Intel Knights Landing Slides
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- Intel dominates the TOP500 supercomputer list, powering 427 of the top 500 systems and 111 of the newest systems using Intel Xeon and Xeon Phi processors. - HPC performance has improved over 15,000x in the past 20 years, with innovations like clusters now enabling top performance to waterfall down to single-socket systems within 6-8 years. - Knights Landing, the next generation Intel Xeon Phi product, will provide over 3 teraflops of performance in a single package in 2015, using enhanced Intel Atom cores and on-package memory.
Intel Knights Landing Slides
- 1. Accelerating Insights… In the Technical Computing Transformation Dr. Rajeeb Hazra Vice President, Data Center Group General Manager, Technical Computing Group June 2014
- 2. TOP500 Highlights 427 of 500 (85%) of all systems 111 of 114 (97%) of new systems Intel® Xeon PhiTM in Jun’14 list #1—TOP500 system #1—Intel® Xeon PhiTM Total Rmax > GPU’s Total Rmax PRACE ISC Award—2014 1st Sustained 1PFlop Real Science Performance on an IA-based System Use Intel processors Source: www.top.500.org
- 3. The Democratization of HPC… A 20 Year Retrospective 108 105 $/FLOP 10 1994 1 2014 >15,000X IMPROVEMENT1 YEAR Pioneering Science High ROI Industry Innovations Beowulf Cluster *Source: Intel per socket estimate comparing Intel DX4TM processor (Beowulf) versus Intel® Xeon PhiTM (Knights Corner) Other brands and names are the property of their respective owners.
- 4. HPC’s Next Stage New Usages HPC Cloud Service3D Printing New Access Other brands and names are the property of their respective owners. New Models Crowdsourcing
- 5. ~9 years #500 to Single Socket Technology Waterfalls from the Top All Other Technical Computing Top 500 <15% >85% Performance Waterfall* #1 Top500 System to Single Socket *plus…..similar waterfalls for other capabilities in areas like fabrics, storage, software, … 6-8 years #1 to #500 Source: Top500.org and Intel Estimate of Top500 sockets as % of sum of analysts reports of HPC and branded Workstations sockets. Performance waterfall timelines based on TOP500.org statistics (#1-#500) and Intel estimate (#500 to projected Intel Knights Landing) Other brands and names are the property of their respective owners. % of sockets sold
- 6. Unabated System Innovation At The Top Interconnect Memory & Storage Processor Performance Reliability and Resiliency Standard Programming Model for Parallelism Power Efficiency from
- 7. All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. 1Over 3 Teraflops of peak theoretical double-precision performance is preliminary and based on current expectations of cores, clock frequency and floating point operations per cycle. FLOPS = cores x clock frequency x floating- point operations per second per cycle. . 2Modified version of Intel® Silvermont microarchitecture currently found in Intel® AtomTM processors. 3Modifications include AVX512 and 4 threads/core support. 4Projected peak theoretical single-thread performance relative to 1st Generation Intel® Xeon Phi™ Coprocessor 7120P (formerly codenamed Knights Corner). 5 Binary Compatible with Intel Xeon processors using Haswell Instruction Set (except TSX) . 6Projected results based on internal Intel analysis of Knights Landing memory vs Knights Corner (GDDR5). 7Projected result based on internal Intel analysis of STREAM benchmark using a Knights Landing processor with 16GB of ultra high-bandwidth versus DDR4 memory only with all channels populated. Unveiling Details of Knights Landing (Next Generation Intel® Xeon Phi™ Products) 2nd half ’15 1st commercial systems 3+ TFLOPS1 In One Package Parallel Performance & Density On-Package Memory: up to 16GB at launch 5X Bandwidth vs DDR47 Compute: Energy-efficient IA cores2 Microarchitecture enhanced for HPC3 3X Single Thread Performance vs Knights Corner4 Intel Xeon Processor Binary Compatible5 1/3X the Space6 5X Power Efficiency6 . . . . . . Integrated Fabric Intel® Silvermont Arch. Enhanced for HPC Processor Package Conceptual—Not Actual Package Layout … Platform Memory: DDR4 Bandwidth and Capacity Comparable to Intel® Xeon® Processors Jointly Developed with Micron Technology
- 8. Intel® Omni Scale—The Next-Generation Fabric *OpenFabrics Alliance Other brands and names are the property of their respective owners INTEGRATION Intel® Omni Scale Fabric Intel® Omni Scale Fabric Future 14nm generation Starting with Knights Landing Intel® True Scale Fabric Upgrade Program Helps Your Transition Coming in ‘15 PCIe Adapters√ Edge Switches√ Open Software Tools* √ Director Systems√ Designed for Maximum Scalability Rich Set of Programming Models Flexible Configurations End-to-End Solution Announcing Intel Silicon Photonics√
- 9. The Future Is Here Knights Landing Supercomputer…the 1st of Many “Cori will provide a significant increase in capability for our users and will provide a platform for transitioning our very broad user community to many core architectures.” Sudip Dosanjh NERSC Director >9300 Knights Landing nodes “..a significant step in advancing supercomputing design toward the kinds of computing systems we expect to see in the next decade as we advance to exascale.” Steve Binkley Associate Director of the Office of Advanced Scientific Computing Research *Source: NERSC.gov announcement April 29, 2014 . DOE--National Energy Research Scientific Computing Center Other brands and names are the property of their respective owners Knights Landing: Next generation Intel® Xeon PhiTM processor and Intel® Xeon PhiTM coprocessor System name: Cori Next Generation Intel® Xeon Phi™ Products (Knights Landing)
- 10. Modernizing Community Codes…Together AVBP (Large Eddy) Blast BUDE CAM-5 CASTEP Castep CESM CFSv2 CIRCAC AMBER CliPhi (COSMOS) COSA Cosmos codes DL-MESO DL-Poly ECHAM6 Elmer FrontFlow/Blue Code GADGET GAMESS-US GPAW Gromacs GS2 GTC Harmonie Ls1 MACPO Mardyn MPAS NEMO5 NWChemOpenflow OPENMP/ MPI Optimized integral Quantum Espresso R ROTOR SIM SeisSol, GADGET, SG++ SG++SU2UTBENCHVASPVISITWRF Other brands and names are the property of their respective owners. Intel® Parallel Computing Centers Plus…User Groups Forming
- 12. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm Intel, Intel Xeon, Intel Xeon Phi™, Intel® Atom™ are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or other countries. Copyright © 2014, Intel Corporation *Other brands and names may be claimed as the property of others. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.The cost reduction scenarios described in this document are intended to enable you to get a better understanding of how the purchase of a given Intel product, combined with a number of situation-specific variables, might affect your future cost and savings. Nothing in this document should be interpreted as either a promise of or contract for a given level of costs. Intel® Advanced Vector Extensions (Intel® AVX)* are designed to achieve higher throughput to certain integer and floating point operations. Due to varying processor power characteristics, utilizing AVX instructions may cause a) some parts to operate at less than the rated frequency and b) some parts with Intel® Turbo Boost Technology 2.0 to not achieve any or maximum turbo frequencies. Performance varies depending on hardware, software, and system configuration and you should consult your system manufacturer for more information. *Intel® Advanced Vector Extensions refers to Intel® AVX, Intel® AVX2 or Intel® AVX-512. For more information on Intel® Turbo Boost Technology 2.0, visit http://www.intel.com/go/turbo All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Optimization Notice Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2®, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice. Notice revision #20110804 Legal Disclaimer