1. Wet etching is a material removal process that uses liquid chemicals or etchants to remove materials from a wafer through oxidation and dissolving of the oxidized material.
2. The process involves the diffusion of byproducts from the reacted surface.
3. Wet etching offers advantages such as being damage-free, simple, occurring at atmospheric environment, having low cost, and providing high selectivity and uniformity. However, it results in isotropic etching and lacks precision control.