Understanding The Vpx Redi
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This document provides an overview of REDI (Ruggedized Enhanced Design Implementation), which defines mechanical design standards for plug-in units in VPX systems. It discusses REDI form factors and covers air cooling and conduction cooling designs. For air cooling, it describes design considerations like minimum PCB thickness and cover specifications. For conduction cooling, it outlines the role of frames and covers in transferring heat. Important rules are highlighted, such as covers being electrically grounded and type 1 units requiring both primary and secondary covers.
![REDI – FORM FACTORS
REDI recommends two Board Sizes as 3U [100mm X 160mm] and 6U
[233.35mm X 160mm] for circuit Boards & plug-in units with AIR or
Conduction cool mechanism
The base Mechanical specifications of PCB & Plug-In units are defined
by VITA46
The Allowable Standoff Height for PMC/XMC is 10mm where 0.8” &
0.85” plug-in unit scheme. It is 12mm where 1.0” pitch Plug-in unit
scheme. In this Sufficient Package area to be planned for protective
cover for TYPE1 Card](https://image.slidesharecdn.com/understandingthevpxredi-13378799863923-phpapp01-120524122516-phpapp01/85/Understanding-The-Vpx-Redi-4-320.jpg)
![REDI –Conduction Cool Mechanism
REDI conduction Cool mechanism is defined by VITA 48.1
It defines the detailed mechanical implementation for conduction cool
mechanism for PCB/Plug-In Units which is defined by VITA 46
In Conduction Cooled System, there are two important components
namely Frame and Cover. Frame used to transfer the heat from
PCB/components to Sub rack and Cover is used to cover the Both side
of Plug-In units with support of ESD suppression
Cover Plate differentiates the TYPE1 & TYPE2 Cards
The PCB thickness can be variable from 0.06” [1.5mm] to
0.12”[3.048mm] and Even Thicker PCB also can be accommodated
based on considering the Guide Rail Thickness and so PCB is limited on
following
For Primary Side Retainer design – 0.137”[3.48mm]MAX
For secondary side Retainer Design – 0.112”[2.85mm]MAX](https://image.slidesharecdn.com/understandingthevpxredi-13378799863923-phpapp01-120524122516-phpapp01/85/Understanding-The-Vpx-Redi-12-320.jpg)
Understanding The Vpx Redi
- 1. Understanding of REDI Kamal Raj Krishnan
- 2. AGENDA INTRODUCTION To REDI FORM FACTORS INTRODUCTION - Air Cool Design Design Considerations Important Rules to remember INTRODUCTION – Conduction Cool Design Design Considerations Important Rules to remember Any Questions..
- 3. INTRODUCTION - REDI REDI is the Mechanical specification of ruggedized electronics system and it is defined by VITA48 Standard. REDI – Ruggedized Enhanced Design Implementation This REDI standard defines the mechanical design Implementation for Plug in Units in VPX system Environment REDI defines Various Thermal Management Mechanical Design implementations namely the Air Cooling, Conduction Cooling, Liquid Cooling based on classified standards VITA 48.1, 48.2, 48.3.. REDI defines two types of Plug In Units namely TYPE1 and TYPE2 TYPE1 Plug-In Units are compatible for handling in 2 Level Maintenance Environments where TYPE2 Plug-In Units requires required precaution in handling Primary Difference between TYPE1 & TYPE2 units is the presence of External covers REDI supports the 0.8”, 0.85” and 1.0” Pitch Plugging on Back Plane
- 4. REDI – FORM FACTORS REDI recommends two Board Sizes as 3U [100mm X 160mm] and 6U [233.35mm X 160mm] for circuit Boards & plug-in units with AIR or Conduction cool mechanism The base Mechanical specifications of PCB & Plug-In units are defined by VITA46 The Allowable Standoff Height for PMC/XMC is 10mm where 0.8” & 0.85” plug-in unit scheme. It is 12mm where 1.0” pitch Plug-in unit scheme. In this Sufficient Package area to be planned for protective cover for TYPE1 Card
- 5. REDI – Introduction to Air Cool Mechanism REDI Air cool mechanism defined by VITA48.1 standard specification For Conductive elements such as Frame Covers - Need not to connect to PCB electrically except connecting to Safety Ground
- 6. REDI –Air Cool Mechanism This STD VITA48.1 defines Minimum PCB thickness as 0.06” It defines the mechanical interface specifications of components namely Main PCB, Main Frame, PMC/XMC, PMC/XMC Cover, and Secondary cover as it is indicated in the Image For main board Connector Protection, Primary Cover, PMC/XMC Cover and Secondary cover can be extended up to connector Edge
- 7. REDI –Air Cool Mechanism Cover Thickness & extension specification is indicated in following table NF – Not Feasible, FwR-Feasible with Risk, F-Feasible
- 8. REDI –Air Cool Mechanism 3U Air Cooled Plug-in Unit – Form factors
- 9. REDI –Air Cool Mechanism Primary side Cover provides following Accepts PMC/XMC and Cover for PMC/XMC EMC Compatibility & ESD Protection Maintains the managed Air flow paths in air-cooled applications Can contain Insertion / Extraction Features Secondary Side Cover provides following EMC Compatibility & ESD Protection Provides protection for secondary side components Maintains the managed Air flow paths in air-cooled applications
- 10. REDI –Air Cool Mechanism Secondary Side Cooling should be carefully evaluated particularly for 0.8” & 0.85” because of limited Gap between Secondary cover to PCB. This is likely to be High Pressure Flow path where cooling air requirements are high Component Layout can be critical to proper plug-in unit Cooling. The Layout should consider the flow direction, shadowing effect, air preheating, re-circulation etc.. The Direction of Airflow should be as shown in image
- 11. REDI –Air Cool Mechanism – Important Rules to Remember Rule 7-4: Thickness of Plu-in unit that interface with sub Rack’s Card Guide shall be 1.6mm +-0.2mm. But if Thicker PCB is recommended, then the distance from Primary side of PCB to Outside of Secondary cover is to be maintained as per Pitch of Plug-in units Rule 7-5: Covers shall be electrically connected to safety ground with resistance not to exceed 100mohm Rule 7-9: Maximum Plug-in Width is defined by following Table Rule 7-11, 7-12: Primary & Secondary Side Cover is mandatory for TYPE1 and it is not required for TYPE2 implementations Rule 13-1: In Order to achieve 2 Level maintenance, Type1 Plu-in units shall comply with ESD requirements of VITA 47
- 12. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism is defined by VITA 48.1 It defines the detailed mechanical implementation for conduction cool mechanism for PCB/Plug-In Units which is defined by VITA 46 In Conduction Cooled System, there are two important components namely Frame and Cover. Frame used to transfer the heat from PCB/components to Sub rack and Cover is used to cover the Both side of Plug-In units with support of ESD suppression Cover Plate differentiates the TYPE1 & TYPE2 Cards The PCB thickness can be variable from 0.06” [1.5mm] to 0.12”[3.048mm] and Even Thicker PCB also can be accommodated based on considering the Guide Rail Thickness and so PCB is limited on following For Primary Side Retainer design – 0.137”[3.48mm]MAX For secondary side Retainer Design – 0.112”[2.85mm]MAX
- 13. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism defines 2 way implementation the Design based on retainer placement. Primary Side Retainer Secondary side Retainer
- 14. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism Supports Connector Side Protections as it is indicated by image
- 15. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism – Primary Side Retainer
- 16. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism – Secondary Side Retainer
- 17. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism – Retainer Position Plug-In Unit along with Retainer plugged on Guide Rail of Chassis with Gap of 13.34mm In Retainer Relaxed State, thermal interface side should not have any gap with Rack Wall and Retainer side will have 0.76mm gap. Total Plug-in unit Thickness on Guide Rail is 12.57mm In Retainer tightened state, Total Plug-in Unit Thickness will be 13.3mm Card Guide Depth is 9.19mm to 10.41mm
- 18. REDI –Conduction Cool Mechanism – Guidance on Cooling Component Layout can be critical to proper plug-in unit cooling. The layout should consider the how each component cooling, length and cross sectional area of heat transfer paths etc.. The conduction contact area for heat transfer from plug-in unit is dependant on several factors, including the depth of card, the presence of air cooled card guide projection.
- 19. REDI –Conduction Cool Mechanism – Important Rules to Remember Rule 6-1: For Type1 Implementations, Both Primary & Secondary side covers shall be required Rule 6-12: Covers shall be electrically connected to safety ground with resistance not to exceed 100mohm Rule 6-11: Maximum Plug-in Width is defined by following Table Rule 7-11, 7-12: Primary & Secondary Side Cover is mandatory for TYPE1 and it is not required for TYPE2 implementations Rule 13-1: In Order to achieve 2 Level maintenance, Type1 Plu-in units shall comply with ESD requirements of VITA 47
- 20. REDI - VPX Any Questions for Discussion..........