ASIC Design Solution & Challenges for Shorter TTM [Infographic]
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1) As demand for semiconductors increases, engineers face challenges to do more with less time, money, and resources. 2) ASIC companies leverage technologies like mobility, IoT, computing and networking to help reduce product development times from over a year to just 5 months. 3) Faster time-to-market allows companies to beat competitors to market, lower overall product costs, and optimize design and manufacturing cycles.
ASIC Design Solution & Challenges for Shorter TTM [Infographic]
- 1. End-to-End Solution in ASIC Design for Shorter TTM Demand of Semiconductor in the Market As the demand graph of Semiconductor goes high, engineers, hardware designers, and companies face following challenges: “To do more with Less Time, Less Money and Less People” Growth of Selected Markets, 17-Q2 Q2-16toQ2-17Growth $300 billion, Worldwide 320 340 360 380 400 2015 2016 2017 2018 2019 2020 Chip market to post 3.3% annual growth The global semiconductor market will increase an average of 3.3 per cent per year through 2020 when the market will total more than $400 billion Growth of Semiconductor in Different Markets Challenges Faced by Engineers in the Semiconductor Industry -10% 0% 10% 20% 30% 40% 50% 60% 70% 80% AutoADAS AutoOther Infotainment Power/Body OtherComs Video DC PC Gaming Smartphone Mobile OtherCons IndIoT OtherInd Automobile ConsumerCommunication Computing Industrial 65.9% 64.1% 52.8% 26.1% 25.8% 32.0% 36.0% 34.7% 20.0% 16.5% 5.7% 8.0% 3.9% -8.8% Tools and MethodologiesIPQualityPower 1 2 3As the demand graph of Semiconductor goes high, engineers, hardware designers, and companies face following challenges: Cost Capacity PerformanceTime to Market Customer Base 12 Months 5 Months Revenue Market Penetration Solutions Leveraged by ASIC Companies for Faster TTM During competitive situations, ASIC companies leverage Mobility, IoT, Computing, and Networking to launch their products on time. Mobility helps ASIC cycles to shrink from to } 4During competitive situations, ASIC companies leverage Mobility, IoT, Computing, and Networking to launch their products on time. Benefits of Faster TTM with Continuous Performance Improvement Program Helps beat the competitors in market Delivers high impact on overall cost of the product Optimizes the time by reducing design and manufacturing cycle 5 References : hhp://www.electronics-sourcing.com/2017/01/12/semiconductor-market-will-recover-2017/ hhp://engagement-group.com/en/growth-charts/ hhps://www.design-reuse.com/arrcles/4360/fpga-to-asic-strategy-for-communicaaon-soc-designs.html hhp://www.skillpad.com/how-to-reduce--me-to-market-and-improve-produccvity-through-the-use-of-elearning/ hhps://www.einfochips.com HQ: 2025 Gateway Place, Suite #270, San Jose, CA 95110. Talk to Us at +1-408-496-1882 or write to markeeng@einfochips.com /eInfochips /eInfochips/einfochipsltd /einfochipsindia Connect with us 15% 2% 11% 15% 6% 24% 27% 130nm 180nm 65nm 90nm 28nm 16nm 45nm 6 How eInfochips Delivers Faster TTM in the Era of Miniaturization ASIC Design / Physical Design Services Chip-top planning / partitioning Block level Floorplan Placement, Power plan & Time budgeting Routing / Clock tree synthesis Feedback to full chip owner for die-size closure SignoSignoff using PTSI, Calibre, LEC, Apache tools 1. 2. 3. DFT Architecture and Implementation DFT Evaluation and Assessment DFT Architecture and Methodology Development DFT Automation Design vs Test Time & DFT Trade-offs ATPG Library Generation Multiple Silicon Tape-outs Achieved DFT Architecture Expertise Turnkey Services RTL to GDSII Implementation + DFT: Synthesis, Floorplan, and Placement Optimization, CTS, and Routing for block Active role in feedback to oorplan team and RTL team Provide feedback to full chip owner TTiming closure, Crosstalk Analysis & OCV Analysis through PTSI, Physical Veriication DFT Architecture, Scan, ATPG, BIST, Silicon Debug 28nm 45nm 65nm 90nm 130nm 20% 40% 5%15% 20%