Data sheet acquired from Harris Semiconductor
SCHS027C − Revised February 2004
The CD4017B and CD4022B types are supplied in
16-lead hermetic dual-in-line ceramic packages
(F3A suffix), 16-lead dual-in-line plastic package
(E suffix), 16-lead small-outline packages (NSR suffix),
and 16-lead thin shrink small-outline packages (PW and
PWR suffixes). The CD4017B types also are supplied in
16-lead small-outline packages (M and M96 suffixes).
ripple-clock the succeeding device in a
multi-device counting chain.
Copyright  2004, Texas Instruments Incorporated
Cd 4017
Cd 4017
Cd 4017
Cd 4017
Cd 4017
PACKAGING INFORMATION
Orderable Device Status (1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan (2)
Lead/Ball Finish MSL Peak Temp (3)
89270AKB3T OBSOLETE 0 TBD Call TI Call TI
CD4017BE ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD4017BEE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD4017BF ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
CD4017BF3A ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
CD4017BM ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4017BM96 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4017BM96E4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4017BME4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4017BNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4017BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4017BPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4017BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4017BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4017BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4022BE ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD4022BEE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD4022BF ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
CD4022BF3A ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
CD4022BNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4022BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4022BPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4022BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4022BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4022BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
JM38510/05651BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Oct-2005
Addendum-Page 1
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Oct-2005
Addendum-Page 2
Cd 4017
Cd 4017
Cd 4017
Cd 4017
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated

More Related Content

PDF
PDF
Cd4060b
PDF
PDF
Cd4011b
PPT
A RoHS Update
PDF
Restriction of hazardous substances - an overview
PDF
The Restriction of Hazardous Substances (RoHS) Manual for SMEs
PDF
330 Ctos Electronicos
Cd4060b
Cd4011b
A RoHS Update
Restriction of hazardous substances - an overview
The Restriction of Hazardous Substances (RoHS) Manual for SMEs
330 Ctos Electronicos

Viewers also liked (20)

PDF
Montajes De Electronica Circuitos 3
PDF
150 circuitos de electronica 2
PDF
500 proyectos de electronica
PDF
DataSheet 74ls90
PPTX
circuitos con diodos
PPTX
Electrónica básica (Componentes de Electrónica)
DOCX
Proyecto de sistemas digitales
PDF
Practicas crocodile serie y paralelo
PDF
Curso De Electronica Practica
PPS
Electrónica analógica
PPT
Digital
PDF
1500 Câu Hỏi Về Điện
PDF
Control de posicion de un motro dccc
PPT
Conexión darlington transistor
PDF
91769788 modelo-y-control-de-motor-d-c-con-engranajes-2011-2
PDF
Schaum circuitos-electricos-tercera-edicion-3°-ed
PPS
Electronica Basica
PDF
Cekit (Proyectos Sistemas Digitales)
ODP
Introducción a la electrónica básica
Montajes De Electronica Circuitos 3
150 circuitos de electronica 2
500 proyectos de electronica
DataSheet 74ls90
circuitos con diodos
Electrónica básica (Componentes de Electrónica)
Proyecto de sistemas digitales
Practicas crocodile serie y paralelo
Curso De Electronica Practica
Electrónica analógica
Digital
1500 Câu Hỏi Về Điện
Control de posicion de un motro dccc
Conexión darlington transistor
91769788 modelo-y-control-de-motor-d-c-con-engranajes-2011-2
Schaum circuitos-electricos-tercera-edicion-3°-ed
Electronica Basica
Cekit (Proyectos Sistemas Digitales)
Introducción a la electrónica básica
Ad

Similar to Cd 4017 (20)

PDF
Datasheet
PDF
PDF
Msp430g2453
PDF
CC2540 Bluetooth Low Energy Reference Design Schematic
PDF
Original audio amplifier ic tda7292 7292 new st microelectronics
PDF
LED Driver "BCR402W" | Infineon Technologies
PDF
Bipolar Power Transistor Databook - 2001 ON Semiconductor.pdf
PDF
LED Driver "BCR401W" | Infineon Technologies
PDF
LED Driver "BCR402U" - Datasheet | Infineon Technologies
PDF
Original IC Mosfet Driver IXDN602SIATR IXDN602SIA 602 SOP-8 New IXYS Corporation
PPT
Handheld Infrared Thermometer
PDF
Datasheet
PDF
scyd013b.pdf
PDF
LED Driver "BCR401U"| Infineon Technologies
PDF
Datablad ua741 operasjonsforsterer OP-AMP OPAMP Forsterker operational amplif...
PPT
Handheld Laser Barcode Scanners
PPT
Solution on Handheld Signal Generator
PDF
LED Driver "BCR420U / BCR421U" | Infineon Technologies
Datasheet
Msp430g2453
CC2540 Bluetooth Low Energy Reference Design Schematic
Original audio amplifier ic tda7292 7292 new st microelectronics
LED Driver "BCR402W" | Infineon Technologies
Bipolar Power Transistor Databook - 2001 ON Semiconductor.pdf
LED Driver "BCR401W" | Infineon Technologies
LED Driver "BCR402U" - Datasheet | Infineon Technologies
Original IC Mosfet Driver IXDN602SIATR IXDN602SIA 602 SOP-8 New IXYS Corporation
Handheld Infrared Thermometer
Datasheet
scyd013b.pdf
LED Driver "BCR401U"| Infineon Technologies
Datablad ua741 operasjonsforsterer OP-AMP OPAMP Forsterker operational amplif...
Handheld Laser Barcode Scanners
Solution on Handheld Signal Generator
LED Driver "BCR420U / BCR421U" | Infineon Technologies
Ad

More from Mr Giap (20)

PDF
Viết Ngôn Ngữ Lập Trình 8051 PIC AVR
PDF
Vi Điều Khiển Ứng Dụng AT89s52
PDF
Tài Liệu Điều Khiển Từ Xa Bằng Hồng Ngoại
PDF
LED Vu-Metter LM3915 and LM386
PDF
Đồ Án Đo Điện Áp Hiển Thị Trên LCD
PDF
15 Ghép nối 8255
PDF
13 DC Bước - Bàn phím DAC
PDF
12 LCD ADC - Cảm biến
PDF
11 Lập trình ngắt
PDF
10 Truyền thông nối tiếp
PDF
09 Bộ đếm và định thời
PDF
08 Lệnh một Bit
PDF
07 Lệnh Logic
PDF
05 Chế độ danh địa chỉ
PDF
04 Lập trình cổng vào ra
PDF
03 Các lệnh nháy
PDF
02 Lập trình hợp ngữ 8051
PDF
01 Các bộ Vi Điều Khiển 8051
PDF
14 Ghép nối bộ nhớ ngoài
PDF
Lập trình C cho VĐK 8051
Viết Ngôn Ngữ Lập Trình 8051 PIC AVR
Vi Điều Khiển Ứng Dụng AT89s52
Tài Liệu Điều Khiển Từ Xa Bằng Hồng Ngoại
LED Vu-Metter LM3915 and LM386
Đồ Án Đo Điện Áp Hiển Thị Trên LCD
15 Ghép nối 8255
13 DC Bước - Bàn phím DAC
12 LCD ADC - Cảm biến
11 Lập trình ngắt
10 Truyền thông nối tiếp
09 Bộ đếm và định thời
08 Lệnh một Bit
07 Lệnh Logic
05 Chế độ danh địa chỉ
04 Lập trình cổng vào ra
03 Các lệnh nháy
02 Lập trình hợp ngữ 8051
01 Các bộ Vi Điều Khiển 8051
14 Ghép nối bộ nhớ ngoài
Lập trình C cho VĐK 8051

Recently uploaded (20)

PDF
HVAC Specification 2024 according to central public works department
PDF
Hazard Identification & Risk Assessment .pdf
PDF
Τίμαιος είναι φιλοσοφικός διάλογος του Πλάτωνα
PDF
International_Financial_Reporting_Standa.pdf
PDF
MBA _Common_ 2nd year Syllabus _2021-22_.pdf
PDF
Literature_Review_methods_ BRACU_MKT426 course material
PDF
LIFE & LIVING TRILOGY- PART (1) WHO ARE WE.pdf
PDF
David L Page_DCI Research Study Journey_how Methodology can inform one's prac...
PDF
Environmental Education MCQ BD2EE - Share Source.pdf
PDF
Vision Prelims GS PYQ Analysis 2011-2022 www.upscpdf.com.pdf
PDF
Journal of Dental Science - UDMY (2020).pdf
PDF
LIFE & LIVING TRILOGY - PART (3) REALITY & MYSTERY.pdf
PDF
AI-driven educational solutions for real-life interventions in the Philippine...
PPTX
ELIAS-SEZIURE AND EPilepsy semmioan session.pptx
PDF
IP : I ; Unit I : Preformulation Studies
PDF
Skin Care and Cosmetic Ingredients Dictionary ( PDFDrive ).pdf
PDF
BP 505 T. PHARMACEUTICAL JURISPRUDENCE (UNIT 1).pdf
PPTX
Unit 4 Computer Architecture Multicore Processor.pptx
PDF
1.3 FINAL REVISED K-10 PE and Health CG 2023 Grades 4-10 (1).pdf
PDF
CRP102_SAGALASSOS_Final_Projects_2025.pdf
HVAC Specification 2024 according to central public works department
Hazard Identification & Risk Assessment .pdf
Τίμαιος είναι φιλοσοφικός διάλογος του Πλάτωνα
International_Financial_Reporting_Standa.pdf
MBA _Common_ 2nd year Syllabus _2021-22_.pdf
Literature_Review_methods_ BRACU_MKT426 course material
LIFE & LIVING TRILOGY- PART (1) WHO ARE WE.pdf
David L Page_DCI Research Study Journey_how Methodology can inform one's prac...
Environmental Education MCQ BD2EE - Share Source.pdf
Vision Prelims GS PYQ Analysis 2011-2022 www.upscpdf.com.pdf
Journal of Dental Science - UDMY (2020).pdf
LIFE & LIVING TRILOGY - PART (3) REALITY & MYSTERY.pdf
AI-driven educational solutions for real-life interventions in the Philippine...
ELIAS-SEZIURE AND EPilepsy semmioan session.pptx
IP : I ; Unit I : Preformulation Studies
Skin Care and Cosmetic Ingredients Dictionary ( PDFDrive ).pdf
BP 505 T. PHARMACEUTICAL JURISPRUDENCE (UNIT 1).pdf
Unit 4 Computer Architecture Multicore Processor.pptx
1.3 FINAL REVISED K-10 PE and Health CG 2023 Grades 4-10 (1).pdf
CRP102_SAGALASSOS_Final_Projects_2025.pdf

Cd 4017

  • 1. Data sheet acquired from Harris Semiconductor SCHS027C − Revised February 2004 The CD4017B and CD4022B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic package (E suffix), 16-lead small-outline packages (NSR suffix), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). The CD4017B types also are supplied in 16-lead small-outline packages (M and M96 suffixes). ripple-clock the succeeding device in a multi-device counting chain. Copyright  2004, Texas Instruments Incorporated
  • 7. PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) 89270AKB3T OBSOLETE 0 TBD Call TI Call TI CD4017BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD4017BEE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD4017BF ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD4017BF3A ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD4017BM ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4017BM96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4017BM96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4017BME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4017BNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4017BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4017BPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4017BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4017BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4017BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4022BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD4022BEE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD4022BF ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD4022BF3A ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD4022BNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4022BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4022BPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4022BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4022BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4022BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM JM38510/05651BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 Addendum-Page 1
  • 8. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 Addendum-Page 2
  • 13. MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 28 9,80 9,60 24 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 8 0,19 4,30 4,50 7 0,15 14 A 1 1,20 MAX 14 5,10 4,90 8 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
  • 14. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright  2005, Texas Instruments Incorporated