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Manufacturing That Eliminates Risk & Improves Reliability
Why High-Tech Multi-Layer PCB Features
Add Cost and Processing Time
5.20.22
Manufacturing That Eliminates Risk & Improves Reliability
2
Agenda
 PCB base cost
 Common cost adders
 Specialty processing not as common
 Additional time needed for production
 Least common specialty process
cost and lead time
 Summary
Manufacturing That Eliminates Risk & Improves Reliability
3
Base Pricing of a Printed Circuit Board
Manufacturing That Eliminates Risk & Improves Reliability
4
The Base Cost
 What are the base cost considerations when costing a PCB?
– Layer count
– X,Y
– Material FR4
• Copper weight
– Thickness overall
– Classification – II, III, ITAR, domestic, military, or medical grade
– Surface finish
 If we have only the above information for the PCB, we can then
calculate a base cost.
Manufacturing That Eliminates Risk & Improves Reliability
5
Common Cost Adders of a Printed Circuit Board
Manufacturing That Eliminates Risk & Improves Reliability
6
Common Features That Add Cost
 From the base pricing, additional costs may be added to the unit price.
Depending on what those items are, the price can quickly increase.
– Copper wt. above 2oz, mixed
• 3oz, 4oz, 5oz are more standard
– Impedance
• Controlled dielectrics
– RoHS finishes
• ENIG, Immersion Silver, LF-HASL, OSP, Immersion Tin, Gold Tabs
– High-temperature material >130tg, 170tg, 180tg
– A specific brand or type of material
• Isola, Nelco, Nanya, Arlon, Rogers, Taconic, I-speed, Panasonic
– Specifying a brand will add cost
Manufacturing That Eliminates Risk & Improves Reliability
7
Using IPC-4101 and 4103 Spec
 Not all fabricators support or stock every possible
laminate material.
 IPC-4101 and IPC-4103 standards specify various
requirements for PCB laminate materials that help
ensure interchangeability and compatibility in a
PCB stack-up.
 Specs contain 2 sets of data on a particular
material system: primary structural/material
properties and some testing results as determined
under IPC testing standards.
 Call out a slash number rather than a tradename
or brand on your fabrication drawing.
Manufacturing That Eliminates Risk & Improves Reliability
8
There Are New Materials Available
 For RF/microwave
designs, there are new
materials that are:
– More available
– Cost less per panel
– Cost less to process
 Work with your
fabricator so that you
get the same
performance for less
overall cost.
Manufacturing That Eliminates Risk & Improves Reliability
9
How is the Cost of a PCB Determined?
Base Cost from
Supplied Fabrication
Drawing
• LxW of PCB/array
• Thickness
• Layer count
• Material(s)
• Copper weight
• Surface finish
What else to look for?
• Impedance
• Specified
dielectrics
• Copper wt. >2oz
• High temp.
More …
• Blind/buried vias
• Stacked vias
• Via-in-pad
• Plated slots
• Gold tabs
Manufacturing That Eliminates Risk & Improves Reliability
10
Printed Circuit Board Specialty Processing
Manufacturing That Eliminates Risk & Improves Reliability
11
Plated Edges – Castellated Holes
 Hole/edge plating PCB edge
 Drill/rout as a primary process
 > 0.016”
– Drill & cleaning
– Plating
– Image
– Routing special requirements
Manufacturing That Eliminates Risk & Improves Reliability
12
Milling & Excessive Routing
 Milling
– Time-consuming
– Cost
• Programming/engineering
• Control depth routing
• Additional processing
Manufacturing That Eliminates Risk & Improves Reliability
13
Excessive Routing
 Excessive Routing
– Time-consuming
– Cost
• Materials
• Labor
• Engineering
Manufacturing That Eliminates Risk & Improves Reliability
14
Counterbore – Countersink
 Counterbore – primary drilling, plating, secondary drilling
– Processing time
– Special tools  Not all sizes are available
– Setting and controls
 Countersink – primary drilling, plating or non-plated, secondary
– Processing
– Tools
– Settings and controls
 Back Drilling – primary drilling, secondary drilling
– In lieu of blind via processing
– Engineering – production time
– Danger of scrapping – high cost
Manufacturing That Eliminates Risk & Improves Reliability
15
Counterbore – Countersink
Manufacturing That Eliminates Risk & Improves Reliability
16
Back Drilling
 PCB Back Drilling
– Added drill time
• +0.010” min +0.020” typical
• 0.003” accuracy
– Engineering
– Scrap Risk
– Labor
Manufacturing That Eliminates Risk & Improves Reliability
17
Cavity Boards
 Cavity Boards
– FR4 or POLYIMIDE
– Set up and processing
– Engineering
• Tolerance +- 0.005”
• Plug holes in cavity
• Holes 0.100” from cavity edge
– Labor
Manufacturing That Eliminates Risk & Improves Reliability
18
Copper Plated Shut Vias
 Copper plated shut
– Price
– Processing equipment
– DC chemistry
– 0.006” - 0.012” single size
– 12:1< aspect ratio
– Time 15-18hrs
– Risk low
• Voids
• Air/gas
• Chemistry
Manufacturing That Eliminates Risk & Improves Reliability
19
Blind Vias
 Blind via
– Top – bottom side to a
mid-layer
• Processing time –
engineering
Manufacturing That Eliminates Risk & Improves Reliability
20
Buried Vias
 Buried via
– Mid-layer to mid-layer no
external connection
• Engineering – Processing
Manufacturing That Eliminates Risk & Improves Reliability
21
Stacked Vias
 Stacked via
– Processed vias on top of
each other different entry
and exit layer
• Engineering –
processing stack-up
calculation
• Additional lamination
cycles
Manufacturing That Eliminates Risk & Improves Reliability
22
Odd But Not Out
 Jump V-Score
– Cost and time
 Peelable Mask
– Time, shelf-life, low volume
 Combined Surface Treatments
– Gold contacts, tabs, or fingers
– Carbon ink
– ENEPIG
Manufacturing That Eliminates Risk & Improves Reliability
23
Summary
Manufacturing That Eliminates Risk & Improves Reliability
24
Summary
 PCB costing starts the same way with each unique design.
 All PCBs are a built-to-print product; because no two are exactly alike,
pricing can vary.
 Engineering and production review during the design and lay out
phase can improve on cost and lead time challenges.
 DFM is another option to help improve costing and material stack-up
challenges.
 Using a trusted supplier with an expansive capable supply chain
allows for the best cost, delivery, and quality product.
Manufacturing That Eliminates Risk & Improves Reliability
25
Our Products
Battery Packs Flex & Rigid-Flex PCBs Cable Assemblies Printed Circuit Boards
CNC Machining User Interfaces Flexible Heaters EC Fans & Motors
Manufacturing That Eliminates Risk & Improves Reliability
26
Q&A
 Questions?
– Enter any questions you may have
in the control panel
– If we don’t have time to get to it, we
will reply via email
Manufacturing That Eliminates Risk & Improves Reliability
27
Thank You
Check out our website at www.epectec.com.
For more information email sales@epectec.com.
Stay Connected with Epec Engineered Technologies
Follow us on our social media sites for continuous technical updates and information:

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Why High-Tech Multi-Layer PCB Features Add Cost and Processing Time

  • 1. Manufacturing That Eliminates Risk & Improves Reliability Why High-Tech Multi-Layer PCB Features Add Cost and Processing Time 5.20.22
  • 2. Manufacturing That Eliminates Risk & Improves Reliability 2 Agenda  PCB base cost  Common cost adders  Specialty processing not as common  Additional time needed for production  Least common specialty process cost and lead time  Summary
  • 3. Manufacturing That Eliminates Risk & Improves Reliability 3 Base Pricing of a Printed Circuit Board
  • 4. Manufacturing That Eliminates Risk & Improves Reliability 4 The Base Cost  What are the base cost considerations when costing a PCB? – Layer count – X,Y – Material FR4 • Copper weight – Thickness overall – Classification – II, III, ITAR, domestic, military, or medical grade – Surface finish  If we have only the above information for the PCB, we can then calculate a base cost.
  • 5. Manufacturing That Eliminates Risk & Improves Reliability 5 Common Cost Adders of a Printed Circuit Board
  • 6. Manufacturing That Eliminates Risk & Improves Reliability 6 Common Features That Add Cost  From the base pricing, additional costs may be added to the unit price. Depending on what those items are, the price can quickly increase. – Copper wt. above 2oz, mixed • 3oz, 4oz, 5oz are more standard – Impedance • Controlled dielectrics – RoHS finishes • ENIG, Immersion Silver, LF-HASL, OSP, Immersion Tin, Gold Tabs – High-temperature material >130tg, 170tg, 180tg – A specific brand or type of material • Isola, Nelco, Nanya, Arlon, Rogers, Taconic, I-speed, Panasonic – Specifying a brand will add cost
  • 7. Manufacturing That Eliminates Risk & Improves Reliability 7 Using IPC-4101 and 4103 Spec  Not all fabricators support or stock every possible laminate material.  IPC-4101 and IPC-4103 standards specify various requirements for PCB laminate materials that help ensure interchangeability and compatibility in a PCB stack-up.  Specs contain 2 sets of data on a particular material system: primary structural/material properties and some testing results as determined under IPC testing standards.  Call out a slash number rather than a tradename or brand on your fabrication drawing.
  • 8. Manufacturing That Eliminates Risk & Improves Reliability 8 There Are New Materials Available  For RF/microwave designs, there are new materials that are: – More available – Cost less per panel – Cost less to process  Work with your fabricator so that you get the same performance for less overall cost.
  • 9. Manufacturing That Eliminates Risk & Improves Reliability 9 How is the Cost of a PCB Determined? Base Cost from Supplied Fabrication Drawing • LxW of PCB/array • Thickness • Layer count • Material(s) • Copper weight • Surface finish What else to look for? • Impedance • Specified dielectrics • Copper wt. >2oz • High temp. More … • Blind/buried vias • Stacked vias • Via-in-pad • Plated slots • Gold tabs
  • 10. Manufacturing That Eliminates Risk & Improves Reliability 10 Printed Circuit Board Specialty Processing
  • 11. Manufacturing That Eliminates Risk & Improves Reliability 11 Plated Edges – Castellated Holes  Hole/edge plating PCB edge  Drill/rout as a primary process  > 0.016” – Drill & cleaning – Plating – Image – Routing special requirements
  • 12. Manufacturing That Eliminates Risk & Improves Reliability 12 Milling & Excessive Routing  Milling – Time-consuming – Cost • Programming/engineering • Control depth routing • Additional processing
  • 13. Manufacturing That Eliminates Risk & Improves Reliability 13 Excessive Routing  Excessive Routing – Time-consuming – Cost • Materials • Labor • Engineering
  • 14. Manufacturing That Eliminates Risk & Improves Reliability 14 Counterbore – Countersink  Counterbore – primary drilling, plating, secondary drilling – Processing time – Special tools  Not all sizes are available – Setting and controls  Countersink – primary drilling, plating or non-plated, secondary – Processing – Tools – Settings and controls  Back Drilling – primary drilling, secondary drilling – In lieu of blind via processing – Engineering – production time – Danger of scrapping – high cost
  • 15. Manufacturing That Eliminates Risk & Improves Reliability 15 Counterbore – Countersink
  • 16. Manufacturing That Eliminates Risk & Improves Reliability 16 Back Drilling  PCB Back Drilling – Added drill time • +0.010” min +0.020” typical • 0.003” accuracy – Engineering – Scrap Risk – Labor
  • 17. Manufacturing That Eliminates Risk & Improves Reliability 17 Cavity Boards  Cavity Boards – FR4 or POLYIMIDE – Set up and processing – Engineering • Tolerance +- 0.005” • Plug holes in cavity • Holes 0.100” from cavity edge – Labor
  • 18. Manufacturing That Eliminates Risk & Improves Reliability 18 Copper Plated Shut Vias  Copper plated shut – Price – Processing equipment – DC chemistry – 0.006” - 0.012” single size – 12:1< aspect ratio – Time 15-18hrs – Risk low • Voids • Air/gas • Chemistry
  • 19. Manufacturing That Eliminates Risk & Improves Reliability 19 Blind Vias  Blind via – Top – bottom side to a mid-layer • Processing time – engineering
  • 20. Manufacturing That Eliminates Risk & Improves Reliability 20 Buried Vias  Buried via – Mid-layer to mid-layer no external connection • Engineering – Processing
  • 21. Manufacturing That Eliminates Risk & Improves Reliability 21 Stacked Vias  Stacked via – Processed vias on top of each other different entry and exit layer • Engineering – processing stack-up calculation • Additional lamination cycles
  • 22. Manufacturing That Eliminates Risk & Improves Reliability 22 Odd But Not Out  Jump V-Score – Cost and time  Peelable Mask – Time, shelf-life, low volume  Combined Surface Treatments – Gold contacts, tabs, or fingers – Carbon ink – ENEPIG
  • 23. Manufacturing That Eliminates Risk & Improves Reliability 23 Summary
  • 24. Manufacturing That Eliminates Risk & Improves Reliability 24 Summary  PCB costing starts the same way with each unique design.  All PCBs are a built-to-print product; because no two are exactly alike, pricing can vary.  Engineering and production review during the design and lay out phase can improve on cost and lead time challenges.  DFM is another option to help improve costing and material stack-up challenges.  Using a trusted supplier with an expansive capable supply chain allows for the best cost, delivery, and quality product.
  • 25. Manufacturing That Eliminates Risk & Improves Reliability 25 Our Products Battery Packs Flex & Rigid-Flex PCBs Cable Assemblies Printed Circuit Boards CNC Machining User Interfaces Flexible Heaters EC Fans & Motors
  • 26. Manufacturing That Eliminates Risk & Improves Reliability 26 Q&A  Questions? – Enter any questions you may have in the control panel – If we don’t have time to get to it, we will reply via email
  • 27. Manufacturing That Eliminates Risk & Improves Reliability 27 Thank You Check out our website at www.epectec.com. For more information email sales@epectec.com. Stay Connected with Epec Engineered Technologies Follow us on our social media sites for continuous technical updates and information: