If interrupts are desired, set the RCIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. 6. If 9-bit reception is desired, set bit RX9. 7. Start reception by setting the SREN bit or for continuous reception, set the CREN bit. 8. Interrupt flag bit RCIF will be set when reception of a character is complete. An interrupt will be generated if the enable bit RCIE was set. 9. Read the RCSTA register to get the ninth bit (if enabled) and determine if any error occurred during reception. 10. Read the 8-bit received data by reading the RCREG register. 11. If an overrun error occurs, clear the error by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART.
- 315. 2008-2011 Microchip Technology Inc. DS41364E-page 315 PIC16(L)F1934/6/7 FIGURE 25-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN) TABLE 25-8: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 302 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 RCREG EUSART Receive Data Register 296* RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 301 SPBRGL BRG<7:0> 303* SPBRGH BRG<15:8> 303* TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 300 Legend: — = unimplemented read as ‘0’. Shaded cells are not used for synchronous master reception. * Page provides register information. CREN bit RX/DT Write to bit SREN SREN bit RCIF bit (Interrupt) Read RXREG ‘0’ bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 ‘0’ Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0. TX/CK pin TX/CK pin pin (SCKP = 0) (SCKP = 1)
- 316. PIC16(L)F1934/6/7 DS41364E-page 316 2008-2011 Microchip Technology Inc. 25.4.2 SYNCHRONOUS SLAVE MODE The following bits are used to configure the EUSART for Synchronous slave operation: • SYNC = 1 • CSRC = 0 • SREN = 0 (for transmit); SREN = 1 (for receive) • CREN = 0 (for transmit); CREN = 1 (for receive) • SPEN = 1 Setting the SYNC bit of the TXSTA register configures the device for synchronous operation. Clearing the CSRC bit of the TXSTA register configures the device as a slave. Clearing the SREN and CREN bits of the RCSTA register ensures that the device is in the Transmit mode, otherwise the device will be configured to receive. Setting the SPEN bit of the RCSTA register enables the EUSART. 25.4.2.1 EUSART Synchronous Slave Transmit The operation of the Synchronous Master and Slave modes are identical (see Section 25.4.1.3 “Synchronous Master Transmission”), except in the case of the Sleep mode. If two words are written to the TXREG and then the SLEEP instruction is executed, the following will occur: 1. The first character will immediately transfer to the TSR register and transmit. 2. The second word will remain in TXREG register. 3. The TXIF bit will not be set. 4. After the first character has been shifted out of TSR, the TXREG register will transfer the second character to the TSR and the TXIF bit will now be set. 5. If the PEIE and TXIE bits are set, the interrupt will wake the device from Sleep and execute the next instruction. If the GIE bit is also set, the program will call the Interrupt Service Routine. 25.4.2.2 Synchronous Slave Transmission Set-up: 1. Set the SYNC and SPEN bits and clear the CSRC bit. 2. Clear the ANSEL bit for the CK pin (if applicable). 3. Clear the CREN and SREN bits. 4. If interrupts are desired, set the TXIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. 5. If 9-bit transmission is desired, set the TX9 bit. 6. Enable transmission by setting the TXEN bit. 7. If 9-bit transmission is selected, insert the Most Significant bit into the TX9D bit. 8. Start transmission by writing the Least Significant 8 bits to the TXREG register. TABLE 25-9: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 302 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 301 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 TXREG EUSART Transmit Data Register 293* TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 300 Legend: — = unimplemented read as ‘0’. Shaded cells are not used for synchronous slave transmission. * Page provides register information.
- 317. 2008-2011 Microchip Technology Inc. DS41364E-page 317 PIC16(L)F1934/6/7 25.4.2.3 EUSART Synchronous Slave Reception The operation of the Synchronous Master and Slave modes is identical (Section 25.4.1.5 “Synchronous Master Reception”), with the following exceptions: • Sleep • CREN bit is always set, therefore the receiver is never Idle • SREN bit, which is a “don’t care” in Slave mode A character may be received while in Sleep mode by setting the CREN bit prior to entering Sleep. Once the word is received, the RSR register will transfer the data to the RCREG register. If the RCIE enable bit is set, the interrupt generated will wake the device from Sleep and execute the next instruction. If the GIE bit is also set, the program will branch to the interrupt vector. 25.4.2.4 Synchronous Slave Reception Set-up: 1. Set the SYNC and SPEN bits and clear the CSRC bit. 2. Clear the ANSEL bit for both the CK and DT pins (if applicable). 3. If interrupts are desired, set the RCIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. 4. If 9-bit reception is desired, set the RX9 bit. 5. Set the CREN bit to enable reception. 6. The RCIF bit will be set when reception is complete. An interrupt will be generated if the RCIE bit was set. 7. If 9-bit mode is enabled, retrieve the Most Significant bit from the RX9D bit of the RCSTA register. 8. Retrieve the 8 Least Significant bits from the receive FIFO by reading the RCREG register. 9. If an overrun error occurs, clear the error by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART. TABLE 25-10: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 302 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 99 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 102 RCREG EUSART Receive Data Register 296* RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 301 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 300 Legend: — = unimplemented read as ‘0’. Shaded cells are not used for synchronous slave reception. * Page provides register information.
- 318. PIC16(L)F1934/6/7 DS41364E-page 318 2008-2011 Microchip Technology Inc. 25.5 EUSART Operation During Sleep The EUSART will remain active during Sleep only in the Synchronous Slave mode. All other modes require the system clock and therefore cannot generate the neces- sary signals to run the Transmit or Receive Shift regis- ters during Sleep. Synchronous Slave mode uses an externally generated clock to run the Transmit and Receive Shift registers. 25.5.1 SYNCHRONOUS RECEIVE DURING SLEEP To receive during Sleep, all the following conditions must be met before entering Sleep mode: • RCSTA and TXSTA Control registers must be configured for Synchronous Slave Reception (see Section 25.4.2.4 “Synchronous Slave Reception Set-up:”). • If interrupts are desired, set the RCIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. • The RCIF interrupt flag must be cleared by read- ing RCREG to unload any pending characters in the receive buffer. Upon entering Sleep mode, the device will be ready to accept data and clocks on the RX/DT and TX/CK pins, respectively. When the data word has been completely clocked in by the external device, the RCIF interrupt flag bit of the PIR1 register will be set. Thereby, waking the processor from Sleep. Upon waking from Sleep, the instruction following the SLEEP instruction will be executed. If the Global Inter- rupt Enable (GIE) bit of the INTCON register is also set, then the Interrupt Service Routine at address 004h will be called. 25.5.2 SYNCHRONOUS TRANSMIT DURING SLEEP To transmit during Sleep, all the following conditions must be met before entering Sleep mode: • RCSTA and TXSTA Control registers must be configured for Synchronous Slave Transmission (see Section 25.4.2.2 “Synchronous Slave Transmission Set-up:”). • The TXIF interrupt flag must be cleared by writing the output data to the TXREG, thereby filling the TSR and transmit buffer. • If interrupts are desired, set the TXIE bit of the PIE1 register and the PEIE bit of the INTCON reg- ister. • Interrupt enable bits TXIE of the PIE1 register and PEIE of the INTCON register must set. Upon entering Sleep mode, the device will be ready to accept clocks on TX/CK pin and transmit data on the RX/DT pin. When the data word in the TSR has been completely clocked out by the external device, the pending byte in the TXREG will transfer to the TSR and the TXIF flag will be set. Thereby, waking the processor from Sleep. At this point, the TXREG is available to accept another character for transmission, which will clear the TXIF flag. Upon waking from Sleep, the instruction following the SLEEP instruction will be executed. If the Global Interrupt Enable (GIE) bit is also set then the Interrupt Service Routine at address 0004h will be called.
- 319. 2008-2011 Microchip Technology Inc. DS41364E-page 319 PIC16(L)F1934/6/7 26.0 CAPACITIVE SENSING (CPS) MODULE The Capacitive Sensing (CPS) module allows for an interaction with an end user without a mechanical interface. In a typical application, the CPS module is attached to a pad on a Printed Circuit Board (PCB), which is electrically isolated from the end user. When the end user places their finger over the PCB pad, a capacitive load is added, causing a frequency shift in the CPS module. The CPS module requires software and at least one timer resource to determine the change in frequency. Key features of this module include: • Analog MUX for monitoring multiple inputs • Capacitive sensing oscillator • Multiple power ranges • Multiple timer resources • Software control • Operation during Sleep FIGURE 26-1: CAPACITIVE SENSING BLOCK DIAGRAM TMR0CS CPS0 CPS1 CPS2 CPS3 CPS4 CPS5 CPS6 CPS7 CPS8(1) CPS9(1) CPS10(1) CPSCH<3:0>(2) Capacitive Sensing Oscillator CPSOSC CPSON CPSRNG<1:0> TMR0 0 1 Set TMR0IF Overflow T0XCS 0 1 T0CKI CPSOUT CPS11(1) CPS12(1) CPS13(1) CPS14(1) CPS15(1) CPSCLK Note 1: Reference CPSCON1 register (Register 26-2) for channels implemented on each device. 2: CPSCH3 is not implemented on PIC16(L)F1936. 3: If CPSON = 0, disabling capacitive sensing, no channel is selected. FOSC/4 Timer0 Module CPSON(3) T1CS<1:0> T1OSC/ T1CKI TMR1H:TMR1L EN T1GSEL<1:0> Timer1 Gate Control Logic T1G FOSC FOSC/4 Timer1 Module SYNCC1OUT SYNCC2OUT
- 320. PIC16(L)F1934/6/7 DS41364E-page 320 2008-2011 Microchip Technology Inc. 26.1 Analog MUX The CPS module can monitor up to 16 inputs. The capacitive sensing inputs are defined as CPS<15:0>. To determine if a frequency change has occurred the user must: • Select the appropriate CPS pin by setting the CPSCH<3:0> bits of the CPSCON1 register. • Set the corresponding ANSEL bit. • Set the corresponding TRIS bit. • Run the software algorithm. Selection of the CPSx pin while the module is enabled will cause the capacitive sensing oscillator to be on the CPSx pin. Failure to set the corresponding ANSEL and TRIS bits can cause the capacitive sensing oscillator to stop, leading to false frequency readings. 26.2 Capacitive Sensing Oscillator The capacitive sensing oscillator consists of a constant current source and a constant current sink, to produce a triangle waveform. The CPSOUT bit of the CPSCON0 register shows the status of the capacitive sensing oscillator, whether it is a sinking or sourcing current. The oscillator is designed to drive a capacitive load (single PCB pad) and at the same time, be a clock source to either Timer0 or Timer1. The oscillator has three different current settings as defined by CPSRNG<1:0> of the CPSCON0 register. The different current settings for the oscillator serve two purposes: • Maximize the number of counts in a timer for a fixed time base. • Maximize the count differential in the timer during a change in frequency. 26.3 Voltage References The capacitive sensing oscillator uses voltage refer- ences to provide two voltage thresholds for oscillation. The upper voltage threshold is referred to as Ref+ and the lower voltage threshold is referred to as Ref-. The VSS voltage determines the lower threshold level (Ref-) and the VDD voltage determines the upper threshold level (Ref+). 26.4 Power Ranges The capacitive sensing oscillator can operate in one of three different power modes. There are three distinct power ranges; low, medium and high. Current consumption is dependent upon the range selected. See Table 26-1 for proper power range selection. The remaining mode is a Noise Detection mode that resides within the high range. The Noise Detection mode is unique in that it disables the sinking and sourc- ing of current on the analog pin but leaves the rest of the oscillator circuitry active. This reduces the oscilla- tion frequency on the analog pin to zero and also greatly reduces the current consumed by the oscillator module. When noise is introduced onto the pin, the oscillator is driven at the frequency determined by the noise. This produces a detectable signal at the comparator output, indicating the presence of activity on the pin. Figure 26-2 shows a more detailed drawing of the current sources and comparators associated with the oscillator. TABLE 26-1: POWER RANGE SELECTION CPSRNG<1:0> Mode Nominal Current(1) 00 Off 0.0 A 01 Low 0.1 A 10 Medium 1.2 A 11 High 18 A Note 1: See the applicable Electrical Specifica- tions Chapter for more information.
- 321. 2008-2011 Microchip Technology Inc. DS41364E-page 321 PIC16(L)F1934/6/7 26.5 Timer Resources To measure the change in frequency of the capacitive sensing oscillator, a fixed time base is required. For the period of the fixed time base, the capacitive sensing oscillator is used to clock either Timer0 or Timer1. The frequency of the capacitive sensing oscillator is equal to the number of counts in the timer divided by the period of the fixed time base. 26.6 Fixed Time Base To measure the frequency of the capacitive sensing oscillator, a fixed time base is required. Any timer resource or software loop can be used to establish the fixed time base. It is up to the end user to determine the method in which the fixed time base is generated. 26.6.1 TIMER0 To select Timer0 as the timer resource for the CPS module: • Set the T0XCS bit of the CPSCON0 register. • Clear the TMR0CS bit of the OPTION_REG register. When Timer0 is chosen as the timer resource, the capacitive sensing oscillator will be the clock source for Timer0. Refer to Section 20.0 “Timer0 Module” for additional information. 26.6.2 TIMER1 To select Timer1 as the timer resource for the CPS module, set the TMR1CS<1:0> of the T1CON register to ‘11’. When Timer1 is chosen as the timer resource, the capacitive sensing oscillator will be the clock source for Timer1. Because the Timer1 module has a gate control, developing a time base for the frequency measurement can be simplified by using the Timer0 overflow flag. It is recommend that the Timer0 overflow flag, in con- junction with the Toggle mode of the Timer1 gate, be used to develop the fixed time base required by the software portion of the CPS module. Refer to Section 21.12 “Timer1 Gate Control Register” for additional information. TABLE 26-2: TIMER1 ENABLE FUNCTION 26.7 Software Control The software portion of the CPS module is required to determine the change in frequency of the capacitive sensing oscillator. This is accomplished by the following: • Setting a fixed time base to acquire counts on Timer0 or Timer1. • Establishing the nominal frequency for the capacitive sensing oscillator. • Establishing the reduced frequency for the capacitive sensing oscillator due to an additional capacitive load. • Set the frequency threshold. 26.7.1 NOMINAL FREQUENCY (NO CAPACITIVE LOAD) To determine the nominal frequency of the capacitive sensing oscillator: • Remove any extra capacitive load on the selected CPSx pin. • At the start of the fixed time base, clear the timer resource. • At the end of the fixed time base save the value in the timer resource. The value of the timer resource is the number of oscillations of the capacitive sensing oscillator for the given time base. The frequency of the capacitive sensing oscillator is equal to the number of counts on in the timer divided by the period of the fixed time base. 26.7.2 REDUCED FREQUENCY (ADDITIONAL CAPACITIVE LOAD) The extra capacitive load will cause the frequency of the capacitive sensing oscillator to decrease. To determine the reduced frequency of the capacitive sensing oscillator: • Add a typical capacitive load on the selected CPSx pin. • Use the same fixed time base as the nominal frequency measurement. • At the start of the fixed time base, clear the timer resource. • At the end of the fixed time base save the value in the timer resource. The value of the timer resource is the number of oscil- lations of the capacitive sensing oscillator with an addi- tional capacitive load. The frequency of the capacitive sensing oscillator is equal to the number of counts on in the timer divided by the period of the fixed time base. This frequency should be less than the value obtained during the nominal frequency measurement. Note: The fixed time base can not be generated by the timer resource that the capacitive sensing oscillator is clocking. TMR1ON TMR1GE Timer1 Operation 0 0 Off 0 1 Off 1 0 On 1 1 Count Enabled by input
- 322. PIC16(L)F1934/6/7 DS41364E-page 322 2008-2011 Microchip Technology Inc. 26.7.3 FREQUENCY THRESHOLD The frequency threshold should be placed midway between the value of nominal frequency and the reduced frequency of the capacitive sensing oscillator. Refer to Application Note AN1103, “Software Handling for Capacitive Sensing” (DS01103) for more detailed information on the software required for CPS module. 26.8 Operation during Sleep The capacitive sensing oscillator will continue to run as long as the module is enabled, independent of the part being in Sleep. In order for the software to determine if a frequency change has occurred, the part must be awake. However, the part does not have to be awake when the timer resource is acquiring counts. Note: For more information on general capacitive sensing refer to Application Notes: • AN1101, “Introduction to Capacitive Sensing” (DS01101) • AN1102, “Layout and Physical Design Guidelines for Capacitive Sensing” (DS01102) Note: Timer0 does not operate when in Sleep, and therefore cannot be used for capacitive sense measurements in Sleep.
- 323. 2008-2011 Microchip Technology Inc. DS41364E-page 323 PIC16(L)F1934/6/7 REGISTER 26-1: CPSCON0: CAPACITIVE SENSING CONTROL REGISTER 0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 CPSON — — — CPSRNG<1:0> CPSOUT T0XCS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CPSON: CPS Module Enable bit 1 = CPS module is enabled 0 = CPS module is disabled bit 6-4 Unimplemented: Read as ‘0’ bit 3-2 CPSRNG<1:0>: Capacitive Sensing Current Range 00 = Oscillator is off 01 = Oscillator is in Low Range. Charge/Discharge Current is nominally 0.1 µA 10 = Oscillator is in Medium Range. Charge/Discharge Current is nominally 1.2 µA 11 = Oscillator is in High Range. Charge/Discharge Current is nominally 18 µA bit 1 CPSOUT: Capacitive Sensing Oscillator Status bit 1 = Oscillator is sourcing current (Current flowing out of the pin) 0 = Oscillator is sinking current (Current flowing into the pin) bit 0 T0XCS: Timer0 External Clock Source Select bit If TMR0CS = 1: The T0XCS bit controls which clock external to the core/Timer0 module supplies Timer0: 1 = Timer0 clock source is the capacitive sensing oscillator 0 = Timer0 clock source is the T0CKI pin If TMR0CS = 0: Timer0 clock source is controlled by the core/Timer0 module and is FOSC/4
- 324. PIC16(L)F1934/6/7 DS41364E-page 324 2008-2011 Microchip Technology Inc. REGISTER 26-2: CPSCON1: CAPACITIVE SENSING CONTROL REGISTER 1 U-0 U-0 U-0 U-0 R/W-0/0(1) R/W-0/0 R/W-0/0 R/W-0/0 — — — — CPSCH<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 CPSCH<3:0>: Capacitive Sensing Channel Select bits If CPSON = 0: These bits are ignored. No channel is selected. If CPSON = 1: 0000 = channel 0, (CPS0) 0001 = channel 1, (CPS1) 0010 = channel 2, (CPS2) 0011 = channel 3, (CPS3) 0100 = channel 4, (CPS4) 0101 = channel 5, (CPS5) 0110 = channel 6, (CPS6) 0111 = channel 7, (CPS7) 1000 = channel 8, (CPS8(1) ) 1001 = channel 9, (CPS9(1) ) 1010 = channel 10, (CPS10(1) ) 1011 = channel 11, (CPS11(1) ) 1100 = channel 12, (CPS12(1) ) 1101 = channel 13, (CPS13(1) ) 1110 = channel 14, (CPS14(1) ) 1111 = channel 15, (CPS15(1) ) Note 1: These channels are not implemented on the PIC16(L)F1936. 2: This bit is not implemented on PIC16(L)F1936, read as ‘0’
- 325. 2008-2011 Microchip Technology Inc. DS41364E-page 325 PIC16(L)F1934/6/7 TABLE 26-3: SUMMARY OF REGISTERS ASSOCIATED WITH CAPACITIVE SENSING Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 134 ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 139 ANSELD ANSD7 ANSD6 ANSD5 ANSD4 ANSD3 ANSD2 ANSD1 ANSD0 146 CPSCON0 CPSON — — — CPSRNG<1:0> CPSOUT T0XCS 323 CPSCON1 — — — — CPSCH<3:0> 324 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS2 PS1 PS0 193 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 203 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 133 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 138 TRISD TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 145 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the CPS module.
- 326. PIC16(L)F1934/6/7 DS41364E-page 326 2008-2011 Microchip Technology Inc. NOTES:
- 327. 2008-2011 Microchip Technology Inc. DS41364E-page 327 PIC16(L)F1934/6/7 27.0 LIQUID CRYSTAL DISPLAY (LCD) DRIVER MODULE The Liquid Crystal Display (LCD) Driver module generates the timing control to drive a static or multiplexed LCD panel. In the PIC16(L)F1934/6/7 device, the module drives the panels of up to four commons and up to 24 segments. The LCD module also provides control of the LCD pixel data. The LCD Driver module supports: • Direct driving of LCD panel • Three LCD clock sources with selectable prescaler • Up to four common pins: - Static (1 common) - 1/2 multiplex (2 commons) - 1/3 multiplex (3 commons) - 1/4 multiplex (4 commons) • Segment pins up to: - 16 (PIC16(L)F1936) - 24 (PIC16(L)F1934/7) • Static, 1/2 or 1/3 LCD Bias FIGURE 27-1: LCD DRIVER MODULE BLOCK DIAGRAM Note: COM3 and SEG15 share the same physical pin on the PIC16(L)F1936, therefore SEG15 is not available when using 1/4 multiplex displays. Data Bus SEG<23:0>(1, 3) To I/O Pads(1) LCDDATAx Registers Note 1: These are not directly connected to the I/O pads, but may be tri-stated, depending on the configuration of the LCD module. 2: SEG<23:0> on PIC16F1934/1937, SEG<15:0> on PIC16(L)F1936. 3: COM3 and SEG15 share the same physical pin on the PIC16(L)F1936, therefore SEG15 is not available when using 1/4 multiplex displays. COM<3:0>(3) Clock Source Timing Control Select and Prescaler LFINTOSC FOSC/256 T1OSC To I/O Pads(1) LCDCON LCDPS LCDSEn MUX
- 328. PIC16(L)F1934/6/7 DS41364E-page 328 2008-2011 Microchip Technology Inc. 27.1 LCD Registers The module contains the following registers: • LCD Control register (LCDCON) • LCD Phase register (LCDPS) • LCD Reference Ladder register (LCDRL) • LCD Contrast Control register (LCDCST) • LCD Reference Voltage Control register (LCDREF) • Up to 3 LCD Segment Enable registers (LCDSEn) • Up to 12 LCD data registers (LCDDATAn) TABLE 27-1: LCD SEGMENT AND DATA REGISTERS The LCDCON register (Register 27-1) controls the operation of the LCD driver module. The LCDPS regis- ter (Register 27-2) configures the LCD clock source prescaler and the type of waveform; Type-A or Type-B. The LCDSEn registers (Register 27-5) configure the functions of the port pins. The following LCDSEn registers are available: • LCDSE0 SE<7:0> • LCDSE1 SE<15:8> • LCDSE2 SE<23:16>(1) Once the module is initialized for the LCD panel, the individual bits of the LCDDATAn registers are cleared/set to represent a clear/dark pixel, respectively: • LCDDATA0 SEG<7:0>COM0 • LCDDATA1 SEG<15:8>COM0 • LCDDATA2 SEG<23:16>COM0(1) • LCDDATA3 SEG<7:0>COM1 • LCDDATA4 SEG<15:8>COM1 • LCDDATA5 SEG<23:16>COM1(1) • LCDDATA6 SEG<7:0>COM2 • LCDDATA7 SEG<15:8>COM2 • LCDDATA8 SEG<23:16>COM2(1) • LCDDATA9 SEG<7:0>COM3 • LCDDATA10 SEG<15:8>COM3 • LCDDATA11 SEG<23:16>COM3(1) As an example, LCDDATAn is detailed in Register 27-6. Once the module is configured, the LCDEN bit of the LCDCON register is used to enable or disable the LCD module. The LCD panel can also operate during Sleep by clearing the SLPEN bit of the LCDCON register. Device # of LCD Registers Segment Enable Data PIC16(L)F1936 2 8 PIC16(L)F1934/7 3 12 Note 1: PIC16(L)F1934/7 only. Note 1: PIC16(L)F1934/7 only.
- 329. 2008-2011 Microchip Technology Inc. DS41364E-page 329 PIC16(L)F1934/6/7 REGISTER 27-1: LCDCON: LIQUID CRYSTAL DISPLAY (LCD) CONTROL REGISTER R/W-0/0 R/W-0/0 R/C-0/0 U-0 R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7 LCDEN: LCD Driver Enable bit 1 = LCD Driver module is enabled 0 = LCD Driver module is disabled bit 6 SLPEN: LCD Driver Enable in Sleep Mode bit 1 = LCD Driver module is disabled in Sleep mode 0 = LCD Driver module is enabled in Sleep mode bit 5 WERR: LCD Write Failed Error bit 1 = LCDDATAn register written while the WA bit of the LCDPS register = 0 (must be cleared in software) 0 = No LCD write error bit 4 Unimplemented: Read as ‘0’ bit 3-2 CS<1:0>: Clock Source Select bits 00 = FOSC/256 01 = T1OSC (Timer1) 1x = LFINTOSC (31 kHz) bit 1-0 LMUX<1:0>: Commons Select bits Note 1: On these devices, COM3 and SEG15 are shared on one pin, limiting the device from driving 64 pixels. LMUX<1:0> Multiplex Maximum Number of Pixels Bias PIC16(L)F1936 PIC16(L)F1934/7 00 Static (COM0) 16 24 Static 01 1/2 (COM<1:0>) 32 48 1/2 or 1/3 10 1/3 (COM<2:0>) 48 72 1/2 or 1/3 11 1/4 (COM<3:0>) 60(1) 96 1/3
- 330. PIC16(L)F1934/6/7 DS41364E-page 330 2008-2011 Microchip Technology Inc. REGISTER 27-2: LCDPS: LCD PHASE REGISTER R/W-0/0 R/W-0/0 R-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 WFT BIASMD LCDA WA LP<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7 WFT: Waveform Type bit 1 = Type-B phase changes on each frame boundary 0 = Type-A phase changes within each common type bit 6 BIASMD: Bias Mode Select bit When LMUX<1:0> = 00: 0 = Static Bias mode (do not set this bit to ‘1’) When LMUX<1:0> = 01: 1 = 1/2 Bias mode 0 = 1/3 Bias mode When LMUX<1:0> = 10: 1 = 1/2 Bias mode 0 = 1/3 Bias mode When LMUX<1:0> = 11: 0 = 1/3 Bias mode (do not set this bit to ‘1’) bit 5 LCDA: LCD Active Status bit 1 = LCD Driver module is active 0 = LCD Driver module is inactive bit 4 WA: LCD Write Allow Status bit 1 = Writing to the LCDDATAn registers is allowed 0 = Writing to the LCDDATAn registers is not allowed bit 3-0 LP<3:0>: LCD Prescaler Selection bits 1111 = 1:16 1110 = 1:15 1101 = 1:14 1100 = 1:13 1011 = 1:12 1010 = 1:11 1001 = 1:10 1000 = 1:9 0111 = 1:8 0110 = 1:7 0101 = 1:6 0100 = 1:5 0011 = 1:4 0010 = 1:3 0001 = 1:2 0000 = 1:1
- 331. 2008-2011 Microchip Technology Inc. DS41364E-page 331 PIC16(L)F1934/6/7 REGISTER 27-3: LCDREF: LCD REFERENCE VOLTAGE CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 LCDIRE LCDIRS LCDIRI — VLCD3PE VLCD2PE VLCD1PE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7 LCDIRE: LCD Internal Reference Enable bit 1 = Internal LCD Reference is enabled and connected to the Internal Contrast Control circuit 0 = Internal LCD Reference is disabled bit 6 LCDIRS: LCD Internal Reference Source bit If LCDIRE = 1: 0 = Internal LCD Contrast Control is powered by VDD 1 = Internal LCD Contrast Control is powered by a 3.072V output of the FVR If LCDIRE = 0: Internal LCD Contrast Control is unconnected. LCD bandgap buffer is disabled. bit 5 LCDIRI: LCD Internal Reference Ladder Idle Enable bit Allows the Internal FVR buffer to shut down when the LCD Reference Ladder is in power mode ‘B’ 1 = When the LCD Reference Ladder is in power mode ‘B’, the LCD Internal FVR buffer is disabled 0 = The LCD Internal FVR Buffer ignores the LCD Reference Ladder Power mode bit 4 Unimplemented: Read as ‘0’ bit 3 VLCD3PE: VLCD3 Pin Enable bit 1 = The VLCD3 pin is connected to the internal bias voltage LCDBIAS3(1) 0 = The VLCD3 pin is not connected bit 2 VLCD2PE: VLCD2 Pin Enable bit 1 = The VLCD2 pin is connected to the internal bias voltage LCDBIAS2(1) 0 = The VLCD2 pin is not connected bit 1 VLCD1PE: VLCD1 Pin Enable bit 1 = The VLCD1 pin is connected to the internal bias voltage LCDBIAS1(1) 0 = The VLCD1 pin is not connected bit 0 Unimplemented: Read as ‘0’ Note 1: Normal pin controls of TRISx and ANSELx are unaffected.
- 332. PIC16(L)F1934/6/7 DS41364E-page 332 2008-2011 Microchip Technology Inc. REGISTER 27-4: LCDCST: LCD CONTRAST CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 — — — — — LCDCST<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 LCDCST<2:0>: LCD Contrast Control bits Selects the resistance of the LCD contrast control resistor ladder Bit Value = Resistor ladder 000 = Minimum Resistance (Maximum contrast). Resistor ladder is shorted. 001 = Resistor ladder is at 1/7th of maximum resistance 010 = Resistor ladder is at 2/7th of maximum resistance 011 = Resistor ladder is at 3/7th of maximum resistance 100 = Resistor ladder is at 4/7th of maximum resistance 101 = Resistor ladder is at 5/7th of maximum resistance 110 = Resistor ladder is at 6/7th of maximum resistance 111 = Resistor ladder is at maximum resistance (Minimum contrast).
- 333. 2008-2011 Microchip Technology Inc. DS41364E-page 333 PIC16(L)F1934/6/7 REGISTER 27-5: LCDSEn: LCD SEGMENT ENABLE REGISTERS R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SEn SEn SEn SEn SEn SEn SEn SEn bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SEn: Segment Enable bits 1 = Segment function of the pin is enabled 0 = I/O function of the pin is enabled REGISTER 27-6: LCDDATAn: LCD DATA REGISTERS R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SEGx-COMy: Pixel On bits 1 = Pixel on (dark) 0 = Pixel off (clear)
- 334. PIC16(L)F1934/6/7 DS41364E-page 334 2008-2011 Microchip Technology Inc. 27.2 LCD Clock Source Selection The LCD module has 3 possible clock sources: • FOSC/256 • T1OSC • LFINTOSC The first clock source is the system clock divided by 256 (FOSC/256). This divider ratio is chosen to provide about 1 kHz output when the system clock is 8 MHz. The divider is not programmable. Instead, the LCD prescaler bits LP<3:0> of the LCDPS register are used to set the LCD frame clock rate. The second clock source is the T1OSC. This also gives about 1 kHz when a 32.768 kHz crystal is used with the Timer1 oscillator. To use the Timer1 oscillator as a clock source, the T1OSCEN bit of the T1CON register should be set. The third clock source is the 31 kHz LFINTOSC, which provides approximately 1 kHz output. The second and third clock sources may be used to continue running the LCD while the processor is in Sleep. Using bits CS<1:0> of the LCDCON register can select any of these clock sources. 27.2.1 LCD PRESCALER A 4-bit counter is available as a prescaler for the LCD clock. The prescaler is not directly readable or writable; its value is set by the LP<3:0> bits of the LCDPS register, which determine the prescaler assignment and prescale ratio. The prescale values are selectable from 1:1 through 1:16. FIGURE 27-2: LCD CLOCK GENERATION CS<1:0> T1OSC 32 kHz Crystal Osc. LFINTOSC Nominal = 31 kHz Static 1/2 1/3, 1/4 ÷4 LMUX<1:0> 4-bit Prog ÷1, 2, 3, 4 Ring Counter COM0 COM1 COM2 COM3 ÷256 FOSC ÷2 ÷ 32 LP<3:0> Prescaler To Ladder Power Control Segment Clock Counter
- 335. 2008-2011 Microchip Technology Inc. DS41364E-page 335 PIC16(L)F1934/6/7 27.3 LCD Bias Voltage Generation The LCD module can be configured for one of three bias types: • Static Bias (2 voltage levels: VSS and VLCD) • 1/2 Bias (3 voltage levels: VSS, 1/2 VLCD and VLCD) • 1/3 Bias (4 voltage levels: VSS, 1/3 VLCD, 2/3 VLCD and VLCD) TABLE 27-2: LCD BIAS VOLTAGES So that the user is not forced to place external compo- nents and use up to three pins for bias voltage generation, internal contrast control and an internal reference ladder are provided internally. Both of these features may be used in conjunction with the external VLCD<3:1> pins, to provide maximum flexibility. Refer to Figure 27-3. FIGURE 27-3: LCD BIAS VOLTAGE GENERATION BLOCK DIAGRAM Static Bias 1/2 Bias 1/3 Bias LCD Bias 0 VSS VSS VSS LCD Bias 1 — 1/2 VDD 1/3 VDD LCD Bias 2 — 1/2 VDD 2/3 VDD LCD Bias 3 VLCD3 VLCD3 VLCD3 VDD LCDIRE x 3 3.072V 1.024V from FVR VLCD3 LCDIRS LCDIRE LCDIRS LCDCST<2:0> VLCD3PE VLCD2 VLCD2PE VLCD1 VLCD1PE LCDRLP1 BIASMD lcdbias3 lcdbias2 lcdbias1 lcdbias0 LCDA LCDA LCDA LCDRLP0
- 336. PIC16(L)F1934/6/7 DS41364E-page 336 2008-2011 Microchip Technology Inc. 27.4 LCD Bias Internal Reference Ladder The internal reference ladder can be used to divide the LCD bias voltage two or three equally spaced voltages that will be supplied to the LCD segment pins. To create this, the reference ladder consists of three matched resistors. Refer to Figure 27-3. 27.4.1 BIAS MODE INTERACTION When in 1/2 Bias mode (BIASMD = 1), then the middle resistor of the ladder is shorted out so that only two voltages are generated. The current consumption of the ladder is higher in this mode, with the one resistor removed. TABLE 27-3: LCD INTERNAL LADDER POWER MODES (1/3 BIAS) 27.4.2 POWER MODES The internal reference ladder may be operated in one of three power modes. This allows the user to trade off LCD contrast for power in the specific application. The larger the LCD glass, the more capacitance is present on a physical LCD segment, requiring more current to maintain the same contrast level. Three different power modes are available, LP, MP and HP. The internal reference ladder can also be turned off for applications that wish to provide an external ladder or to minimize power consumption. Disabling the internal reference ladder results in all of the ladders being disconnected, allowing external voltages to be supplied. Whenever the LCD module is inactive (LCDA = 0), the internal reference ladder will be turned off. Power Mode Nominal Resistance of Entire Ladder Nominal IDD Low 3 Mohm 1 µA Medium 300 kohm 10 µA High 30 kohm 100 µA
- 337. 2008-2011 Microchip Technology Inc. DS41364E-page 337 PIC16(L)F1934/6/7 27.4.3 AUTOMATIC POWER MODE SWITCHING As an LCD segment is electrically only a capacitor, cur- rent is drawn only during the interval where the voltage is switching. To minimize total device current, the LCD internal reference ladder can be operated in a different power mode for the transition portion of the duration. This is controlled by the LCDRL register (Register 27-7). The LCDRL register allows switching between two power modes, designated ‘A’ and ‘B’. ‘A’ Power mode is active for a programmable time, beginning at the time when the LCD segments transition. ‘B’ Power mode is the remaining time before the segments or commons change again. The LRLAT<2:0> bits select how long, if any, that the ‘A’ Power mode is active. Refer to Figure 27-4. To implement this, the 5-bit prescaler used to divide the 32 kHz clock down to the LCD controller’s 1 kHz base rate is used to select the power mode. FIGURE 27-4: LCD INTERNAL REFERENCE LADDER POWER MODE SWITCHING DIAGRAM – TYPE A Single Segment Time ‘H00 ‘H01 ‘H02 ‘H03 ‘H04 ‘H05 ‘H06 ‘H07 ‘H0E ‘H0F ‘H00 ‘H01 ‘H3 Power Mode A Power Mode B Mode A LRLAT<2:0> 32 kHz Clock Ladder Power Segment Clock LRLAT<2:0> Segment Data Power Mode COM0 SEG0 COM0-SEG0 Control V0 V1 V0 V1 V0 V1 -V1
- 338. PIC16(L)F1934/6/7 DS41364E-page 338 Preliminary 2008-2011 Microchip Technology Inc. FIGURE 27-5: LCD INTERNAL REFERENCE LADDER POWER MODE SWITCHING DIAGRAM – TYPE A WAVEFORM (1/2 MUX, 1/2 BIAS DRIVE) Single Segment Time ‘H00 ‘H01 ‘H02 ‘H03 ‘H04 ‘H05 ‘H06 ‘H07 ‘H0F Power Mode A Power Mode B LRLAT<2:0> = 011 32 kHz Clock Ladder Power Segment Clock Segment Data Power Mode COM0-SEG0 Control V1 V2 V0 -V2 -V1 Single Segment Time ‘H00 ‘H01 ‘H02 ‘H03 ‘H04 ‘H05 ‘H06 ‘H07 ‘H0F Power Mode A Power Mode B ‘H0E ‘H0E LRLAT<2:0> = 011
- 339. 2008-2011 Microchip Technology Inc. Preliminary DS41364E-page 339 PIC16(L)F1934/6/7 FIGURE 27-6: LCD INTERNAL REFERENCE LADDER POWER MODE SWITCHING DIAGRAM – TYPE B WAVEFORM (1/2 MUX, 1/2 BIAS DRIVE) Single Segment Time ‘H00 ‘H01 ‘H02 ‘H03 ‘H0F Power Mode A Power Mode B 32 kHz Clock Ladder Power Segment Clock Segment Data Power Mode COM0-SEG0 Control V1 V2 V0 -V2 -V1 ‘H0E Single Segment Time ‘H10 ‘H11 ‘H12 ‘H13 ‘H1F Power Mode A Power Mode B ‘H1E Single Segment Time ‘H00 ‘H01 ‘H02 ‘H03 ‘H0F Power Mode A Power Mode B ‘H0E Single Segment Time ‘H10 ‘H11 ‘H12 ‘H13 ‘H1F Power Mode A Power Mode B ‘H1E LRLAT<2:0> = 011 LRLAT<2:0> = 011 LRLAT<2:0> = 011 LRLAT<2:0> = 011
- 340. PIC16(L)F1934/6/7 DS41364E-page 340 2008-2011 Microchip Technology Inc. REGISTER 27-7: LCDRL: LCD REFERENCE LADDER CONTROL REGISTERS R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 LRLAP<1:0> LRLBP<1:0> — LRLAT<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 LRLAP<1:0>: LCD Reference Ladder A Time Power Control bits During Time interval A (Refer to Figure 27-4): 00 = Internal LCD Reference Ladder is powered down and unconnected 01 = Internal LCD Reference Ladder is powered in Low-Power mode 10 = Internal LCD Reference Ladder is powered in Medium-Power mode 11 = Internal LCD Reference Ladder is powered in High-Power mode bit 5-4 LRLBP<1:0>: LCD Reference Ladder B Time Power Control bits During Time interval B (Refer to Figure 27-4): 00 = Internal LCD Reference Ladder is powered down and unconnected 01 = Internal LCD Reference Ladder is powered in Low-Power mode 10 = Internal LCD Reference Ladder is powered in Medium-Power mode 11 = Internal LCD Reference Ladder is powered in High-Power mode bit 3 Unimplemented: Read as ‘0’ bit 2-0 LRLAT<2:0>: LCD Reference Ladder A Time Interval Control bits Sets the number of 32 kHz clocks that the A Time Interval Power mode is active For type A waveforms (WFT = 0): 000 = Internal LCD Reference Ladder is always in ‘B’ Power mode 001 = Internal LCD Reference Ladder is in ‘A’ Power mode for 1 clock and ‘B’ Power mode for 15 clocks 010 = Internal LCD Reference Ladder is in ‘A’ Power mode for 2 clocks and ‘B’ Power mode for 14 clocks 011 = Internal LCD Reference Ladder is in ‘A’ Power mode for 3 clocks and ‘B’ Power mode for 13 clocks 100 = Internal LCD Reference Ladder is in ‘A’ Power mode for 4 clocks and ‘B’ Power mode for 12 clocks 101 = Internal LCD Reference Ladder is in ‘A’ Power mode for 5 clocks and ‘B’ Power mode for 11 clocks 110 = Internal LCD Reference Ladder is in ‘A’ Power mode for 6 clocks and ‘B’ Power mode for 10 clocks 111 = Internal LCD Reference Ladder is in ‘A’ Power mode for 7 clocks and ‘B’ Power mode for 9 clocks For type B waveforms (WFT = 1): 000 = Internal LCD Reference Ladder is always in ‘B’ Power mode. 001 = Internal LCD Reference Ladder is in ‘A’ Power mode for 1 clock and ‘B’ Power mode for 31 clocks 010 = Internal LCD Reference Ladder is in ‘A’ Power mode for 2 clocks and ‘B’ Power mode for 30 clocks 011 = Internal LCD Reference Ladder is in ‘A’ Power mode for 3 clocks and ‘B’ Power mode for 29 clocks 100 = Internal LCD Reference Ladder is in ‘A’ Power mode for 4 clocks and ‘B’ Power mode for 28 clocks 101 = Internal LCD Reference Ladder is in ‘A’ Power mode for 5 clocks and ‘B’ Power mode for 27 clocks 110 = Internal LCD Reference Ladder is in ‘A’ Power mode for 6 clocks and ‘B’ Power mode for 26 clocks 111 = Internal LCD Reference Ladder is in ‘A’ Power mode for 7 clocks and ‘B’ Power mode for 25 clocks
- 341. 2008-2011 Microchip Technology Inc. DS41364E-page 341 PIC16(L)F1934/6/7 27.4.4 CONTRAST CONTROL The LCD contrast control circuit consists of a seven-tap resistor ladder, controlled by the LCDCST bits. Refer to Figure 27-7. The contrast control circuit is used to decrease the output voltage of the signal source by a total of approximately 10%, when LCDCST = 111. Whenever the LCD module is inactive (LCDA = 0), the contrast control ladder will be turned off (open). FIGURE 27-7: INTERNAL REFERENCE AND CONTRAST CONTROL BLOCK DIAGRAM 27.4.5 INTERNAL REFERENCE Under firmware control, an internal reference for the LCD bias voltages can be enabled. When enabled, the source of this voltage can be either VDDIO or a voltage 3 times the main fixed voltage reference (3.072V). When no internal reference is selected, the LCD con- trast control circuit is disabled and LCD bias must be provided externally. Whenever the LCD module is inactive (LCDA = 0), the internal reference will be turned off. When the internal reference is enabled and the Fixed Voltage Reference is selected, the LCDIRI bit can be used to minimize power consumption by tieing into the LCD Reference Ladder Automatic Power mode switch- ing. When LCDIRI = 1 and the LCD reference ladder is in Power mode ‘B’, the LCD internal FVR buffer is disabled. . 27.4.6 VLCD<3:1> PINS The VLCD<3:1> pins provide the ability for an external LCD bias network to be used instead of the internal lad- der. Use of the VLCD<3:1> pins does not prevent use of the internal ladder. Each VLCD pin has an indepen- dent control in the LCDREF register (Register 27-3), allowing access to any or all of the LCD Bias signals. This architecture allows for maximum flexibility in differ- ent applications For example, the VLCD<3:1> pins may be used to add capacitors to the internal reference ladder, increasing the drive capacity. For applications where the internal contrast control is insufficient, the firmware can choose to only enable the VLCD3 pin, allowing an external contrast control circuit to use the internal reference divider. LCDCST<2:0> Analog R R R R 7 Stages MUX To top of Reference Ladder 7 0 3 3.072V VDDIO From FVR Buffer Internal Reference Contrast control Note: The LCD module automatically turns on the Fixed Voltage Reference when needed.
- 342. PIC16(L)F1934/6/7 DS41364E-page 342 2008-2011 Microchip Technology Inc. 27.5 LCD Multiplex Types The LCD driver module can be configured into one of four multiplex types: • Static (only COM0 is used) • 1/2 multiplex (COM<1:0> are used) • 1/3 multiplex (COM<2:0> are used) • 1/4 multiplex (COM<3:0> are used) The LMUX<1:0> bit setting of the LCDCON register decides which of the LCD common pins are used (see Table 27-4 for details). If the pin is a digital I/O, the corresponding TRIS bit controls the data direction. If the pin is a COM drive, then the TRIS setting of that pin is overridden. TABLE 27-4: COMMON PIN USAGE 27.6 Segment Enables The LCDSEn registers are used to select the pin function for each segment pin. The selection allows each pin to operate as either an LCD segment driver or as one of the pin’s alternate functions. To configure the pin as a segment pin, the corresponding bits in the LCDSEn registers must be set to ‘1’. If the pin is a digital I/O, the corresponding TRIS bit controls the data direction. Any bit set in the LCDSEn registers overrides any bit settings in the corresponding TRIS register. 27.7 Pixel Control The LCDDATAx registers contain bits which define the state of each pixel. Each bit defines one unique pixel. Register 27-6 shows the correlation of each bit in the LCDDATAx registers to the respective common and segment signals. Any LCD pixel location not being used for display can be used as general purpose RAM. 27.8 LCD Frame Frequency The rate at which the COM and SEG outputs change is called the LCD frame frequency. TABLE 27-5: FRAME FREQUENCY FORMULAS TABLE 27-6: APPROXIMATE FRAME FREQUENCY (IN Hz) USING FOSC @ 8 MHz, TIMER1 @ 32.768 kHz OR LFINTOSC Multiplex LMUX <1:0> COM3 COM2 COM1 Static 00 Unused Unused Unused 1/2 01 Unused Unused Active 1/3 10 Unused Active Active 1/4 11 Active Active Active Note: On a Power-on Reset, these pins are configured as normal I/O, not LCD pins. Multiplex Frame Frequency = Static Clock source/(4 x 1 x (LPD Prescaler) x 32)) 1/2 Clock source/(2 x 2 x (LPD Prescaler) x 32)) 1/3 Clock source/(1 x 3 x (LPD Prescaler) x 32)) 1/4 Clock source/(1 x 4 x (LPD Prescaler) x 32)) Note: Clock source is FOSC/256, T1OSC or LFINTOSC. LP<3:0> Static 1/2 1/3 1/4 2 122 122 162 122 3 81 81 108 81 4 61 61 81 61 5 49 49 65 49 6 41 41 54 41 7 35 35 47 35
- 343. 2008-2011 Microchip Technology Inc. DS41364E-page 343 PIC16(L)F1934/6/7 TABLE 27-7: LCD SEGMENT MAPPING WORKSHEET LCD Function COM0 COM1 COM2 COM3 LCDDATAx Address LCD Segment LCDDATAx Address LCD Segment LCDDATAx Address LCD Segment LCDDATAx Address LCD Segment SEG0 LCDDATA0, 0 LCDDATA3, 0 LCDDATA6, 0 LCDDATA9, 0 SEG1 LCDDATA0, 1 LCDDATA3, 1 LCDDATA6, 1 LCDDATA9, 1 SEG2 LCDDATA0, 2 LCDDATA3, 2 LCDDATA6, 2 LCDDATA9, 2 SEG3 LCDDATA0, 3 LCDDATA3, 3 LCDDATA6, 3 LCDDATA9, 3 SEG4 LCDDATA0, 4 LCDDATA3, 4 LCDDATA6, 4 LCDDATA9, 4 SEG5 LCDDATA0, 5 LCDDATA3, 5 LCDDATA6, 5 LCDDATA9, 5 SEG6 LCDDATA0, 6 LCDDATA3, 6 LCDDATA6, 6 LCDDATA9, 6 SEG7 LCDDATA0, 7 LCDDATA3, 7 LCDDATA6, 7 LCDDATA9, 7 SEG8 LCDDATA1, 0 LCDDATA4, 0 LCDDATA7, 0 LCDDATA10, 0 SEG9 LCDDATA1, 1 LCDDATA4, 1 LCDDATA7, 1 LCDDATA10, 1 SEG10 LCDDATA1, 2 LCDDATA4, 2 LCDDATA7, 2 LCDDATA10, 2 SEG11 LCDDATA1, 3 LCDDATA4, 3 LCDDATA7, 3 LCDDATA10, 3 SEG12 LCDDATA1, 4 LCDDATA4, 4 LCDDATA7, 4 LCDDATA10, 4 SEG13 LCDDATA1, 5 LCDDATA4, 5 LCDDATA7, 5 LCDDATA10, 5 SEG14 LCDDATA1, 6 LCDDATA4, 6 LCDDATA7, 6 LCDDATA10, 6 SEG15 LCDDATA1, 7 LCDDATA4, 7 LCDDATA7, 7 LCDDATA10, 7 SEG16 LCDDATA2, 0 LCDDATA5, 0 LCDDATA8, 0 LCDDATA11, 0 SEG17 LCDDATA2, 1 LCDDATA5, 1 LCDDATA8, 1 LCDDATA11, 1 SEG18 LCDDATA2, 2 LCDDATA5, 2 LCDDATA8, 2 LCDDATA11, 2 SEG19 LCDDATA2, 3 LCDDATA5, 3 LCDDATA8, 3 LCDDATA11, 3 SEG20 LCDDATA2, 4 LCDDATA5, 4 LCDDATA8, 4 LCDDATA11, 4 SEG21 LCDDATA2, 5 LCDDATA5, 5 LCDDATA8, 5 LCDDATA11, 5 SEG22 LCDDATA2, 6 LCDDATA5, 6 LCDDATA8, 6 LCDDATA11, 6 SEG23 LCDDATA2, 7 LCDDATA5, 7 LCDDATA8, 7 LCDDATA11, 7
- 344. PIC16(L)F1934/6/7 DS41364E-page 344 2008-2011 Microchip Technology Inc. 27.9 LCD Waveform Generation LCD waveforms are generated so that the net AC voltage across the dark pixel should be maximized and the net AC voltage across the clear pixel should be minimized. The net DC voltage across any pixel should be zero. The COM signal represents the time slice for each common, while the SEG contains the pixel data. The pixel signal (COM-SEG) will have no DC component and it can take only one of the two RMS values. The higher RMS value will create a dark pixel and a lower RMS value will create a clear pixel. As the number of commons increases, the delta between the two RMS values decreases. The delta represents the maximum contrast that the display can have. The LCDs can be driven by two types of waveform: Type-A and Type-B. In Type-A waveform, the phase changes within each common type, whereas in Type-B waveform, the phase changes on each frame boundary. Thus, Type-A waveform maintains 0 VDC over a single frame, whereas Type-B waveform takes two frames. Figure 27-8 through Figure 27-18 provide waveforms for static, half-multiplex, 1/3-multiplex and 1/4-multiplex drives for Type-A and Type-B waveforms. FIGURE 27-8: TYPE-A/TYPE-B WAVEFORMS IN STATIC DRIVE Note 1: If Sleep has to be executed with LCD Sleep disabled (LCDCON<SLPEN> is ‘1’), then care must be taken to execute Sleep only when VDC on all the pixels is ‘0’. 2: When the LCD clock source is FOSC/256, if Sleep is executed, irrespective of the LCDCON<SLPEN> setting, the LCD immediately goes into Sleep. Thus, take care to see that VDC on all pixels is ‘0’ when Sleep is executed. V1 V0 COM0 pin SEG0 pin COM0-SEG0 COM0-SEG1 SEG1 pin V1 V0 V1 V0 V0 V1 -V1 V0 1 Frame COM0 SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 segment voltage (active) segment voltage (inactive)
- 345. 2008-2011 Microchip Technology Inc. DS41364E-page 345 PIC16(L)F1934/6/7 FIGURE 27-9: TYPE-A WAVEFORMS IN 1/2 MUX, 1/2 BIAS DRIVE V2 V1 V0 V2 V1 V0 V2 V1 V0 V2 V1 V0 V2 V1 V0 -V2 -V1 V2 V1 V0 -V2 -V1 COM0 pin COM1 pin SEG0 pin SEG1 pin COM0-SEG0 COM0-SEG1 1 Frame COM1 COM0 SEG0 SEG1 SEG2 SEG3 1 Segment Time Note: 1 Frame = 2 single segment times. segment voltage segment voltage (active) (inactive)
- 346. PIC16(L)F1934/6/7 DS41364E-page 346 2008-2011 Microchip Technology Inc. FIGURE 27-10: TYPE-B WAVEFORMS IN 1/2 MUX, 1/2 BIAS DRIVE V2 V1 V0 V2 V1 V0 V2 V1 V0 V2 V1 V0 V2 V1 V0 -V2 -V1 V2 V1 V0 -V2 -V1 COM0 pin COM1 pin SEG0 pin SEG1 pin COM0-SEG0 COM0-SEG1 COM1 COM0 SEG2 SEG3 2 Frames Note: 1 Frame = 2 single segment times. 1 Segment Time segment voltage (active) segment voltage (inactive) SEG0 SEG1
- 347. 2008-2011 Microchip Technology Inc. DS41364E-page 347 PIC16(L)F1934/6/7 FIGURE 27-11: TYPE-A WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 -V3 -V2 -V1 V3 V2 V1 V0 -V3 -V2 -V1 COM0 pin COM1 pin SEG0 pin SEG1 pin COM0-SEG0 COM0-SEG1 1 Frame COM1 COM0 SEG2 SEG3 segment voltage (active) segment voltage (inactive) SEG0 SEG1 1 Segment Time Note: 1 Frame = 2 single segment times.
- 348. PIC16(L)F1934/6/7 DS41364E-page 348 2008-2011 Microchip Technology Inc. FIGURE 27-12: TYPE-B WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 -V3 -V2 -V1 V3 V2 V1 V0 -V3 -V2 -V1 COM0 pin COM1 pin SEG0 pin SEG1 pin COM0-SEG0 COM0-SEG1 COM1 COM0 SEG2 SEG3 segment voltage (active) segment voltage (inactive) SEG0 SEG1 2 Frames Note: 1 Frame = 2 single segment times. 1 Segment Time
- 349. 2008-2011 Microchip Technology Inc. DS41364E-page 349 PIC16(L)F1934/6/7 FIGURE 27-13: TYPE-A WAVEFORMS IN 1/3 MUX, 1/2 BIAS DRIVE V2 V1 V0 V2 V1 V0 V2 V1 V0 V2 V1 V0 V2 V1 V0 V2 V1 V0 -V2 -V1 V2 V1 V0 -V2 -V1 COM0 pin COM1 pin COM2 pin SEG0 and SEG1 pin COM0-SEG0 COM0-SEG1 COM2 COM1 COM0 SEG0 SEG1 SEG2 SEG2 pins segment voltage (inactive) segment voltage (active) 1 Frame 1 Segment Time Note: 1 Frame = 2 single segment times.
- 350. PIC16(L)F1934/6/7 DS41364E-page 350 2008-2011 Microchip Technology Inc. FIGURE 27-14: TYPE-B WAVEFORMS IN 1/3 MUX, 1/2 BIAS DRIVE V2 V1 V0 V2 V1 V0 V2 V1 V0 V2 V1 V0 V2 V1 V0 V2 V1 V0 -V2 -V1 V2 V1 V0 -V2 -V1 COM0 pin COM1 pin COM2 pin SEG0 pin SEG1 pin COM0-SEG0 COM0-SEG1 COM2 COM1 COM0 SEG0 SEG1 SEG2 segment voltage (inactive) segment voltage (active) 2 Frames Note: 1 Frame = 2 single segment times. 1 Segment Time
- 351. 2008-2011 Microchip Technology Inc. DS41364E-page 351 PIC16(L)F1934/6/7 FIGURE 27-15: TYPE-A WAVEFORMS IN 1/3 MUX, 1/3 BIAS DRIVE V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 -V3 -V2 -V1 V3 V2 V1 V0 -V3 -V2 -V1 COM0 pin COM1 pin COM2 pin SEG0 and SEG1 pin COM0-SEG0 COM0-SEG1 COM2 COM1 COM0 SEG0 SEG1 SEG2 SEG2 pins segment voltage (inactive) segment voltage (active) 1 Frame 1 Segment Time Note: 1 Frame = 2 single segment times.
- 352. PIC16(L)F1934/6/7 DS41364E-page 352 2008-2011 Microchip Technology Inc. FIGURE 27-16: TYPE-B WAVEFORMS IN 1/3 MUX, 1/3 BIAS DRIVE V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 -V3 -V2 -V1 V3 V2 V1 V0 -V3 -V2 -V1 COM0 pin COM1 pin COM2 pin SEG0 pin SEG1 pin COM0-SEG0 COM0-SEG1 COM2 COM1 COM0 SEG0 SEG1 SEG2 segment voltage (inactive) segment voltage (active) 2 Frames Note: 1 Frame = 2 single segment times. 1 Segment Time
- 353. 2008-2011 Microchip Technology Inc. DS41364E-page 353 PIC16(L)F1934/6/7 FIGURE 27-17: TYPE-A WAVEFORMS IN 1/4 MUX, 1/3 BIAS DRIVE V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 -V3 -V2 -V1 V3 V2 V1 V0 -V3 -V2 -V1 COM0 pin COM1 pin COM2 pin COM3 pin SEG0 pin SEG1 pin COM0-SEG0 COM0-SEG1 COM3 COM2 COM1 COM0 SEG0 SEG1 segment voltage (active) segment voltage (inactive) 1 Frame 1 Segment Time Note: 1 Frame = 2 single segment times.
- 354. PIC16(L)F1934/6/7 DS41364E-page 354 2008-2011 Microchip Technology Inc. FIGURE 27-18: TYPE-B WAVEFORMS IN 1/4 MUX, 1/3 BIAS DRIVE V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 -V3 -V2 -V1 V3 V2 V1 V0 -V3 -V2 -V1 COM0 pin COM1 pin COM2 pin COM3 pin SEG0 pin SEG1 pin COM0-SEG0 COM0-SEG1 COM2 COM1 COM0 SEG0 SEG1 COM3 segment voltage (active) segment voltage (inactive) 2 Frames Note: 1 Frame = 2 single segment times. 1 Segment Time
- 355. 2008-2011 Microchip Technology Inc. DS41364E-page 355 PIC16(L)F1934/6/7 27.10 LCD Interrupts The LCD module provides an interrupt in two cases. An interrupt when the LCD controller goes from active to inactive controller. An interrupt also provides unframed boundaries for Type B waveform. The LCD timing gen- eration provides an interrupt that defines the LCD frame timing. 27.10.1 LCD INTERRUPT ON MODULE SHUTDOWN An LCD interrupt is generated when the module com- pletes shutting down (LCDA goes from ‘1’ to ‘0’). 27.10.2 LCD FRAME INTERRUPTS A new frame is defined to begin at the leading edge of the COM0 common signal. The interrupt will be set immediately after the LCD controller completes access- ing all pixel data required for a frame. This will occur at a fixed interval before the frame boundary (TFINT), as shown in Figure 27-19. The LCD controller will begin to access data for the next frame within the interval from the interrupt to when the controller begins to access data after the interrupt (TFWR). New data must be writ- ten within TFWR, as this is when the LCD controller will begin to access the data for the next frame. When the LCD driver is running with Type-B waveforms and the LMUX<1:0> bits are not equal to ‘00’ (static drive), there are some additional issues that must be addressed. Since the DC voltage on the pixel takes two frames to maintain zero volts, the pixel data must not change between subsequent frames. If the pixel data were allowed to change, the waveform for the odd frames would not necessarily be the complement of the waveform generated in the even frames and a DC component would be introduced into the panel. Therefore, when using Type-B waveforms, the user must synchronize the LCD pixel updates to occur within a subframe after the frame interrupt. To correctly sequence writing while in Type-B, the interrupt will only occur on complete phase intervals. If the user attempts to write when the write is disabled, the WERR bit of the LCDCON register is set and the write does not occur. Note: The LCD frame interrupt is not generated when the Type-A waveform is selected and when the Type-B with no multiplex (static) is selected.
- 356. PIC16(L)F1934/6/7 DS41364E-page 356 2008-2011 Microchip Technology Inc. FIGURE 27-19: WAVEFORMS AND INTERRUPT TIMING IN QUARTER-DUTY CYCLE DRIVE (EXAMPLE – TYPE-B, NON-STATIC) Frame Boundary Frame Boundary LCD Interrupt Occurs Controller Accesses Next Frame Data TFINT TFWR TFWR = TFRAME/2*(LMUX<1:0> + 1) + TCY/2 TFINT = (TFWR/2 – (2 TCY + 40 ns)) minimum = 1.5(TFRAME/4) – (2 TCY + 40 ns) (TFWR/2 – (1 TCY + 40 ns)) maximum = 1.5(TFRAME/4) – (1 TCY + 40 ns) Frame Boundary V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 COM0 COM1 COM2 COM3 2 Frames
- 357. 2008-2011 Microchip Technology Inc. DS41364E-page 357 PIC16(L)F1934/6/7 27.11 Operation During Sleep The LCD module can operate during Sleep. The selection is controlled by bit SLPEN of the LCDCON register. Setting the SLPEN bit allows the LCD module to go to Sleep. Clearing the SLPEN bit allows the module to continue to operate during Sleep. If a SLEEP instruction is executed and SLPEN = 1, the LCD module will cease all functions and go into a very low-current Consumption mode. The module will stop operation immediately and drive the minimum LCD voltage on both segment and common lines. Figure 27-20 shows this operation. The LCD module can be configured to operate during Sleep. The selection is controlled by bit SLPEN of the LCDCON register. Clearing SLPEN and correctly con- figuring the LCD module clock will allow the LCD mod- ule to operate during Sleep. Setting SLPEN and correctly executing the LCD module shutdown will dis- able the LCD module during Sleep and save power. If a SLEEP instruction is executed and SLPEN = 1, the LCD module will immediately cease all functions, drive the outputs to Vss and go into a very Low-Current mode. The SLEEP instruction should only be executed after the LCD module has been disabled and the cur- rent cycle completed, thus ensuring that there are no DC voltages on the glass. To disable the LCD module, clear the LCDEN bit. The LCD module will complete the disabling process after the current frame, clear the LCDA bit and optionally cause an interrupt. The steps required to properly enter Sleep with the LCD disabled are: • Clear LCDEN • Wait for LCDA = 0 either by polling or by interrupt • Execute SLEEP If SLPEN = 0 and SLEEP is executed while the LCD module clock source is FOSC/4, then the LCD module will halt with the pin driving the last LCD voltage pat- tern. Prolonged exposure to a fixed LCD voltage pat- tern will cause damage to the LCD glass. To prevent LCD glass damage, either perform the proper LCD module shutdown prior to Sleep, or change the LCD module clock to allow the LCD module to continue operation during Sleep. If a SLEEP instruction is executed and SLPEN = 0 and the LCD module clock is either T1OSC or LFINTOSC, the module will continue to display the current contents of the LCDDATA registers. While in Sleep, the LCD data cannot be changed. If the LCDIE bit is set, the device will wake from Sleep on the next LCD frame boundary. The LCD module current consumption will not decrease in this mode; however, the overall device power consumption will be lower due to the shutdown of the CPU and other peripherals. Table 27-8 shows the status of the LCD module during a Sleep while using each of the three available clock sources. If a SLEEP instruction is executed and SLPEN = 0, the module will continue to display the current contents of the LCDDATA registers. To allow the module to continue operation while in Sleep, the clock source must be either the LFINTOSC or T1OSC external oscillator. While in Sleep, the LCD data cannot be changed. The LCD module current consumption will not decrease in this mode; however, the overall consumption of the device will be lower due to shut down of the core and other peripheral functions. Table 27-8 shows the status of the LCD module during Sleep while using each of the three available clock sources: TABLE 27-8: LCD MODULE STATUS DURING SLEEP If LCD interrupts are being generated (Type-B wave- form with a multiplex mode not static) and LCDIE = 1, the device will awaken from Sleep on the next frame boundary. Note: When the LCDEN bit is cleared, the LCD module will be disabled at the completion of frame. At this time, the port pins will revert to digital functionality. To minimize power consumption due to floating digital inputs, the LCD pins should be driven low using the PORT and TRIS registers. Clock Source SLPEN Operational During Sleep T1OSC 0 Yes 1 No LFINTOSC 0 Yes 1 No FOSC/4 0 No 1 No Note: The LFINTOSC or external T1OSC oscillator must be used to operate the LCD module during Sleep.
- 358. PIC16(L)F1934/6/7 DS41364E-page 358 2008-2011 Microchip Technology Inc. FIGURE 27-20: SLEEP ENTRY/EXIT WHEN SLPEN = 1 SLEEP Instruction Execution Wake-up 2 Frames V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 COM0 COM1 COM2 SEG0
- 359. 2008-2011 Microchip Technology Inc. DS41364E-page 359 PIC16(L)F1934/6/7 27.12 Configuring the LCD Module The following is the sequence of steps to configure the LCD module. 1. Select the frame clock prescale using bits LP<3:0> of the LCDPS register. 2. Configure the appropriate pins to function as segment drivers using the LCDSEn registers. 3. Configure the LCD module for the following using the LCDCON register: - Multiplex and Bias mode, bits LMUX<1:0> - Timing source, bits CS<1:0> - Sleep mode, bit SLPEN 4. Write initial values to pixel data registers, LCDDATA0 through LCDDATA11. 5. Clear LCD Interrupt Flag, LCDIF bit of the PIR2 register and if desired, enable the interrupt by setting bit LCDIE of the PIE2 register. 6. Configure bias voltages by setting the LCDRL, LCDREF and the associated ANSELx registers as needed. 7. Enable the LCD module by setting bit LCDEN of the LCDCON register. 27.13 Disabling the LCD Module To disable the LCD module, write all ‘0’s to the LCDCON register. 27.14 LCD Current Consumption When using the LCD module the current consumption consists of the following three factors: • Oscillator Selection • LCD Bias Source • Capacitance of the LCD segments The current consumption of just the LCD module can be considered negligible compared to these other factors. 27.14.1 OSCILLATOR SELECTION The current consumed by the clock source selected must be considered when using the LCD module. See the applicable Electrical Specifications Chapter for oscillator current consumption information. 27.14.2 LCD BIAS SOURCE The LCD bias source, internal or external, can contrib- ute significantly to the current consumption. Use the highest possible resistor values while maintaining contrast to minimize current. 27.14.3 CAPACITANCE OF THE LCD SEGMENTS The LCD segments which can be modeled as capaci- tors which must be both charged and discharged every frame. The size of the LCD segment and its technology determines the segment’s capacitance.
- 360. PIC16(L)F1934/6/7 DS41364E-page 360 2008-2011 Microchip Technology Inc. TABLE 27-9: SUMMARY OF REGISTERS ASSOCIATED WITH LCD OPERATION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 98 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 329 LCDCST — — — — — LCDCST<2:0> 332 LCDDATA0 SEG7 COM0 SEG6 COM0 SEG5 COM0 SEG4 COM0 SEG3 COM0 SEG2 COM0 SEG1 COM0 SEG0 COM0 333 LCDDATA1 SEG15 COM0 SEG14 COM0 SEG13 COM0 SEG12 COM0 SEG11 COM0 SEG10 COM0 SEG9 COM0 SEG8 COM0 333 LCDDATA2 SEG23 COM0 SEG22 COM0 SEG21 COM0 SEG20 COM0 SEG19 COM0 SEG18 COM0 SEG17 COM0 SEG16 COM0 333 LCDDATA3 SEG7 COM1 SEG6 COM1 SEG5 COM1 SEG4 COM1 SEG3 COM1 SEG2 COM1 SEG1 COM1 SEG0 COM1 333 LCDDATA4 SEG15 COM1 SEG14 COM1 SEG13 COM1 SEG12 COM1 SEG11 COM1 SEG10 COM1 SEG9 COM1 SEG8 COM1 333 LCDDATA5 SEG23 COM1 SEG22 COM1 SEG21 COM1 SEG20 COM1 SEG19 COM1 SEG18 COM1 SEG17 COM1 SEG16 COM1 333 LCDDATA6 SEG7 COM2 SEG6 COM2 SEG5 COM2 SEG4 COM2 SEG3 COM2 SEG2 COM2 SEG1 COM2 SEG0 COM2 333 LCDDATA7 SEG15 COM2 SEG14 COM2 SEG13 COM2 SEG12 COM2 SEG11 COM2 SEG10 COM2 SEG9 COM2 SEG8 COM2 333 LCDDATA8 SEG23 COM2 SEG22 COM2 SEG21 COM2 SEG20 COM2 SEG19 COM2 SEG18 COM2 SEG17 COM2 SEG16 COM2 333 LCDDATA9 SEG7 COM3 SEG6 COM3 SEG5 COM3 SEG4 COM3 SEG3 COM3 SEG2 COM3 SEG1 COM3 SEG0 COM3 333 LCDDATA10 SEG15 COM3 SEG14 COM3 SEG13 COM3 SEG12 COM3 SEG11 COM3 SEG10 COM3 SEG9 COM3 SEG8 COM3 333 LCDDATA11 SEG23 COM3 SEG22 COM3 SEG21 COM3 SEG20 COM3 SEG19 COM3 SEG18 COM3 SEG17 COM3 SEG16 COM3 333 LCDPS WFT BIASMD LCDA WA LP<3:0> 330 LCDREF LCDIRE LCDIRS LCDIRI — VLCD3PE VLCD2PE VLCD1PE — 331 LCDRL LRLAP<1:0> LRLBP<1:0> — LRLAT<2:0> 340 LCDSE0 SE<7:0> 333 LCDSE1 SE<15:8> 333 LCDSE2 SE<23:16> 333 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 100 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 103 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 203 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the LCD module.
- 361. 2008-2011 Microchip Technology Inc. DS41364E-page 361 PIC16(L)F1934/6/7 28.0 IN-CIRCUIT SERIAL PROGRAMMING™ (ICSP™) ICSP™ programming allows customers to manufacture circuit boards with unprogrammed devices. Programming can be done after the assembly process allowing the device to be programmed with the most recent firmware or a custom firmware. Five pins are needed for ICSP™ programming: • ICSPCLK • ICSPDAT • MCLR/VPP • VDD • VSS In Program/Verify mode the Program Memory, User IDs and the Configuration Words are programmed through serial communications. The ICSPDAT pin is a bidirec- tional I/O used for transferring the serial data and the ICSPCLK pin is the clock input. For more information on ICSP™ refer to the “PIC16193X/PIC16LF193X Memory Programming Specification” (DS41360). 28.1 High-Voltage Programming Entry Mode The device is placed into High-Voltage Programming Entry mode by holding the ICSPCLK and ICSPDAT pins low then raising the voltage on MCLR/VPP to VIHH. Some programmers produce VPP greater than VIHH (9.0V), an external circuit is required to limit the VPP voltage. See Figure 28-1 for example circuit. FIGURE 28-1: VPP LIMITER EXAMPLE CIRCUIT VREF VPP VDD VSS ICSP_DATA ICSP_CLOCK NC RJ11-6PIN RJ11-6PIN R1 270 Ohm To MPLAB® ICD 2 To Target Board 1 2 3 4 5 6 1 2 3 4 5 6 R2 R3 10k 1% 24k 1% U1 LM431BCMX A 2 3 6 7 8 A A A K NC NC 1 4 5 Note: The MPLAB® ICD 2 produces a VPP voltage greater than the maximum VPP specification of the PIC16(L)F1934/6/7.
- 362. PIC16(L)F1934/6/7 DS41364E-page 362 2008-2011 Microchip Technology Inc. 28.2 Low-Voltage Programming Entry Mode The Low-Voltage Programming Entry mode allows the PIC16(L)F1934/6/7 devices to be programmed using VDD only, without high voltage. When the LVP bit of Configuration Word 2 is set to ‘1’, the low-voltage ICSP programming entry is enabled. To disable the Low-Voltage ICSP mode, the LVP bit must be programmed to ‘0’. Entry into the Low-Voltage Programming Entry mode requires the following steps: 1. MCLR is brought to VIL. 2. A 32-bit key sequence is presented on ICSPDAT, while clocking ICSPCLK. Once the key sequence is complete, MCLR must be held at VIL for as long as Program/Verify mode is to be maintained. If low-voltage programming is enabled (LVP = 1), the MCLR Reset function is automatically enabled and cannot be disabled. See Section 6.3 “MCLR” for more information. The LVP bit can only be reprogrammed to ‘0’ by using the High-Voltage Programming mode. 28.3 Common Programming Interfaces Connection to a target device is typically done through an ICSP™ header. A commonly found connector on development tools is the RJ-11 in the 6P6C (6 pin, 6 connector) configuration. See Figure 28-2. FIGURE 28-2: ICD RJ-11 STYLE CONNECTOR INTERFACE Another connector often found in use with the PICkit™ programmers is a standard 6-pin header with 0.1 inch spacing. Refer to Figure 28-3. FIGURE 28-3: PICkit™ STYLE CONNECTOR INTERFACE 1 2 3 4 5 6 Target Bottom Side PC Board VPP/MCLR VSS ICSPCLK VDD ICSPDAT NC Pin Description* 1 = VPP/MCLR 2 = VDD Target 3 = VSS (ground) 4 = ICSPDAT 5 = ICSPCLK 6 = No Connect 1 2 3 4 5 6 * The 6-pin header (0.100" spacing) accepts 0.025" square pins. Pin Description* 1 = VPP/MCLR 2 = VDD Target 3 = VSS (ground) 4 = ICSPDAT 5 = ICSPCLK 6 = No Connect Pin 1 Indicator
- 363. 2008-2011 Microchip Technology Inc. DS41364E-page 363 PIC16(L)F1934/6/7 For additional interface recommendations, refer to your specific device programmer manual prior to PCB design. It is recommended that isolation devices be used to separate the programming pins from other circuitry. The type of isolation is highly dependent on the specific application and may include devices such as resistors, diodes, or even jumpers. See Figure 28-4 for more information. FIGURE 28-4: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING VDD VPP VSS External Device to be Data Clock VDD MCLR/VPP VSS ICSPDAT ICSPCLK * * * To Normal Connections * Isolation devices (as required). Programming Signals Programmed VDD
- 364. PIC16(L)F1934/6/7 DS41364E-page 364 2008-2011 Microchip Technology Inc. NOTES:
- 365. 2008-2011 Microchip Technology Inc. DS41364E-page 365 PIC16(L)F1934/6/7 29.0 INSTRUCTION SET SUMMARY Each PIC16 instruction is a 14-bit word containing the operation code (opcode) and all required operands. The opcodes are broken into three broad categories. • Byte Oriented • Bit Oriented • Literal and Control The literal and control category contains the most var- ied instruction word format. Table 29-3 lists the instructions recognized by the MPASMTM assembler. All instructions are executed within a single instruction cycle, with the following exceptions, which may take two or three cycles: • Subroutine takes two cycles (CALL, CALLW) • Returns from interrupts or subroutines take two cycles (RETURN, RETLW, RETFIE) • Program branching takes two cycles (GOTO, BRA, BRW, BTFSS, BTFSC, DECFSZ, INCSFZ) • One additional instruction cycle will be used when any instruction references an indirect file register and the file select register is pointing to program memory. One instruction cycle consists of 4 oscillator cycles; for an oscillator frequency of 4 MHz, this gives a nominal instruction execution rate of 1 MHz. All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. 29.1 Read-Modify-Write Operations Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (R-M-W) operation. The register is read, the data is modified, and the result is stored according to either the instruc- tion, or the destination designator ‘d’. A read operation is performed on a register even if the instruction writes to that register. TABLE 29-1: OPCODE FIELD DESCRIPTIONS TABLE 29-2: ABBREVIATION DESCRIPTIONS Field Description f Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. n FSR or INDF number. (0-1) mm Pre-post increment-decrement mode selection Field Description PC Program Counter TO Time-out bit C Carry bit DC Digit carry bit Z Zero bit PD Power-down bit
- 366. PIC16(L)F1934/6/7 DS41364E-page 366 2008-2011 Microchip Technology Inc. FIGURE 29-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 0 d = 0 for destination W OPCODE d f (FILE #) d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 0 OPCODE b (BIT #) f (FILE #) b = 3-bit bit address f = 7-bit file register address Literal and control operations 13 8 7 0 OPCODE k (literal) k = 8-bit immediate value 13 11 10 0 OPCODE k (literal) k = 11-bit immediate value General CALL and GOTO instructions only MOVLP instruction only 13 5 4 0 OPCODE k (literal) k = 5-bit immediate value MOVLB instruction only 13 9 8 0 OPCODE k (literal) k = 9-bit immediate value BRA instruction only FSR Offset instructions 13 7 6 5 0 OPCODE n k (literal) n = appropriate FSR FSR Increment instructions 13 7 6 0 OPCODE k (literal) k = 7-bit immediate value 13 3 2 1 0 OPCODE n m (mode) n = appropriate FSR m = 2-bit mode value k = 6-bit immediate value 13 0 OPCODE OPCODE only
- 367. 2008-2011 Microchip Technology Inc. DS41364E-page 367 PIC16(L)F1934/6/7 TABLE 29-3: PIC16(L)F1934/6/7 ENHANCED INSTRUCTION SET Mnemonic, Operands Description Cycles 14-Bit Opcode Status Affected Notes MSb LSb BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ADDWFC ANDWF ASRF LSLF LSRF CLRF CLRW COMF DECF INCF IORWF MOVF MOVWF RLF RRF SUBWF SUBWFB SWAPF XORWF f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d f f, d f, d f, d f, d f, d f, d Add W and f Add with Carry W and f AND W with f Arithmetic Right Shift Logical Left Shift Logical Right Shift Clear f Clear W Complement f Decrement f Increment f Inclusive OR W with f Move f Move W to f Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Subtract with Borrow W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 00 11 00 11 11 11 00 00 00 00 00 00 00 00 00 00 00 11 00 00 0111 1101 0101 0111 0101 0110 0001 0001 1001 0011 1010 0100 1000 0000 1101 1100 0010 1011 1110 0110 dfff dfff dfff dfff dfff dfff lfff 0000 dfff dfff dfff dfff dfff 1fff dfff dfff dfff dfff dfff dfff ffff ffff ffff ffff ffff ffff ffff 00xx ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff C, DC, Z C, DC, Z Z C, Z C, Z C, Z Z Z Z Z Z Z Z C C C, DC, Z C, DC, Z Z 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 BYTE ORIENTED SKIP OPERATIONS DECFSZ INCFSZ f, d f, d Decrement f, Skip if 0 Increment f, Skip if 0 1(2) 1(2) 00 00 1011 1111 dfff dfff ffff ffff 1, 2 1, 2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF f, b f, b Bit Clear f Bit Set f 1 1 01 01 00bb 01bb bfff bfff ffff ffff 2 2 BIT-ORIENTED SKIP OPERATIONS BTFSC BTFSS f, b f, b Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 (2) 1 (2) 01 01 10bb 11bb bfff bfff ffff ffff 1, 2 1, 2 LITERAL OPERATIONS ADDLW ANDLW IORLW MOVLB MOVLP MOVLW SUBLW XORLW k k k k k k k k Add literal and W AND literal with W Inclusive OR literal with W Move literal to BSR Move literal to PCLATH Move literal to W Subtract W from literal Exclusive OR literal with W 1 1 1 1 1 1 1 1 11 11 11 00 11 11 11 11 1110 1001 1000 0000 0001 0000 1100 1010 kkkk kkkk kkkk 001k 1kkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk C, DC, Z Z Z C, DC, Z Z Note 1:If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle.
- 368. PIC16(L)F1934/6/7 DS41364E-page 368 2008-2011 Microchip Technology Inc. TABLE 29-3: PIC16(L)F1938/9 ENHANCED INSTRUCTION SET (CONTINUED) Mnemonic, Operands Description Cycles 14-Bit Opcode Status Affected Notes MSb LSb CONTROL OPERATIONS BRA BRW CALL CALLW GOTO RETFIE RETLW RETURN k – k – k k k – Relative Branch Relative Branch with W Call Subroutine Call Subroutine with W Go to address Return from interrupt Return with literal in W Return from Subroutine 2 2 2 2 2 2 2 2 11 00 10 00 10 00 11 00 001k 0000 0kkk 0000 1kkk 0000 0100 0000 kkkk 0000 kkkk 0000 kkkk 0000 kkkk 0000 kkkk 1011 kkkk 1010 kkkk 1001 kkkk 1000 INHERENT OPERATIONS CLRWDT NOP OPTION RESET SLEEP TRIS – – – – – f Clear Watchdog Timer No Operation Load OPTION_REG register with W Software device Reset Go into Standby mode Load TRIS register with W 1 1 1 1 1 1 00 00 00 00 00 00 0000 0000 0000 0000 0000 0000 0110 0000 0110 0000 0110 0110 0100 0000 0010 0001 0011 0fff TO, PD TO, PD C-COMPILER OPTIMIZED ADDFSR MOVIW MOVWI n, k n mm k[n] n mm k[n] Add Literal k to FSRn Move Indirect FSRn to W with pre/post inc/dec modifier, mm Move INDFn to W, Indexed Indirect. Move W to Indirect FSRn with pre/post inc/dec modifier, mm Move W to INDFn, Indexed Indirect. 1 1 1 1 1 11 00 11 00 11 0001 0000 1111 0000 1111 0nkk 0001 0nkk 0001 1nkk kkkk 0nmm kkkk 1nmm kkkk Z Z 2, 3 2 2, 3 2 Note 1:If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. 3: See Table in the MOVIW and MOVWI instruction descriptions.
- 369. 2008-2011 Microchip Technology Inc. DS41364E-page 369 PIC16(L)F1934/6/7 29.2 Instruction Descriptions ADDFSR Add Literal to FSRn Syntax: [ label ] ADDFSR FSRn, k Operands: -32 k 31 n [ 0, 1] Operation: FSR(n) + k FSR(n) Status Affected: None Description: The signed 6-bit literal ‘k’ is added to the contents of the FSRnH:FSRnL register pair. FSRn is limited to the range 0000h - FFFFh. Moving beyond these bounds will cause the FSR to wrap around. ADDLW Add literal and W Syntax: [ label ] ADDLW k Operands: 0 k 255 Operation: (W) + k (W) Status Affected: C, DC, Z Description: The contents of the W register are added to the eight-bit literal ‘k’ and the result is placed in the W register. ADDWF Add W and f Syntax: [ label ] ADDWF f,d Operands: 0 f 127 d 0,1 Operation: (W) + (f) (destination) Status Affected: C, DC, Z Description: Add the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ADDWFC ADD W and CARRY bit to f Syntax: [ label ] ADDWFC f {,d} Operands: 0 f 127 d [0,1] Operation: (W) + (f) + (C) dest Status Affected: C, DC, Z Description: Add W, the Carry flag and data mem- ory location ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in data memory location ‘f’. ANDLW AND literal with W Syntax: [ label ] ANDLW k Operands: 0 k 255 Operation: (W) .AND. (k) (W) Status Affected: Z Description: The contents of W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. ANDWF AND W with f Syntax: [ label ] ANDWF f,d Operands: 0 f 127 d 0,1 Operation: (W) .AND. (f) (destination) Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ASRF Arithmetic Right Shift Syntax: [ label ] ASRF f {,d} Operands: 0 f 127 d [0,1] Operation: (f<7>) dest<7> (f<7:1>) dest<6:0>, (f<0>) C, Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the right through the Carry flag. The MSb remains unchanged. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in reg- ister ‘f’. register f C
- 370. PIC16(L)F1934/6/7 DS41364E-page 370 2008-2011 Microchip Technology Inc. BCF Bit Clear f Syntax: [ label ] BCF f,b Operands: 0 f 127 0 b 7 Operation: 0 (f<b>) Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. BRA Relative Branch Syntax: [ label ] BRA label [ label ] BRA $+k Operands: -256 label - PC + 1 255 -256 k 255 Operation: (PC) + 1 + k PC Status Affected: None Description: Add the signed 9-bit literal ‘k’ to the PC. Since the PC will have incre- mented to fetch the next instruction, the new address will be PC + 1 + k. This instruction is a two-cycle instruc- tion. This branch has a limited range. BRW Relative Branch with W Syntax: [ label ] BRW Operands: None Operation: (PC) + (W) PC Status Affected: None Description: Add the contents of W (unsigned) to the PC. Since the PC will have incre- mented to fetch the next instruction, the new address will be PC + 1 + (W). This instruction is a two-cycle instruc- tion. BSF Bit Set f Syntax: [ label ] BSF f,b Operands: 0 f 127 0 b 7 Operation: 1 (f<b>) Status Affected: None Description: Bit ‘b’ in register ‘f’ is set. BTFSC Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b Operands: 0 f 127 0 b 7 Operation: skip if (f<b>) = 0 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’, in register ‘f’, is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a 2-cycle instruction. BTFSS Bit Test f, Skip if Set Syntax: [ label ] BTFSS f,b Operands: 0 f 127 0 b < 7 Operation: skip if (f<b>) = 1 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is executed. If bit ‘b’ is ‘1’, then the next instruction is discarded and a NOP is executed instead, making this a 2-cycle instruction.
- 371. 2008-2011 Microchip Technology Inc. DS41364E-page 371 PIC16(L)F1934/6/7 CALL Call Subroutine Syntax: [ label ] CALL k Operands: 0 k 2047 Operation: (PC)+ 1 TOS, k PC<10:0>, (PCLATH<6:3>) PC<14:11> Status Affected: None Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The eleven-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruc- tion. CALLW Subroutine Call With W Syntax: [ label ] CALLW Operands: None Operation: (PC) +1 TOS, (W) PC<7:0>, (PCLATH<6:0>) PC<14:8> Status Affected: None Description: Subroutine call with W. First, the return address (PC + 1) is pushed onto the return stack. Then, the con- tents of W is loaded into PC<7:0>, and the contents of PCLATH into PC<14:8>. CALLW is a two-cycle instruction. CLRF Clear f Syntax: [ label ] CLRF f Operands: 0 f 127 Operation: 00h (f) 1 Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h (W) 1 Z Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. CLRWDT Clear Watchdog Timer Syntax: [ label ] CLRWDT Operands: None Operation: 00h WDT 0 WDT prescaler, 1 TO 1 PD Status Affected: TO, PD Description: CLRWDT instruction resets the Watch- dog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. COMF Complement f Syntax: [ label ] COMF f,d Operands: 0 f 127 d [0,1] Operation: (f) (destination) Status Affected: Z Description: The contents of register ‘f’ are com- plemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DECF Decrement f Syntax: [ label ] DECF f,d Operands: 0 f 127 d [0,1] Operation: (f) - 1 (destination) Status Affected: Z Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’.
- 372. PIC16(L)F1934/6/7 DS41364E-page 372 2008-2011 Microchip Technology Inc. DECFSZ Decrement f, Skip if 0 Syntax: [ label ] DECFSZ f,d Operands: 0 f 127 d [0,1] Operation: (f) - 1 (destination); skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are decre- mented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, then a NOP is executed instead, making it a 2-cycle instruction. GOTO Unconditional Branch Syntax: [ label ] GOTO k Operands: 0 k 2047 Operation: k PC<10:0> PCLATH<6:3> PC<14:11> Status Affected: None Description: GOTO is an unconditional branch. The eleven-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a two-cycle instruction. INCF Increment f Syntax: [ label ] INCF f,d Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination) Status Affected: Z Description: The contents of register ‘f’ are incre- mented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. INCFSZ Increment f, Skip if 0 Syntax: [ label ] INCFSZ f,d Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination), skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are incre- mented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, a NOP is executed instead, making it a 2-cycle instruction. IORLW Inclusive OR literal with W Syntax: [ label ] IORLW k Operands: 0 k 255 Operation: (W) .OR. k (W) Status Affected: Z Description: The contents of the W register are OR’ed with the eight-bit literal ‘k’. The result is placed in the W register. IORWF Inclusive OR W with f Syntax: [ label ] IORWF f,d Operands: 0 f 127 d [0,1] Operation: (W) .OR. (f) (destination) Status Affected: Z Description: Inclusive OR the W register with regis- ter ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’.
- 373. 2008-2011 Microchip Technology Inc. DS41364E-page 373 PIC16(L)F1934/6/7 LSLF Logical Left Shift Syntax: [ label ] LSLF f {,d} Operands: 0 f 127 d [0,1] Operation: (f<7>) C (f<6:0>) dest<7:1> 0 dest<0> Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the left through the Carry flag. A ‘0’ is shifted into the LSb. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. LSRF Logical Right Shift Syntax: [ label ] LSLF f {,d} Operands: 0 f 127 d [0,1] Operation: 0 dest<7> (f<7:1>) dest<6:0>, (f<0>) C, Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the right through the Carry flag. A ‘0’ is shifted into the MSb. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. register f 0 C register f C 0 MOVF Move f Syntax: [ label ] MOVF f,d Operands: 0 f 127 d [0,1] Operation: (f) (dest) Status Affected: Z Description: The contents of register f is moved to a destination dependent upon the status of d. If d = 0, destination is W register. If d = 1, the destination is file register f itself. d = 1 is useful to test a file register since status flag Z is affected. Words: 1 Cycles: 1 Example: MOVF FSR, 0 After Instruction W = value in FSR register Z = 1
- 374. PIC16(L)F1934/6/7 DS41364E-page 374 2008-2011 Microchip Technology Inc. MOVIW Move INDFn to W Syntax: [ label ] MOVIW ++FSRn [ label ] MOVIW --FSRn [ label ] MOVIW FSRn++ [ label ] MOVIW FSRn-- [ label ] MOVIW k[FSRn] Operands: n [0,1] mm [00,01, 10, 11] -32 k 31 Operation: INDFn W Effective address is determined by • FSR + 1 (preincrement) • FSR - 1 (predecrement) • FSR + k (relative offset) After the Move, the FSR value will be either: • FSR + 1 (all increments) • FSR - 1 (all decrements) • Unchanged Status Affected: Z Mode Syntax mm Preincrement ++FSRn 00 Predecrement --FSRn 01 Postincrement FSRn++ 10 Postdecrement FSRn-- 11 Description: This instruction is used to move data between W and one of the indirect registers (INDFn). Before/after this move, the pointer (FSRn) is updated by pre/post incrementing/decrementing it. Note: The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the FSRn. FSRn is limited to the range 0000h - FFFFh. Incrementing/decrementing it beyond these bounds will cause it to wrap around. MOVLB Move literal to BSR Syntax: [ label ] MOVLB k Operands: 0 k 15 Operation: k BSR Status Affected: None Description: The five-bit literal ‘k’ is loaded into the Bank Select Register (BSR). MOVLP Move literal to PCLATH Syntax: [ label ] MOVLP k Operands: 0 k 127 Operation: k PCLATH Status Affected: None Description: The seven-bit literal ‘k’ is loaded into the PCLATH register. MOVLW Move literal to W Syntax: [ label ] MOVLW k Operands: 0 k 255 Operation: k (W) Status Affected: None Description: The eight-bit literal ‘k’ is loaded into W register. The “don’t cares” will assem- ble as ‘0’s. Words: 1 Cycles: 1 Example: MOVLW 0x5A After Instruction W = 0x5A MOVWF Move W to f Syntax: [ label ] MOVWF f Operands: 0 f 127 Operation: (W) (f) Status Affected: None Description: Move data from W register to register ‘f’. Words: 1 Cycles: 1 Example: MOVWF OPTION_REG Before Instruction OPTION_REG = 0xFF W = 0x4F After Instruction OPTION_REG = 0x4F W = 0x4F
- 375. 2008-2011 Microchip Technology Inc. DS41364E-page 375 PIC16(L)F1934/6/7 MOVWI Move W to INDFn Syntax: [ label ] MOVWI ++FSRn [ label ] MOVWI --FSRn [ label ] MOVWI FSRn++ [ label ] MOVWI FSRn-- [ label ] MOVWI k[FSRn] Operands: n [0,1] mm [00,01, 10, 11] -32 k 31 Operation: W INDFn Effective address is determined by • FSR + 1 (preincrement) • FSR - 1 (predecrement) • FSR + k (relative offset) After the Move, the FSR value will be either: • FSR + 1 (all increments) • FSR - 1 (all decrements) Unchanged Status Affected: None Mode Syntax mm Preincrement ++FSRn 00 Predecrement --FSRn 01 Postincrement FSRn++ 10 Postdecrement FSRn-- 11 Description: This instruction is used to move data between W and one of the indirect registers (INDFn). Before/after this move, the pointer (FSRn) is updated by pre/post incrementing/decrementing it. Note: The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the FSRn. FSRn is limited to the range 0000h - FFFFh. Incrementing/decrementing it beyond these bounds will cause it to wrap around. The increment/decrement operation on FSRn WILL NOT affect any Status bits. NOP No Operation Syntax: [ label ] NOP Operands: None Operation: No operation Status Affected: None Description: No operation. Words: 1 Cycles: 1 Example: NOP OPTION Load OPTION_REG Register with W Syntax: [ label ] OPTION Operands: None Operation: (W) OPTION_REG Status Affected: None Description: Move data from W register to OPTION_REG register. Words: 1 Cycles: 1 Example: OPTION Before Instruction OPTION_REG = 0xFF W = 0x4F After Instruction OPTION_REG = 0x4F W = 0x4F RESET Software Reset Syntax: [ label ] RESET Operands: None Operation: Execute a device Reset. Resets the nRI flag of the PCON register. Status Affected: None Description: This instruction provides a way to execute a hardware Reset by soft- ware.
- 376. PIC16(L)F1934/6/7 DS41364E-page 376 2008-2011 Microchip Technology Inc. RETFIE Return from Interrupt Syntax: [ label ] RETFIE Operands: None Operation: TOS PC, 1 GIE Status Affected: None Description: Return from Interrupt. Stack is POPed and Top-of-Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a two-cycle instruction. Words: 1 Cycles: 2 Example: RETFIE After Interrupt PC = TOS GIE = 1 RETLW Return with literal in W Syntax: [ label ] RETLW k Operands: 0 k 255 Operation: k (W); TOS PC Status Affected: None Description: The W register is loaded with the eight bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. Words: 1 Cycles: 2 Example: TABLE CALL TABLE;W contains table ;offset value • ;W now has table value • • ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; • • • RETLW kn ; End of table Before Instruction W = 0x07 After Instruction W = value of k8 RETURN Return from Subroutine Syntax: [ label ] RETURN Operands: None Operation: TOS PC Status Affected: None Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. RLF Rotate Left f through Carry Syntax: [ label ] RLF f,d Operands: 0 f 127 d [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Words: 1 Cycles: 1 Example: RLF REG1,0 Before Instruction REG1 = 1110 0110 C = 0 After Instruction REG1 = 1110 0110 W = 1100 1100 C = 1 Register f C
- 377. 2008-2011 Microchip Technology Inc. DS41364E-page 377 PIC16(L)F1934/6/7 RRF Rotate Right f through Carry Syntax: [ label ] RRF f,d Operands: 0 f 127 d [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. SLEEP Enter Sleep mode Syntax: [ label ] SLEEP Operands: None Operation: 00h WDT, 0 WDT prescaler, 1 TO, 0 PD Status Affected: TO, PD Description: The power-down Status bit, PD is cleared. Time-out Status bit, TO is set. Watchdog Timer and its pres- caler are cleared. The processor is put into Sleep mode with the oscillator stopped. Register f C SUBLW Subtract W from literal Syntax: [ label ] SUBLW k Operands: 0 k 255 Operation: k - (W) W) Status Affected: C, DC, Z Description: The W register is subtracted (2’s com- plement method) from the eight-bit literal ‘k’. The result is placed in the W register. SUBWF Subtract W from f Syntax: [ label ] SUBWF f,d Operands: 0 f 127 d [0,1] Operation: (f) - (W) destination) Status Affected: C, DC, Z Description: Subtract (2’s complement method) W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f. SUBWFB Subtract W from f with Borrow Syntax: SUBWFB f {,d} Operands: 0 f 127 d [0,1] Operation: (f) – (W) – (B) dest Status Affected: C, DC, Z Description: Subtract W and the BORROW flag (CARRY) from register ‘f’ (2’s comple- ment method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. C = 0 W k C = 1 W k DC = 0 W<3:0> k<3:0> DC = 1 W<3:0> k<3:0> C = 0 W f C = 1 W f DC = 0 W<3:0> f<3:0> DC = 1 W<3:0> f<3:0>
- 378. PIC16(L)F1934/6/7 DS41364E-page 378 2008-2011 Microchip Technology Inc. SWAPF Swap Nibbles in f Syntax: [ label ] SWAPF f,d Operands: 0 f 127 d [0,1] Operation: (f<3:0>) (destination<7:4>), (f<7:4>) (destination<3:0>) Status Affected: None Description: The upper and lower nibbles of regis- ter ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. TRIS Load TRIS Register with W Syntax: [ label ] TRIS f Operands: 5 f 7 Operation: (W) TRIS register ‘f’ Status Affected: None Description: Move data from W register to TRIS register. When ‘f’ = 5, TRISA is loaded. When ‘f’ = 6, TRISB is loaded. When ‘f’ = 7, TRISC is loaded. XORLW Exclusive OR literal with W Syntax: [ label ] XORLW k Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR’ed with the eight-bit literal ‘k’. The result is placed in the W register. XORWF Exclusive OR W with f Syntax: [ label ] XORWF f,d Operands: 0 f 127 d [0,1] Operation: (W) .XOR. (f) destination) Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in regis- ter ‘f’.
- 379. 2008-2011 Microchip Technology Inc. DS41364E-page 379 PIC16(L)F1934/6/7 30.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings(†) Ambient temperature under bias....................................................................................................... -40°C to +125°C Storage temperature ........................................................................................................................ -65°C to +150°C Voltage on VDD with respect to VSS ................................................................................................... -0.3V to +6.5V Voltage on VCAP pin with respect to VSS.............................................................................................. -0.3V to +4.0V Voltage on VDD with respect to VSS ................................................................................................... -0.3V to +4.0V Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V) Total power dissipation(1) ...............................................................................................................................800 mW Maximum current out of VSS (2) pin, -40°C TA +85°C for industrial ........................................................... 255 mA Maximum current out of VSS (2) pin, -40°C TA +125°C for extended......................................................... 105 mA Maximum current into VDD (2) pin, -40°C TA +85°C for industrial.............................................................. 170 mA Maximum current into VDD (2) pin, -40°C TA +125°C for extended.............................................................. 70 mA Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA Maximum output current sunk by any I/O pin....................................................................................................25 mA Maximum output current sourced by any I/O pin .............................................................................................. 25 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL) 2: For 28-pin devices. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.
- 380. PIC16(L)F1934/6/7 DS41364E-page 380 2008-2011 Microchip Technology Inc. FIGURE 30-1: PIC16F1934/36/37 VOLTAGE FREQUENCY GRAPH, -40°C TA +125°C FIGURE 30-2: PIC16LF1934/36/37 VOLTAGE FREQUENCY GRAPH, -40°C TA +125°C 1.8 0 2.5 Frequency (MHz) V DD (V) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 30-1 for each Oscillator mode’s supported frequencies. 4 32 10 16 5.5 1.8 0 2.5 Frequency (MHz) V DD (V) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 30-1 for each Oscillator mode’s supported frequencies. 4 32 10 16 3.6
- 381. 2008-2011 Microchip Technology Inc. DS41364E-page 381 PIC16(L)F1934/6/7 FIGURE 30-3: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE 125 25 2.0 0 60 85 VDD (V) 4.0 5.0 4.5 Temperature (°C) 2.5 3.0 3.5 5.5 1.8 -40 ± 5% ± 2% ± 5% ± 3%
- 382. PIC16(L)F1934/6/7 DS41364E-page 382 2008-2011 Microchip Technology Inc. 30.1 DC Characteristics: PIC16(L)F1934/6/7-I/E (Industrial, Extended) PIC16LF1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended PIC16F1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended Param. No. Sym. Characteristic Min. Typ† Max. Units Conditions D001 VDD Supply Voltage PIC16LF1934/36/37 1.8 2.3 — — 3.6 3.6 V V FOSC 16 MHz: FOSC 32 MHz (Note 2) D001 PIC16F1934/36/37 1.8 2.3 — — 5.5 5.5 V V FOSC 16 MHz: FOSC 32 MHz (Note 2) D002* VDR RAM Data Retention Voltage(1) PIC16LF1934/36/37 1.5 — — V Device in Sleep mode D002* PIC16F1934/36/37 1.7 — — V Device in Sleep mode VPOR* Power-on Reset Release Voltage — 1.6 — V VPORR* Power-on Reset Rearm Voltage PIC16LF1934/36/37 — 0.8 — V Device in Sleep mode PIC16F1934/36/37 — 1.7 — V Device in Sleep mode D003 VADFVR Fixed Voltage Reference Voltage for ADC -8 6 % 1.024V, VDD 2.5V 2.048V, VDD 2.5V 4.096V, VDD 4.75V D003A VCDAFVR Fixed Voltage Reference Voltage for Comparator and DAC -11 7 % 1.024V, VDD 2.5V 2.048V, VDD 2.5V 4.096V, VDD 4.75V D003B VLCDFVR Fixed Voltage Reference Voltage for LCD Bias -11 — 10 % 3.072V, VDD 3.6V D004* SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — V/ms See Section 6.1 “Power-on Reset (POR)” for details. * These parameters are characterized but not tested. † Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 2: PLL required for 32 MHz operation.
- 383. 2008-2011 Microchip Technology Inc. DS41364E-page 383 PIC16(L)F1934/6/7 FIGURE 30-4: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR VSS VSS NPOR TPOR (3) POR REARM Note 1: When NPOR is low, the device is held in Reset. 2: TPOR 1 s typical. 3: TVLOW 2.7 s typical. TVLOW (2)
- 384. PIC16(L)F1934/6/7 DS41364E-page 384 2008-2011 Microchip Technology Inc. 30.2 DC Characteristics: PIC16(L)F1934/6/7-I/E (Industrial, Extended) PIC16LF1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended PIC16F1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended Param No. Device Characteristics Min. Typ† Max. Units Conditions VDD Note Supply Current (IDD)(1, 2) D009 LDO Regulator — 350 — A — HS, EC OR INTOSC/INTOSCIO (8-16 MHZ) Clock modes with all VCAP pins disabled — 50 — A — All VCAP pins disabled — 30 — A — VCAP enabled on RA0, RA5 or RA6 — 5 — A — LP Clock mode and Sleep (requires FVR and BOR to be disabled) D010 — 7.0 16 A 1.8 FOSC = 32 kHz LP Oscillator mode (Note 4), -40°C TA +85°C — 9.0 20 A 3.0 D010 — 29 63 A 1.8 FOSC = 32 kHz LP Oscillator mode (Note 4, 5), -40°C TA +85°C — 37 74 A 3.0 — 40 79 A 5.0 D010A — 7.0 23 A 1.8 FOSC = 32 kHz LP Oscillator mode (Note 4) -40°C TA +125°C — 9.0 27 A 3.0 D010A — 29 68 A 1.8 FOSC = 32 kHz LP Oscillator mode (Note 4, 5) -40°C TA +125°C — 37 88 A 3.0 — 40 95 A 5.0 D011 — 140 200 A 1.8 FOSC = 1 MHz XT Oscillator mode — 250 330 A 3.0 D011 — 160 260 A 1.8 FOSC = 1 MHz XT Oscillator mode (Note 5) — 280 480 A 3.0 — 390 690 A 5.0 D012 — 430 650 A 1.8 FOSC = 4 MHz XT Oscillator mode — 750 1000 A 3.0 D012 — 450 700 A 1.8 FOSC = 4 MHz XT Oscillator mode (Note 5) — 770 1100 A 3.0 — 930 1300 A 5.0 Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in k 4: FVR and BOR are disabled. 5: 0.1 F capacitor on VCAP (RA0). 6: 8 MHz crystal oscillator with 4x PLL enabled.
- 385. 2008-2011 Microchip Technology Inc. DS41364E-page 385 PIC16(L)F1934/6/7 Supply Current (IDD)(1, 2) D013 — 50 100 A 1.8 FOSC = 500 kHz EC Oscillator Low-Power mode — 85 150 A 3.0 D013 — 70 120 A 1.8 FOSC = 500 kHz EC Oscillator Low-Power mode (Note 5) — 115 170 A 3.0 — 120 200 A 5.0 D014 — 400 550 A 1.8 FOSC = 4 MHz EC Oscillator mode Medium Power mode — 700 1100 A 3.0 D014 — 430 650 A 1.8 FOSC = 4 MHz EC Oscillator mode (Note 5) Medium Power mode — 720 1000 A 3.0 — 850 1200 A 5.0 D015 — 5.3 6.2 mA 3.0 FOSC = 32 MHz EC Oscillator High-Power mode — 6.3 7.5 mA 3.6 D015 — 5.3 6.5 mA 3.0 FOSC = 32 MHz EC Oscillator High-Power mode (Note 5) — 5.4 7.5 mA 5.0 D016 — 5 12 A 1.8 FOSC = 32 kHz, LFINTOSC mode (Note 4) -40°C TA +85°C — 8 16 A 3.0 D016 — 27 70 A 1.8 FOSC = 32 kHz, LFINTOSC mode (Note 4, Note 5) -40°C TA +85°C — 34 80 A 3.0 — 36 90 A 5.0 30.2 DC Characteristics: PIC16(L)F1934/6/7-I/E (Industrial, Extended) (Continued) PIC16LF1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended PIC16F1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended Param No. Device Characteristics Min. Typ† Max. Units Conditions VDD Note Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in k 4: FVR and BOR are disabled. 5: 0.1 F capacitor on VCAP (RA0). 6: 8 MHz crystal oscillator with 4x PLL enabled.
- 386. PIC16(L)F1934/6/7 DS41364E-page 386 2008-2011 Microchip Technology Inc. D017 Supply Current (IDD)(1, 2) — 110 180 A 1.8 FOSC = 500 kHz MFINTOSC mode — 140 250 A 3.0 D017 — 150 250 A 1.8 FOSC = 500 kHz MFINTOSC mode (Note 5) — 210 330 A 3.0 — 270 430 A 5.0 D018 — 1.0 1.4 mA 1.8 FOSC = 8 MHz HFINTOSC mode — 1.8 2.3 mA 3.0 D018 — 1.0 1.5 mA 1.8 FOSC = 8 MHz HFINTOSC mode (Note 5) — 1.8 2.3 mA 3.0 — 2.0 2.8 mA 5.0 D019 — 1.5 2.2 mA 1.8 FOSC = 16 MHz HFINTOSC mode — 2.8 3.7 mA 3.0 D019 — 1.7 2.3 mA 1.8 FOSC = 16 MHz HFINTOSC mode (Note 5) — 2.9 3.9 mA 3.0 — 3.1 4.1 mA 5.0 D020 — 4.8 6.2 mA 3.0 FOSC = 32 MHz HFINTOSC mode — 5.0 7.5 mA 3.6 D020 — 4.8 6.5 mA 3.0 FOSC = 32 MHz HFINTOSC mode — 5.0 7.5 mA 5.0 D021 — 410 550 A 1.8 FOSC = 4 MHz EXTRC mode (Note 3) — 710 990 A 3.0 D021 — 430 700 A 1.8 FOSC = 4 MHz EXTRC mode (Note 3, Note 5) — 730 1100 A 3.0 — 860 1400 A 5.0 D022 — 5.0 6.2 mA 3.0 FOSC = 32 MHz HS Oscillator mode (Note 6) — 6.0 7.5 mA 3.6 D022 — 5.0 6.5 mA 3.0 FOSC = 32 MHz HS Oscillator mode (Note 5, Note 6) — 5.2 7.5 mA 5.0 30.2 DC Characteristics: PIC16(L)F1934/6/7-I/E (Industrial, Extended) (Continued) PIC16LF1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended PIC16F1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended Param No. Device Characteristics Min. Typ† Max. Units Conditions VDD Note Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in k 4: FVR and BOR are disabled. 5: 0.1 F capacitor on VCAP (RA0). 6: 8 MHz crystal oscillator with 4x PLL enabled.
- 387. 2008-2011 Microchip Technology Inc. DS41364E-page 387 PIC16(L)F1934/6/7 30.3 DC Characteristics: PIC16(L)F1934/6/7-I/E (Power-Down) PIC16LF1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended PIC16F1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended Param No. Device Characteristics Min. Typ† Max. +85°C Max. +125°C Units Conditions VDD Note Power-down Base Current (IPD)(2) D023 — 0.06 1.0 8.0 A 1.8 WDT, BOR, FVR, and T1OSC disabled, all Peripherals Inactive — 0.08 2.0 9.0 A 3.0 D023 — 21 55 63 A 1.8 WDT, BOR, FVR, and T1OSC disabled, all Peripherals Inactive — 25 58 78 A 3.0 — 27 60 88 A 5.0 D024 — 0.5 4.0 9.0 A 1.8 LPWDT Current (Note 1) — 0.8 5.0 10 A 3.0 D024 — 23 57 65 A 1.8 LPWDT Current (Note 1) — 26 59 80 A 3.0 — 28 61 90 A 5.0 D025 — 15 28 30 A 1.8 FVR current — 15 30 33 A 3.0 D025 — 38 96 100 A 1.8 FVR current (Note 4) — 45 110 120 A 3.0 — 90 140 155 A 5.0 D026 — 13 25 28 A 3.0 BOR Current (Note 1) D026 — 40 110 120 A 3.0 BOR Current (Note 1, Note 4) — 87 140 155 A 5.0 D027 — 0.6 5.0 9.0 A 1.8 T1OSC Current (Note 1) — 1.8 7.0 12 A 3.0 D027 — 22 57 60 A 1.8 T1OSC Current (Note 1) — 29 62 70 A 3.0 — 35 66 85 A 5.0 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 3: A/D oscillator source is FRC. 4: 0.1 F capacitor on VCAP (RA0).
- 388. PIC16(L)F1934/6/7 DS41364E-page 388 2008-2011 Microchip Technology Inc. Power-down Base Current (IPD)(2) D028 — 0.1 4.0 8.0 A 1.8 A/D Current (Note 1, Note 3), no conversion in progress — 0.1 5.0 9.0 A 3.0 D028 — 22 56 63 A 1.8 A/D Current (Note 1, Note 3), no conversion in progress — 26 58 78 A 3.0 — 27 61 88 A 5.0 D029 — 250 — — A 1.8 A/D Current (Note 1, Note 3), conversion in progress — 250 — — A 3.0 D029 — 280 — — A 1.8 A/D Current (Note 1, Note 3, Note 4), conversion in progress — 280 — — A 3.0 — 280 — — A 5.0 D030 — 2 7 11 A 1.8 Cap Sense, Low-Power mode — 3 9 13 A 3.0 D030 — 21 61 63 A 1.8 Cap Sense, Low-Power mode — 27 63 78 A 3.0 — 28 66 88 A 5.0 D031 — 1 — — A 3.0 LCD Bias Ladder, Low-power — 10 — — A 3.0 LCD Bias Ladder, Medium-power — 75 — — A 3.0 LCD Bias Ladder, High-power D031 — 1 — — A 5.0 LCD Bias Ladder, Low-power — 10 — — A 5.0 LCD Bias Ladder, Medium-power — 75 — — A 5.0 LCD Bias Ladder, High-power D032 — 7.6 22 25 A 1.8 Comparator, Low-Power mode — 8.0 23 27 A 3.0 D032 — 24 65 75 A 1.8 Comparator, Low-Power mode — 26 75 88 A 3.0 — 28 77 97 A 5.0 30.3 DC Characteristics: PIC16(L)F1934/6/7-I/E (Power-Down) (Continued) PIC16LF1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended PIC16F1934/36/37 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended Param No. Device Characteristics Min. Typ† Max. +85°C Max. +125°C Units Conditions VDD Note * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 3: A/D oscillator source is FRC. 4: 0.1 F capacitor on VCAP (RA0).
- 389. 2008-2011 Microchip Technology Inc. DS41364E-page 389 PIC16(L)F1934/6/7 30.4 DC Characteristics: PIC16(L)F1934/6/7-I/E DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended Param No. Sym. Characteristic Min. Typ† Max. Units Conditions VIL Input Low Voltage I/O PORT: D032 with TTL buffer — — 0.8 V 4.5V VDD 5.5V D032A — — 0.15 VDD V 1.8V VDD 4.5V D033 with Schmitt Trigger buffer — — 0.2 VDD V 2.0V VDD 5.5V with I2 C™ levels — — 0.3 VDD V with SMBus levels — — 0.8 V 2.7V VDD 5.5V D034 MCLR, OSC1 (RC mode)(1) — — 0.2 VDD V D034A OSC1 (HS mode) — — 0.3 VDD V VIH Input High Voltage I/O ports: D040 with TTL buffer 2.0 — — V 4.5V VDD 5.5V D040A 0.25 VDD + 0.8 — — V 1.8V VDD 4.5V D041 with Schmitt Trigger buffer 0.8 VDD — — V 2.0V VDD 5.5V with I2 C™ levels 0.7 VDD — — V with SMBus levels 2.1 — — V 2.7V VDD 5.5V D042 MCLR 0.8 VDD — — V D043A OSC1 (HS mode) 0.7 VDD — — V D043B OSC1 (RC mode) 0.9 VDD — — V VDD 2.0V (Note 1) IIL Input Leakage Current(2) D060 I/O ports — ± 5 ± 5 ± 125 ± 1000 nA nA VSS VPIN VDD, Pin at high- impedance @ 85°C 125°C D061 MCLR(3) — ± 50 ± 200 nA VSS VPIN VDD @ 85°C IPUR Weak Pull-up Current D070* 25 25 100 140 200 300 A VDD = 3.3V, VPIN = VSS VDD = 5.0V, VPIN = VSS VOL Output Low Voltage(4) D080 I/O ports — — 0.6 V IOL = 8mA, VDD = 5V IOL = 6mA, VDD = 3.3V IOL = 1.8mA, VDD = 1.8V VOH Output High Voltage(4) D090 I/O ports VDD - 0.7 — — V IOH = 3.5mA, VDD = 5V IOH = 3mA, VDD = 3.3V IOH = 1mA, VDD = 1.8V Capacitive Loading Specs on Output Pins D101* COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1 D101A* CIO All I/O pins — — 50 pF * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: Negative current is defined as current sourced by the pin. 3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 4: Including OSC2 in CLKOUT mode.
- 390. PIC16(L)F1934/6/7 DS41364E-page 390 2008-2011 Microchip Technology Inc. VCAP Capacitor Charging D102 Charging current — 200 — A D102A Source/sink capability when charging complete — 0.0 — mA 30.4 DC Characteristics: PIC16(L)F1934/6/7-I/E (Continued) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended Param No. Sym. Characteristic Min. Typ† Max. Units Conditions * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: Negative current is defined as current sourced by the pin. 3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 4: Including OSC2 in CLKOUT mode.
- 391. 2008-2011 Microchip Technology Inc. DS41364E-page 391 PIC16(L)F1934/6/7 30.5 Memory Programming Requirements DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C Param No. Sym. Characteristic Min. Typ† Max. Units Conditions Program Memory Programming Specifications D110 VIHH Voltage on MCLR/VPP/RE3 pin 8.0 — 9.0 V (Note 3, Note 4) D111 IDDP Supply Current during Programming — — 10 mA D112 VDD for Bulk Erase 2.7 — VDD max. V D113 VPEW VDD for Write or Row Erase VDD min. — VDD max. V D114 IPPPGM Current on MCLR/VPP during Erase/ Write — — 1.0 mA D115 IDDPGM Current on VDD during Erase/Write — 5.0 mA Data EEPROM Memory D116 ED Byte Endurance 100K — — E/W -40C to +85C D117 VDRW VDD for Read/Write VDD min. — VDD max. V D118 TDEW Erase/Write Cycle Time — 4.0 5.0 ms D119 TRETD Characteristic Retention — 40 — Year Provided no other specifications are violated D120 TREF Number of Total Erase/Write Cycles before Refresh(2) 1M 10M — E/W -40°C to +85°C Program Flash Memory D121 EP Cell Endurance 10K — — E/W -40C to +85C (Note 1) D122 VPR VDD for Read VDD min. — VDD max. V D123 TIW Self-timed Write Cycle Time — 2 2.5 ms D124 TRETD Characteristic Retention — 40 — Year Provided no other specifications are violated † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Self-write and Block Erase. 2: Refer to Section 11.2 “Using the Data EEPROM” for a more detailed discussion on data EEPROM endurance. 3: Required only if single-supply programming is disabled. 4: The MPLAB ICD 2 does not support variable VPP output. Circuitry to limit the ICD 2 VPP voltage must be placed between the ICD 2 and target system when programming or debugging with the ICD 2.
- 392. PIC16(L)F1934/6/7 DS41364E-page 392 2008-2011 Microchip Technology Inc. 30.6 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C Param No. Sym. Characteristic Typ. Units Conditions TH01 JA Thermal Resistance Junction to Ambient 60 C/W 28-pin SPDIP package 80 C/W 28-pin SOIC package 90 C/W 28-pin SSOP package 27.5 C/W 28-pin UQFN 4x4mm package 27.5 C/W 28-pin QFN 6x6mm package 47.2 C/W 40-pin PDIP package 46 C/W 44-pin TQFP package 24.4 C/W 44-pin QFN 8x8mm package TH02 JC Thermal Resistance Junction to Case 31.4 C/W 28-pin SPDIP package 24 C/W 28-pin SOIC package 24 C/W 28-pin SSOP package 24 C/W 28-pin UQFN 4x4mm package 24 C/W 28-pin QFN 6x6mm package 24.7 C/W 40-pin PDIP package 14.5 C/W 44-pin TQFP package 20 C/W 44-pin QFN 8x8mm package TH03 TJMAX Maximum Junction Temperature 150 C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD (1) TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA (2) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature 3: TJ = Junction Temperature
- 393. 2008-2011 Microchip Technology Inc. DS41364E-page 393 PIC16(L)F1934/6/7 30.7 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: FIGURE 30-5: LOAD CONDITIONS 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase letters (pp) and their meanings: pp cc CCP1 osc OSC1 ck CLKOUT rd RD cs CS rw RD or WR di SDI sc SCK do SDO ss SS dt Data in t0 T0CKI io I/O PORT t1 T1CKI mc MCLR wr WR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (High-impedance) V Valid L Low Z High-impedance VSS CL Legend: CL = 50 pF for all pins, 15 pF for OSC2 output Load Condition Pin
- 394. PIC16(L)F1934/6/7 DS41364E-page 394 2008-2011 Microchip Technology Inc. 30.8 AC Characteristics: PIC16(L)F1934/6/7-I/E FIGURE 30-6: CLOCK TIMING TABLE 30-1: CLOCK OSCILLATOR TIMING REQUIREMENTS OSC1/CLKIN OSC2/CLKOUT Q4 Q1 Q2 Q3 Q4 Q1 OS02 OS03 OS04 OS04 OSC2/CLKOUT (LP,XT,HS Modes) (CLKOUT Mode) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C Param No. Sym. Characteristic Min. Typ† Max. Units Conditions OS01 FOSC External CLKIN Frequency(1) DC — 0.5 MHz EC Oscillator mode (low) DC — 4 MHz EC Oscillator mode (medium) DC — 20 MHz EC Oscillator mode (high) Oscillator Frequency(1) — 32.768 — kHz LP Oscillator mode 0.1 — 4 MHz XT Oscillator mode 1 — 4 MHz HS Oscillator mode 1 — 20 MHz HS Oscillator mode, VDD > 2.7V DC — 4 MHz RC Oscillator mode, VDD 2.0V OS02 TOSC External CLKIN Period(1) 27 — s LP Oscillator mode 250 — ns XT Oscillator mode 50 — ns HS Oscillator mode 50 — ns EC Oscillator mode Oscillator Period(1) — 30.5 — s LP Oscillator mode 250 — 10,000 ns XT Oscillator mode 50 — 1,000 ns HS Oscillator mode 250 — — ns RC Oscillator mode OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC OS04* TosH, TosL External CLKIN High, External CLKIN Low 2 — — s LP oscillator 100 — — ns XT oscillator 20 — — ns HS oscillator OS05* TosR, TosF External CLKIN Rise, External CLKIN Fall 0 — ns LP oscillator 0 — ns XT oscillator 0 — ns HS oscillator * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con- sumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
- 395. 2008-2011 Microchip Technology Inc. DS41364E-page 395 PIC16(L)F1934/6/7 TABLE 30-2: OSCILLATOR PARAMETERS TABLE 30-3: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.7V TO 5.5V) Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param No. Sym. Characteristic Freq. Tolerance Min. Typ† Max. Units Conditions OS08 HFOSC Internal Calibrated HFINTOSC Frequency(2) ±2% ±3% — — 16.0 16.0 — — MHz MHz 0°C TA +60°C, VDD 2.5V 60°C TA 85°C, VDD 2.5V ±5% — 16.0 — MHz -40°C TA +125°C OS08A MFOSC Internal Calibrated MFINTOSC Frequency(2) ±2% ±3% — — 500 500 — — kHz kHz 0°C TA +60°C, VDD 2.5V 60°C TA 85°C, VDD 2.5V ±5% — 500 — kHz -40°C TA +125°C OS09 LFOSC Internal LFINTOSC Frequency — — 31 — kHz -40°C TA +125°C OS10* TIOSC ST HFINTOSC Wake-up from Sleep Start-up Time MFINTOSC Wake-up from Sleep Start-up Time — — 3.2 8 s — — 24 35 s * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con- sumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an exter- nal clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. 2: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. 3: By design. Param No. Sym. Characteristic Min. Typ† Max. Units Conditions F10 FOSC Oscillator Frequency Range 4 — 8 MHz F11 FSYS On-Chip VCO System Frequency 16 — 32 MHz F12 TRC PLL Start-up Time (Lock Time) — — 2 ms F13* CLK CLKOUT Stability (Jitter) -0.25% — +0.25% % * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
- 396. PIC16(L)F1934/6/7 DS41364E-page 396 2008-2011 Microchip Technology Inc. FIGURE 30-7: CLKOUT AND I/O TIMING FOSC CLKOUT I/O pin (Input) I/O pin (Output) Q4 Q1 Q2 Q3 OS11 OS19 OS13 OS15 OS18, OS19 OS20 OS21 OS17 OS16 OS14 OS12 OS18 Old Value New Value Write Fetch Read Execute Cycle
- 397. 2008-2011 Microchip Technology Inc. DS41364E-page 397 PIC16(L)F1934/6/7 TABLE 30-4: CLKOUT AND I/O TIMING PARAMETERS FIGURE 30-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param No. Sym. Characteristic Min. Typ† Max. Units Conditions OS11 TosH2ckL FOSC to CLKOUT (1) — — 70 ns VDD = 3.3-5.0V OS12 TosH2ckH FOSC to CLKOUT (1) — — 72 ns VDD = 3.3-5.0V OS13 TckL2ioV CLKOUT to Port out valid(1) — — 20 ns OS14 TioV2ckH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns OS15 TosH2ioV Fosc (Q1 cycle) to Port out valid — 50 70* ns VDD = 3.3-5.0V OS16 TosH2ioI Fosc (Q2 cycle) to Port input invalid (I/O in hold time) 50 — — ns VDD = 3.3-5.0V OS17 TioV2osH Port input valid to Fosc(Q2 cycle) (I/O in setup time) 20 — — ns OS18 TioR Port output rise time — — 40 15 72 32 ns VDD = 1.8V VDD = 3.3-5.0V OS19 TioF Port output fall time — — 28 15 55 30 ns VDD = 1.8V VDD = 3.3-5.0V OS20* Tinp INT pin input high or low time 25 — — ns OS21* Tioc Interrupt-on-change new input level time 25 — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25C unless otherwise stated. Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC. VDD MCLR Internal POR PWRT Time-out OSC Start-Up Time Internal Reset(1) Watchdog Timer 33 32 30 31 34 I/O pins 34 Note 1: Asserted low. Reset(1)
- 398. PIC16(L)F1934/6/7 DS41364E-page 398 2008-2011 Microchip Technology Inc. FIGURE 30-9: BROWN-OUT RESET TIMING AND CHARACTERISTICS VBOR VDD (Device in Brown-out Reset) (Device not in Brown-out Reset) 33(1) Note 1: 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’. 2 ms delay if PWRTE = 0 and VREGEN = 1. Reset (due to BOR) VBOR and VHYST 37
- 399. 2008-2011 Microchip Technology Inc. DS41364E-page 399 PIC16(L)F1934/6/7 TABLE 30-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS FIGURE 30-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param No. Sym. Characteristic Min. Typ† Max. Units Conditions 30 TMCL MCLR Pulse Width (low) 2 — — s 31 TWDTLP Low-Power Watchdog Timer Time-out Period 10 16 27 ms VDD = 3.3V-5V 1:16 Prescaler used 32 TOST Oscillator Start-up Timer Period(1), (2) — 1024 — Tosc (Note 3) 33* TPWRT Power-up Timer Period, PWRTE = 0 40 65 140 ms 34* TIOZ I/O high-impedance from MCLR Low or Watchdog Timer Reset — — 2.0 s 35 VBOR Brown-out Reset Voltage 2.38 1.80 2.5 1.9 2.73 2.11 V BORV=2.5V BORV=1.9V 36* VHYST Brown-out Reset Hysteresis 0 25 60 mV -40°C to +85°C 37* TBORDC Brown-out Reset DC Response Time 1 3 35 s VDD VBOR * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. 2: By design. 3: Period of the slower clock. 4: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. T0CKI T1CKI 40 41 42 45 46 47 49 TMR0 or TMR1
- 400. PIC16(L)F1934/6/7 DS41364E-page 400 2008-2011 Microchip Technology Inc. TABLE 30-6: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS FIGURE 30-11: CAPTURE/COMPARE/PWM TIMINGS (CCP) TABLE 30-7: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP) Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param No. Sym. Characteristic Min. Typ† Max. Units Conditions 40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 42* TT0P T0CKI Period Greater of: 20 or TCY + 40 N — — ns N = prescale value (2, 4, ..., 256) 45* TT1H T1CKI High Time Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 46* TT1L T1CKI Low Time Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 47* TT1P T1CKI Input Period Synchronous Greater of: 30 or TCY + 40 N — — ns N = prescale value (1, 2, 4, 8) Asynchronous 60 — — ns 48 FT1 Timer1 Oscillator Input Frequency Range (oscillator enabled by setting bit T1OSCEN) 32.4 32.768 33.1 kHz 49* TCKEZTMR1 Delay from External Clock Edge to Timer Increment 2 TOSC — 7 TOSC — Timers in Sync mode * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param No. Sym. Characteristic Min. Typ† Max. Units Conditions CC01* TccL CCPx Input Low Time No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns CC02* TccH CCPx Input High Time No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns CC03* TccP CCPx Input Period 3TCY + 40 N — — ns N = prescale value (1, 4 or 16) * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note: Refer to Figure 30-5 for load conditions. (Capture mode) CC01 CC02 CC03 CCPx
- 401. 2008-2011 Microchip Technology Inc. DS41364E-page 401 PIC16(L)F1934/6/7 TABLE 30-8: PIC16(L)F1934/6/7 A/D CONVERTER (ADC) CHARACTERISTICS: TABLE 30-9: PIC16(L)F1934/6/7 A/D CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature Tested at 25°C Param No. Sym. Characteristic Min. Typ† Max. Units Conditions AD01 NR Resolution — — 10 bit AD02 EIL Integral Error — — ±1.7 LSb VREF = 3.0V AD03 EDL Differential Error — — ±1 LSb No missing codes VREF = 3.0V AD04 EOFF Offset Error — — ±2.5 LSb VREF = 3.0V AD05 EGN Gain Error — — ±2.0 LSb VREF = 3.0V AD06 VREF Reference Voltage(3) 1.8 — VDD V VREF = (VREF+ minus VREF-) (Note 5) AD07 VAIN Full-Scale Range VSS — VREF V AD08 ZAIN Recommended Impedance of Analog Voltage Source — — 10 k Can go higher if external 0.01F capacitor is present on input pin. * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Total Absolute Error includes integral, differential, offset and gain errors. 2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 3: ADC VREF is from external VREF, VDD pin or FVR, whichever is selected as reference input. 4: When ADC is off, it will not consume any current other than leakage current. The power-down current specification includes any such leakage from the ADC module. 5: FVR voltage selected must be 2.048V or 4.096V. Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C Param No. Sym. Characteristic Min. Typ† Max. Units Conditions AD130* TAD A/D Clock Period 1.0 — 9.0 s TOSC-based A/D Internal RC Oscillator Period 1.0 2.5 6.0 s ADCS<1:0> = 11 (ADRC mode) AD131 TCNV Conversion Time (not including Acquisition Time)(1) — 11 — TAD Set GO/DONE bit to conversion complete AD132* TACQ Acquisition Time — 5.0 — s * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The ADRES register may be read on the following TCY cycle.
- 402. PIC16(L)F1934/6/7 DS41364E-page 402 2008-2011 Microchip Technology Inc. FIGURE 30-12: PIC16(L)F1934/6/7 A/D CONVERSION TIMING (NORMAL MODE) FIGURE 30-13: PIC16(L)F1934/6/7 A/D CONVERSION TIMING (SLEEP MODE) AD131 AD130 BSF ADCON0, GO Q4 A/D CLK A/D Data ADRES ADIF GO Sample OLD_DATA Sampling Stopped DONE NEW_DATA 7 6 5 3 2 1 0 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 1 TCY 4 AD134 (TOSC/2(1)) 1 TCY AD132 AD132 AD131 AD130 BSF ADCON0, GO Q4 A/D CLK A/D Data ADRES ADIF GO Sample OLD_DATA Sampling Stopped DONE NEW_DATA 7 5 3 2 1 0 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. AD134 4 6 1 TCY (TOSC/2 + TCY (1) ) 1 TCY
- 403. 2008-2011 Microchip Technology Inc. DS41364E-page 403 PIC16(L)F1934/6/7 TABLE 30-10: COMPARATOR SPECIFICATIONS TABLE 30-11: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS FIGURE 30-14: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING Operating Conditions: 1.8V < VDD < 5.5V, -40°C < TA < +125°C (unless otherwise stated). Param No. Sym. Characteristics Min. Typ. Max. Units Comments CM01 VIOFF Input Offset Voltage — ±7.5 ±60 mV High-Power mode CM02 VICM Input Common Mode Voltage 0 — VDD V CM03 CMRR Common Mode Rejection Ratio — 50 — dB CM04A TRESP Response Time Rising Edge — 400 800 ns High-Power mode CM04B Response Time Falling Edge — 200 400 ns High-Power mode CM04C Response Time Rising Edge — 1200 — ns Low-Power mode CM04D Response Time Falling Edge — 550 — ns Low-Power mode CM05 TMC2OV Comparator Mode Change to Output Valid* — — 10 s CM06 CHYSTER Comparator Hysteresis — 45 — mV Hysteresis on * These parameters are characterized but not tested. Note 1: Response time measured with one comparator input at VDD/2, while the other input transitions from VSS to VDD. 2: Comparator Hysteresis is available when the CxHYS bit of the CMxCON0 register is enabled. Operating Conditions: 2.5V < VDD < 5.5V, -40°C < TA < +125°C (unless otherwise stated). Param No. Sym. Characteristics Min. Typ. Max. Units Comments DAC01* CLSB Step Size — VDD/32 — V DAC02* CACC Absolute Accuracy — — 1/2 LSb DAC03* CR Unit Resistor Value (R) — 5000 — DAC04* CST Settling Time(1) — — 10 s * These parameters are characterized but not tested. Note 1: Settling time measured while DACR<4:0> transitions from ‘0000’ to ‘1111’. Note: Refer to Figure 30-5 for load conditions. US121 US121 US120 US122 CK DT
- 404. PIC16(L)F1934/6/7 DS41364E-page 404 2008-2011 Microchip Technology Inc. TABLE 30-12: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS FIGURE 30-15: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING TABLE 30-13: USART SYNCHRONOUS RECEIVE REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param. No. Symbol Characteristic Min. Max. Units Conditions US120 TCKH2DTV SYNC XMIT (Master and Slave) Clock high to data-out valid 3.0-5.5V — 80 ns 1.8-5.5V — 100 ns US121 TCKRF Clock out rise time and fall time (Master mode) 3.0-5.5V — 45 ns 1.8-5.5V — 50 ns US122 TDTRF Data-out rise time and fall time 3.0-5.5V — 45 ns 1.8-5.5V — 50 ns Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param. No. Symbol Characteristic Min. Max. Units Conditions US125 TDTV2CKL SYNC RCV (Master and Slave) Data-hold before CK (DT hold time) 10 — ns US126 TCKL2DTL Data-hold after CK (DT hold time) 15 — ns Note: Refer to Figure 30-5 for load conditions. US125 US126 CK DT
- 405. 2008-2011 Microchip Technology Inc. DS41364E-page 405 PIC16(L)F1934/6/7 FIGURE 30-16: SPI MASTER MODE TIMING (CKE = 0, SMP = 0) FIGURE 30-17: SPI MASTER MODE TIMING (CKE = 1, SMP = 1) SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI SP70 SP71 SP72 SP73 SP74 SP75, SP76 SP78 SP79 SP80 SP79 SP78 MSb LSb bit 6 - - - - - -1 MSb In LSb In bit 6 - - - -1 Note: Refer to Figure 30-5 for load conditions. SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI SP81 SP71 SP72 SP74 SP75, SP76 SP78 SP80 MSb SP79 SP73 MSb In bit 6 - - - - - -1 LSb In bit 6 - - - -1 LSb Note: Refer to Figure 30-5 for load conditions.
- 406. PIC16(L)F1934/6/7 DS41364E-page 406 2008-2011 Microchip Technology Inc. FIGURE 30-18: SPI SLAVE MODE TIMING (CKE = 0) FIGURE 30-19: SPI SLAVE MODE TIMING (CKE = 1) SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI SP70 SP71 SP72 SP73 SP74 SP75, SP76 SP77 SP78 SP79 SP80 SP79 SP78 MSb LSb bit 6 - - - - - -1 MSb In bit 6 - - - -1 LSb In SP83 Note: Refer to Figure 30-5 for load conditions. SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI SP70 SP71 SP72 SP82 SP74 SP75, SP76 MSb bit 6 - - - - - -1 LSb SP77 MSb In bit 6 - - - -1 LSb In SP80 SP83 Note: Refer to Figure 30-5 for load conditions.
- 407. 2008-2011 Microchip Technology Inc. DS41364E-page 407 PIC16(L)F1934/6/7 TABLE 30-14: SPI MODE REQUIREMENTS FIGURE 30-20: I2 C™ BUS START/STOP BITS TIMING Param No. Symbol Characteristic Min. Typ† Max. Units Conditions SP70* TSSL2SCH, TSSL2SCL SS to SCK or SCK input TCY — — ns SP71* TSCH SCK input high time (Slave mode) TCY + 20 — — ns SP72* TSCL SCK input low time (Slave mode) TCY + 20 — — ns SP73* TDIV2SCH, TDIV2SCL Setup time of SDI data input to SCK edge 100 — — ns SP74* TSCH2DIL, TSCL2DIL Hold time of SDI data input to SCK edge 100 — — ns SP75* TDOR SDO data output rise time 3.0-5.5V — 10 25 ns 1.8-5.5V — 25 50 ns SP76* TDOF SDO data output fall time — 10 25 ns SP77* TSSH2DOZ SS to SDO output high-impedance 10 — 50 ns SP78* TSCR SCK output rise time (Master mode) 3.0-5.5V — 10 25 ns 1.8-5.5V — 25 50 ns SP79* TSCF SCK output fall time (Master mode) — 10 25 ns SP80* TSCH2DOV, TSCL2DOV SDO data output valid after SCK edge 3.0-5.5V — — 50 ns 1.8-5.5V — — 145 ns SP81* TDOV2SCH, TDOV2SCL SDO data output setup to SCK edge Tcy — — ns SP82* TSSL2DOV SDO data output valid after SS edge — — 50 ns SP83* TSCH2SSH, TSCL2SSH SS after SCK edge 1.5TCY + 40 — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note: Refer to Figure 30-5 for load conditions. SP91 SP92 SP93 SCL SDA Start Condition Stop Condition SP90
- 408. PIC16(L)F1934/6/7 DS41364E-page 408 2008-2011 Microchip Technology Inc. TABLE 30-15: I2C™ BUS START/STOP BITS REQUIREMENTS FIGURE 30-21: I2 C™ BUS DATA TIMING Param No. Symbol Characteristic Min. Typ Max. Units Conditions SP90* TSU:STA Start condition 100 kHz mode 4700 — — ns Only relevant for Repeated Start condition Setup time 400 kHz mode 600 — — SP91* THD:STA Start condition 100 kHz mode 4000 — — ns After this period, the first clock pulse is generated Hold time 400 kHz mode 600 — — SP92* TSU:STO Stop condition 100 kHz mode 4700 — — ns Setup time 400 kHz mode 600 — — SP93 THD:STO Stop condition 100 kHz mode 4000 — — ns Hold time 400 kHz mode 600 — — * These parameters are characterized but not tested. Note: Refer to Figure 30-5 for load conditions. SP90 SP91 SP92 SP100 SP101 SP103 SP106 SP107 SP109 SP109 SP110 SP102 SCL SDA In SDA Out
- 409. 2008-2011 Microchip Technology Inc. DS41364E-page 409 PIC16(L)F1934/6/7 TABLE 30-16: I2C™ BUS DATA REQUIREMENTS Param. No. Symbol Characteristic Min. Max. Units Conditions SP100* THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a minimum of 1.5 MHz 400 kHz mode 0.6 — s Device must operate at a minimum of 10 MHz SSP module 1.5TCY — SP101* TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a minimum of 1.5 MHz 400 kHz mode 1.3 — s Device must operate at a minimum of 10 MHz SSP module 1.5TCY — SP102* TR SDA and SCL rise time 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1CB 300 ns CB is specified to be from 10-400 pF SP103* TF SDA and SCL fall time 100 kHz mode — 250 ns 400 kHz mode 20 + 0.1CB 250 ns CB is specified to be from 10-400 pF SP106* THD:DAT Data input hold time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 s SP107* TSU:DAT Data input setup time 100 kHz mode 250 — ns (Note 2) 400 kHz mode 100 — ns SP109* TAA Output valid from clock 100 kHz mode — 3500 ns (Note 1) 400 kHz mode — — ns SP110* TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free before a new transmission can start 400 kHz mode 1.3 — s SP111 CB Bus capacitive loading — 400 pF * These parameters are characterized but not tested. Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 2: A Fast mode (400 kHz) I2 C™ bus device can be used in a Standard mode (100 kHz) I2 C bus system, but the requirement TSU:DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2 C bus specification), before the SCL line is released.
- 410. PIC16(L)F1934/6/7 DS41364E-page 410 2008-2011 Microchip Technology Inc. TABLE 30-17: CAP SENSE OSCILLATOR SPECIFICATIONS FIGURE 30-22: CAP SENSE OSCILLATOR Param. No. Symbol Characteristic Min. Typ† Max. Units Conditions CS01 ISRC Current Source High -3 -8 -15 A Medium -0.8 -1.5 -3 A Low -0.1 -0.3 -0.4 A CS02 ISNK Current Sink High 2.5 7.5 14 A Medium 0.6 1.5 2.9 A Low 0.1 0.25 0.6 A CS03 VCTH Cap Threshold — 0.8 — mV CS04 VCTL Cap Threshold — 0.4 — mV CS05 VCHYST Cap Hysteresis (VCTH-VCTL) High Medium Low 350 250 175 525 375 300 725 500 425 mV mV mV * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. ISRC VCTH VCTL ISNK Enabled Enabled
- 411. 2008-2011 Microchip Technology Inc. DS41364E-page 411 PIC16(L)F1934/6/7 31.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS FIGURE 31-1: PIC16F1934/6/7 RESET VOLTAGE, BOR = 1.9V FIGURE 31-2: PIC16F1934/6/7 HYSTERESIS, BOR = 1.9V 1.800 1.850 1.900 1.950 2.000 2.050 2.100 -40°C 25°C 85°C 125°C Max. Min. Voltage (V) Temperature (Celsius) Max.: High Power + 3 Min.: Low Power -3 Typical Min. Max. 0 0.005 0.01 0.015 0.02 0.025 0.03 0.035 -40°C 25°C 85°C 125°C Voltage (V) Temperature (Celsius) Max.: Typical + 3 Min.: Typical -3
- 412. PIC16(L)F1934/6/7 DS41364E-page 412 2008-2011 Microchip Technology Inc. FIGURE 31-3: PIC16F1934/6/7 RESET VOLTAGE, BOR = 2.5V FIGURE 31-4: PIC16F1934/6/7 HYSTERESIS, BOR = 2.5V 2.350 2.400 2.450 2.500 2.550 2.600 2.650 -40°C 25°C 85°C 125°C Max. Min. Voltage (V) Temperature (Celsius) Max.: High Power + 3 Min.: Low Power -3 Typical Min. Max. 0 0.01 0.02 0.03 0.04 0.05 0.06 -40°C 25°C 85°C 125°C Voltage (V) Temperature (Celsius) Max.: Typical + 3 Min.: Typical -3
- 413. 2008-2011 Microchip Technology Inc. DS41364E-page 413 PIC16(L)F1934/6/7 FIGURE 31-5: PIC16F1934/6/7 POR RELEASE FIGURE 31-6: PIC16F1934/6/7 COMPARATOR HYSTERESIS, HIGH-POWER MODE Typical Min. Max. 1.5 1.52 1.54 1.56 1.58 1.6 1.62 1.64 1.66 1.68 1.7 -40°C 25°C 85°C 125°C Release Voltage (V) Temperature (Celsius) Max.: Maximum + 3 Min.: Minimum -3 Min: -40°C Typical: 25°C Max.: 125°C 0 10 20 30 40 50 60 70 80 90 1.8 3 3.6 5.5 Hysteresis (mV) VDD (V) Max.: Maximum + 3 Min.: Minimum -3
- 414. PIC16(L)F1934/6/7 DS41364E-page 414 2008-2011 Microchip Technology Inc. FIGURE 31-7: PIC16F1934/6/7 COMPARATOR HYSTERESIS, LOW-POWER MODE FIGURE 31-8: PIC16F1934/6/7 COMPARATOR OFFSET, HIGH-POWER MODE, VDD = 5.5V Min.: -40°C Typical: 25°C Max.: 125°C 0 2 4 6 8 10 12 14 16 1.8 5.5 Hysteresis (mV) VDD (V) Max.: Maximum + 3 Min.: Minimum -3 Max. Typical Min. -60 -40 -20 0 20 40 60 0.2 1 1.8 2.6 3.4 4.2 5 Offset (mV) Common Mode Voltage (V) Max.: Maximum + 3 Min.: Minimum -3
- 415. 2008-2011 Microchip Technology Inc. DS41364E-page 415 PIC16(L)F1934/6/7 FIGURE 31-9: PIC16F1934/6/7 COMPARATOR RESPONSE TIME, HIGH-POWER MODE FIGURE 31-10: TYPICAL COMPARATOR RESPONSE TIME OVER TEMPERATURE, HIGH-POWER MODE Typical Max. 0 50 100 150 200 250 300 350 1.8 2 2.5 3 3.6 5.5 Time (nSeconds) VDD (V) Max.: Maximum + 3 Min.: Minimum -3 -40°C 25°C 85°C 125°C 135 140 145 150 155 160 165 170 1.8 2 2.5 3 3.6 5.5 Time (nSeconds) VDD (V)
- 416. PIC16(L)F1934/6/7 DS41364E-page 416 2008-2011 Microchip Technology Inc. FIGURE 31-11: VOH vs. IOH OVER TEMPERATURE (VDD = 5.0V) FIGURE 31-12: VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V) FIGURE 31-13: VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V) 0 1 2 3 4 5 6 0 -2.5 -5 -7.5 -10 -12.5 -15 -17.5 -20 -22.5 -25 -27.5 -30 Typ.: 25°C Max.: -40°C Min.: 125°C IOH (mA) Max.: Maximum + 3 Min.: Minimum -3 V OH (V) 0 1 2 3 4 5 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 Max.: 125°C Typ.: 25°C Min.: -40°C V OL (V) IOL (mA) Max.: Maximum + 3 Min.: Minimum -3 0 0.5 1 1.5 2 2.5 3 3.5 -15 -12.5 -10 -7.5 -5 -2.5 0 Typ.: 25°C Max.: -40°C Min.: 125°C IOH (mA) Max.: Maximum + 3 Min.: Minimum -3 V OH (V)
- 417. 2008-2011 Microchip Technology Inc. DS41364E-page 417 PIC16(L)F1934/6/7 FIGURE 31-14: VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V) FIGURE 31-15: VOH vs. IOH OVER TEMPERATURE (VDD = 1.8V) FIGURE 31-16: VOL vs. IOL OVER TEMPERATURE (VDD = 1.8V) 0 0.5 1 1.5 2 2.5 3 0 5 10 15 20 25 30 Max.: 125°C Typ.: 25°C Min.: -40°C V OL (V) IOL (mA) Max.: Maximum + 3 Min.: Minimum -3 Typ.: 25°C Max.: -40°C Min.: 125°C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 -5 -4.5 -4 -3.5 -3 -2.5 -2 -1.5 -1 -0.5 0 IOH (mA) V OH (V) Max.: Maximum + 3 Min.: Minimum -3 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 1 2 3 4 5 6 7 8 9 10 Max.: 125°C Typ.: 25°C Min.: -40°C V OL (V) IOL (mA) Max.: Maximum + 3 Min.: Minimum -3
- 418. PIC16(L)F1934/6/7 DS41364E-page 418 2008-2011 Microchip Technology Inc. FIGURE 31-17: PIC16LF1937 HF INTOSC MODE, FOSC = 8 MHz FIGURE 31-18: PIC16F1937 MF INTOSC MODE, FOSC = 500 kHz FIGURE 31-19: PIC16LF1937 HF INTOSC MODE, FOSC = 16 MHz Max. Typical 1 1.2 1.4 1.6 1.8 2 2.2 2.4 1.8 2 2.5 3 3.3 3.6 Max.: 25°C + 3 Typical: 25°C I DD (mA) VDD (V) Max. Typical 100 150 200 250 300 350 400 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 VDD (V) I DD (µA) Max.: 25°C + 3 Typical: 25°C Max. Typical 1.5 2 2.5 3 3.5 4 1.8 2 2.5 3 3.3 3.6 VDD (V) I DD (mA) Max.: 25°C + 3 Typical: 25°C
- 419. 2008-2011 Microchip Technology Inc. DS41364E-page 419 PIC16(L)F1934/6/7 FIGURE 31-20: PIC16F1937 HF INTOSC MODE, FOSC = 16 MHz FIGURE 31-21: PIC16F1937 HF INTOSC MODE, FOSC = 8 MHz FIGURE 31-22: PIC16F1937 LF INTOSC MODE, FOSC = 32 kHz Max. Typical 1.25 1.75 2.25 2.75 3.25 3.75 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 VDD (V) I DD (mA) Max.: 25°C + 3 Typical: 25°C Max. Typical 0.75 0.95 1.15 1.35 1.55 1.75 1.95 2.15 1.8 2 2.5 3 3.3 3.6 4.2 5.5 I DD (mA) 5 4.5 Max.: 25°C + 3 Typical: 25°C VDD (V) Typical Max. 20 25 30 35 40 45 50 55 60 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I DD (µA) VDD (V) Max.: 85°C + 3 Typical: 25°C
- 420. PIC16(L)F1934/6/7 DS41364E-page 420 2008-2011 Microchip Technology Inc. FIGURE 31-23: PIC16LF1937 LF INTOSC MODE, FOSC = 32 kHz FIGURE 31-24: PIC16LF1937 MF INTOSC MODE, FOSC = 500 kHz FIGURE 31-25: PIC16LF1937 LP OSCILLATOR MODE, FOSC = 32 kHz Typical Max. 2 4 6 8 10 12 14 16 1.8 2 2.5 3 3.3 3.6 VDD (V) I DD (µA) Max.: 85°C + 3 Typical: 25°C Max. Typical 75 95 115 135 155 175 195 215 1.8 2 2.5 3 3.3 3.6 VDD (V) I DD (mA) Max.: 25°C + 3 Typical: 25°C Typical Max. 0 2 4 6 8 10 12 14 16 18 1.8 2 2.5 3 3.3 3.6 Max.: 85°C + 3 Typical: 25°C I DD (µA) VDD (V)
- 421. 2008-2011 Microchip Technology Inc. DS41364E-page 421 PIC16(L)F1934/6/7 FIGURE 31-26: PIC16F1937 LP OSCILLATOR MODE, FOSC = 32 kHz FIGURE 31-27: PIC16LF1937 HS OSCILLATOR MODE, FOSC = 32 MHz FIGURE 31-28: PIC16F1937 HS OSCILLATOR MODE, FOSC = 32 MHz Typical Max. 20 25 30 35 40 45 50 55 60 65 70 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I DD (µA) VDD (V) Max.: 85°C + 3 Typical: 25°C Max. Typical 2 3 4 5 6 7 1.8 2 2.5 3 3.3 3.6 I DD (mA) VDD (V) Max.: 25°C + 3 Typical: 25°C Max. Typical 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I DD (mA) VDD (V) Max.: -40°C + 3 Typical: 25°C
- 422. PIC16(L)F1934/6/7 DS41364E-page 422 2008-2011 Microchip Technology Inc. FIGURE 31-29: PIC16LF1937 EXTRC MODE, FOSC = 4 MHz FIGURE 31-30: PIC16LF1937 XT OSCILLATOR, FOSC = 1 MHz FIGURE 31-31: PIC16F1937 XT OSCILLATOR, FOSC = 1 MHz Max. Typical 200 300 400 500 600 700 800 900 1000 1.8 2 2.5 3 3.3 3.6 VDD (V) I DD (µA) Max.: 125°C + 3 Typical: 25°C Max. Typical 50 100 150 200 250 300 350 400 1.8 2 2.5 3 3.3 3.6 VDD (V) I DD (µA) Max.: 125°C + 3 Typical: 25°C Max. Typical 100 150 200 250 300 350 400 450 500 550 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 VDD (V) Current (µA)
- 423. 2008-2011 Microchip Technology Inc. DS41364E-page 423 PIC16(L)F1934/6/7 FIGURE 31-32: PIC16LF1937 XT OSCILLATOR, FOSC = 4 MHz FIGURE 31-33: PIC16F1937 XT OSCILLATOR, FOSC = 4 MHz FIGURE 31-34: PIC16LF1937 EC OSCILLATOR, HIGH-POWER MODE, FOSC = 32 MHz Max. Typical 200 300 400 500 600 700 800 900 1000 1100 1.8 2 2.5 3 3.3 3.6 VDD (V) Max.: 125°C + 3 Typical: 25°C I DD (µA) Max. Typical 300 400 500 600 700 800 900 1000 1100 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 Max.: 125°C + 3 Typical: 25°C VDD (V) Current (µA) Typical Max. 2 3 4 5 6 7 8 1.8 2 2.5 3 3.3 3.6 I DD (mA) VDD (V) Max.: 125°C + 3 Typical: 25°C
- 424. PIC16(L)F1934/6/7 DS41364E-page 424 2008-2011 Microchip Technology Inc. FIGURE 31-35: PIC16F1937 EC OSCILLATOR, HIGH-POWER MODE, FOSC = 32 MHz FIGURE 31-36: PIC16LF1937 EC OSCILLATOR, MEDIUM-POWER MODE, FOSC = 4 MHz FIGURE 31-37: PIC16F1937 EC OSCILLATOR, MEDIUM-POWER MODE, FOSC = 4 MHz Typical Max. 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 VDD (V) Current (mA) Max.: -40°C + 3 Typical: 25°C Max. Typical 200 300 400 500 600 700 800 900 1000 1.8 2 2.5 3 3.3 3.6 VDD (V) I DD (µA) Max.: 125°C + 3 Typical: 25°C Max. Typical 300 400 500 600 700 800 900 1000 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 VDD (V) I DD (µA) Max.: 125°C + 3 Typical: 25°C
- 425. 2008-2011 Microchip Technology Inc. DS41364E-page 425 PIC16(L)F1934/6/7 FIGURE 31-38: PIC16LF1937 EC OSCILLATOR, LOW-POWER MODE, FOSC = 500 kHz FIGURE 31-39: PIC16F1937 EC OSCILLATOR, LOW-POWER MODE, FOSC = 500 kHz FIGURE 31-40: PIC16F1937 EXTRC MODE, FOSC = 4 MHz Max. Typical 0 20 40 60 80 100 120 140 160 1.8 2 2.5 3 3.3 3.6 VDD (V) I DD (µA) Max.: 125°C + 3 Typical: 25°C Max. Typical 40 60 80 100 120 140 160 180 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 VDD (V) I DD (µA) Max.: 125°C + 3 Typical: 25°C Max. Typical 300 400 500 600 700 800 900 1000 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 VDD (V) I DD (µA) Max.: 125°C + 3 Typical: 25°C
- 426. PIC16(L)F1934/6/7 DS41364E-page 426 2008-2011 Microchip Technology Inc. FIGURE 31-41: PIC16LF1937 LCD, LOW POWER FIGURE 31-42: PIC16LF1937 LCD, MEDIUM POWER Max. Typical 0 1 2 3 4 5 6 1.7 1.8 2 2.5 3 3.3 3.6 VDD (V) I PD (µA) Max.: 85°C + 3 Typical: 25°C Max. Typical 0 2 4 6 8 10 12 14 16 18 1.8 2 2.5 3 3.3 3.6 VDD (V) I PD (µA) Max.: 85°C + 3 Typical: 25°C
- 427. 2008-2011 Microchip Technology Inc. DS41364E-page 427 PIC16(L)F1934/6/7 FIGURE 31-43: PIC16LF1937 LCD, HIGH POWER FIGURE 31-44: PIC16LF1937 A/D CURRENT FIGURE 31-45: PIC16F1937 A/D CURRENT Max. Typical 0 20 40 60 80 100 120 1.7 1.8 2 2.5 3 3.3 VDD (V) Max.: 85°C + 3 Typical: 25°C I PD (µA) Typical Max. 0 20 40 60 80 100 120 140 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 85°C + 3 Typical: 25°C Typical Max. 0 10 20 30 40 50 60 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 85°C + 3 Typical: 25°C
- 428. PIC16(L)F1934/6/7 DS41364E-page 428 2008-2011 Microchip Technology Inc. FIGURE 31-46: PIC16LF1937 HF INTOSC FIGURE 31-47: PIC16F1937 HF INTOSC FIGURE 31-48: PIC16LF1937 COMPARATOR 1, HIGH POWER Max. Typical 0.01 0.1 1 10 100 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C Max. Typical 0 10 20 30 40 50 60 70 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C Max. Typical 20 25 30 35 40 45 50 55 60 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C
- 429. 2008-2011 Microchip Technology Inc. DS41364E-page 429 PIC16(L)F1934/6/7 FIGURE 31-49: PIC16F1937 COMPARATOR 1, HIGH POWER FIGURE 31-50: PIC16LF1937 COMPARATOR 1, LOW POWER Max. Typical 30 40 50 60 70 80 90 100 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C Max. Typical 5 6 7 8 9 10 11 12 13 14 15 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C
- 430. PIC16(L)F1934/6/7 DS41364E-page 430 2008-2011 Microchip Technology Inc. FIGURE 31-51: PIC16F1937 COMPARATOR 1, LOW POWER FIGURE 31-52: PIC16LF1937 CAP SENSE, HIGH POWER Max. Typical 20 25 30 35 40 45 50 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C Max. Typical 0 10 20 30 40 50 60 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C
- 431. 2008-2011 Microchip Technology Inc. DS41364E-page 431 PIC16(L)F1934/6/7 FIGURE 31-53: PIC16F1937 CAP SENSE, HIGH POWER FIGURE 31-54: PIC16LF1937 CAP SENSE, MEDIUM POWER FIGURE 31-55: PIC16F1937 CAP SENSE, MEDIUM POWER Max. Typical 0 20 40 60 80 100 120 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C Max. Typical 0 2 4 6 8 10 12 14 16 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C Max. Typical 10 20 30 40 50 60 70 80 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C
- 432. PIC16(L)F1934/6/7 DS41364E-page 432 2008-2011 Microchip Technology Inc. FIGURE 31-56: PIC16LF1937 COMPARATOR 2, HIGH POWER FIGURE 31-57: PIC16F1937 COMPARATOR 2, HIGH POWER FIGURE 31-58: PIC16LF1937 COMPARATOR 2, LOW POWER Max. Typical 20 25 30 35 40 45 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C Max. Typical 30 35 40 45 50 55 60 65 70 75 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C Max. Typical 0 2 4 6 8 10 12 14 16 18 20 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C
- 433. 2008-2011 Microchip Technology Inc. DS41364E-page 433 PIC16(L)F1934/6/7 FIGURE 31-59: PIC16F1937 COMPARATOR 2, LOW POWER FIGURE 31-60: PIC16LF1937 CAP SENSE, LOW POWER FIGURE 31-61: PIC16F1937 CAP SENSE, LOW POWER Max. Typical 20 25 30 35 40 45 50 55 60 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C Max. Typical 0 2 4 6 8 10 12 14 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C Max. Typical 0 10 20 30 40 50 60 70 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 125°C + 3 Typical: 25°C
- 434. PIC16(L)F1934/6/7 DS41364E-page 434 2008-2011 Microchip Technology Inc. FIGURE 31-62: PIC16LF1937 TIMER 1 OSCILLATOR FIGURE 31-63: PIC16F1937 TIMER 1 OSCILLATOR FIGURE 31-64: PIC16LF1937 BOR CURRENT Max. Typical 0 1 2 3 4 5 6 7 8 9 10 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 85°C + 3 Typical: 25°C Max. Typical 0 10 20 30 40 50 60 70 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 85°C + 3 Typical: 25°C Max. Typical 0 5 10 15 20 25 3 3.6 4 I PD (µA) VDD (V) Max.: 85°C + 3 Typical: 25°C
- 435. 2008-2011 Microchip Technology Inc. DS41364E-page 435 PIC16(L)F1934/6/7 FIGURE 31-65: PIC16F1937 BOR CURRENT FIGURE 31-66: PIC16LF1937 FVR_ADC Max. Typical 0 20 40 60 80 100 120 140 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 85°C + 3 Typical: 25°C Max. Typical 0 5 10 15 20 25 30 1.8 2 2.5 3 3.6 I PD (µA) VDD (V) Max.: 85°C + 3 Typical: 25°C
- 436. PIC16(L)F1934/6/7 DS41364E-page 436 2008-2011 Microchip Technology Inc. FIGURE 31-67: PIC16F1937 FVR_ADC FIGURE 31-68: PIC16LF1937 WDT Max. Typical 0 20 40 60 80 100 120 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) VDD (V) Max.: 85°C + 3 Typical: 25°C Max. Typical 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 1.8 2 2.5 3 3.6 I PD (µA) Max.: 85°C + 3 Typical: 25°C VDD (V)
- 437. 2008-2011 Microchip Technology Inc. DS41364E-page 437 PIC16(L)F1934/6/7 FIGURE 31-69: PIC16F1937 WDT FIGURE 31-70: PIC16LF1937 FVR_DAC FIGURE 31-71: PIC16F1937 FVR_DAC Max. Typical 0 5 10 15 20 25 30 35 40 45 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) Max.: 85°C + 3 Typical: 25°C VDD (V) Max. Typical 0 5 10 15 20 25 30 1.8 2 2.5 3 3.6 I PD (µA) Max.: 85°C + 3 Typical: 25°C VDD (V) Max. Typical 0 20 40 60 80 100 120 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 I PD (µA) Max.: 85°C + 3 Typical: 25°C VDD (V)
- 438. PIC16(L)F1934/6/7 DS41364E-page 438 2008-2011 Microchip Technology Inc. FIGURE 31-72: PIC16LF1937 BASE IPD FIGURE 31-73: PIC16F1937 BASE IPD Typical Max. 0.1 1 10 100 1.8 2 2.5 3 3.6 Max.: 85°C + 3 Typical: 25°C I PD (µA) VDD (V) Typical Max. 0 5 10 15 20 25 30 35 40 45 1.8 2 2.5 3 3.3 3.6 4.2 4.5 5 5.5 Max.: 85°C + 3 Typical: 25°C I PD (µA) VDD (V)
- 439. 2008-2011 Microchip Technology Inc. DS41364E-page 439 PIC16(L)F1934/6/7 32.0 DEVELOPMENT SUPPORT The PIC® microcontrollers and dsPIC® digital signal controllers are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® IDE Software • Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers - MPLAB ICD 3 - PICkit™ 3 Debug Express • Device Programmers - PICkit™ 2 Programmer - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits 32.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either C or assembly) • One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power.
- 440. PIC16(L)F1934/6/7 DS41364E-page 440 2008-2011 Microchip Technology Inc. 32.2 MPLAB C Compilers for Various Device Families The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal control- lers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 32.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, pre- processor, and one-step driver, and can run on multiple platforms. 32.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 32.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 32.6 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • Support for the entire device instruction set • Support for fixed-point and floating-point data • Command line interface • Rich directive set • Flexible macro language • MPLAB IDE compatibility
- 441. 2008-2011 Microchip Technology Inc. DS41364E-page 441 PIC16(L)F1934/6/7 32.7 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulat- ing the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The soft- ware simulator offers the flexibility to develop and debug code outside of the hardware laboratory envi- ronment, making it an excellent, economical software development tool. 32.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with in- circuit debugger systems (RJ11) or with the new high- speed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 32.9 MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Micro- chip’s most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Sig- nal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC® Flash microcon- trollers and dsPIC® DSCs with the powerful, yet easy- to-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is con- nected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 32.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and program- ming of PIC® and dsPIC® Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer’s PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to imple- ment in-circuit debugging and In-Circuit Serial Pro- gramming™. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software.
- 442. PIC16(L)F1934/6/7 DS41364E-page 442 2008-2011 Microchip Technology Inc. 32.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express The PICkit™ 2 Development Programmer/Debugger is a low-cost development tool with an easy to use inter- face for programming and debugging Microchip’s Flash families of microcontrollers. The full featured Windows® programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip’s powerful MPLAB Integrated Development Environment (IDE) the PICkit™ 2 enables in-circuit debugging on most PIC® microcon- trollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a break- point, the file registers can be examined and modified. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. 32.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modu- lar, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. 32.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully func- tional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demon- stration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA® , PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits.
- 443. 2008-2011 Microchip Technology Inc. DS41364E-page 443 PIC16(L)F1934/6/7 33.0 PACKAGING INFORMATION 33.1 Package Marking Information 40-Lead PDIP (600 mil) Example XXXXXXXXXXXXXXXXXX YYWWNNN XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX 3 e PIC16F1937 1048017 -I/P * Standard PICmicro® device marking consists of Microchip part number, year code, week code and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 28-Lead SOIC (7.50 mm) Example YYWWNNN XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX 0810017 -I/SO 3 e PIC16F1936 28-Lead SPDIP (300 mil) Example XXXXXXXXXXXXXXX YYWWNNN XXXXXXXXXXXXXXX XXXXXXXXXXXXXXX 3 e PIC16F1936 1048017 -I/SP
- 444. PIC16(L)F1934/6/7 DS41364E-page 444 2008-2011 Microchip Technology Inc. Package Marking Information (Continued) 28-Lead SSOP (5.30 mm) Example PIC16F1936 0810017 -I/SS 3 e 28-Lead UQFN (4x4x0.5 mm) Example PIN 1 PIN 1 PIC16 048017 F1936 I/ML 3 e 40-Lead UQFN (5x5x0.5 mm) Example PIN 1 PIN 1 3 e PIC16F1937 -I/ML 0810017
- 445. 2008-2011 Microchip Technology Inc. DS41364E-page 445 PIC16(L)F1934/6/7 Package Marking Information (Continued) 44-Lead TQFP (10x10x1 mm) Example XXXXXXXXXX YYWWNNN XXXXXXXXXX XXXXXXXXXX PIC16F1937 0810017 -I/PT 3 e 44-Lead QFN (8x8x0.9 mm) Example XXXXXXXXXXX XXXXXXXXXXX YYWWNNN XXXXXXXXXXX PIN 1 PIN 1 3 e PIC16F1937 -I/ML 0810017
- 446. PIC16(L)F1934/6/7 DS41364E-page 446 2008-2011 Microchip Technology Inc. 33.2 Package Details The following sections give the technical details of the packages. ! !#$% ' ()'!) #* # +%, ! - '! !#.# #' #%! ! ! #%! ! !! $#/ !# '! # .0 1,2 1!'! $ ! ** ! ! 3 ' ! 4# *!( !! 4 % # 255***' '5 4 6! 7,8. '! 9'! 7 7: ; 7') %! 7 1, = = ##4 4!! - 1! = = # # # . - -- ##4# . : 9 - -? 9 - 9# 4!! 6 9## ) 9 * 9## ) : * + 1 = = - NOTE 1 N 1 2 D E1 eB c E L A2 e b b1 A1 A 3 * ,1
- 447. 2008-2011 Microchip Technology Inc. DS41364E-page 447 PIC16(L)F1934/6/7 # $ ! !#$% ' ()'!) #* # +%, ! - '! !#.# #' #%! ! ! #%! ! !! $#/ !# '! # .0 1,2 1!'! $ ! ** ! ! 3 ' ! 4# *!( !! 4 % # 255***' '5 4 6! 7,8. '! 9'! 7 7: ; 7') %! 7 1, = = ##4 4!! = 1! = = # # # . = ? ##4# . = : 9 = 9 = 9# 4!! = 6 9## ) - = 9 * 9## ) = - : * + 1 = = N NOTE 1 E1 D 1 2 3 A A1 b1 b e c eB E L A2 * ,?1
- 448. PIC16(L)F1934/6/7 DS41364E-page 448 2008-2011 Microchip Technology Inc. % % ' ()* %+ ! !#$% ' ()'!) #* # +%, ! - '! !#.# #' #%! ! ! #%! ! !! $#'' !# '! # .0 1,2 1!'! $ ! ** ! .32 % '! (!* (% % ' !! ! 3 ' ! 4# *!( !! 4 % # 255***' '5 4 6! 99. . '! 9'! 7 7: ; 7') %! 7 1, : 8 = = ? ##4 4!! = = # %%+ = - : # . -1, ##4# . 1, : 9 1, , '% @ A = 3 9 9 = 3 9 .3 3 B = B 9# 4!! = -- 9## ) - = # % B = B # %1 ' B = B c h h L L1 A2 A1 A NOTE 1 1 2 3 b e E E1 D φ β α N * ,1
- 449. 2008-2011 Microchip Technology Inc. DS41364E-page 449 PIC16(L)F1934/6/7 ,- % *) % ! !#$% ' ()'!) #* # '! !#.# #' #%! ! ! #%! ! !! $#'' !# - '! # .0 1,2 1!'! $ ! ** ! .32 % '! (!* (% % ' !! ! 3 ' ! 4# *!( !! 4 % # 255***' '5 4 6! 99. . '! 9'! 7 7: ; 7') %! 7 ?1, : 8 = = ##4 4!! ? # %% = = : # . ##4# . - ? : 9 3 9 9 3 9 .3 9# 4!! = 3 B B B 9## ) = - L L1 c A2 A1 A E E1 D N 1 2 NOTE 1 b e φ * ,-1
- 450. PIC16(L)F1934/6/7 DS41364E-page 450 2008-2011 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
- 451. 2008-2011 Microchip Technology Inc. DS41364E-page 451 PIC16(L)F1934/6/7 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
- 452. PIC16(L)F1934/6/7 DS41364E-page 452 2008-2011 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
- 453. 2008-2011 Microchip Technology Inc. DS41364E-page 453 PIC16(L)F1934/6/7 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
- 454. PIC16(L)F1934/6/7 DS41364E-page 454 2008-2011 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
- 455. 2008-2011 Microchip Technology Inc. DS41364E-page 455 PIC16(L)F1934/6/7 ## ., / 01 . 23232 ' ) ./0 ! !#$% ' ()'!) #* # , '% ! ! Y!Z' - '! !#.# #' #%! ! ! #%! ! !! $#'' !# '! # .0 1,2 1!'! $ ! ** ! .32 % '! (!* (% % ' !! ! 3 ' ! 4# *!( !! 4 % # 255***' '5 4 6! 99. . '! 9'! 7 7: ; 7') %9#! 7 9# 1, : 8 = = ##4 4!! # %% = 3 9 9 ? 3 9 .3 3 B -B B : # . 1, : 9 1, ##4# . 1, ##49 1, 9# 4!! = 9## ) - - # % B B -B # %1 ' B B -B A E E1 D D1 e b NOTE 1 NOTE 2 N 1 2 3 c A1 L A2 L1 α φ β * ,?1
- 456. PIC16(L)F1934/6/7 DS41364E-page 456 2008-2011 Microchip Technology Inc. ## ., / 01 . 23232 ' ) ./0 ! 3 ' ! 4# *!( !! 4 % # 255***' '5 4
- 457. 2008-2011 Microchip Technology Inc. DS41364E-page 457 PIC16(L)F1934/6/7 ## / 0' ! 4 5 3 /0! ! !#$% ' ()'!) #* # 4!!*!# - '! # .0 1,2 1!'! $ ! ** ! .32 % '! (!* (% % ' !! ! 3 ' ! 4# *!( !! 4 % # 255***' '5 4 6! 99. . '! 9'! 7 7: ; 7') %! 7 ?1, : 8 # %% , 4!! - .3 : # . 1, .$ !### . ?- ? ? : 9 1, .$ !##9 ?- ? ? , # ) - - , 9 9 - , .$ !## [ = = D EXPOSED PAD D2 e b K L E2 2 1 N NOTE 1 2 1 E N BOTTOM VIEW TOP VIEW A3 A1 A * ,-1
- 458. PIC16(L)F1934/6/7 DS41364E-page 458 2008-2011 Microchip Technology Inc. ## / 0' ! 4 5 3 /0! ! 3 ' ! 4# *!( !! 4 % # 255***' '5 4
- 459. 2008-2011 Microchip Technology Inc. DS41364E-page 459 PIC16(L)F1934/6/7 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (12/2008) Original release Revision B (04/2009) Revised data sheet title; Revised Features section. Revision C (10/2009) Added PIC16L/LF1933/34. General updates. Revision D (12/2009) General updates. Revision E (5/2011) Separated 193X data sheet into three separate data sheets. Added Characterization Data. APPENDIX B: MIGRATING FROM OTHER PIC® DEVICES This discusses some of the issues in migrating from other PIC® devices to the PIC16(L)F1934/6/7 family of devices. B.1 PIC16F917 to PIC16F1937 TABLE B-1: FEATURE COMPARISON Feature PIC16F917 PIC16F1937 Max. Operating Speed 20 MHz 32 MHz Max. Program Memory (Words) 8K 8K Max. SRAM (Bytes) 368 512 A/D Resolution 10-bit 10-bit Timers (8/16-bit) 2/1 4/1 Oscillator Modes 4 8 Brown-out Reset Y Y Internal Pull-ups RB7:0 RB7:0 Interrupt-on-change RB7:4 RB7:0 Comparator 2 2 AUSART/EUSART 1/0 0/1 Extended WDT Y Y Software Control Option of WDT/BOR N Y INTOSC Frequencies 30 kHz - 8 MHz 500 kHz - 32 MHz Clock Switching Y Y Capacitive Sensing N Y CCP/ECCP 2/0 2/3 Enhanced PIC16 CPU N Y MSSP/SSP 0/1 1/0 LCD Y Y
- 460. PIC16(L)F1934/6/7 DS41364E-page 460 2008-2011 Microchip Technology Inc. NOTES:
- 461. 2008-2011 Microchip Technology Inc. DS41364E-page 461 PIC16(L)F1934/6/7 INDEX A A/D Specifications............................................................ 403 Absolute Maximum Ratings (PIC16F/LF1934/36/37) ....... 381 AC Characteristics Industrial and Extended ............................................ 396 Load Conditions........................................................ 395 ACKSTAT ......................................................................... 276 ACKSTAT Status Flag ...................................................... 276 ADC .................................................................................. 159 Acquisition Requirements ......................................... 169 Associated registers.................................................. 171 Block Diagram........................................................... 159 Calculating Acquisition Time..................................... 169 Channel Selection..................................................... 160 Configuration............................................................. 160 Configuring Interrupt ................................................. 164 Conversion Clock...................................................... 160 Conversion Procedure .............................................. 164 Internal Sampling Switch (RSS) Impedance.............. 169 Interrupts................................................................... 162 Operation .................................................................. 163 Operation During Sleep ............................................ 163 Port Configuration..................................................... 160 Reference Voltage (VREF)......................................... 160 Source Impedance.................................................... 169 Special Event Trigger................................................ 163 Starting an A/D Conversion ...................................... 162 ADCON0 Register....................................................... 40, 165 ADCON1 Register....................................................... 40, 166 ADDFSR ........................................................................... 371 ADDWFC .......................................................................... 371 ADRESH Register............................................................... 40 ADRESH Register (ADFM = 0)......................................... 167 ADRESH Register (ADFM = 1)......................................... 168 ADRESL Register (ADFM = 0).......................................... 167 ADRESL Register (ADFM = 1).......................................... 168 Alternate Pin Function....................................................... 132 Analog-to-Digital Converter. See ADC ANSELA Register ............................................................. 136 ANSELB Register ............................................................. 141 ANSELD Register ............................................................. 148 ANSELE Register ............................................................. 151 APFCON Register............................................................. 133 Assembler MPASM Assembler................................................... 442 B BAUDCON Register.......................................................... 304 BF ............................................................................. 276, 278 BF Status Flag .......................................................... 276, 278 Block Diagram Capacitive Sensing ................................................... 321 Block Diagrams (CCP) Capture Mode Operation ............................... 214 ADC .......................................................................... 159 ADC Transfer Function ............................................. 170 Analog Input Model........................................... 170, 184 CCP PWM................................................................. 218 Clock Source............................................................... 70 Comparator............................................................... 180 Compare ................................................................... 216 Crystal Operation.................................................. 72, 73 Digital-to-Analog Converter (DAC) ........................... 176 EUSART Receive ..................................................... 294 EUSART Transmit.................................................... 293 External RC Mode ...................................................... 73 Fail-Safe Clock Monitor (FSCM)................................. 81 Generic I/O Port........................................................ 131 Interrupt Logic............................................................. 95 LCD Bias Voltage Generation .................................. 337 LCD Clock Generation.............................................. 336 On-Chip Reset Circuit................................................. 87 PIC16F193X/LF193X ........................................... 16, 24 PWM (Enhanced) ..................................................... 222 Resonator Operation .................................................. 72 Timer0 ...................................................................... 193 Timer1 ...................................................................... 197 Timer1 Gate.............................................. 202, 203, 204 Timer2/4/6 ................................................................ 209 Voltage Reference.................................................... 157 Voltage Reference Output Buffer Example .............. 176 BORCON Register.............................................................. 89 BRA .................................................................................. 372 Break Character (12-bit) Transmit and Receive ............... 313 Brown-out Reset (BOR)...................................................... 89 Specifications ........................................................... 401 Timing and Characteristics ....................................... 400 C C Compilers MPLAB C18.............................................................. 442 CALL................................................................................. 373 CALLW ............................................................................. 373 Capacitive Sensing........................................................... 321 Associated registers w/ Capacitive Sensing............. 327 Specifications ........................................................... 412 Capture Module. See Enhanced Capture/Compare/ PWM(ECCP) Capture/Compare/PWM ................................................... 213 Capture/Compare/PWM (CCP) Associated Registers w/ Capture ............................. 215 Associated Registers w/ Compare ........................... 217 Associated Registers w/ PWM ......................... 221, 235 Capture Mode........................................................... 214 CCPx Pin Configuration............................................ 214 Compare Mode......................................................... 216 CCPx Pin Configuration.................................... 216 Software Interrupt Mode........................... 214, 216 Special Event Trigger ....................................... 216 Timer1 Mode Resource............................ 214, 216 Prescaler .................................................................. 214 PWM Mode Duty Cycle ........................................................ 219 Effects of Reset ................................................ 221 Example PWM Frequencies and Resolutions, 20 MHZ................................ 220 Example PWM Frequencies and Resolutions, 32 MHZ................................ 220 Example PWM Frequencies and Resolutions, 8 MHz .................................. 220 Operation in Sleep Mode.................................. 221 Resolution ........................................................ 220 System Clock Frequency Changes .................. 221 PWM Operation........................................................ 218 PWM Overview......................................................... 218 PWM Period ............................................................. 219
- 462. PIC16(L)F1934/6/7 DS41364E-page 462 2008-2011 Microchip Technology Inc. PWM Setup...............................................................219 CCP1CON Register ...................................................... 44, 45 CCPR1H Register......................................................... 44, 45 CCPR1L Register.......................................................... 44, 45 CCPTMRS0 Register........................................................237 CCPTMRS1 Register........................................................237 CCPxAS Register..............................................................238 CCPxCON (ECCPx) Register ...........................................236 Clock Accuracy with Asynchronous Operation .................302 Clock Sources External Modes ...........................................................71 EC.......................................................................71 HS.......................................................................71 LP........................................................................71 OST.....................................................................72 RC.......................................................................73 XT .......................................................................71 Internal Modes ............................................................74 HFINTOSC..........................................................74 Internal Oscillator Clock Switch Timing...............76 LFINTOSC ..........................................................75 MFINTOSC .........................................................74 Clock Switching...................................................................78 CMOUT Register...............................................................186 CMxCON0 Register ..........................................................185 CMxCON1 Register ..........................................................186 Code Examples A/D Conversion.........................................................164 Changing Between Capture Prescalers....................214 Initializing PORTA.....................................................131 Initializing PORTE.....................................................150 Write Verify ...............................................................127 Writing to Flash Program Memory ............................125 Comparator Associated Registers ........................................ 187, 188 Operation ..................................................................179 Comparator Module ..........................................................179 Cx Output State Versus Input Conditions .................181 Comparator Specifications................................................405 Comparators C2OUT as T1 Gate ...................................................199 Compare Module. See Enhanced Capture/Compare/ PWM (ECCP) CONFIG1 Register..............................................................62 CONFIG2 Register..............................................................64 Core Registers ....................................................................39 CPSCON0 Register ..........................................................325 CPSCON1 Register ..........................................................326 Customer Change Notification Service .............................471 Customer Notification Service...........................................471 Customer Support.............................................................471 D DACCON0 (Digital-to-Analog Converter Control 0) Register.....................................................................178 DACCON1 (Digital-to-Analog Converter Control 1) Register.....................................................................178 Memory ............................................................................117 Associated Registers ................................................130 Code Protection ........................................................118 Reading.....................................................................118 Writing.......................................................................118 Data Memory................................................................. 28, 31 DC and AC Characteristics ...............................................413 DC Characteristics Extended and Industrial (PIC16F/LF1934/36/37) .....391 Industrial and Extended (PIC16F/LF1934/36/37) ..... 384 Development Support....................................................... 441 Device Configuration .......................................................... 61 Code Protection.......................................................... 65 Configuration Word..................................................... 61 User ID ................................................................. 65, 66 Device Overview......................................................... 15, 113 Digital-to-Analog Converter (DAC) ................................... 175 Associated Registers................................................ 178 Effects of a Reset ..................................................... 176 Specifications ........................................................... 405 E ECCP/CCP. See Enhanced Capture/Compare/PWM EEADR Registers ............................................................. 117 EEADRH Registers........................................................... 117 EEADRL Register............................................................. 128 EEADRL Registers ........................................................... 117 EECON1 Register..................................................... 117, 129 EECON2 Register..................................................... 117, 130 EEDATH Register............................................................. 128 EEDATL Register ............................................................. 128 EEPROM Data Memory Avoiding Spurious Write ........................................... 118 Write Verify ............................................................... 127 Effects of Reset PWM mode............................................................... 221 Electrical Specifications (PIC16F/LF1934/36/37) ............. 381 Enhanced Capture/Compare/PWM (ECCP)..................... 213 Enhanced PWM Mode.............................................. 222 Auto-Restart ..................................................... 231 Auto-shutdown.................................................. 230 Direction Change in Full-Bridge Output Mode.. 228 Full-Bridge Application...................................... 226 Full-Bridge Mode .............................................. 226 Half-Bridge Application ..................................... 225 Half-Bridge Application Examples .................... 232 Half-Bridge Mode.............................................. 225 Output Relationships (Active-High and Active-Low)............................................... 223 Output Relationships Diagram.......................... 224 Programmable Dead Band Delay..................... 232 Shoot-through Current...................................... 232 Start-up Considerations.................................... 234 Specifications ........................................................... 402 Enhanced Mid-range CPU.................................................. 23 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) .............................. 293 Errata .................................................................................. 14 EUSART ........................................................................... 293 Associated Registers Baud Rate Generator ....................................... 306 Asynchronous Mode................................................. 295 12-bit Break Transmit and Receive .................. 313 Associated Registers Receive .................................................... 301 Transmit.................................................... 297 Auto-Wake-up on Break ................................... 311 Baud Rate Generator (BRG) ............................ 305 Clock Accuracy................................................. 302 Receiver ........................................................... 298 Setting up 9-bit Mode with Address Detect ...... 300 Transmitter ....................................................... 295 Baud Rate Generator (BRG) Auto Baud Rate Detect..................................... 310 Baud Rate Error, Calculating............................ 305
- 463. 2008-2011 Microchip Technology Inc. DS41364E-page 463 PIC16(L)F1934/6/7 Baud Rates, Asynchronous Modes .................. 307 Formulas........................................................... 306 High Baud Rate Select (BRGH Bit) .................. 305 Synchronous Master Mode............................... 314, 318 Associated Registers Receive..................................................... 317 Transmit.................................................... 315 Reception.......................................................... 316 Transmission .................................................... 314 Synchronous Slave Mode Associated Registers Receive..................................................... 319 Transmit.................................................... 318 Reception.......................................................... 319 Transmission .................................................... 318 Extended Instruction Set ADDFSR ................................................................... 371 F Fail-Safe Clock Monitor....................................................... 81 Fail-Safe Condition Clearing....................................... 81 Fail-Safe Detection ..................................................... 81 Fail-Safe Operation..................................................... 81 Reset or Wake-up from Sleep..................................... 81 Firmware Instructions........................................................ 367 Fixed Voltage Reference (FVR) Associated Registers ................................................ 158 Flash Program Memory .................................................... 117 Erasing...................................................................... 122 Modifying................................................................... 126 Writing....................................................................... 122 FSR Register39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 51, 52 FVRCON (Fixed Voltage Reference Control) Register..... 158 I I2C Mode (MSSP) Acknowledge Sequence Timing................................ 280 Bus Collision During a Repeated Start Condition................... 284 During a Stop Condition.................................... 285 Effects of a Reset...................................................... 281 I2C Clock Rate w/BRG.............................................. 287 Master Mode Operation .......................................................... 272 Reception.......................................................... 278 Start Condition Timing .............................. 274, 275 Transmission .................................................... 276 Multi-Master Communication, Bus Collision and Arbitration ......................................................... 281 Multi-Master Mode .................................................... 281 Read/Write Bit Information (R/W Bit) ........................ 257 Slave Mode Transmission .................................................... 262 Sleep Operation........................................................ 281 Stop Condition Timing............................................... 280 INDF Register39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 51, 52 Indirect Addressing ............................................................. 56 Instruction Format ............................................................. 368 Instruction Set ................................................................... 367 ADDLW..................................................................... 371 ADDWF..................................................................... 371 ADDWFC .................................................................. 371 ANDLW..................................................................... 371 ANDWF..................................................................... 371 BRA........................................................................... 372 CALL......................................................................... 373 CALLW ..................................................................... 373 LSLF......................................................................... 375 LSRF ........................................................................ 375 MOVF ....................................................................... 375 MOVIW..................................................................... 376 MOVLB..................................................................... 376 MOVWI..................................................................... 377 OPTION.................................................................... 377 RESET...................................................................... 377 SUBWFB .................................................................. 379 TRIS ......................................................................... 380 BCF .......................................................................... 372 BSF........................................................................... 372 BTFSC...................................................................... 372 BTFSS ...................................................................... 372 CALL......................................................................... 373 CLRF ........................................................................ 373 CLRW....................................................................... 373 CLRWDT .................................................................. 373 COMF....................................................................... 373 DECF........................................................................ 373 DECFSZ ................................................................... 374 GOTO....................................................................... 374 INCF ......................................................................... 374 INCFSZ..................................................................... 374 IORLW...................................................................... 374 IORWF...................................................................... 374 MOVLW.................................................................... 376 MOVWF.................................................................... 376 NOP.......................................................................... 377 RETFIE..................................................................... 378 RETLW..................................................................... 378 RETURN................................................................... 378 RLF........................................................................... 378 RRF .......................................................................... 379 SLEEP ...................................................................... 379 SUBLW..................................................................... 379 SUBWF..................................................................... 379 SWAPF..................................................................... 380 XORLW .................................................................... 380 XORWF .................................................................... 380 INTCON Register.............................................................. 100 Internal Oscillator Block INTOSC Specifications ................................................... 397 Internal Sampling Switch (RSS) Impedance ..................... 169 Internet Address ............................................................... 471 Interrupt-On-Change......................................................... 153 Associated Registers................................................ 155 Interrupts ............................................................................ 95 ADC .......................................................................... 164 Associated registers w/ Interrupts ............................ 107 Configuration Word w/ Clock Sources........................ 85 Configuration Word w/ LDO...................................... 109 TMR1........................................................................ 201 INTOSC Specifications..................................................... 397 IOCBF Register ................................................................ 154 IOCBN Register................................................................ 154 IOCBP Register ................................................................ 154 L LATA Register .......................................................... 135, 144 LATB Register .................................................................. 140 LATD Register .................................................................. 147 LATE Register .................................................................. 151 LCD
- 464. PIC16(L)F1934/6/7 DS41364E-page 464 2008-2011 Microchip Technology Inc. Associated Registers ................................................362 Bias Voltage Generation ................................... 337, 338 Clock Source Selection.............................................336 Configuring the Module.............................................361 Disabling the Module ................................................361 Frame Frequency......................................................344 Interrupts...................................................................357 LCDCON Register ....................................................330 LCDPS Register........................................................330 Multiplex Types .........................................................344 Operation During Sleep ............................................359 Pixel Control..............................................................344 Prescaler...................................................................336 Segment Enables......................................................344 Waveform Generation...............................................346 LCDCON Register..................................................... 330, 331 LCDCST Register .............................................................334 LCDDATAx Registers ............................................... 335, 342 LCDPS Register........................................................ 330, 332 LP Bits.......................................................................336 LCDREF Register .............................................................333 LCDRL Register................................................................342 LCDSEn Registers............................................................335 Liquid Crystal Display (LCD) Driver ..................................329 Load Conditions ................................................................395 LSLF..................................................................................375 LSRF.................................................................................375 M Master Synchronous Serial Port. See MSSP MCLR..................................................................................90 Internal ........................................................................90 Memory Organization Data ...................................................................... 28, 31 Program ......................................................................25 Microchip Internet Web Site..............................................471 Migrating from other PIC Microcontroller Devices.............461 MOVIW..............................................................................376 MOVLB..............................................................................376 MOVWI..............................................................................377 MPLAB ASM30 Assembler, Linker, Librarian ...................442 MPLAB Integrated Development Environment Software ..441 MPLAB PM3 Device Programmer.....................................444 MPLAB REAL ICE In-Circuit Emulator System.................443 MPLINK Object Linker/MPLIB Object Librarian ................442 MSSP................................................................................241 SPI Mode ..................................................................244 SSPBUF Register .....................................................247 SSPSR Register .......................................................247 O OPCODE Field Descriptions .............................................367 OPTION ............................................................................377 OPTION Register..............................................................195 OSCCON Register..............................................................83 Oscillator Associated Registers ..................................................85 Oscillator Module ................................................................69 ECH ............................................................................69 ECL .............................................................................69 ECM ............................................................................69 HS ...............................................................................69 INTOSC ......................................................................69 LP................................................................................69 RC...............................................................................69 XT ...............................................................................69 Oscillator Parameters ....................................................... 397 Oscillator Specifications.................................................... 396 Oscillator Start-up Timer (OST) Specifications ........................................................... 401 Oscillator Switching Fail-Safe Clock Monitor .............................................. 81 Two-Speed Clock Start-up.......................................... 79 OSCSTAT Register ............................................................ 84 OSCTUNE Register............................................................ 85 P P1A/P1B/P1C/P1D.See Enhanced Capture/Compare/ PWM (ECCP)............................................................ 222 Packaging......................................................................... 445 Marking..................................................... 445, 446, 447 PDIP Details ............................................................. 448 PCL and PCLATH............................................................... 24 PCL Register39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 51, 52 PCLATH Register39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 51, .................................................................................... 52 PCON Register............................................................. 40, 93 PIE1 Register.............................................................. 40, 101 PIE2 Register.............................................................. 40, 102 PIE3 Register.................................................................... 103 Pin Diagram PIC16(L)F1934/1937, 40-pin PDIP............................... 8 PIC16(L)F1934/1937, 40-pin UQFN............................. 9 PIC16(L)F1934/1937, 44-pin QFN.............................. 10 PIC16(L)F1934/1937, 44-pin TQFP............................ 11 PIC16(L)F1936, 28-pin QFN/UQFN ............................. 6 PIC16(L)F1936, 28-pin SPDIP/SOIC/SSOP................. 5 Pinout Descriptions PIC16F193X/PIC16LF193X........................................ 17 PIR1 Register ............................................................. 39, 104 PIR2 Register ............................................................. 39, 105 PIR3 Register ................................................................... 106 PORTA ............................................................................. 134 ANSELA Register ..................................................... 134 Associated Registers................................................ 137 Configuration Word w/ PORTA................................. 137 PORTA Register................................................... 39, 41 Specifications ........................................................... 399 PORTA Register............................................................... 135 PORTB ............................................................................. 138 Additional Pin Functions Weak Pull-up .................................................... 139 ANSELB Register ..................................................... 138 Associated Registers................................................ 142 Interrupt-on-Change ................................................. 138 P1B/P1C/P1D.See Enhanced Capture/Compare/ PWM+ (ECCP+) ............................................... 138 Pin Descriptions and Diagrams ................................ 139 PORTB Register................................................... 39, 41 PORTB Register............................................................... 140 PORTC ............................................................................. 143 Associated Registers................................................ 145 P1A.See Enhanced Capture/Compare/PWM+ (ECCP+) ........................................................... 143 Pin Descriptions and Diagrams ................................ 143 PORTC Register................................................... 39, 41 Specifications ........................................................... 399 PORTC Register............................................................... 144 PORTD ............................................................................. 146 Additional Pin Functions ANSELD Register............................................. 146 Associated Registers................................................ 148
- 465. 2008-2011 Microchip Technology Inc. DS41364E-page 465 PIC16(L)F1934/6/7 P1B/P1C/P1D.See Enhanced Capture/Compare/ PWM+ (ECCP+) ............................................... 146 Pin Descriptions and Diagrams................................. 146 PORTD Register ................................................... 39, 41 PORTD Register ............................................................... 147 PORTE.............................................................................. 149 ANSELE Register ..................................................... 149 Associated Registers ................................................ 152 Pin Descriptions and Diagrams................................. 149 PORTE Register ................................................... 39, 41 PORTE Register ............................................................... 150 Power-Down Mode (Sleep)............................................... 111 Associated Registers ................................................ 112 Power-on Reset .................................................................. 88 Power-up Timer (PWRT) .................................................... 88 Specifications............................................................ 401 PR2 Register................................................................. 39, 47 Precision Internal Oscillator Parameters........................... 397 Program Memory ................................................................ 25 Map and Stack (PIC16(L)F1934) ................................ 25 Map and Stack (PIC16(L)F1936, PIC16(L)F1937) ..... 26 Map and Stack (PIC16F1934/LF1934) ....................... 31 Map and Stack (PIC16F1936/LF1936, PIC16F1937/LF1937) ......................................... 31 Programming Mode Exit ..................................................... 90 Programming, Device Instructions .................................... 367 PSTRxCON Register ........................................................ 240 PWM (ECCP Module) PWM Steering........................................................... 233 Steering Synchronization.......................................... 234 PWM Mode. See Enhanced Capture/Compare/PWM ...... 222 PWM Steering................................................................... 233 PWMxCON Register ......................................................... 239 R RCREG ............................................................................. 300 RCREG Register................................................................. 42 RCSTA Register ......................................................... 42, 303 Reader Response ............................................................. 472 Read-Modify-Write Operations ......................................... 367 Register RCREG Register....................................................... 310 Registers ADCON0 (ADC Control 0) ........................................ 165 ADCON1 (ADC Control 1) ........................................ 166 ADRESH (ADC Result High) with ADFM = 0)........... 167 ADRESH (ADC Result High) with ADFM = 1)........... 168 ADRESL (ADC Result Low) with ADFM = 0)............ 167 ADRESL (ADC Result Low) with ADFM = 1)............ 168 ANSELA (PORTA Analog Select)............................. 136 ANSELB (PORTB Analog Select)............................. 141 ANSELD (PORTD Analog Select) ............................ 148 ANSELE (PORTE Analog Select)............................. 151 APFCON (Alternate Pin Function Control)................ 133 BAUDCON (Baud Rate Control)............................... 304 BORCON Brown-out Reset Control)........................... 89 CCPTMRS0 (PWM Timer Selection Control 0) ........ 237 CCPTMRS1 (PWM Timer Selection Control 1) ........ 237 CCPxAS (CCPx Auto-Shutdown Control)................. 238 CCPxCON (ECCPx Control)..................................... 236 CMOUT (Comparator Output)................................... 186 CMxCON0 (Cx Control) ............................................ 185 CMxCON1 (Cx Control 1) ......................................... 186 Configuration Word 1.................................................. 62 Configuration Word 2.................................................. 64 CPSCON0 (Capacitive Sensing Control Register 0) 325 CPSCON1 (Capacitive Sensing Control Register 1) 326 DACCON0................................................................ 178 DACCON1................................................................ 178 EEADRL (EEPROM Address) .................................. 128 EECON1 (EEPROM Control 1) ................................ 129 EECON2 (EEPROM Control 2) ................................ 130 EEDATH (EEPROM Data) ....................................... 128 EEDATL (EEPROM Data) ........................................ 128 FVRCON .................................................................. 158 INTCON (Interrupt Control) ...................................... 100 IOCBF (Interrupt-on-Change Flag)........................... 154 IOCBN (Interrupt-on-Change Negative Edge).......... 154 IOCBP (Interrupt-on-Change Positive Edge)............ 154 LATA (Data Latch PORTA) ...................................... 135 LATB (Data Latch PORTB) ...................................... 140 LATC (Data Latch PORTC) ...................................... 144 LATD (Data Latch PORTD) ...................................... 147 LATE (Data Latch PORTE) ...................................... 151 LCDCON (LCD Control) ........................................... 331 LCDCST (LCD Contrast Control) ............................. 334 LCDDATAx (LCD Data).................................... 335, 342 LCDPS (LCD Phase)................................................ 332 LCDREF (LCD Reference Voltage Control) ............. 333 LCDRL (LCD Reference Voltage Control)................ 342 LCDSEn (LCD Segment Enable) ............................. 335 OPTION_REG (OPTION)......................................... 195 OSCCON (Oscillator Control)..................................... 83 OSCSTAT (Oscillator Status) ..................................... 84 OSCTUNE (Oscillator Tuning).................................... 85 PCON (Power Control Register)................................. 93 PCON (Power Control) ............................................... 93 PIE1 (Peripheral Interrupt Enable 1) ........................ 101 PIE2 (Peripheral Interrupt Enable 2) ........................ 102 PIE3 (Peripheral Interrupt Enable 3) ........................ 103 PIR1 (Peripheral Interrupt Register 1) ...................... 104 PIR2 (Peripheral Interrupt Request 2) ...................... 105 PIR3 (Peripheral Interrupt Request 3) ...................... 106 PORTA ..................................................................... 135 PORTB ..................................................................... 140 PORTC..................................................................... 144 PORTD..................................................................... 147 PORTE ..................................................................... 150 PSTRxCON (PWM Steering Control) ....................... 240 PWMxCON (Enhanced PWM Control) ..................... 239 RCSTA (Receive Status and Control) ...................... 303 Special Function, Summary........................................ 39 SRCON0 (SR Latch Control 0)................................. 191 SRCON1 (SR Latch Control 1)................................. 192 SSPADD (MSSP Address and Baud Rate, I2 C Mode) ......................................................... 292 SSPCON1 (MSSP Control 1) ................................... 289 SSPCON2 (SSP Control 2) ...................................... 290 SSPCON3 (SSP Control 3) ...................................... 291 SSPMSK (SSP Mask) .............................................. 292 SSPSTAT (SSP Status) ........................................... 288 STATUS ..................................................................... 29 T1CON (Timer1 Control) .......................................... 205 T1GCON (Timer1 Gate Control)............................... 206 TRISA (Tri-State PORTA) ........................................ 135 TRISB (Tri-State PORTB) ........................................ 140 TRISC (Tri-State PORTC) ........................................ 144 TRISD (Tri-State PORTD) ........................................ 147 TRISE (Tri-State PORTE) ........................................ 150 TXCON..................................................................... 211 TXSTA (Transmit Status and Control)...................... 302
- 466. PIC16(L)F1934/6/7 DS41364E-page 466 2008-2011 Microchip Technology Inc. WDTCON (Watchdog Timer Control)........................115 WPUB (Weak Pull-up PORTB) .................................141 RESET ..............................................................................377 Reset...................................................................................87 Reset Instruction .................................................................90 Resets.................................................................................87 Associated Registers ..................................................94 Revision History ................................................................461 S Shoot-through Current ......................................................232 Software Simulator (MPLAB SIM).....................................443 SPBRG Register ........................................................... 41, 42 SPBRGH...........................................................................305 SPBRGL............................................................................305 Special Event Trigger........................................................163 Special Function Registers (SFRs).....................................39 SPI Mode (MSSP) Associated Registers ................................................251 SPI Clock ..................................................................247 SR Latch ...........................................................................189 Associated registers w/ SR Latch .............................192 SRCON0 Register.............................................................191 SRCON1 Register.............................................................192 SSPADD Register....................................................... 43, 292 SSPBUF Register ...............................................................43 SSPCON Register...............................................................43 SSPCON1 Register...........................................................289 SSPCON2 Register...........................................................290 SSPCON3 Register...........................................................291 SSPMSK Register.............................................................292 SSPOV..............................................................................278 SSPOV Status Flag...........................................................278 SSPSTAT Register ..................................................... 43, 288 R/W Bit......................................................................257 Stack ...................................................................................54 Accessing....................................................................54 Reset...........................................................................56 Stack Overflow/Underflow...................................................90 STATUS Register................................................................29 SUBWFB...........................................................................379 T T1CON Register.......................................................... 39, 205 T1GCON Register.............................................................206 T2CON Register............................................................ 39, 47 Temperature Indicator Module..........................................173 Thermal Considerations (PIC16F/LF1934/36/37) .............394 Timer0...............................................................................193 Associated Registers ................................................195 Operation ..................................................................193 Specifications............................................................402 Timer1...............................................................................197 Associated registers..................................................207 Asynchronous Counter Mode ...................................199 Reading and Writing .........................................199 Clock Source Selection.............................................198 Interrupt.....................................................................201 Operation ..................................................................198 Operation During Sleep ............................................201 Oscillator ...................................................................199 Prescaler...................................................................199 Specifications............................................................402 Timer1 Gate Selecting Source...............................................199 TMR1H Register .......................................................197 TMR1L Register........................................................ 197 Timer2 Associated registers ................................................. 212 Timer2/4/6......................................................................... 209 Associated registers ................................................. 212 Timers Timer1 T1CON ............................................................. 205 T1GCON........................................................... 206 Timer2/4/6 TXCON............................................................. 211 Timing Diagrams A/D Conversion......................................................... 404 A/D Conversion (Sleep Mode).................................. 404 Acknowledge Sequence ........................................... 280 Asynchronous Reception.......................................... 300 Asynchronous Transmission..................................... 296 Asynchronous Transmission (Back to Back) ............ 296 Auto Wake-up Bit (WUE) During Normal Operation. 312 Auto Wake-up Bit (WUE) During Sleep .................... 312 Automatic Baud Rate Calibration.............................. 310 Baud Rate Generator with Clock Arbitration............. 273 BRG Reset Due to SDA Arbitration During Start Condition .......................................................... 283 Brown-out Reset (BOR)............................................ 400 Brown-out Reset Situations ........................................ 89 Bus Collision During a Repeated Start Condition (Case 1)............................................................ 284 Bus Collision During a Repeated Start Condition (Case 2)............................................................ 284 Bus Collision During a Start Condition (SCL = 0) ..... 283 Bus Collision During a Stop Condition (Case 1)....... 285 Bus Collision During a Stop Condition (Case 2)....... 285 Bus Collision During Start Condition (SDA only) ...... 282 Bus Collision for Transmit and Acknowledge ........... 281 CLKOUT and I/O ...................................................... 398 Clock Synchronization .............................................. 270 Clock Timing............................................................. 396 Comparator Output................................................... 179 Enhanced Capture/Compare/PWM (ECCP)............. 402 Fail-Safe Clock Monitor (FSCM)................................. 82 First Start Bit Timing ................................................. 274 Full-Bridge PWM Output........................................... 227 Half-Bridge PWM Output .................................. 225, 232 I2 C Bus Data............................................................. 410 I2C Bus Start/Stop Bits ............................................. 409 I2 C Master Mode (7-Bit Reception)................... 277, 279 I2 C Stop Condition Receive or Transmit Mode......... 280 INT Pin Interrupt ......................................................... 98 Internal Oscillator Switch Timing ................................ 77 LCD Interrupt Timing in Quarter-Duty Cycle Drive ... 358 LCD Sleep Entry/Exit when SLPEN = 1 or CS = 00 . 360 PWM Auto-shutdown................................................ 231 Firmware Restart.............................................. 230 PWM Direction Change ............................................ 228 PWM Direction Change at Near 100% Duty Cycle... 229 PWM Output (Active-High) ....................................... 223 PWM Output (Active-Low) ........................................ 224 Repeat Start Condition ............................................. 275 Reset Start-up Sequence ........................................... 91 Reset, WDT, OST and Power-up Timer ................... 399 Send Break Character Sequence............................. 313 SPI Master Mode (CKE = 1, SMP = 1) ..................... 407 SPI Mode (Master Mode).......................................... 247 SPI Slave Mode (CKE = 0) ....................................... 408
- 467. 2008-2011 Microchip Technology Inc. DS41364E-page 467 PIC16(L)F1934/6/7 SPI Slave Mode (CKE = 1) ....................................... 408 Synchronous Reception (Master Mode, SREN) ....... 317 Synchronous Transmission....................................... 315 Synchronous Transmission (Through TXEN) ........... 315 Timer0 and Timer1 External Clock ........................... 401 Timer1 Incrementing Edge........................................ 201 Two Speed Start-up.................................................... 80 Type-A in 1/2 MUX, 1/2 Bias Drive ........................... 347 Type-A in 1/2 MUX, 1/3 Bias Drive ........................... 349 Type-A in 1/3 MUX, 1/2 Bias Drive ........................... 351 Type-A in 1/3 MUX, 1/3 Bias Drive ........................... 353 Type-A in 1/4 MUX, 1/3 Bias Drive ........................... 355 Type-A/Type-B in Static Drive................................... 346 Type-B in 1/2 MUX, 1/2 Bias Drive ........................... 348 Type-B in 1/2 MUX, 1/3 Bias Drive ........................... 350 Type-B in 1/3 MUX, 1/2 Bias Drive ........................... 352 Type-B in 1/3 MUX, 1/3 Bias Drive ........................... 354 Type-B in 1/4 MUX, 1/3 Bias Drive ........................... 356 USART Synchronous Receive (Master/Slave) ......... 406 USART Synchronous Transmission (Master/Slave) . 405 Wake-up from Interrupt............................................. 112 Timing Diagrams and Specifications PLL Clock.................................................................. 397 Timing Parameter Symbology........................................... 395 Timing Requirements I2 C Bus Data............................................................. 411 I2C Bus Start/Stop Bits ............................................. 410 SPI Mode .................................................................. 409 TMR0 Register.................................................................... 39 TMR1H Register ................................................................. 39 TMR1L Register.................................................................. 39 TMR2 Register.............................................................. 39, 47 TRIS.................................................................................. 380 TRISA Register ........................................................... 40, 135 TRISB ............................................................................... 138 TRISB Register ........................................................... 40, 140 TRISC ............................................................................... 143 TRISC Register........................................................... 40, 144 TRISD ............................................................................... 146 TRISD Register........................................................... 40, 147 TRISE ............................................................................... 149 TRISE Register ........................................................... 40, 150 Two-Speed Clock Start-up Mode........................................ 79 TXCON (Timer2/4/6) Register .......................................... 211 TXREG.............................................................................. 295 TXREG Register ................................................................. 42 TXSTA Register .......................................................... 42, 302 BRGH Bit .................................................................. 305 U USART Synchronous Master Mode Requirements, Synchronous Receive .............. 406 Requirements, Synchronous Transmission ...... 406 Timing Diagram, Synchronous Receive ........... 406 Timing Diagram, Synchronous Transmission ... 405 V VREF. SEE ADC Reference Voltage W Wake-up on Break............................................................ 311 Wake-up Using Interrupts................................................. 112 Watchdog Timer (WDT)...................................................... 90 Associated Registers................................................ 116 Configuration Word w/ Watchdog Timer................... 116 Modes....................................................................... 114 Specifications ........................................................... 401 WCOL....................................................... 273, 276, 278, 280 WCOL Status Flag.................................... 273, 276, 278, 280 WDTCON Register ........................................................... 115 WPUB Register................................................................. 141 Write Protection .................................................................. 65 WWW Address ................................................................. 471 WWW, On-Line Support ..................................................... 14
- 468. PIC16(L)F1934/6/7 DS41364E-page 468 2008-2011 Microchip Technology Inc. NOTES:
- 469. 2008-2011 Microchip Technology Inc. DS41364E-page 469 PIC16(L)F1934/6/7 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support • Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support
- 470. PIC16(L)F1934/6/7 DS41364E-page 470 2008-2011 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: FAX: (______) _________ - _________ DS41364E PIC16(L)F1934/6/7 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document?
- 471. 2008-2011 Microchip Technology Inc. DS41364E-page 471 PIC16(L)F1934/6/7 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Examples: a) PIC16LF1937 - I/P = Industrial temp., Plastic DIP package, low-voltage VDD limits. b) PIC16F1934 - I/PT = Industrial temp., TQFP package, standard VDD limits. Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. PART NO. X /XX XXX Pattern Package Temperature Range Device [X](1) Tape and Reel Option - Device: PIC16F1934, PIC16LF1934, PIC16F1934, PIC16LF1934 PIC16F1936, PIC16LF1936, PIC16F1936, PIC16LF1936 PIC16F1937, PIC16LF1937, PIC16F1937, PIC16LF1937 Tape and Reel Option: Blank = Standard packaging (tube or tray) T = Tape and Reel(1) Temperature Range: I = -40C to +85C E = -40C to +125C Package: ML = Micro Lead Frame (QFN) MV = Micro Lead Frame (UQFN) 4x4 P = Plastic DIP PT = TQFP (Thin Quad Flatpack) SO = SOIC SP = Skinny Plastic DIP SS = SSOP Pattern: 3-Digit Pattern Code for QTP (blank otherwise)
- 472. DS41364E-page 472 2008-2011 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-2819-3180 Fax: 86-571-2819-3189 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-213-7830 Fax: 886-7-330-9305 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 Worldwide Sales and Service 05/02/11