Sensors expo-2013-engineering-ultra-low-power-so c-sensors
- 1. Engineering Ultra Low Power System on Chip Sensors Steve Grady – Cymbet Scott Hanson – Ambiq Micro Jim Magos – Cardinal Components
- 2. Key Trends Driving Micro SoC Sensors Ultra Low Power Processors Smart Devices and Sensors Everywhere Wireless is pervasive Integration with other components Miniaturization Eco-Friendly and Renewable Energy • New innovative products are smarter, smaller and wireless • Smart devices with status indications • There will be billions of new networked smart devices • Industrial, Medical, Security, Transportation, Environmental... Key Trends Drive New Technologies in Many Areas
- 3. EH-Powered Autonomous Wireless Sensor Block Diagram ΔT Motion EM Field Energy Harvesting Power Supply IC - Energy Conversion Battery Management Power Management Sensor (e.g., temperature, pressure, occupancy) Light MCU + Radio Input Power “Energy Aware” Communications and Control EH Transducer Electrical Interface Discrete Components Rechargeable Energy Storage Device Energy Manager RTC/Timer
- 4. System on Chip Sensors Position Sensor Seismometer Oxygen Sensor Hall Effect Soil Moisture Speed Sensor Water Sensor Particle Air Speed Altimeter Depth Gauge Accelerometer Gravimeter Gyroscopic Inclinometer D to A Micro-C A to D Micro-P RTC TCXO GPS VCXO FPGA Crystal Level Shifter Solid State Battery EEPROM Multiplayer Bluetooth Encryption Sensor Types Components
- 5. Trends Driving Need for Innovative Energy Storage Ultra Low Power Processors Smart Devices and Sensors Everywhere Wireless is pervasive Integration with other components Miniaturization Eco-Friendly and Renewable Energy HP: 1 trillion sensors in 5 years 60 mm wireless devices annually Solar powered sensors Complete wireless sensor with power 800mm Micro machines in a package 10 year component s Pennies to dollars Low energy for Space used Bulky Size/Metal “coin” package Not Eco-Friendly - Toxic Chemicals Transportation Safety Issues Cannot be integrated with other electronics TRENDS CURRENT SOLUTIONS
- 6. Rechargeable solid State Batteries • EnerChip™ Rechargeable Solid State Batteries are created on Silicon wafers using standard semiconductor fabrication processes and device packaging techniques • As the battery is charged, ions move from the cathode through the solid electrolyte to the current collector. As the battery discharges, the reverse is true. • EnerChips are 150 microns thick – less than two human hairs – and are 1/20th the thickness of a comparable battery. Charging Discharging Solid State Cathode EnerChips on Silicon Wafers Solid State Electrolyte Protective Coating Current Collector
- 7. Key Technical Battery Requirements Capacity with Cycling 0 10 20 30 40 50 60 70 0 100 200 300 400 500 600 700 800 900 1000 Discharge Cycle # Capacity(µAh) 4.2V 4.15V 4.1V 4.3V 4.0V High Cycle Life Flat Output Voltage Profile Charge Current & Charge Capacity vs, Charge Time 0 10 20 30 40 50 60 120 100 80 60 40 20 0 PercentofCharge Time (Minutes) 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 ChargeCurrent/BatteryCapacity Fast and Simple Charge ChargeLoss% 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Stand Time (Years) 1 2 3 4 5 Non-Recoverable Recoverable Self-Discharge Low Self-Discharge
- 8. Solid State Batteries are Safe Assembly, Transport, Use and Disposal • RoHS • China RoHS • REACH • CE Mark • UL - Underwriters Laboratory • JEDEC IC Packaging Standards and Tape and Reel EIA Standards • IEC, NEMA/ANSI • United Nations Transportation Air Safety Regulations • WEEE Waste Electrical and Electronic Equipment Directive • EU Battery Directive • MSDS and OSHA Information • Solid State Battery End-of-life Disposal Instructions • In vitro/In vivo Biocompatibility Test Standards for Cytotoxicity Rechargeable solid state batteries are the only energy storage solution that satisfies all the following global environmental and safety regulations and certifications:
- 9. Packaging Options EnerChip Bare Die µController, Sensor, RTC Solid State Batteries are a unique solution for customer applications requiring a small energy storage device integrated directly into the system EnerChips support many different device configurations using standard wire bond or solder bump attachment Applications in the this market include: • Sensor Systems on Chip • Security and tamper detection devices • Electronic fuses for various devices • Medical devices – ophthalmic, implantable, patches Side-by-Side EnerChip and ICs with Wire Bond Stacking EnerChip and ICs using Wire Bond Stacking EnerChip and ICs using solder bump Flip Chip EnerChip and ICs in System On Chip
- 10. Sensor SoC Packaging Roadmap EnerChip Bare Die Location Examples EnerChip Solid State Batteries in Bare Die form are the ideal devices for integrating energy storage in emerging System in 3D Packaged Systems EnerChips using wire bonding, solder bumps for flip chip or eventually Thru Silicon Vias can be integrated into Systems in Package, Package on Package, TSV stacks and other 3D configurations
- 11. Solving the Power Problem Hardware Components System Hardware Architecture System Software Architecture Power must be optimized all levels of the design hierarchy The focus of today’s presentation
- 12. Building ULP Components with Sub-threshold Voltage Threshold Voltage (i.e., Noise Floor) Time Voltage Threshold Voltage (i.e., Noise Floor) Conventional Super-threshold Sub-threshold Sub-threshold enables energy reductions on the order of 1.82/0.52=13X
- 13. The Limits of Sub-threshold Inverter Operation at 65mV SRAM Cell Operation at 70 mV Deep sub-threshold operation is possible, but significant challenges exist
- 14. The Challenges of Sub-threshold 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1E-11 1E-10 1E-9 1E-8 1E-7 1E-6 1E-5 1E-4 Vdd =1.2V Ion /Ioff ~800,000 Vdd =250mV Ion /Ioff ~800 ID (A) Vgs (V) On-to-off current ratio is reduced dramatically
- 15. The Challenges of Sub-threshold 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1E-11 1E-10 1E-9 1E-8 1E-7 1E-6 1E-5 1E-4 Limited Vth sensitivity at high Vdd ~14X change in current for ∆Vth =100mV ID (A) Vgs (V) Current is exponentially sensitive to process, voltage, and temperature
- 16. Addressing the Challenges with SPOT • SPOT: Sub-threshold Power Optimized Technology • Standard manufacturing process • Circuit, architecture, and test methodology that enables robust sub-threshold operation • Proven over 8 years of development 2005 2006 2007 2009 2010 processor memory 244µm 305µm 122µm 181µm processor memory 244µm 305µm 122µm 181µm 2012
- 17. AM18XX: A SPOT-Based RTC XT Osc RC Osc Divider Seconds Minutes Hours Days Weekdays Months Years Power Control VCC VBAT I2C/SPI InterfaceSCL SDA/O Control Alarms Int/Clock FOUT/nIRQ PSW/nIRQ2 VSS CLKOUT/nIRQ3 SDI nCE WDI ResetnEXTR nRST RAM XO XI nTIRQ Timer WDT 100ths Divider Calibration Engine EXTI Analog Compare SPOT enables unprecedented power of only 15-55nA
- 18. A Typical Use Case SPOT enables a 5X increase in battery life Incumbent System SPOT-Based System EnerChip Power Management Current 35nA 20nA RTC Current 150nA 21nA Life for 12µAh battery* 4 days 20 days VCC VSS nIRQ IRQ VCC AM1805 RTC MCU I2C/SPI XO XI VBAT + _ VOUT EnerChip with Integrated Power Management VDD VSS VSS * EnerChip CBC012 battery under 41nA load is an 18uAh equivalent
- 19. Sensor SoC - What’s Needed? • Looking for reduction in system size • Systems incorporating energy harvesting techniques • Low power small wireless systems • Wireless sensor nodes • Short time back up power • Self powered systems • Embedded power systems needing time logs, datalogs • Embedded processing systems • Any system that maintains RTC during power outage
- 20. Real Time Plus Concept Real Time Clock RTC Crystal Solid State Battery I2C Integration Configuration Options Battery Recharging Circuit
- 21. Real Time Plus – RTC + Battery + XTAL Type Length Width Square mm Area PCB with CR2032 30.0 32.0 960 CRTP 12.4 17.4 216 78% Traditional Design Approach Real Time Plus Solution 78% smaller surface area
- 22. RTPlus SoC Components Real Time Clock Temperature Compensation Industrial Temperature Range -40 to +850C RoHS Complaint Calendar tracks year and leap year Clock tracks seconds, minutes and hours in 24 hour format Interrupt Output Programmable Alarm and Universal Timer Extremely Accurate i.e., @250C, + 2 PPM 8 Bytes of Ram and 2 Bytes EEPROM for Customer Application Battery Solid State Battery RoHS Compliant Rechargeable with on board trickle charge circuit Package SMD 10.3 x 12.7 mm 12.4 x 15.1 mm 12.4 x 17.8 mm High quality Crystal Application Examples Wireless sensors and RFID tags Consumer appliances Energy Harvesting Time Keeping Metering Telemedicine Time stamping Smart energy Military surveillance CRTP Series Power Holdover CRTPN05 4 days CRTPA12 20 days CRTPA50 90 days I2C Interface Bus
- 23. Creating a Sensor SoC – Modu-FlexTM Example Typical System Before Modu-FlexTM After Modu-FlexTM Battery Backup Micro P, or Micro C Memory Control Logic Analog Processing (ADC) Sensors P O W E R Analog Processing (DAC) Recharging Circuit RTC Oscillator Output Driver, switches Micro P, or Micro C Memory Control Logic Analog Processing (ADC) P O W E R Analog Processing (DAC) Output Driver, switches Modu-Flex Crystal
- 24. Sensor SoC Package Innovation uC uC Osc RTC Battery Charge EEPROM Temp Sensor D/A A/D Output Driver Switch Crystal
- 25. Sensor SoC Integrated Package Modu-Flex is a RoHS compliant (including the battery), CMOS low-power, real-time clock/calendar module with built-in Thermometer, Digital Temperature Compensation circuitry (DTCXO), a solid-state battery back up for the RTC, and single or dual output oscillator circuit (1 to 200 MHz) Applications: • Automotive: Car Radio / GPS and Tracking Systems / Dashboard / Engine Controller / Car Mobile & Entertainment Systems / Tachometers • Metering: E-meter / Heating Counter • Outdoor: ATM & POS systems / Surveillance & Safety systems / Ticketing systems • All Types Portable and battery operated devices • Industrial Automation, Robotics, Controls • Consumer Gaming, Set top box, Data Storage • White goods Refrigerators, Dishwasher, Washers Benefits: Integration, any frequency from 1 to 200 MHz, small physical size, simplifies design, custom options available, factory configurable in 48 hours TCXO Crystal Solid State Battery Oscillator single output Temperature Sensor I2C Flexibility CRTP Re-charging circuit Modu-Flex Real Time Clock—High Accuracy 2 PPM
- 26. Customer Concept Integrated Solution Flexible Manufacturing Design Base with gold termination Epoxy 1 Die 1 Epoxy 2 Die 2 Wire Sweep Die 2 Conformal Coating Plastic Mold Item Hard PCB Hard PCB Flex PCB Flip Chip Stack Die Prototype-Small Volume Volume Packaging Sensor SoC Creation Process
- 28. Customizable System Options Continued Touch Sensing DACs • CapSense capacitive sensing • 6-, 8-, and 9-bit (buttons, sliders) • 6- and 8-bit multiplying • Touchscreens Filters • Trackpads • 2-pole low-pass • Proximity sensing • 2-pole band-pass Other sensing • Modulators • Position • Peak detectors • Accelerometer Amplifiers • Water • Programmable gain • Speed • Instrumentation • Inclinometer • Comparators • UV Timers/Counters • Pressure • 8-, 16-, and 24-bit Fan/Motor Control Pulse-Width Modulators • AC motor • 8-, 16-, and 24-bit • DC motor Coming soon • Fan GPS • Fuel pump Bluetooth • Instrument gauges Zigbee IrDA Modu-Flex is a flexible module that Integrates peripherals into a single component A fast, reliable way for companies to take their design and integrate for production with a low NRE custom offerings and solutions.
- 29. Combining IC Bare Die into SoC Cymbet EnerChip RTC CBC34803 example • Integrate Ambiq AM0803 (I2C) with Cymbet EnerChip CBC005 and CBC910 power mgmt IC • Miniature Land Grid Array (LGA) module or possibly BGA package • Wire bond in this case, but could also use flip chip style attachment using bumped bare die • CBC34813 uses AM0813 (SPI) AM0803
- 30. RTPLUS and EnerChip RTC Integrated Solutions Examples Ambiq RTC + 5uAh EnerChip + PMIC + Xtal Oscillator using Packaged parts – 8 mm x 10 mm Ambiq RTC + 5uAh EnerChip + PMIC using bare die – 5 mm x 5 mm
- 31. Summary • Key Industry Trends and Application Requirements are driving the need for highly integrated Sensor Systems on Chip designs • Ultra-low power electronics with Sub-threshold Power Optimized technologies are now available • Solid State Batteries provide ideal energy storage • Innovative packaging techniques enable optimized footprint and volume • Optimized Sensor SoCs are available today